Method for Measuring a Behavior of a MEMS Device

Abstract

A method for measuring a behavior of a MEMS device is disclosed. In an embodiment a method includes mounting the MEMS device to a testing apparatus that comprises a vibration source, wherein the MEMS device comprises a 6-axis or 9-axis inertial sensor, applying a vibration to the MEMS device by the vibration source and simultaneously moving the testing apparatus according to a predefined movement pattern, reading output data provided by the inertial sensor and comparing the output data to the predefined movement pattern and/or reading output data provided by the inertial sensor and calculating a frequency response curve of the inertial sensor.

Claims

1-16. (canceled)

17. A method for measuring a behavior of a MEMS device, the method comprising: mounting the MEMS device to a testing apparatus that comprises a vibration source, wherein the MEMS device comprises a 6-axis or 9-axis inertial sensor; applying a vibration to the MEMS device by the vibration source and simultaneously moving the testing apparatus according to a predefined movement pattern; reading output data provided by the inertial sensor and comparing the output data to the predefined movement pattern; and/or reading output data provided by the inertial sensor and calculating a frequency response curve of the inertial sensor.

18. The method according to claim 17, wherein the testing apparatus comprises a 3-axis accelerometer configured to measure a frequency of the applied vibration, wherein the frequency of the applied vibration is varied, and wherein the frequency response curve is calculated based on the output data by the inertial sensor and data provided by the 3-axis accelerometer.

19. The method according to claim 17, wherein comparing the output data to the predefined movement patter comprises determining, by a software algorithm, whether a difference between the output data provided by the inertial sensor and the predefined movement pattern is within a predetermined acceptance limit.

20. The method according to claim 17, wherein moving the testing apparatus according to the predefined movement pattern comprises tilting the testing apparatus at a defined angular rate in different directions, and wherein reading output data provided by the inertial sensor comprises calculating a roll angle and a pitch angle based on the output data provided by the inertial sensor.

21. The method according to claim 17, wherein the output data provided by the inertial sensor are evaluated using a sensor fusion algorithm comprising a Kalman filter before comparing the output data to the predefined movement pattern.

22. The method according to claim 17, wherein the inertial sensor comprises a gyroscope.

23. The method according to claim 17, wherein the inertial sensor is resiliently mounted on a carrier by spring elements, wherein an air gap is provided between a top surface of the carrier and a bottom surface of the inertial sensor, and wherein a damping structure is applied to at least one surface chosen from a first surface located on the carrier or a second surface located on the inertial sensor.

24. The method according to claim 23, wherein the damping structure is applied as a layer between the inertial sensor and the carrier on one of first surface or the second surface, wherein the layer comprises recesses, and wherein the recesses are at least measured to accommodate the spring elements.

25. The method according to claim 23, wherein the spring elements comprise an extended structure that is linear, bent or angled, wherein a first end of the extended structure is coupled to a first anchor point on the carrier, wherein a second end of the extended structure is coupled to a second anchor point on a sensor system, and wherein a height of the air gap normal to the surface is smaller than a distance normal to the surface between first and second anchor point.

26. The method according to claim 17, wherein the inertial sensor is encapsulated in a sealed package.

27. The method according to claim 17, wherein mounting the MEMS device comprises mounting a plurality of MEMS devices to the testing apparatus in, and wherein the behavior of the plurality of MEMS devices is measured simultaneously.

28. The method according to claim 17, wherein applying the vibration to the MEMS device by the vibration source comprises applying the vibration continuously.

29. The method according to claim 17, wherein applying the vibration to the MEMS device by the vibration source comprises applying the vibration discontinuously.

30. The method according to claim 17, wherein moving the testing apparatus comprises rotating the testing apparatus at an angular rate in a range of 0.001 deg/s to 1000 deg/s.

31. The method according to claim 17, wherein applying the vibration to the MEMS device by the vibration source comprises vibrating the vibration source with a frequency in a range of 0.1 kHz to 100 kHz and with an amplitude in a range of 1 nm to 10 m.

32. A method for measuring a behavior of a MEMS device, the method comprising: applying a vibration to an inertial sensor of the MEMS device; and measuring an attenuation of a vibration using a laser Doppler vibrometer.

33. The method according to claim 32, wherein the MEMS device comprises a cap which seals the inertial sensor, and wherein the cap is transparent for a laser beam of the laser Doppler vibrometer, or wherein the MEMS device comprises a cap which covers the inertial sensor, and wherein the cap has one or more holes, and wherein a laser beam is applied to the inertial sensor through one of the holes, and wherein the one or more holes are sealed after measuring the attenuation of the vibration.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In the following, the present invention is described in detail with reference to the figures.

[0047] FIGS. 1 and 2 show MEMS devices comprising a damping structure;

[0048] FIG. 3 shows a setup for performing a measurement of a behavior of a MEMS device;

[0049] FIGS. 4 to 8 show results of different measurements; and

[0050] FIG. 9 shows another method of measuring the behavior of a MEMS device.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0051] A method for measuring a behavior of a MEMS device 1 comprising an inertial sensor 2 is disclosed. The behavior may, in particular, be a mechanical attenuation behavior in response to a vibration applied to the MEMS device 1. Such a measurement is particularly relevant for a MEMS device 1 which comprises a damping structure 3 configured to attenuate a vibration of the inertial sensor 2. FIGS. 1 and 2 show such a MEMS device 1.

[0052] It is the purpose of the measurement to evaluate the performance of the MEMS device 1 when the MEMS device 1 is subjected to a mechanical disturbance, e.g., a vibration. The measurement is designed to determine if the inertial sensor 2 can provide reliable information even if a vibration is applied to the MEMS device 1. Moreover, the measurement is designed to determine an attenuation of a vibration of the MEMS device 1. For example, the measurement setup is designed to determine how long it takes, after the disappearance of a disturbance in form of a vibration, until the inertial sensor 2 provides reliable data again. Thus, these measurements may allow evaluating the performance of the damping structure 3 and/or of a sensor fusion algorithm.

[0053] FIG. 1 shows a cross section through the MEMS device 1. The device 1 comprises an inertial measurement unit 4 that comprises the inertial sensor 2. The MEMS device 1 may also comprise a pressure sensor or a microphone. The inertial measurement unit 4 is resiliently mounted onto a carrier 5 via spring elements 6. The spring elements 6 may comprise a stand-off 7 on the carrier 5 and a free standing end laterally extending therefrom. The inertial measurement unit 4 is bonded to the free standing end by means of bumps 8. Via the spring element 6, stand-off 7 and bump 8 electrical contact between second electrical contacts P2 on a bottom surface 10 of the inertial measurement unit 4 and first electrical contacts P1 on the carrier 5 is achieved.

[0054] The carrier 5 may be a multilayer printed circuited board that may have a multilayer structure comprising at least one wiring layer and other internal wiring connecting the first electrical contacts P1 to external contacts P3 of the MEMS device 1 on a bottom surface of the carrier.

[0055] A cap 9 is bonded to a top surface 12 of the carrier 5 via a glue or solder. Between cap 9 and carrier 5 a volume is enclosed accommodating at least the inertial measurement unit 4. The volume may be necessary for the function of the MEMS device 1 and may provide protection against chemical and mechanical impact from the environment. For clarity reasons only the inertial measurement unit 4 comprising the inertial sensor 2 is shown. But other components of the MEMS device 1 like an ASIC, for example, may be accommodated too under the cap 9.

[0056] An external shock may be able to induce a resonance of the inertial measurement unit 4. This resonance may saturate the inertial sensor 2 and disturb its sensing function. In order to prevent such a disturbance, the MEMS device 1 comprises a damping structure 3. In the embodiment shown in FIG. 1, the damping structure 3 is applied to the bottom surface 10 of the inertial measurement unit 4. The damping structure 3 comprises recesses to accommodate the spring elements 6. Thereby the airgap 11 between the bottom surface 10 of the inertial measurement unit 4 and the top surface 12 of the carrier 5 is reduced. As the spring elements 6 are mounted to an anchor point on the bottom surface 10 of the inertial measurement unit 4 below the damping structure 3 the maximum mutual movement of inertial measurement unit 4 versus carrier 5 is limited by the air gap 11 between top surface 12 of carrier 5 and a bottom surface of the damping structure 3. The air gap 11 is reduced with regard to a device which does not comprise a damping structure 3. The height of the air gap 11 is set to a value small enough that squeeze film damping occurs.

[0057] FIG. 2 shows a cross section of a MEMS device 1 according to a second embodiment of the invention. Different from the first embodiment of FIG. 1, the damping structure 3 is applied to the top surface 12 of the carrier 5. The thus reduced air gap 11 is formed between a top surface on the damping structure 3 and the bottom surface 10 of the inertial measurement unit 4. The same effect is achieved by this embodiment as the same squeeze film damping occurs at this air gap 11.

[0058] FIG. 3 shows a measurement setup which enables a measuring of the mechanical attenuation behavior of a MEMS device 1. The measurement setup comprises a testing apparatus 13. The testing apparatus 13 may be a measurement table or a printed circuit board.

[0059] The MEMS device 1 is mounted to surface of the testing apparatus 13, for example, to a top surface. Further, the measurement setup comprises a vibration source 14 which is fixed to the testing apparatus 13. According to the embodiment shown in FIG. 3, the vibration source 14 is mounted to a bottom surface opposite to the top surface of the testing apparatus 13. Alternatively, the vibration source 14 may also be mounted to the top surface of the testing apparatus 13. The vibration source 14 is configured to apply a vibration to the testing apparatus 13. The vibration source 14 may be an electromechanical exciter or a piezoelectric vibration source.

[0060] The testing apparatus 13 is configured to be moved according to a predefined movement pattern. In particular, the testing apparatus 13 is configured to be tilted relative to one axis or to be tilted relative to multiple axis. In particular, according to the predefined movement pattern, the testing apparatus 13 is tilted at a defined angular rate in different directions. This predefined movement pattern is well-known with a high precision.

[0061] The MEMS device 1 comprises the inertial sensor 2. In particular, the MEMS device 1 may comprise the inertial measurement unit 4 configured to measure inertial movements with respect to six or nine axes. The inertial sensor 2 may comprise one or more gyroscopes. In particular, the MEMS device 1 may be the device shown in FIG. 1 or the device shown in FIG. 2.

[0062] For measurement of the behavior of the MEMS device 1, a vibration is applied to the testing apparatus 13 and, thereby, to the MEMS device 1 by the vibration source 14. At the same time, the MEMS device 1 is moved according to the predefined movement pattern.

[0063] The output data provided by the inertial sensor 2 are read out and compared to the predefined movement pattern. This allows determining an error which results from the vibration being applied to the MEMS device 1.

[0064] The output data provided by the inertial sensor 2 are analyzed and a software algorithm determines whether the deviation of the output data from the predefined movement pattern is within a predefined acceptance limit. This allows determining whether the MEMS device 1 has an attenuation behavior that is within given customer specifications.

[0065] The output data provided by the inertial sensor 2 may first be evaluated in a sensor fusion algorithm comprising a Kalman filter. The sensor fusion algorithm may be carried out in the ASIC inside the MEMS device 1. Alternatively, raw output data provided by the inertial sensor 2 may be applied to an evaluation unit outside of the MEMS device 1 and the sensor fusion algorithm may be performed in the evaluation unit outside of the MEMS device 1.

[0066] The testing apparatus 13 further comprises a 3-axis accelerometer 20.

[0067] FIG. 4 shows an example of the output data provided by the MEMS device 1 in response to a movement of the testing apparatus 13 and a simultaneous vibration being applied by the vibration source 14. The output data shown in FIG. 4 are the output data provided by the sensor fusion algorithm wherein the raw data provided by the inertial sensor 2 have been evaluated using a Kalman filter. On the horizontal axis, a time after the start of the measurement in seconds is shown. On the vertical axis, the angle of rotation as calculated from the output data is shown wherein the output data have been evaluated using a sensor fusion algorithm.

[0068] It can be seen in FIG. 4 that the output data result in a rather smooth curve. Thus, the data show that the inertial sensor 2 was able to perform a reliable measurement even when the MEMS device 1 is vibrated.

[0069] FIG. 5 shows the result of another measurement. On the horizontal axis, a time after the start of the measurement in seconds is shown. On the vertical axis, the angle of rotation as calculated from the output data is shown wherein the raw output data are shown which have not been evaluated using a sensor fusion algorithm. The inertial sensor 2 is a gyroscope. It is clearly visible in the data shown in FIG. 5 that a vibration has been applied with the resonance frequency of the inertial sensor 2 at the time of 0.0 seconds. Due to the resonance behavior of the gyroscope, the raw data provided by the inertial sensor 2 shown a large error and cannot be considered as being reliable.

[0070] FIG. 6 shows the result of another measurement wherein a MEMS device 1 has been moved according to a predefined movement pattern and, simultaneously, vibrated. On the horizontal axis, a time after the start of the measurement in seconds is shown. On the vertical axis, a difference between the roll angle of the testing apparatus 13 which is known in the predefined movement pattern and the roll angle as calculated by a sensor fusion algorithm is shown. It is shown in FIG. 6 that the roll angle as calculated by the sensor fusion algorithm deviates from the actual roll angle up to 7. This deviation is due to resonance effects. Thus, this measurement shows that a damping provided by the damping structure was not strong enough to guarantee reliable data in this case.

[0071] FIGS. 7 and 8 show the result of another measurement of this kind. In FIGS. 7 and 8, the same measurement is shown; only the scale of the respective vertical axis differs. Again, a time after the start of the measurement in seconds is shown on the respective horizontal axis. On the vertical axis, a difference between the roll angle of the measurement table which is known in the predefined movement pattern and the roll angle as calculated by a sensor fusion algorithm is shown.

[0072] A vibration has been applied form the start of the measurement at 0.0 seconds until 8.5 seconds. It can be seen in both figures that, after the vibration stops, the inertial sensor is damped very fast and provides reliable data less than 0.1 seconds after the end of the vibration. Thus, the measurement allows determining the performance of the damping structure.

[0073] The above-described measurement can be performed simultaneously for multiple MEMS devices 1. In particular, multiple MEMS devices 1 can be mounted onto the testing apparatus 13 and evaluated simultaneously. Thus, the measurement is suitable for a mass production of a multitude of MEMS devices 1. The measurement may be performed after a manufacturing process of the multitude of MEMS devices 1 has been completed as part of a performance and reliability test of the MEMS devices 1.

[0074] In particular, the measurement can be performed after the MEMS device 1 has been encapsulated with the cap 9. Accordingly, no further production steps have to be performed after the measurement which could, otherwise, influence the damping behavior.

[0075] The measurement can be performed and evaluated very fast. This also helps to enable the measurement for mass production of multiple MEMS devices 1.

[0076] FIG. 9 shows another method of measuring the behavior of the MEMS device 1. First, a vibration is applied to the MEMS device 1. Further, a laser beam 15 is applied to the inertial sensor 2. The vibration of the inertial sensor 2 is determined by a laser Doppler vibrometer using the laser beam 15. The cap 9 comprises a hole 16 wherein the laser beam 15 can access the inertial sensor 2 through the hole 16. In an alternative embodiment, the cap 9 is transparent for the laser beam 15.