Organic electronic element manufacturing method and organic electronic element

Abstract

An organic electronic element manufacturing method is a method of manufacturing an organic electronic element (1) having flexibility using a roll-to-roll process, including a first electrode forming step in which a first electrode (21) is pattern-formed onto a flexible substrate (10), a functional layer forming step in which a functional layer (23) containing an organic material is pattern-formed onto the first electrode (21), and a mask forming step in which a mask element (30) having flexibility is formed on the substrate (10) such that it has an opening on at least a portion of the functional layer (23) and at least a portion of the first electrode (21) with the functional layer (23) therebetween and covers edge portions (21a and 23a) on at least one side of the first electrode (21) and the functional layer (23).

Claims

1. A method of manufacturing an organic electronic element having flexibility using a roll-to-roll process, the method comprising: a first electrode forming step in which a first electrode is pattern-formed onto a flexible substrate; a functional layer forming step in which a functional layer containing an organic material is pattern-formed onto the first electrode; and a mask forming step in which a mask element having flexibility is formed on the substrate such that it has an opening on at least a portion of the functional layer and at least a portion of the first electrode with the functional layer therebetween and covers an edge portion on at least one side of the first electrode and an edge portion on at least one side of the functional layer, wherein the mask forming step includes a step in which a lamination film in which a first removable release sheet, a mask film having flexibility, a second removable release sheet, and a carrier film are laminated in that order, and the first removable release sheet and the make film are processed into the mask element having the opening is produced; a step in which the lamination film is laminated on the substrate such that the mask element covers an edge portion on at least one side of the first electrode and an edge portion on at least one side of the functional layer; and a step in which the second removable release sheet and the carrier film in the lamination film are separated from the mask element.

2. The organic electronic element manufacturing method according to claim 1, further comprising a second electrode forming step in which a second electrode is formed on the functional layer using the mask element.

3. A method of manufacturing an organic electronic element having flexibility using a roll-to-roll process, the method comprising: a first electrode forming step in which a first electrode is pattern-formed onto a flexible substrate; and a mask forming step in which a mask element having flexibility is formed on the substrate such that it has an opening on at least a portion of the first electrode and covers an edge portion on at least one side of the first electrode, wherein the mask forming step includes a step in which a lamination film in which a first removable release sheet, a mask film having flexibility, a second removable release sheet, and a carrier film are laminated in that order, and the first removable release sheet and the mask film are processed into the mask element having the opening is produced; a step in which the lamination film is laminated on the substrate such that the mask element covers an edge portion on at least one side of the first electrode; and a step in which the second removable release sheet and the carrier film in the lamination film are sepoarated from the mask element.

4. The organic electronic element manufacturing method according to claim 3, further comprising a functional layer forming step in which a functional layer containing an organic material is pattern-formed onto the first electrode after the mask forming step; and a second electrode forming step in which a second electrode is formed on the functional layer using the mask element.

5. The organic electronic element manufacturing method according to claim 2, further comprising a sealing film forming step in which a sealing film is formed on the second electrode using the mask element.

6. The organic electronic element manufacturing method according to claim 2, further comprising a mask separating step in which the mask element is separated from the substrate.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1(A), FIG. 1(B), FIG. 1(C), FIG. 1(D), FIG. 1(E), FIG. 1(F) and FIG. 1(G) are diagrams (cross-sectional views) illustrating a method of manufacturing an organic EL element (organic electronic element) according to a first embodiment.

(2) FIG. 2 is a illustrating an intermediate product for the organic EL element after a mask forming step illustrated in FIG. 1(E) when viewed from above.

(3) FIG. 3 is a diagram illustrating an elongated substrate (roll substrate) in which a plurality of intermediate products for the organic EL element after the mask forming step illustrated in FIG. 1(E) are two-dimensionally arranged when viewed from above.

(4) FIG. 4(A) is a diagram illustrating an intermediate product for the organic EL element after the mask forming step illustrated in FIG. 1(E) and FIG. 4(B) is a diagram (cross-sectional view) illustrating a state in which the intermediate product for the organic EL element after a second electrode forming step illustrated in FIG. 1(F) is wound into a roll shape.

(5) FIG. 5(A), FIG. 5(B), FIG. 5(C), FIG. 5(D), FIG. 5(E) and FIG. 5(F) are diagrams (cross-sectional views) illustrating a method of manufacturing an organic EL element (organic electronic element) according to a modified example of the first embodiment.

(6) FIG. 6(A), FIG. 6(B), FIG. 6(C), FIG. 6(D), FIG. 6(E), FIG. 6(F) and FIG. 6(G) are diagrams (cross-sectional views) illustrating a method of manufacturing an organic EL element (organic electronic element) according to a second embodiment.

(7) FIG. 7(A), FIG. 7(B), FIG. 7(C), FIG. 7(D), FIG. 7(E) and FIG. 7(F) are diagrams (cross-sectional views) illustrating a method of manufacturing an organic EL element (organic electronic element) according to a modified example of the second embodiment.

(8) FIG. 8 is a diagram illustrating the intermediate product corresponding to FIG. 2, which is an intermediate product for the organic EL element according to the modified example, when viewed from above.

(9) FIG. 9 is a diagram illustrating the intermediate product corresponding to FIG. 2, which is an intermediate product for the organic EL element according to the modified example, when viewed from above.

DESCRIPTION OF EMBODIMENTS

(10) Embodiments will be described below in detail with reference to the drawings. Here, the same or corresponding components in the drawings are denoted with the same reference numerals.

First Embodiment

(11) FIGS. 1(A)-1(G) show diagrams (cross-sectional views) illustrating a method of manufacturing an organic EL element (organic electronic element) according to a first embodiment. FIG. 2 is a diagram illustrating the organic EL element illustrated in FIG. 1(E) when viewed from above. In addition, FIG. 3 is a diagram illustrating an elongated substrate (roll substrate) in which a plurality of organic EL elements illustrated in FIG. 1(E) are two-dimensionally arranged when viewed from above. In an organic EL element 1 in this example, a substrate 10 is set as a light emitting surface.

(12) First, using a continuous transport method such as a roll-to-roll process, according to a vapor deposition method, a sputtering method, an ion plating method, a plating method, a transfer method, or the like, as illustrated in FIG. 1(A), FIG. 2, and FIG. 3, on the film-like substrate (substrate having flexibility, flexible substrate) 10, a positive electrode layer (first electrode layer) 21 for an organic EL portion 20 is pattern-formed. In addition, on the film-like substrate 10, a lead-out electrode layer 22A to be bonded to a negative electrode layer (second electrode layer) to be described below may be pattern-formed. Here, the positive electrode layer 21 and the lead-out electrode layer 22A may be electrically insulated, may be spatially separated in a longitudinal direction X of the substrate 10, or may be isolated with an insulating layer therebetween (first electrode forming step). A width direction of the substrate 10 will be set below as Y.

(13) For the film-like substrate 10, a material having optical transparency such as PEN (polyethylene naphthalate) and PET (polyethylene terephthalate) may be used. For the positive electrode layer 21 and the lead-out electrode layer 22A, in particular, for a light emitting area of the positive electrode layer 21, for example, an electrode exhibiting optical transparency, more specifically, a conductive metal oxide thin film made of a relatively transparent material such as ITO (Indium Tin Oxide) and IZO (Indium Zinc Oxide) may be used. In addition, for the light emitting area of the positive electrode layer 21, a mesh electrode in which a metal is formed into a mesh shape can be used. A region other than the light emitting area of the positive electrode layer 21 and the lead-out electrode layer 22A may be made of the same material as the light emitting area of the positive electrode layer 21, or made of different materials, or may be opaque.

(14) Next, using a roll-to-roll process, according to a coating method (for example, an ink jet printing method, a slit coating method, a spray method, or a screen printing method), a light emitting layer 23 for the organic EL portion 20 is pattern-formed on the positive electrode layer 21 or on the positive electrode layer 21 and the lead-out electrode layer 22A. Here, between the light emitting layer 23 and the positive electrode layer 21, functional layers such as a hole injection layer, a hole transport layer, and an electron blocking layer may be provided. In addition, between the light emitting layer 23 and the negative electrode layer 22 to be described below, functional layers such as an electron injection layer, an electron transport layer, and a hole blocking layer may be provided. In addition, between the positive electrode layer 21 and the negative electrode layer 22, an insulating layer having a higher electrical resistance than an electrical resistance in a lamination direction of a region in which the light emitting layer of the light emitting region and the functional layer are laminated may be provided in a region other than the light emitting region.

(15) An edge portion 23a on one side in the longitudinal direction X of the light emitting layer 23 or the functional layer is formed to be shorter than an edge portion 21a such that the edge portion 21a on one side in the longitudinal direction X of the positive electrode layer 21 is exposed to obtain a lead-out wiring connecting portion. An edge portion 23b on the other side in the longitudinal direction X of the light emitting layer 23 or the functional layer is formed to be shorter than an edge portion 22b such that the edge portion 22b on the other side in the longitudinal direction X of the lead-out electrode layer 22A is exposed to obtain a lead-out wiring connecting portion. On the other hand, an edge portion 23c on one side in the width direction Y of the light emitting layer 23 or the functional layer is formed to be longer than an edge portion 21c such that the edge portion 21c on one side in the width direction Y of the positive electrode layer 21 is covered. The edge portion 23d on the other side in the width direction Y of the light emitting layer 23 is formed to be longer than an edge portion 21d such that the edge portion 21d on the other side in the width direction Y of the positive electrode layer 21 is covered. Here, the light emitting layer 23 may be deposited between the positive electrode layer 21 and the lead-out electrode layer 22A (functional layer forming step).

(16) Here, as illustrated in FIG. 8, the light emitting layer 23 or the functional layer may be formed such that at least a portion 21A of the positive electrode layer 21 on the side of the edge portion 21a on one side in the longitudinal direction X of the positive electrode layer 21 is exposed to obtain a lead-out wiring connecting portion and at least the portion 21A on the side of the edge portion 21a of the positive electrode layer 21 is exposed. In addition, the light emitting layer 23 or the functional layer may be formed such that at least a portion 22B of the lead-out electrode layer 22A on the side of the edge portion 22b on the other side in the longitudinal direction X of the lead-out electrode layer 22A is exposed to obtain a lead-out wiring connecting portion and at least a portion on the side of the edge portion 22b of the lead-out electrode layer 22A is exposed.

(17) The light emitting layer 23 contains various known organic EL materials such as low-molecular-weight type and high-molecular-weight type materials.

(18) Next, using a roll-to-roll process, as illustrated in FIG. 1(B) to FIG. 1(E), FIG. 2 and FIG. 3, a mask element with an opening 30 is formed on the substrate 10 to surround four sides of the positive electrode layer 21 and the light emitting layer 23 or the functional layer in an opening region. In other words, the mask element with an opening 30 is a grid-like mask element that crosses the substrate 10 in the longitudinal direction X and the width direction Y. The mask element 30 is formed to cover the edge portions 21a and 23a in the positive electrode layer 21 and the light emitting layer 23 or the functional layer. In addition, the mask element 30 is formed to surround the edge portion 23b in the light emitting layer 23 or the functional layer.

(19) In addition, the opening of the mask element 30 may have an arbitrary shape, for example, a circular shape or an elliptical shape as illustrated in FIG. 8. When the opening having an arbitrary shape is used, since the negative electrode layer 22 to be described below is formed into the shape of the opening, it is possible to obtain an arbitrary shape according to the shape of the opening, that is, it is possible to obtain a light emitting region having an arbitrary light emission pattern.

(20) In addition, as illustrated in FIG. 8, on the side of the lead-out electrode layer 22A, the mask element 30 may be formed such that the opening overlaps the portion (lead-out wiring connecting portion) 22B from which the lead-out electrode layer 22A is exposed, and thus the lead-out electrode layer 22A and the negative electrode layer 22 can be electrically connected. In addition, as illustrated in FIG. 8, on the side of the edge portion 21a of the positive electrode layer 21, the mask element 30 may be formed such that the opening does not overlap the portion (lead-out wiring connecting portion) 21A from which the positive electrode layer 21 is exposed.

(21) In addition, as illustrated in FIG. 9, the lead-out electrode layer 22A of the negative electrode layer 22 may be omitted. In addition, as illustrated in FIGS. 1(A)-1(G), FIG. 8 and FIG. 9, the opening of the mask element 30 may not overlap an exposed portion of the positive electrode layer 21 or the opening of the mask element 30 may overlap an exposed portion of the positive electrode layer 21. In this case, an insulating layer may be provided between the positive electrode layer 21 and the negative electrode layer 22.

(22) In this manner, the mask element 30 may be formed on the substrate 10 such that it has an opening on at least a portion of the light emitting layer 23 or the functional layer and on at least a portion of the positive electrode layer 21 with the light emitting layer 23 or the functional layer therebetween and covers the edge portions 21a and 23a on at least one side of the positive electrode layer 21 and the light emitting layer 23 or the functional layer.

(23) Specifically, first, as illustrated in FIG. 1(B) and FIG. 1(C), a first removable release sheet 32A, a mask film 31 having flexibility, a second removable release sheet 32B, and a carrier film 33 are laminated in that order and the release sheet 32A and the mask film 31 are processed into the mask element 30 to produce a lamination film 34. Specifically, the opening region is cut out from the release sheet 32A and the mask film 31 and thus the mask element 30 is produced.

(24) Next, as illustrated in FIG. 1(D), the lamination film 34 is laminated on the substrate 10 such that the mask element 30 covers the edge portions 21a and 23a of the positive electrode layer 21 and the light emitting layer 23 or the functional layer and the mask element 30 surrounds the edge portion 23b in the light emitting layer 23 or the functional layer.

(25) Next, as illustrated in FIG. 1(E), the removable release sheet 32B and the carrier film 33 in the lamination film 34 are separated from the mask element 30 (mask forming step).

(26) As a material of the mask film 31, that is, a material of the mask element 30, a material having the same coefficient of linear thermal expansion as the substrate can be selected in order to prevent the occurrence of separation and wrinkles depending on a temperature during a second electrode forming process. Specifically, examples of a material of the mask element 30 include PEN and PET. In addition, for the mask element 30, a plastic film having a glass transition temperature that is higher than the temperature during the second electrode forming process can be used. Specifically, examples of a material of the mask element 30 include a polyimide and a fluorine resin. In addition, for the mask element 30, a metal foil, a composite member in which a metal, particularly, Al or Cu, and a plastic film are laminated or a glass cloth can be used. For the removable release sheets 32A and 32B, an acrylic type, silicon type, or polyolefin material may be used. Examples of a material of the carrier film 33 include PET, PC (polycarbonate), PS (polystyrene), and PE (polyethylene).

(27) Next, using a roll-to-roll process, according to a vapor deposition method, a sputtering method, an ion plating method, a plating method, a transfer method, or the like, as illustrated in FIG. 1(F), the negative electrode layer 22 for the organic EL portion 20 is formed on the light emitting layer 23 or the functional layer. In this case, the mask element 30 is used as a mask (second electrode forming step). As the negative electrode layer 22, for example, an electrode exhibiting light reflectivity, more specifically, a conductive metal thin film made of a metal material may be used. In particular, in consideration of light reflectivity and conductivity, as the negative electrode layer 22, Al, an Al alloy (such as AlNd), Ag, and an Ag alloy (such as AgPaCu) are preferable.

(28) Next, using a roll-to-roll process, as illustrated in FIG. 1(G), the mask element 30 is separated from the substrate 10 (mask separating step). Here, after a sealing film is formed on the negative electrode layer 22 using the mask element 30 (sealing film forming step), the mask element 30 may be separated therefrom. As a material of the sealing film, a silicon oxide, a silicon oxynitride and a silicon nitride (may contain carbon in a composition) such as SiOx, SiOxNy, and SiNx, and an aluminum oxide such as AlxOy may be used for an inorganic film having a moisture permeability barrier property. Examples of a method of forming a sealing film include a CVD method, a sputtering method, a vapor deposition method, and a method of forming a film by coating a precursor and applying light or heat energy. In addition, in order to perform flattening or to prevent penetration of pinholes into the inorganic film, an organic layer made of an acrylic resin or the like may be formed. In addition, the organic layer may contain a metal oxide, a metal complex, or a getter material having a moisture capture function such as a zeolite.

(29) According to the method of manufacturing an organic EL element of the first embodiment, when the substrate 10 is first wound on a roller after the positive electrode layer 21 and the light emitting layer 23 or the functional layer are formed (refer to a roll cross section illustrated in FIG. 4(A)), the mask element 30 having flexibility makes it possible to prevent the film surface of the light emitting layer 23 or the functional layer from coming in contact with the back surface of the substrate 10 and additionally, it is possible to prevent the film surface of the light emitting layer 23 or the functional layer from coming in direct contact with a roller. In particular, even if the width of the substrate 10 becomes larger, the grid-like mask element 30 makes it possible to prevent the occurrence of sagging, and it is possible to prevent the film surface of the light emitting layer 23 or the functional layer from coming in contact with the back surface of the substrate 10 also in the central portion in the width direction Y. As a result, it is possible to prevent a film surface of the light emitting layer 23 or the functional layer from being physically or chemically damaged (protection of the film surface).

(30) Similarly, even when the substrate 10 is first wound on a roller after the negative electrode layer 22 is formed (refer to a roll cross section illustrated in FIG. 4(B)), the mask element 30 having flexibility makes it possible to prevent the film surface of the negative electrode layer 22 from coming in contact with the back surface of the substrate 10, and additionally, it is possible to prevent the film surface of the negative electrode layer 22 from coming in direct contact with a roller. In particular, even if the width of the substrate 10 becomes larger, the grid-like mask element 30 makes it possible to prevent the occurrence of sagging, and it is possible to prevent the film surface of the negative electrode layer 22 from coming in contact with the back surface of the substrate 10 also in the central portion in the width direction Y. As a result, it is possible to prevent the film surface of the negative electrode layer 22 from being physically or chemically damaged.

(31) In addition, according to method of manufacturing an organic EL element of the first embodiment, the mask element 30 can be used as a mask for forming the negative electrode layer 22, and it is not necessary to set a shadow mask for forming the negative electrode layer 22 as in the related art. Therefore, it is possible to improve continuous productivity (improvement in continuous productivity).

(32) Here, since the mask element 30 covers the edge portions 21a and 23a in the positive electrode layer 21 and the light emitting layer 23 or the functional layer, when the mask element 30 is used as a mask for forming the negative electrode layer 22, it is possible to prevent the positive electrode layer 21 and the negative electrode layer 22 from coming in contact with each other and it is possible to form a connecting portion for lead-out wiring on the edge portion 21a of the positive electrode layer 21. In addition, since the mask element 30 covers the edge portion 22b in a portion of the negative electrode layer 22, it is possible to form a connecting portion for lead-out wiring on the edge portion 22b of the negative electrode layer 22.

Modified Example of First Embodiment

(33) FIGS. 5(A)-5(F) are diagrams (cross-sectional view) illustrating a method of manufacturing an organic EL element (organic electronic element) according to a modified example of the first embodiment. The method of manufacturing an organic EL element of the modified example differs from the method of manufacturing an organic EL element of the first embodiment in that it includes a mask forming step illustrated in FIG. 5(B) to FIG. 5(D) in place of the mask forming step illustrated in FIG. 1(B) to FIG. 1(E) in the first embodiment. Here, the first electrode forming step and the functional layer forming step illustrated in FIG. 5(A) are the same as the first electrode forming step and the functional layer forming step illustrated in FIG. 1(A), and the second electrode forming step illustrated in FIG. 5(E) is the same as the second electrode forming step illustrated in FIG. 1(F). The mask separating step illustrated in FIG. 5(F) is the same as the mask separating step illustrated in FIG. 1(G).

(34) The mask forming step illustrated in FIG. 5(B) to FIG. 5(D) will be described below. First, as illustrated in FIG. 5(B), the removable release sheet 32A and the mask film 31 having flexibility are sequentially laminated on the substrate 10 such that the positive electrode layer 21 and the light emitting layer 23 or the functional layer are covered.

(35) Next, as illustrated in FIG. 5(C) and FIG. 5(D), the release sheet 32A and the mask film 31 are processed into the mask element 30. Specifically, an opening region is cut out from the release sheet 32A and the mask film 31 such that the mask element 30 covers the edge portions 21a and 23a in the positive electrode layer 21 and the light emitting layer 23 or the functional layer, and the mask element 30 surrounds the edge portion 23b in the light emitting layer 23 or the functional layer, and thus the mask element 30 is produced.

(36) Also in the method of manufacturing an organic EL element of the modified example, it is possible to obtain the same advantages as in the method of manufacturing an organic EL element of the first embodiment.

Second Embodiment

(37) FIGS. 6(A)-6(G) are diagrams (cross-sectional view) illustrating a method of manufacturing an organic EL element (organic electronic element) according to the second embodiment. The method of manufacturing an organic EL element of the second embodiment differs from the method of manufacturing an organic EL element of the first embodiment in that the order of the functional layer forming step and the mask forming step in the first embodiment is changed.

(38) First, using a continuous transport method such as a roll-to-roll process, according to a vapor deposition method, a sputtering method, an ion plating method, a plating method, a transfer method or the like, as illustrated in FIG. 6(A), the positive electrode layer 21 for the organic EL portion 20 is pattern-formed on the film-like substrate 10. In addition, the lead-out electrode layer 22A to be bonded to the negative electrode layer (second electrode layer) may be pattern-formed on the film-like substrate 10 (first electrode forming step).

(39) Next, using a roll-to-roll process, as illustrated in FIG. 6(B) to FIG. 6(E), the mask element with an opening 30 is formed on the substrate 10 to surround four sides of the positive electrode layer 21 in an opening region. In other words, the mask element with an opening 30 is a grid-like mask element that crosses the substrate 10 in the longitudinal direction X and the width direction Y. The mask element 30 is formed to cover the edge portion 21a in the positive electrode layer 21.

(40) Specifically, first, as illustrated in FIG. 6(B) and FIG. 6(C), the first removable release sheet 32A, the mask film 31 having flexibility, the second removable release sheet 32B, and the carrier film 33 are laminated in that order, and the release sheet 32A and the mask film 31 are processed into the mask element 30 to produce the lamination film 34. Specifically, the opening region is cut out from the release sheet 32A and the mask film 31 and thus the mask element 30 is produced.

(41) Next, as illustrated in FIG. 6(D), the lamination film 34 is laminated on the substrate 10 such that the mask element 30 covers the edge portion 21a of the positive electrode layer 21 and the mask element 30 covers the edge portion 22b of the negative electrode layer 22.

(42) Next, as illustrated in FIG. 6(E), the removable release sheet 32B and the carrier film 33 in the lamination film 34 are separated from the mask element 30 (mask forming step).

(43) Next, using a roll-to-roll process, according to a coating method (for example, an ink jet printing method, a slit coating method, a spray method, or a screen printing method), as illustrated in FIG. 6(F), the light emitting layer 23 or the functional layer for the organic EL portion 20 is pattern-formed on the positive electrode layer 21 and the lead-out electrode layer 22A. The edge portion 23a of the light emitting layer 23 or the functional layer is formed such that it comes in contact with the mask element 30 and is formed to be shorter than the edge portion 21a such that the edge portion 21a of the positive electrode layer 21 is exposed to obtain a lead-out wiring connecting portion. On the other hand, the edge portion 23b of the light emitting layer 23 or the functional layer is formed such that it provides a space with the mask element 30 therebetween and is formed to be shorter than the edge portion 22b such that the edge portion 22b of the negative electrode layer 22 is exposed to obtain a lead-out wiring connecting portion. In addition, the edge portion 23c of the light emitting layer 23 is formed to be longer than the edge portion 21c such that the edge portion 21c of the positive electrode layer 21 is covered and the edge portion 23d of the light emitting layer 23 is formed to be longer than the edge portion 21d such that the edge portion 21d of the positive electrode layer 21 is covered (functional layer forming step).

(44) Next, using a roll-to-roll process, according to a vapor deposition method, a sputtering method, an ion plating method, a plating method, a transfer method or the like, as illustrated in FIG. 6(F), the negative electrode layer 22 for the organic EL portion 20 is formed on the light emitting layer 23. In this case, the mask element 30 is used as a mask (second electrode forming step).

(45) Next, using a roll-to-roll process, as illustrated in FIG. 6(G), the mask element 30 is separated from the substrate 10 (mask separating step). Here, after a sealing film is formed on the negative electrode layer 22 using the mask element 30 (sealing film forming step), the mask element 30 may be separated therefrom.

(46) Also in the method of manufacturing an organic EL element of the second embodiment, it is possible to obtain the same advantages as in the method of manufacturing an organic EL element of the first embodiment.

Modified Example of Second Embodiment

(47) FIGS. 7(A)-7((F) show diagrams (cross-sectional views) illustrating a method of manufacturing an organic EL element (organic electronic element) according to a modified example of the second embodiment. The method of manufacturing an organic EL element of the modified example differs from the method of manufacturing an organic EL element of the second embodiment in that it includes a mask forming step illustrated FIG. 7(B) to FIG. 7(D) in place of the mask forming step illustrated in FIG. 6(B) to FIG. 6(E) in the second embodiment. Here, the first electrode forming step illustrated in FIG. 7(A) is the same as the first electrode forming step illustrated in FIG. 6(A), the functional layer forming step and the second electrode forming step illustrated in FIG. 7(E) are the same as the functional layer forming step and the second electrode forming step illustrated in FIG. 6(F), and the mask separating step illustrated in FIG. 7(F) is the same as the mask separating step illustrated in FIG. 6(G).

(48) A mask forming step illustrated in FIG. 7(B) to FIG. 7(D) will be described below. First, as illustrated in FIG. 7(B), the removable release sheet 32A and the mask film 31 having flexibility are sequentially laminated on the substrate 10 such that the positive electrode layer 21 is covered.

(49) Next, as illustrated in FIG. 7(C) and FIG. 7(D), the release sheet 32A and the mask film 31 are processed into the mask element 30. Specifically, an opening region is cut out from the release sheet 32A and the mask film 31 such that the mask element 30 covers the edge portion 21a of the positive electrode layer 21, the mask element 30 covers the edge portion 22b of the negative electrode layer 22, and the mask element 30 surrounds the edge portions 21c and 21d of the positive electrode layer 21, and thus the mask element 30 is produced.

(50) Also in the method of manufacturing an organic EL element of the modified example, it is possible to obtain the same advantages as in the method of manufacturing an organic EL element of the first and second embodiments.

(51) Here, the present invention is not limited to the above embodiments and various modifications can be made. For example, while an organic EL element including a light emitting layer (functional layer) between a pair of electrodes has been exemplified in the present embodiment, features of the present invention can also be applied to various organic EL elements illustrated below.

(52) a) Positive electrode/light emitting layer/negative electrode

(53) b) Positive electrode/hole injection layer/light emitting layer/negative electrode

(54) c) Positive electrode/hole injection layer/light emitting layer/electron injection layer/negative electrode

(55) d) Positive electrode/hole injection layer/light emitting layer/electron transport layer/electron injection layer/negative electrode

(56) e) Positive electrode/hole injection layer/hole transport layer/light emitting layer/negative electrode

(57) f) Positive electrode/hole injection layer/hole transport layer/light emitting layer/electron injection layer/negative electrode

(58) g) Positive electrode/hole injection layer/hole transport layer/light emitting layer/electron transport layer/electron injection layer/negative electrode

(59) h) Positive electrode/light emitting layer/electron injection layer/negative electrode

(60) i) Positive electrode/light emitting layer/electron transport layer/electron injection layer/negative electrode

(61) Here, the symbol / indicates that layers between which the symbol / is interposed are laminated adjacent to each other.

(62) Here, the method of manufacturing an organic EL element in the form in which a positive electrode layer is disposed on the side of the substrate with respect to the light emitting layer and a negative electrode layer is disposed on the side opposite to the substrate with respect to the light emitting layer has been exemplified in the present embodiment. However, the present invention can also be applied to a manufacturing method in the form in which the negative electrode layer is disposed on the side of the substrate with respect to the light emitting layer and the positive electrode layer is disposed on the side opposite to the substrate with respect to the light emitting layer.

(63) In addition, while the method of manufacturing an organic EL element (organic electronic element) has been exemplified in the present embodiment, the features of the present invention can also be applied to a method of manufacturing an organic solar cell (organic electronic element) and an organic transistor (organic electronic element).

REFERENCE SIGNS LIST

(64) 1 Organic EL element (organic electronic element) 10 Substrate (elongated substrate) 20 Organic EL portion 21 Positive electrode layer (first electrode) 21a, 21c, 21d Edge portion on each side of positive electrode layer 22 Negative electrode layer (second electrode) 22b Edge portion on each side of negative electrode layer 22A Lead-out electrode layer 23 Light emitting layer (functional layer) 23a, 23b, 23c, 23d Edge portion on each side of light emitting layer 30 Mask element 31 Mask film 32A, 32B First and second release sheets 33 Carrier film 34 Lamination film X Longitudinal direction of elongated substrate Y Width direction of elongated substrate