Field device with a component for filling potting compound

Abstract

The invention relates to a field device of automation technology with an opened housing and an electronics part in the housing, comprising at least one component for filling potting compound into the housing, wherein the component has a trough, in order to conduct the potting compound, with targeting, to a location of the housing to be potted.

Claims

1. A field device of automation technology, comprising: a housing including a housing opening; an electronics part disposed within the housing; and a fill component attached to the housing such that the fill component is disposed within the housing, the fill component configured for dispensing potting compound into the housing, wherein the fill component includes a trough structured to conduct the potting compound, with targeting, to a location within the housing to be potted, wherein the trough includes a collecting pan, which faces the housing opening, and a channel, the channel offset vertically from the collecting pan as to enable the potting compound to flow from the collecting pan into the channel, wherein the channel is configured with an incline and cross-section to convey the potting compound from the collecting pan to a gap between the electronics part and an inner surface of the housing without entrapping air in the housing or potting compound, the gap laterally displaced from the housing opening, and wherein the fill component is further configured to be at least partially trapped within the potting compound in assembly.

2. The field device of claim 1, wherein the fill component is embodied as a cable holder for at least one cable passing into the housing.

3. The field device of claim 1, wherein the fill component includes at least one component opening for de-airing the housing.

4. The field device of claim 3, wherein the collecting pan is arranged beside the at least one component opening.

5. The field device of claim 3, wherein the collecting pan extends around the at least one component opening.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The invention will now be explained in greater detail based on the appended drawing, the figures of which show as follows:

(2) FIG. 1 shows a perspective view of the component of a field device of automation technology; and

(3) FIG. 2 shows a perspective view of a transparent housing of a field device of automation technology.

DETAILED DESCRIPTION

(4) FIG. 1 shows a component 1 for a housing (not shown) of a field device of automation technology (not shown). Component 1 serves, on the one hand, for filling potting compound into the housing and, on the other hand, as a cable holder. For holding a cable (not shown), the component 1 includes an opening 11.

(5) Component 1 includes a trough 4, which includes a collecting pan 6 and a channel 8. The collecting pan 6 is arranged in an upper region of the component 1 and extends around the opening 11 and opens into the channel 8, which is arranged in a lower region of the component 1. Furthermore, the component 1 includes holders 12 for securing to a housing (not shown).

(6) FIG. 2 shows a perspective view of a transparent housing of a field device of automation technology. Installed in the housing 3 is a component 1 of FIG. 1. Component 1 is embodied as a cable holder for a cable 5. Housing 3 includes a housing opening 7 and the collecting pan 6 of the component 1 faces in the direction of the opening 7. As a result, the channel (not shown) of the component 1 is directed toward the housing interior. Of course, the housing can have besides a number of components also a component with a number of collecting pans or a number of channels.

(7) Arranged in the housing interior of the housing 3 is an electronics part 10. In this way, there arises a gap 9 between the inner surface of the housing 3 and the electronics part 10. The casting of the potting compound into the housing 3 of the field device occurs in the following way: The liquid potting compound is cast through the housing opening 7 into the collecting pan 6 of the component 1. The liquid potting compound flows from the collecting pan 6 into the channel (not visible) of the component 1. The flow direction of the potting compound is shown by arrows. The channel conducts the potting compound to the gap between the electronics part 10 and the inner surface of the housing 3. The potting compound flows into the gap 9, wherein the pushed air can escape through the opening 11 of the component 1 and the housing opening 7.