Vehicular luminous laminated glazed roof, vehicle incorporating same and manufacture
10639869 ยท 2020-05-05
Assignee
Inventors
Cpc classification
H01L33/62
ELECTRICITY
B32B17/10036
PERFORMING OPERATIONS; TRANSPORTING
B32B17/10348
PERFORMING OPERATIONS; TRANSPORTING
B60Q3/76
PERFORMING OPERATIONS; TRANSPORTING
B32B2255/10
PERFORMING OPERATIONS; TRANSPORTING
H01L25/13
ELECTRICITY
B32B2367/00
PERFORMING OPERATIONS; TRANSPORTING
B32B37/182
PERFORMING OPERATIONS; TRANSPORTING
B32B38/0004
PERFORMING OPERATIONS; TRANSPORTING
B32B3/266
PERFORMING OPERATIONS; TRANSPORTING
B32B17/10541
PERFORMING OPERATIONS; TRANSPORTING
B60Q9/00
PERFORMING OPERATIONS; TRANSPORTING
B32B17/10293
PERFORMING OPERATIONS; TRANSPORTING
B32B17/10005
PERFORMING OPERATIONS; TRANSPORTING
B60Q1/2696
PERFORMING OPERATIONS; TRANSPORTING
B32B2605/006
PERFORMING OPERATIONS; TRANSPORTING
B32B2307/4026
PERFORMING OPERATIONS; TRANSPORTING
B32B17/10935
PERFORMING OPERATIONS; TRANSPORTING
B32B3/30
PERFORMING OPERATIONS; TRANSPORTING
B32B2367/00
PERFORMING OPERATIONS; TRANSPORTING
B32B17/10005
PERFORMING OPERATIONS; TRANSPORTING
International classification
B32B17/06
PERFORMING OPERATIONS; TRANSPORTING
B60Q3/14
PERFORMING OPERATIONS; TRANSPORTING
B60Q3/20
PERFORMING OPERATIONS; TRANSPORTING
B60Q3/76
PERFORMING OPERATIONS; TRANSPORTING
B60Q9/00
PERFORMING OPERATIONS; TRANSPORTING
B32B3/26
PERFORMING OPERATIONS; TRANSPORTING
B32B3/30
PERFORMING OPERATIONS; TRANSPORTING
B32B37/18
PERFORMING OPERATIONS; TRANSPORTING
H01L33/62
ELECTRICITY
B60Q1/26
PERFORMING OPERATIONS; TRANSPORTING
B60Q1/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A laminated glazed roof includes a first glazing, forming an exterior glazing, with first and second main faces; a lamination interlayer made of polymeric material of thickness e1 of at most 1.8 mm; a second glazing, forming an interior glazing, with third and fourth main faces, the second and third main faces being the internal faces of the laminated glazing; and a set of diodes that are housed in through apertures or blind holes of the lamination interlayer.
Claims
1. A luminous laminated glazed roof for a vehicle, said roof comprising: a laminated glazing including: a first transparent glazing, made of mineral glass, with first and second main faces, which first transparent glazing is intended to be an exterior glazing; a second transparent glazing made of mineral glass, with third and fourth main faces, which second transparent glazing is intended to be an interior glazing; between the second and third main faces, which are internal faces of the laminated glazing, a transparent lamination interlayer film made of thermoplastic polymeric material, the lamination interlayer film having a fifth main face oriented toward the second main face and a sixth main face oriented toward the third main face; and at least one inorganic light-emitting diode, each inorganic light-emitting diode including at least one semiconductor chip, each inorganic light-emitting diode being able to emit in a direction of the third main face; wherein said lamination interlayer is provided, between the fifth main face and the sixth main face, with one or more apertures that are through apertures or that form blind holes, each inorganic light-emitting diode being of sub-millimeter-sized thickness and being housed in a through aperture or a blind hole; wherein each inorganic light-emitting diode is associated with a through aperture or a blind hole encircling the edge face of the inorganic light-emitting diode, or wherein at least one group of said inorganic light-emitting diodes is associated with a common, through aperture or a common, blind hole, wherein a group of said diodes is associated with a common through aperture or a common blind hole and wherein a diode carrier has a back face pressed against or adhesively bonded to the second main face or the third main face, the inorganic light-emitting diodes being reverse-mount diodes, and a front face with the group of diodes makes contact with the fifth main face or the sixth main face, the inorganic light-emitting diodes being reverse-mount diodes.
2. A luminous laminated glazed roof for a vehicle, said roof comprising: a laminated glazing including: a first transparent glazing, made of mineral glass, with first and second main faces, which first transparent glazing is intended to be an exterior glazing; a second transparent glazing made of mineral glass, with third and fourth main faces, which second transparent glazing is intended to be an interior glazing; between the second and third main faces, which are internal faces of the laminated glazing, a transparent lamination interlayer film made of thermoplastic polymeric material, the lamination interlayer film having a fifth main face oriented toward the second main face and a sixth main face oriented toward the third main face; and a plurality of inorganic light-emitting diodes, each inorganic light-emitting diode including at least one semiconductor chip, each inorganic light-emitting diode being able to emit in a direction of the third main face; wherein said lamination interlayer is provided, between the fifth main face and the sixth main face, with one or more apertures that are through apertures or that form blind holes, each inorganic light-emitting diode being of sub-millimeter-sized thickness and being housed in a through aperture or a blind hole; wherein the lamination interlayer includes one or more sheets of thermoplastic polymeric material, and wherein each inorganic light-emitting diode is associated with a through aperture or a blind hole formed in a main face of a first sheet of said one or more sheets of thermoplastic polymeric material so that the through aperture or blind hole receives a single one of the plurality of inorganic light-emitting diodes, said through aperture or blind hole encircling the edge face of the inorganic light-emitting diode, the luminous laminated glazed roof further including a flexible diode carrier to support said plurality of inorganic light-emitting diodes, said flexible diode carrier including a front face on which said plurality of inorganic light-emitting diodes are mounted, said front face extending along part of, and being positioned against, the main face of said first sheet of said one or more sheets.
3. The vehicular luminous laminated glazed roof as claimed in claim 2, wherein each inorganic light-emitting diode is an electronic component equipped with a peripheral package encapsulating an edge face of the electronic component.
4. The vehicular luminous laminated glazed roof as claimed in claim 2, wherein the flexible diode carrier is pressed against or adhesively bonded to the second main face or the third main face, the inorganic light-emitting diodes being reverse-mount diodes, said diode carrier being of thickness that is at most 0.15 mm, and wherein the diode carrier extends beyond the edge face of the laminated glazing, and a narrower electrical supply portion of the diode carrier extending beyond the edge face of the laminated glazing, or wherein the plurality of inorganic light-emitting diodes are on the second main face or are reverse mounted on the third main face.
5. The vehicular luminous laminated glazed roof as claimed in claim 4, wherein the diode carrier includes a diode-bearing first portion that is apertured.
6. The vehicular luminous laminated glazed roof according as claimed in claim 4, wherein the one or more sheets of thermoplastic polymeric material include a second sheet made of thermoplastic material between a back face of the diode carrier and the second main face or the third main face, the inorganic light-emitting diodes being reverse-mount diodes.
7. The vehicular luminous laminated glazed roof as claimed in claim 2, wherein the through aperture or the blind hole is in a thickness of a PVB sheet that forms said first sheet.
8. The vehicular luminous laminated glazed roof as claimed in claim 2, wherein the through aperture or the blind hole is in a thickness of an acoustic lamination interlayer that forms said first sheet.
9. The vehicular luminous laminated glazed roof as claimed in claim 2, wherein the through aperture or the blind hole is in a composite material consisting of: a PVB sheet/transparent plastic film or a PVB sheet/transparent plastic film/PVB sheet, said plastic film a low-emissivity or solar control and/or heating functional coating.
10. The vehicular luminous laminated glazed roof as claimed in claim 2, wherein the diode carrier includes a transparent film made of plastic material and an electrical circuit is provided with conductive tracks.
11. The vehicular luminous laminated glazed roof as claimed in claim 2, wherein the diode carrier extends at least as far as to the edge face of the laminated glazing, and between a back face of the diode carrier and the second main face or the third main face, the plurality of inorganic light emitting diodes being reverse-mount diodes, is housed an adhesive that is impermeable to liquid water, of thickness of at most 0.1 mm.
12. The vehicular luminous laminated glazed roof as claimed in claim 2, wherein the diode carrier essentially covers the second and third main faces.
13. The vehicular luminous laminated glazed roof as claimed in claim 2, wherein the plurality of inorganic light emitting diodes form a reading light.
14. The vehicular luminous laminated glazed roof as claimed in claim 2, wherein the plurality of inorganic light-emitting diodes forms an indicator light of a remote, touch on/off switch oriented toward the third main face.
15. A vehicle including at least one luminous laminated glazed roof as claimed in claim 2.
16. A process for manufacturing the luminous laminated glazed roof as claimed in claim 2, comprising: cutting a single sheet of an acoustic and/or tinted PVB or a composite sheet consisting of a PVB sheet/film of functional plastic or of a PVB sheet/film of functional plastic/PVB sheet to form local blind or through apertures; and assembling the laminated glazing, with the plurality of inorganic light-emitting diodes housed in the apertures.
17. The process for manufacturing the luminous laminated glazed roof as claimed in claim 16, wherein each aperture is blind and is produced in one of the PVB sheets of the composite sheet consisting of a PVB sheet/plastic functional film bearing the functional coating/PVB sheet without touching said functional coating or the plastic functional film.
18. The process for manufacturing the luminous laminated glazed roof as claimed in claim 16, wherein the plurality of inorganic light-emitting diodes are surface mount devices that are mounted on the diode carrier or toward the second main face if the diodes are reverse-mount diodes.
19. The process for manufacturing the luminous laminated glazed roof as claimed in claim 18, wherein the sheet or the composite sheet is the first sheet and a thermoplastic second sheet is between the back face of the diode carrier and the second main face or the third main face if the plurality of inorganic light-emitting diodes are reverse-mount diodes.
20. A process for manufacturing the luminous laminated glazed roof as claimed in claim 19, wherein, by reflow, the lamination interlayer with the one or more apertures that are wider than the plurality of inorganic light-emitting diodes spreads as far as to make contact with the edge face of the plurality of inorganic light-emitting diodes and wherein, for each through aperture, spreads as far as to be between said front surface of the package of the plurality of inorganic light-emitting diodes and the third main face without spreading as far as to make contact with the emitting face of the chip.
Description
(1) The present invention will now be described in greater detail with reference to the appended figures, in which:
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(16) A first set of eight diodes 4 (cf. the detail view) is on a first printed circuit board, i.e. PCB board (not shown here), which is integrated between the two glazings of the laminated glazing, eight diodes forming a circle being placed in the vision area in a longitudinal edge zone in the vicinity of an external peripheral masking zone 15 (opaque enamel, etc.) on, or as a variant in front of, the exterior glazing, and an internal masking zone (layer, opaque enamel, etc.) of similar size on the interior glazing (not shown).
(17) Alternatively, the reading light is masked by the internal masking zone and one or more reserves are produced in the internal masking zone or even in a (transition) zone containing an alternation of the masking zone (opaque layer, such as an opaque enamel) and transparent zone of the interior glazing.
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(19) Inorganic surface mount device (SMD) light-emitting diodes 4 that for example emit white light are surface mounted on the diode carrier.
(20) The diode carrier 3 is a printed circuit board (PCB board) 3 of thickness e2 of at most 0.2 mm and preferably of 0.1 mm to 0.2 mm. The diode carrier 3 extends beyond the edge face of the laminated glazing. It for example includes a diode-bearing portion, and an electrical-connection portion extending beyond the glazing and (partially) between the internal and external peripheral masking layers 15, 15. The layer 15 may be partially on the functional layer 16.
(21) The what is called front face 30 of the diode carrier 3 bears conductive tracks facing the face F3 and the back face 30 is the side of the face F2 or face 12 against a back PVB 22 making adhesive contact with the (bare or coated) face F2, this PVB for example being thinner. Each diode 4 has an emitting face emitting in the direction of the interior glazing 1, and each diode has an edge face.
(22) For each of the diodes, the lamination interlayer 21 therefore comprises a through aperture 20a that encircles the edge face of the diode 4 and even makes contact with this edge face or as a variant is spaced apart by at most 0.5 mm and even at most 0.1 mm from the edge face.
(23) The diodes 4 (with a single semiconductor chip here) are of square shape of length of about 5 mm or less. The diodes are of thickness e2 smaller than the height H of the hole. The diodes do not protrude from the hole, as if they did it would risk weakening the glass by creating points of stress. Furthermore, the diodes must preferably not be spaced too far apart from the face F3, as this would risk creating too many air bubbles.
(24) The PCB board 3 chosen is the thinnest possible, for example of 0.1 mm thickness, flexible and in the case shown here where the diodes 4 are in the vision area (outside of the periphery with the internal and external masking layers 15 and 15) even preferably the most inconspicuous possible (minimum width or even transparency), the board for example including a transparent film such as a film of PET, PEN or a polyimide and even, as regards the printed circuit, transparent connection tracks (rather than tracks made of copper or another metal, unless sufficiently thin).
(25) The following are for example chosen during manufacture: a first sheet 21, made of PVB, with through (or blind as a variant) apertures and a second sheet 22 of PVB on the side of the back face 30 of the PCB board 3. By reflow, the two sheets are joined, the interface (here shown by the dotted line) possibly being visible.
(26) The layer 16 may comprise a zone forming a touch on/off switch for turning on the reading light.
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(28) a functional layer 17, for example a heating layer, is on face F3; and
(29) the layer on face F4 has (optionally) been removed.
(30) The layer 17 comprises a zone forming a touch on/off switch for turning on the reading light.
(31) The following has been added to the carrier 3: a diode 4 forming a luminous indicator of the status of the touch-switch zone (in its associated through aperture).
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(33) The PCB board 3 includes a diode-bearing first portion 31 and a narrower electrical-supply portion 32 leading to beyond the edge face of the roof. More specifically: in
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(38) The transparent film is for example preassembled with the first sheet 21 and the other sheet 23 before the through or preferably blind apertures are produced in the thickness of the PVB sheet 21, rather than in the thickness of the PVB sheet 21/PET film conductor or even the PVB sheet 23.
(39) It is preferable for the layer 33 to be unapertured and therefore away from (not pierced or touched by the holes) the blind holes, which are then in the PVB sheet 21. The layer 33 may be face F2 or face F3 side.
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(44) It differs from that shown in
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(46) Each diode, preferably a power diode for a reading light, is an electronic component including a semiconductor chip 41, and is equipped with a polymeric or ceramic peripheral package 42 encapsulating the edge face of the electronic component.
(47) The lamination interlayer (by reflow during lamination) may spread as far as to between the what is called front surface 42 of the package and the face F3 without however spreading as far as to the front face 40 of the diode (emitting face of the chip or more precisely face of the assembly consisting of the chip and the encapsulating material 43, which has a protective or wavelength-converting function (luminophore)). The package may have a profile 42a that flares with distance from the chip 41.
(48) The electronic component 4 thus generally includes a support 42b, here what is called a lower portion of the package bearing the semiconductor chip and a reflector that is flared toward face F3, here an upper portion 42a of the package.
(49) The material 43 may be a transparent resin and/or a resin mixed with a luminophore.
(50) The luminophore may be just on the chip 41. The material 43 may be below flush with the surface (of the reflector) 42a, in particular creating an air gap that may be useful.
(51) Examples of diodes are described in the document Les LEDs pour l'clairage by Laurent Massol, Edition Dunod, on pages 140 and 141.
(52) The lamination interlayer may spread as far as to be between said front surface 42 of the package and the face F3 without making contact with the emitting face of the chip or the surface 40.
(53) The package is for example made of epoxy or a ceramic. A polymeric package may optionally be compressed (the final thickness after lamination may be smaller than the initial thickness) during the lamination. The (polymeric) package may be opaque.
(54) On the back face of the diode (of the package), there are two areas 44 of electrical contact with zones 33 (isolated by an etch 33 etc.) of an electrically conductive layer 33 on the carrier 3.
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