Composite thermistor chip and preparation method thereof

Abstract

A composite thermistor chip includes a thermosensitive ceramic chip, a metal electrode and a glass glaze resistor, wherein the thermosensitive ceramic chip has a front side and a back side, the metal electrode includes a first terminal electrode, a second terminal electrode and a third electrode layer; the first terminal electrode and the second terminal electrode are respectively arranged at two ends of the front side of the thermosensitive ceramic chip, and the glass glaze resistor is arranged on the front side of the thermosensitive ceramic chip, two ends of the glass glaze resistor are respectively connected to the first terminal electrode and the second terminal electrode; and the back side of the thermosensitive ceramic chip is covered with the third electrode layer.

Claims

1. A composite thermistor chip, comprising a thermosensitive ceramic chip, a metal electrode and a glass glaze resistor; the thermosensitive ceramic chip has a front side and a back side; the metal electrode comprises a first terminal electrode, a second terminal electrode and a third electrode layer; the first terminal electrode and the second terminal electrode are respectively arranged at two ends of the front side of the thermosensitive ceramic chip; the glass glaze electrode is arranged on the front side of the thermosensitive ceramic chip, two ends of the glass glaze resistor are respectively connected to the first terminal electrode and the second terminal electrode; and the back side of the thermosensitive ceramic chip is covered with the third electrode layer.

2. The composite thermistor chip of claim 1, wherein the metal electrode is made from a precious metal.

3. The composite thermistor chip of claim 1, wherein the thermosensitive ceramic chip is made from a negative temperature coefficient thermosensitive ceramic material.

4. The composite thermistor chip of claim 1, wherein the glass glaze resistor is prepared by printing and sintering glass glaze resistor paste on the thermosensitive ceramic chip.

5. A preparation method of the composite thermistor chip of claim 1, comprising following steps: (1) mixing raw materials according to a conventional negative temperature coefficient thermosensitive ceramic material formula, and then sequentially ball-milling, drying, screening, pre-sintering, grinding, drying and screening the raw materials to prepare negative temperature coefficient thermosensitive ceramic powder for later use; (2) placing the prepared negative temperature coefficient thermosensitive ceramic powder into a mold, placing the mold in an isostatic press to press the negative temperature coefficient thermosensitive ceramic powder, taking a formed ceramic ingot out of the mold after pressure relief, then sintering the ceramic ingot, and afterwards, slicing the ceramic ingot to obtain a thermosensitive ceramic substrate; (3) printing a metal electrode layer on a surface of the thermosensitive ceramic substrate; (4) printing glass glaze resistor pastes on the surface of the thermosensitive ceramic substrate, and conducting sintering after the glass glaze resistor pastes are dried to obtain glass glaze resistors printed on the thermosensitive ceramic substrate; and (5) conducting laser resistance trimming on the glass glaze resistors, and then dividing the thermosensitive ceramic substrate to obtain single composite thermistor chips.

6. The preparation method of claim 5, wherein in step (2), the negative temperature coefficient thermosensitive ceramic powder is pressed in the isostatic press at a pressure of 200-400 MPa for 10-50 s.

7. The preparation method of claim 5, wherein in step (4), sintering is conducted at a temperature of 800-900 C. for 10-30 min.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a structural view of a conventional thermistor chip;

(2) FIG. 2 is a flow diagram of a preparation process of the conventional thermistor chip;

(3) FIG. 3 is a structural view of a composite thermistor chip in Embodiment 1;

(4) FIG. 4 is an equivalent circuit diagram of the composite thermistor chip in Embodiment 1:

(5) FIG. 5 is a structural view of a composite thermistor chip in Embodiment 2;

(6) FIG. 6 is an equivalent circuit diagram of the composite thermistor chip in Embodiment 2;

(7) FIG. 7 is a flow diagram of a preparation method in Embodiment 3;

(8) FIG. 8 is a comparison diagram of the resistance-temperature curves of the composite thermistor chip in Embodiment 1, the composite thermistor chip in Embodiment 2, and the conventional thermistor chip.

DETAILED DESCRIPTION

Embodiment 1

(9) Please refer to FIG. 3, which is a structural view of a composite thermistor chip in this embodiment.

(10) In this embodiment, the composite thermistor chip includes a thermosensitive ceramic chip 1, a metal electrode 2, and a glass glaze resistor 3.

(11) The thermosensitive ceramic chip 1 is a rectangular ceramic chip, has two surfaces respectively serving as a front side and a back side, and has a thickness of 200-2000 m.

(12) The metal electrode 2 includes a first terminal electrode 21, a second terminal electrode 22, and a third electrode layer 23. The first terminal electrode 21 and the second terminal electrode 22 are respectively arranged at two ends of the front side of the thermosensitive ceramic chip 1. The back side of the thermosensitive ceramic chip 1 is covered with the third electrode layer 23.

(13) The glass glaze resistor 3 is arranged on the front side of the thermosensitive ceramic chip 1 and has two ends respectively connected to the first terminal electrode 21 and the second terminal electrode 22. The resistance of the glass glaze resistor 3 is 10 k.

(14) Specifically, the thermosensitive ceramic chip 1 is made from an NTC thermosensitive ceramic material having a material constant of B(25/85)=3435K. The metal electrode 2 is made from a precious metal and is preferably made from sliver. The glass glaze resistor 3 is prepared by printing and sintering glass glaze resistor paste on the thermosensitive ceramic chip 1.

(15) The first terminal electrode 21 and the second terminal electrode 22 respectively serve as a positive electrode and a negative electrode. FIG. 4 is an equivalent circuit diagram of the composite thermistor chip in this embodiment, wherein the glass glaze resistor 3 is equivalent to a fixed resistor R, the thermosensitive ceramic chip 1 is equivalent to two cascading thermistors RT connected with the fixed resistor R in parallel.

Embodiment 2

(16) Please refer to FIG. 5, which is a structural view of a composite thermistor chip in this embodiment.

(17) In this embodiment, the composite thermistor chip includes a thermosensitive ceramic chip 1, a metal electrode 2, and a glass glaze resistor 3.

(18) The thermosensitive ceramic chip 1 is a rectangular ceramic chip, has two surfaces respectively serving as a front side and a back side, and has a thickness of 200-2000 m.

(19) The metal electrode 2 includes a first terminal electrode 21 and a second terminal electrode 22. The first terminal electrode 21 and the second terminal electrode 22 are respectively arranged at two ends of the back side of the thermosensitive ceramic chip 1.

(20) The glass glaze resistor 3 is arranged on the front side of the thermosensitive ceramic chip 1. The resistance of the glass glaze resistor 3 is 10 kn.

(21) Specifically, the thermosensitive ceramic chip 1 is made from an NTC thermosensitive ceramic material having a material constant of B(25/85)=3435K. The metal electrode 2 is made from a precious metal and is preferably made from sliver. The glass glaze resistor 3 is prepared by printing and sintering glass glaze resistor paste on the thermosensitive ceramic chip 1.

(22) The first terminal electrode 21 and the second terminal electrode 22 respectively serve as a positive electrode and a negative electrode. FIG. 6 is an equivalent circuit diagram of the composite thermistor chip in this embodiment, wherein the glass glaze resistor 3 is equivalent to a fixed resistor R, the thermosensitive ceramic chip 1 is equivalent to two thermistors RT connected with the fixed resistor R in series.

Embodiment 3

(23) Please refer to FIG. 7 which is a flow diagram of a preparation method in embodiment 3.

(24) In this embodiment, a preparation method of the composite thermistor chip in Embodiment 1 or the composite thermistor chip in Embodiment 3 specifically includes the following steps:

(25) (1) Mixing raw materials according to a conventional NTC thermosensitive ceramic material formula, and then sequentially ball-milling, drying, screening, pre-sintering, grinding, drying and screening the raw materials to prepare NTC thermosensitive ceramic powder 4 for later use;

(26) (2) Loosely placing the prepared NTC thermosensitive ceramic powder 4 into a rubber mold, then compacting the NTC thermosensitive ceramic powder 4, and afterwards, placing the rubber mold in an isostatic press to press the NTC thermosensitive ceramic powder 4 under a pressure of 200-400 MPa for 10-50 s, taking a formed cuboidceramic ingot 5 out of the mold after pressure relief, then sintering the ceramic ingot 5 at a high temperature to obtain a compact ceramic ingot 5, and afterwards, using an inner diameter slicer to slice the ceramic ingot 5 in terms of a set thickness to obtain a thermosensitive ceramic substrate 6;

(27) (3) Printing silver pastes on a surface of the thermosensitive ceramic substrate 6, and drying the silver pastes to obtain a silver metal electrode layer 20 printed on the thermosensitive ceramic substrate 6;

(28) Specifically, when the composite thermistor chip in Embodiment 1 is prepared, a plurality of parallel terminal electrodes are printed on a front side of the thermosensitive ceramic substrate 6, and an electrode layer is printed on a whole back side of the thermosensitive ceramic substrate 6; or when the composite thermistor chip in Embodiment 2 is prepared, a plurality of parallel terminal electrodes are printed on the back side of the thermosensitive ceramic substrate 6;

(29) (4) Printing glass glaze resistor pastes on the surface of the thermosensitive ceramic substrate 6 in a form that can be adjusted according to a desired resistance and the area of the thermosensitive ceramic substrate 6; and conducting sintering at a high temperature of 840V for 10-30 min after the glass glaze resistor pastes are dried to obtain a plurality of glass glaze resistors 3 printed on the thermosensitive ceramic substrate 6;

(30) Specifically, when the composite thermistor chip in Embodiment 1 is prepared, the glass glaze resistors 3 are printed on the front side of the thermosensitive ceramic substrate 6 and arrayed in a matrix manner, and two ends of each glass glaze resistor 3 are respectively connected to two adjacent terminal electrodes; or when the composite thermistor chip in Embodiment 2 is prepared, the glass glaze resistors are printed on the front side of the thermosensitive ceramic substrate 6 and arrayed in a matrix manner;

(31) (5) Conducting laser resistance trimming on the glass glaze resistors 3 to improve resistance precision, and then dividing the thermosensitive ceramic substrate 6 to obtain single composite thermistor chips, wherein: the thermosensitive ceramic substrate 6 is divided into thermosensitive ceramic chips 1, the metal electrode layer 20 is divided into metal electrodes 2, and each composite thermistor chip includes one glass glaze resistor 3.

(32) The resistant-temperature curves (RT curves) of the composite thermistor chip in Embodiment 1, the composite thermistor chip in Embodiment 2, and the conventional thermistor chip are obtained by testing. The conventional thermistor chip is made from an NTC thermosensitive ceramic material having a material constant of B(25/85)=3435K, and the composite thermistor chip in Embodiment 1, the composite thermistor chip in Embodiment 2 and the conventional thermistor chip are identical in specification and size.

(33) As shown in FIG. 8, the RT curves of the composite thermistor chip in Embodiment 1 and the composite thermistor chip in Embodiment 2 are different and deviate from the RT curve of the conventional thermistor chip, which means that a new temperature curve can be formed by disposing the glass glaze resistors 3 at different positions, and accordingly, thermistors having different applications and functions are obtained.

(34) The embodiments which are specifically detailed above are only several illustrative ones of the invention and should not be regarded as restrictive to the patent scope of the invention. It should be noted that various transformations and improvements achieved by those ordinarily skilled in this field without deviating from the concept of the invention also fall within the protection scope of the invention.