FLEXIBLE SUBSTRATE, METHOD OF FABRICATING SAME, AND DISPLAY PANEL
20200144521 ยท 2020-05-07
Inventors
Cpc classification
H10K71/00
ELECTRICITY
H05K2201/0145
ELECTRICITY
Y02P70/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10T428/24628
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10T428/24653
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H05K1/189
ELECTRICITY
Y10T428/24917
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10T428/2419
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y02E10/549
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
Abstract
The present invention provides a flexible substrate, a method of fabricating the flexible substrate and a display panel. The present invention has the advantages that the bendable region of the flexible substrate forms a curved section in the same direction as the bendable direction of the bendable region, thereby reducing the stress of the flexible substrate in the region and reducing the risk of breakage of individual layers of the flexible substrate when bent.
Claims
1. A flexible substrate, comprising at least one non-bending region and at least one bendable region, wherein the flexible substrate has at least one curved section, and a curved direction of the curved section is consistent with a bendable direction of the bendable region.
2. The flexible substrate of claim 1, wherein a curvature of the curved section is the same as a curvature of the bendable region after the bendable region is bent.
3. The flexible substrate of claim 1, further comprising a flexible base and a plurality of functional layers disposed on the flexible base, wherein at least a portion of the functional layers extends to the bendable region of the flexible substrate, and the flexible base and the functional layers are both curved at the curved section.
4. The flexible substrate of claim 3, wherein the functional layers extending to the bendable region comprises a metal trace layer.
5. The flexible substrate of claim 3, wherein the functional layers comprise a thin film transistor layer disposed in the non-bending region.
6. The flexible substrate of claim 1, wherein the flexible substrate comprises two non-bending regions, and the bendable region is disposed between the two non-bending regions.
7. A method of fabricating the flexible substrate according to claim 1, comprising the following steps: providing a support plate comprising at least a first region and at least a second region; forming at least one protrusion of a curved shape in the second region of the support plate; forming a flexible substrate layer on a surface of the support plate and a surface of the protrusion, wherein a region of the flexible substrate layer corresponding to the first region is a non-bending region, while a region of the flexible substrate layer corresponding to the second region is a bendable region, and the flexible substrate layer forms a curved portion at a position corresponding to the protrusion; and removing the support plate and the protrusion to form the flexible substrate.
8. The method of fabricating a flexible substrate according to claim 7, wherein the step of forming at least one protrusion of a curved shape in the second region of the support plate comprises: coating a pad on the second region of the support plate; and heat-curing the pad to form the protrusion.
9. The method of fabricating a flexible substrate according to claim 7, wherein a curvature of the curved section is consistent with a curvature of the bendable region after the bendable region is bent.
10. The method of fabricating a flexible substrate according to claim 7, wherein the step of forming a flexible substrate layer on a surface of the support plate and a surface of the protrusion comprises the following steps: forming a flexible base layer on a surface of the support plate and a surface of the protrusion; forming a plurality of functional layers on the flexible base layer, wherein at least a portion of the functional layers extends to the bendable region of the flexible substrate, and the flexible base and the functional layer are both curved at the curved section.
11. The method of fabricating a flexible substrate according to claim 10, wherein the functional layers extending to the bendable region comprise a metal trace layer.
12. The method of fabricating a flexible substrate according to claim 10, wherein the functional layers comprise a thin film transistor layer disposed in the non-bending region.
13. The method of fabricating a flexible substrate according to claim 7, wherein the flexible substrate comprises two non-bending regions, and the bendable region is disposed between the two non-bending regions.
14. A display panel comprising the flexible substrate of claim 1, wherein a display layer is disposed on the flexible substrate.
15. The display panel of claim 14, wherein the display layer comprises a liquid crystal layer and a color filter substrate, and the liquid crystal layer is disposed between the flexible substrate and the color filter substrate.
16. The display panel of claim 14, wherein the display layer comprises an organic light emitting layer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the embodiments or the technical solutions of the existing art, the drawings illustrating the embodiments or the existing art will be briefly described below. Obviously, the drawings in the following description merely illustrate some embodiments of the present invention. Other drawings may also be obtained by those skilled in the art according to these figures without paying creative work.
[0024]
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[0031]
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0032] Specific embodiments of a flexible substrate, a method for fabricating the flexible substrate, and a display panel provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0033]
[0034] The flexible substrate 20 may include a plurality of non-bending regions A and a plurality of bendable regions B that are alternately arranged, but the invention is not limited thereto. For example, referring to
[0035] Referring to
[0036] In this embodiment, the flexible substrate 20 has a curved section 21. A curvature of the curved section 21 is the same as a curvature of the bendable region B after the flexible substrate is bent.
[0037] The number of the curved sections 21 is not particularly limited in the present invention. For example, referring to
[0038] The flexible substrate 20 of the present invention may be bent at various positions including the display area, and thus can be used to manufacture a flexible display panel; or can be bent mainly at a non-display area such as an edge, and thus can be used, for example, to manufacture a display panel with a narrow border.
[0039] Further, please still refer to
[0040] The flexible base 200 may be made of a polymer, such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate, polymer materials such as (PEN), polyarylate (PAR) or glass fiber reinforced plastic (FRP), and the like. Functional layers 201 refer to various layers such as a driving circuit layer, a metal trace layer, a gate layer, a gate dielectric layer, a source/drain layer, a semiconductor material layer, a passivation layer, and the like, which are constructed to realize a display function of the displaying layers such as an organic electroluminescent layer, a liquid crystal layer, a plasma layer, and an electronic ink layer. Functional layers 201 may be formed on the flexible base 200 by semiconductor fabrication processes well known to those skilled in the art, including, but are not limited to, photolithography, etching, coating, sputtering, vapor deposition, doping, and the like.
[0041] At least a portion of the functional layers 201 extends to the bendable region B of the flexible substrate 20, and the flexible base 200 and the functional layers 201 are each in a curved configuration. The functional layers 201 extending to the bendable region B of the flexible substrate 20 include, but are not limited to, a metal trace layer, a buffer layer, a passivation layer, and the like. In this embodiment, the functional layers 201 extending to the bendable region B of the flexible substrate 20 include the metal trace layer 204. In the bendable region B, because the flexible base 200 and the functional layers 201 are both curved in the curved section 21, when they are bent, the stress of the functional layers 201 in the bendable region can be reduced, thereby reducing the risk of breakage of each functional layer 201 when functional layers 201 are bent. The functional layers 201 further include a thin film transistor layer 202 disposed in the non-bendable region A. Further, the thin film transistor layer 202 is further covered with an alignment layer 203. The functional layers 201 are conventional structures in the art, and details are not repeated herein for brevity.
[0042] The present invention also provides a method of fabricating the above-mentioned flexible substrate.
[0043] Referring to
[0044] Referring to
[0045] Referring to
[0046] In this step, the flexible substrate layer is not specifically limited to a single layer structure, and it may be a single layer structure or a multilayer structure. For example, in this embodiment, the flexible substrate layer has a multilayer structure including a flexible base layer 6041 and a plurality of functional layers 606. The functional layers include, but are not limited to, a thin film transistor layer 6061, an alignment layer 6062, and a metal trace layer 6063. The description of the functional layers can be referred to the above, and details are not repeated herein for brevity.
[0047] The flexible substrate layer forms the curved section 605 at a position corresponding to the protrusion 603. In this step, due to the presence of the protrusion 603 on the support plate 600, when the flexible substrate layer is formed, a curved section 605 of the flexible substrate layer is naturally formed at the protrusion 603 according to the contour of the protrusion 603.
[0048] Specifically, in the embodiment, the method of forming the flexible substrate layer on the surface of the support plate 600 and the surface of the protrusion 603 includes the following steps:
[0049] (1) Referring to
[0050] (2) Referring to
[0051] Referring to
[0052] Optionally, depending on different applications of the flexible substrate 610 of the present invention, the step of forming other structures is further performed before the support plate 600 and the protrusion 603 are removed, wherein the support plate 600 provides support functions. Specifically, if the flexible substrate 610 is used as the array substrate of the liquid crystal display device, before the step of removing the support plate 600 and the protrusion 603, the method further includes: a step of assembling a color filter substrate and the flexible substrate 610 into a cell and filling the cell with liquid crystal. These steps are conventional, and details are not repeated herein for brevity.
[0053] According to the method of fabricating the flexible substrate of the present invention, the curved section 605 can be formed at the bendable region B of the flexible substrate 610, thereby reducing the stress of the functional layers 606 located at this region, and reducing a risk of breakage of the various functional films when they are bent.
[0054] The flexible substrate of the present invention can be applied to an organic light emitting diode (OLED) display device, a liquid crystal display (LCD), a plasma display panel (PDP), or an electronic ink display device. For example, the flexible substrate can be used as a carrier and a driving unit of an organic electroluminescent material, a liquid crystal, a plasma or an electronic ink, and a displaying layer such as an organic electroluminescent material layer, a liquid crystal layer, a plasma layer or an electronic ink layer can be formed on the functional layers to fabricate a corresponding display panel. Meanwhile, those skilled in the art can readily appreciate that the flexible array substrate of the present invention may also be applied to other technical fields in addition to the display field. In such cases, the functional layers refer to various layers required for realizing other target functions.
[0055] The present invention also provides a display panel.
[0056]
[0057] While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
[0058] The subject matter of the present application can be manufactured and used in the industry with industrial applicability.