NONDESTRUCTIVE INTEGRATION OF ELECTRONICS

20200144340 ยท 2020-05-07

    Inventors

    Cpc classification

    International classification

    Abstract

    A thin, sheetlike, electronic, self-powered component including at least a display device and/or a sensor, as well as an energy source or a combination of the preceding is provided. Furthermore, the integration of this electrical component in existing products, especially printing and paper products, without the objects having to be damaged or destroyed is provided.

    Claims

    1. A sheetlike electronic component comprising a display device, an energy source and a conductor track wherein the component comprises: a layer of electronics, comprising the display device, the energy source and the conductor track; and a layer of a printable cover layer, wherein the cover layer is at least partly translucent; wherein the layer of electronics is placed onto the printable cover layer, which is a nonconducting substrate, or onto a separate layer of nonconducting substrate.

    2. (canceled)

    3. The sheetlike electronic component of claim 1 wherein the component has a thickness less than 0.3 mm.

    4. The sheetlike electronic component of claim 1 wherein the layer of electronics is applied at least partly with a printing process chosen from a group consisting of inkjet, screen printing, flexographic printing, and offset printing.

    5. The sheetlike electronic component of claim 1 wherein the display device is an organic light-emitting diode (OLED).

    6. The sheetlike electronic component of claim 5 wherein the OLED comprises a cathode, an anode and a layer system between the cathode and the anode, having: at least one electron injection layer near the cathode, at least one electron transport layer at least one optically active layer at least one hole transport layer at least one hole injection layer near the anode wherein the at least one electron injection layer and the at least one hole injection layer are diffusion-limiting with respect to water and/or oxygen, and the at least one electron transport layer and the at least one hole transport layer constitute a diffusion barrier to water and/or oxygen.

    7. The sheetlike electronic component of claim 1 wherein the energy source comprises a battery, an organic solar cell or a capacitor.

    8. The sheetlike electronic component of claim 1 wherein the conductor track comprises silver, copper or carbon as printing material.

    9. (canceled)

    10. The sheetlike electronic component of claim 1 wherein the cover layer comprises cellulose-containing materials, preferably paper or cardboard, especially preferably transparent paper, waxed paper or films of preferably polyethylene naphthalate (PEN) or polyethylene terephthalate (PET).

    11. The sheetlike electronic component of claim 1 wherein the nonconducting substrate comprises paper and/or or PET.

    12. The sheetlike electronic component of claim 1 wherein an additional nonconducting cap layer is present between the cover layer and the electronics, the nonconducting cap layer having a cutout for the display device.

    13. The sheetlike electronic component of claim 1 wherein the layer of electronics comprises a switch for the activating of the display device.

    14. The sheetlike electronic component of claim 1 wherein the cover layer has a cutout above the conductor track, whereby a circuit is closed by its contacting a conductive object, so that the display device lights up.

    15. The sheetlike electronic component of claim 1 wherein the layer of electronics comprises a sensor, preferably a light sensor.

    16. The sheetlike electronic component of claim 1 wherein the layer of electronics comprises a control electronics with one or more transistors.

    17. A method for manufacturing the sheetlike electronic component as claimed in claim 1, comprising: providing the nonconducting substrate applying the middle layer of electronics comprising the display device, the energy source and the conductor tracks onto the substrate applying the printable cover layer, which is at least partly translucent, onto the electronics.

    18. A method for manufacturing the sheetlike electronic component as claimed in claim 1, comprising: providing the cover layer, which is a nonconducting substrate and at least partly translucent; applying a cap layer onto one side of the cover layer applying the layer of electronics onto an opposite side of the cover layer or onto the cap layer.

    19. A use of the sheetlike electronic component claim 1 for the design of products and packages, especially print and paper products, wherein the sheetlike electronic component is applied onto a surface of the products or packages with the aid of an adhesive.

    20. A product wherein a sheetlike electronic component of claim 1 is applied onto a surface of the product.

    21. The product of claim 20 wherein the product comprises a surface of an at least partially translucent material, which serves as the printable cover layer and the nonconducting substrate, having an imprinting on one side, wherein electronics comprising a display device, an energy source and a conductor track is applied to an opposite side of the imprinting, so that a light signal of the display device is visible through the surface.

    22. The product of claim 21 wherein the surface is a cardboard or a paper, and the surface is applied to a corrugated cardboard with the aid of adhesive bonding.

    Description

    BRIEF DESCRIPTION OF THE FIGURES

    [0099] FIG. 1a, b Schematic representation of the integration of electronics in existing products in the prior art

    [0100] FIG. 2a-c Schematic representation of a preferred embodiment of the sheetlike component according to the invention and illustration of its integration in a product

    [0101] FIG. 3a, b Schematic representation of a preferred embodiment of the sheetlike component according to the invention to illustrate preferred cover layers

    DETAILED DESCRIPTION OF THE FIGURES

    [0102] FIG. 1 a and b is a schematic representation of the integration of electronics in existing products as is known in the prior art. The product comprises a surface 1.1, on which the electronics will be applied. FIG. 1a shows a three-dimensional view of the product and FIG. 1b shows a cross section through the surface 1.1. This surface 1.1 may be, for example, the paper or cardboard surface of a packaging. In the surface 1.1. an electronics comprising a display device 1.3, such as a light-emitting diode (LED), is to be integrated. For this purpose, in the prior art it is necessary to cut open the surface 1.1. of the product. In FIG. 1a, this is shown schematically by the broken line (cut). After this, the electronic components such as the display device 1.3, the battery 1.5 and cable 1.4 for connecting the battery 1.5 to the display device 1.3 are placed behind the surface 1.1 opened up by the cut. Typical paper and cardboard surfaces of the packaging of products are not transparent or not sufficiently transparent to allow the light signal of the display device to become visible. For this reason, it is necessary to provide, at the position of the display device 1.3, a cutout or opening 1.2 in the surface 1.1. The opening 1.2 thus constitutes an inhomogeneity, which allows the consumer to see that an electronics has been integrated. FIG. 1b shows a cross section through the electronics introduced into the surface along the broken line shown in FIG. 1a. Besides the punching and cutting for the insertion, it is necessary to connect the electrical components such as the battery 1.5 and the cable 1.4 on the opposite side of the surface 1.1. In the prior art, therefore, the electronics is often assembled in advance, with the aid of costly soldering processes. After this, the electronics is placed behind the surface 1.1., for example with a mounter, wherein adhesives 1.7 and/or solder 1.6 are needed in order to fasten the electronics to the inner side of the surface 1.1.

    [0103] FIG. 2 shows a preferred embodiment of the sheetlike component 2.0 according to the invention and its integration in the surface 1.1. of a product. With the aid of the sheetlike component 2.0 according to the invention, it is not necessary to cut open the surface 1.1. of the product for the integration of the electronics. Instead, the sheetlike component 2.0 according to the invention, in which the electronics is already integrated, is applied by a simple glue to the surface 1.1 of the product (FIG. 2a). It is especially preferable for the dimension of the sheetlike component 2.0 to be adapted to the size of the surface 1.1, so that no edges are visible. In this way, the integration of the sheetlike component 2.0 on the product surface 1.1. is not visible to the customer, unlike the case of destructive methods. The sheetlike component 2.0 is preferably less than 0.3 mm thick and may be considered to be a laminate made of at least two, preferably at least three layers. FIG. 2b shows a cross section through the product surface 1.1 and the sheetlike component 2.0. FIG. 2c illustrates the electronics integrated in the sheetlike component 2.0. As its bottom layer, the sheetlike component 2.0 has a nonconducting substrate 2.7. On the substrate 2.7 is placed a display device 2.1, such as an OLED, and an energy source 2.2., such as a battery. Furthermore, other electronic components may be placed on the substrate 2.7. Preferably, this is done at least in part with the aid of a printing process. In the preferred embodiment shown, conductor tracks 2.6 are present on the substrate 2.7, connecting the display device 2.1 to a control electronics 2.4, which may comprise a receiver unit, for example, to actuate the display device 2.1 with the aid of an external device (not shown). In the embodiment shown, the control electronics is connected to a sensor 2.3 and/or a switch 2.5. The sensor 2.3 may be a light-sensitive sensor, for example, which releases a voltage from the energy source 2.2., such as a battery, to the display device 2.1. It may also be preferable for this purpose that the switch 2.5 brings about the releasing of electric current from the energy source 2.2 to the display device 2.1 for example by a pressing action. The switch 2.5 and the sensor 2.3 can regulate the connection of the display device 2.1 to the energy source 2.2 either alternatively to each other or in combination. It is preferable for the middle layer, comprising the electronics, to be covered by a printable cover layer 3.1. The functioning of a preferred embodiment of the top layer of the printable cover layer 3.1 is shown in FIG. 3.

    [0104] FIG. 3 shows a schematic representation of a preferred embodiment of the sheetlike component according to the invention as an illustration of preferred cover layers. On the substrate 2.7, as shown in FIG. 2, there is placed an electronics. For easier comprehension, this is not shown in FIG. 3a. In the embodiment shown, at first a nonconducting cap layer 3.3 is placed on the electronics, for example by screen printing. This serves in particular as additional optical covering, in order to conceal the components of the electronics. On the nonconducting cap layer 3.3, there is placed in the preferred embodiment a printable cover layer 3.1. It may also be preferable to place the cover layer 3.1 directly on the substrate. The cover layer is preferably at least partly translucent, so that the display device 2.1 can shine through the cover layer 3.1. It is preferable to place a colored imprint 3.2, for example with the aid of various glazing steps, on the printable cover layer 3.1. Preferably, the colors of the imprint are chosen such that the desired light signal of the display device 2.1 remains visible, while other electronics components such as the conductor tracks 2.6 are covered up.

    [0105] FIG. 3b shows a cross sectional representation of a cutout of the sheetlike electronic component of FIG. 3a. The display device 2.1 is connected by conductor tracks 2.6 to an energy source (not shown). A nonconducting cap layer 3.3 has been placed with the aid of a printing process, preferably screen printing, on the conductor tracks 2.6, but not on the display device 2.1, being optically opaque and thus concealing the conductor tracks 2.6. On top of the display device 2.1, and also on top of the cap layer 3.3, there is placed a printable cover layer 3.1, which is at least partly translucent. The cover layer 3.1 may be optically configured by placement of an imprint 3.2, preferably a colored layer, as is desired for the product. Preferably, the printer color for the imprinting of the cover layer 3.1 is chosen such that the light signal of the display device 2.1 can shine through the cover layer 3.1 and the imprint 3.2. In this way, a homogeneous design surface is obtained, with the display device 2.1 being optically integrated in the product surface 1.1, and without the customer being able to see that the product contains an electronics.

    [0106] It is pointed out that various alternatives to the described embodiments of the invention can be used to implement the invention and arrive at the solution according to the invention. The sheetlike electronic component according to the invention as well as its manufacture in the described method are therefore not limited in their embodiments to the foregoing preferred embodiments. Instead, many variant embodiments are conceivable, which may differ from the represented solution. The aim of the claims is to define the protection scope of the invention. The protection scope of the claims is meant to cover the optoelectronic component according to the invention and the method for its manufacture as well as equivalent embodiments thereof.

    LIST OF REFERENCE NUMBERS

    [0107] 1.1 Side surface of a product [0108] 1.2 Opening for display device [0109] 1.3 Display device [0110] 1.4 Cable [0111] 1.5 Battery [0112] 1.6 Solder [0113] 1.7 Adhesive [0114] 2.0 Sheetlike electronic component [0115] 2.1 Display device [0116] 2.2 Energy source [0117] 2.3 Sensor [0118] 2.4 Control electronics [0119] 2.5 Switch [0120] 2.6 Conductor tracks [0121] 2.7 Nonconducting substrate [0122] 3.1 Printable cover layer [0123] 3.2 Imprint [0124] 3.3 Nonconducting cap layer