DISTRIBUTION BODY FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE
20230026551 · 2023-01-26
Inventors
Cpc classification
C25D17/001
CHEMISTRY; METALLURGY
C25D17/00
CHEMISTRY; METALLURGY
C25D5/08
CHEMISTRY; METALLURGY
International classification
C23F1/08
CHEMISTRY; METALLURGY
C25D17/00
CHEMISTRY; METALLURGY
Abstract
The invention relates to a distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution system for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of a distribution body or a distribution system for a chemical and/or electrolytic surface treatment of a substrate in a process fluid and a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate. The distribution body comprises: a front face, a rear face, at least an inlet, an outlet array, and a flow control array. The front face is configured to be directed towards the substrate for the surface treatment of the substrate. The rear face is arranged opposite to the front face. The inlet is configured for an entry of the process fluid into the distribution body. The outlet array comprises several outlets, which are configured for an exit of the process fluid out of the distribution body and towards the substrate. The flow control array is arranged upstream of the outlet array with respect to a flow of the process fluid and comprises several flow control elements.
Claims
1. A distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, comprising: a front face, a rear face, at least an inlet, an outlet array, and a flow control array, wherein the front face is configured to be directed towards the substrate for the surface treatment of the substrate, wherein the rear face is arranged opposite to the front face, wherein the inlet is configured for an entry of the process fluid into the distribution body, wherein the outlet array comprises several outlets, which are configured for an exit of the process fluid out of the distribution body and towards the substrate, wherein the flow control array is arranged upstream of the outlet array with respect to a flow of the process fluid, and wherein the flow control array comprises several flow control elements.
2. The distribution body according to claim 1, wherein the flow control elements are arranged in a pattern to achieve a turbulent flow of the process fluid towards the outlet array.
3. The distribution body according to claim 1, wherein the flow control elements are arranged in a pattern to achieve Reynolds numbers of at least 5000 in the process fluid.
4. The distribution body according to claim 1, wherein at least some of the flow control elements extend between the front face and the rear face and are in contact with the front face and the rear face.
5. The distribution body according to claim 1, wherein at least some of the flow control elements are pillar shaped.
6. The distribution body according to claim 1, wherein at least some of the flow control elements extend between the front face and the rear face and are only in contact with one of the front face or the rear face.
7. The distribution body according to claim 1, wherein at least some of the flow control elements are shaped as stalactites or stalagmites.
8. The distribution body according to claim 1, wherein at least some of the flow control elements have a patterned surface.
9. The distribution body according to claim 1, wherein at least some of the several flow control elements have different sizes.
10. The distribution body according to claim 1, wherein at least some of the flow control elements have a constant cross-section along their length.
11. The distribution body according to claim 1, wherein at least some of the flow control elements have a cross-section of varying size along the length of the flow control elements.
12. The distribution body according to claim 1, wherein at least some of the several flow control elements are arranged with different distances to each other.
13. A distribution system for chemical and/or electrolytic surface treatment of a substrate in a process fluid, comprising: the distribution body according to claim 1, and a substrate holder, wherein the substrate holder is configured to hold at least one substrate relative to an outlet array of the distribution body.
14. A method of using the distribution body according to claim 1 for a chemical and/or electrolytic surface treatment of a substrate in a process fluid.
15. A distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate, comprising: providing the distribution body according to claim 1, and providing a flow of process fluid from at least an inlet of the distribution body through a flow control array of the distribution body to outlets of the distribution body and towards the substrate.
16. The distribution body according to claim 8, wherein the patterned surface comprises a golf ball kind of surface.
17. The distribution body according to claim 9, wherein at least some of the several flow control elements have different diameters relative to each other.
18. The method of claim 14, wherein the surface is from a large substrate with diagonals or diameters in a range of 300 mm and larger.
19. The method of claim 18, wherein the diagonals or diameters are in a range of 800 mm and larger.
20. The method of claim 18, wherein the diagonals or diameters are in a range of 1000 mm and larger.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0056] Exemplary embodiments of the invention will be described in the following with reference to the accompanying drawing:
[0057]
[0058]
[0059]
DETAILED DESCRIPTION OF EMBODIMENTS
[0060]
[0061] The (flow) distribution body 1 is submerged in the process fluid 6 or fluidic process solution, which may be aqueous or non-aqueous, in a process basin 17 made from plastic, such as polypropylene. In this process basin 17, there is also the substrate 4 having a conductive surface, which is connected to an electrode 12, as well as a counter electrode body 10, which is connected to a further electrode 11, the polarity of which is opposite of that of the electrode 12. The counter electrode body 10 is embodied as a plate, and has no through-holes. The counter electrode body 10, the substrate 4, and the flow distribution body 1 are spatially separated from each other, wherein a distance between the substrate 4 and the flow distribution body 1 is approximately 20 mm, while the distance between the flow distribution body 1 and the counter electrode 10 is approximately 40 mm. In the present case the substrate 4 is a metal substrate, however, in other exemplary embodiments a semi-conductor substrate, such as a wafer, or a conductor plate, may also be used. In order to apply a structure 15 on partial surfaces of the substrate 4, the substrate 4 was equipped with a suitable marking, which is not or only minutely aggravated by the process solution 6. In this context, “minute” shall mean that although the masking, for example, a photoresist may be ablated by the process solution, this process progresses so slowly, however, that with common process durations a remainder of the masking remains on the substrate 4.
[0062] The further electrode 11 is embodied as an anode, while the electrode 12 functions as a cathode. Of course, in other embodiments the further electrode 11 may also represent the cathode, if the electrode 12 is the anode. In the exemplary embodiment illustrated, metal is precipitated on the substrate 4 by means of a galvanic reaction. An electrolytic liquid is used as the process liquid 6. The electric field generated by the two electrodes 11, 12 by means of the arrangement of the counter electrode body 10 and the substrate 4, always extends through the flow distribution body 1. By means of a suitable positioning of the flow distribution body 1 with regard to the counter electrode body 10 and the substrate 4, regions of the substrate 4 may therefore be approached by the electrolytic with a particularly strong incoming flow 13, and also with the electric field such that a reaction occurs at these locations.
[0063] The flow distribution body 1 has a front face 2, which is aligned as plane-parallel to the substrate 4 as possible.
[0064] A rear face 3 is positioned opposite of the front face 2. A hollow space, the liquid passage 7, is present between the front face and the rear face, which may be filled with the process solution 6. For this purpose an inlet 5 or inlet opening is located in a lateral area of the flow distribution body 1 located between the front face 2 and the rear face 1, which is equipped with a thread for the connection to the casing of the pump cycle. The flow distribution body 1 itself is made from polypropylene.
[0065] The convection chamber formed by the front face 2 and the surface of the substrate 4 is further limited by means of the walls of the process basin 17 and a further wall 16, which forces a targeted backflow 14 through the connecting passages 9, and simultaneously influences the field line distribution of the electric current favorably. In the exemplary embodiment shown, these walls are also made of polypropylene. Just as the further wall 16 is arranged between the substrate 4 and the front face 2, such wall may, of course, also be arranged between the rear face 3 and the counter electrode body 10. In the example shown, the further wall 16, like the process basin 17, is made of a plastic, such as polypropylene.
[0066] Bore holes with a diameter of 1 mm are contained in the flow distribution body 1, which end in outlets 8 or outlet openings of the liquid passage 7, each with an identical diameter at the front face 2. In addition to cylindrical shapes, the bore holes may also have a conical shape. The distribution of the outlet openings 8 approximately corresponds with the structure 15 to be produced on the substrate 4, i.e. the outlet openings 8 are in alignment with those partial surfaces of the substrate 4, on which the structure 15 is to be displayed. In this manner the incoming flow 13 coming from the outlet openings 8 impinges directly upon those partial surfaces of the substrate 4, which are to participate in the electrochemical reaction. The outlet openings 8 are round, but may also be embodied in an elliptical or rectangular shape, or in other geometric shape, as long as an adequate flow speed may be reached. The outlet openings 8 may also be significantly larger in a spatial dimension than in another such that, for example, a line-shaped or column-shaped geometry is achieved, wherein the lines or columns may extend across the entire length, or width, respectively, of the flow distribution body 1.
[0067] The process solution 6 exits the hollow space positioned between the front face 2 and the rear face 3 through the outlet openings 8 at a high flow speed, and forms an incoming flow 13 directed toward the substrate 4. The metal coating occurs in the local surface areas at the structure 15 to be applied, and the direction of the flow reverses at that point. Due to the now less strongly directed flow, the flow speed is reduced, the backflow 14 formed is guided to the rear face 3 of the flow distribution body 1 through the connecting passages 9. The connecting passages 9 are located adjacent to the outlet openings 8, and thereby form the structure 15 to be produced on the substrate 4, also offset by approximately about 2 mm as opposed to the surfaces of the structure 15. In the exemplary embodiment shown the connecting passages 9 are individual tubes that were used in the corresponding openings of the flow distribution body 1.
[0068] The connecting passages 9 have a diameter of 5 mm. Due to the different size relations of the connecting passages 9 and the outlet openings 8, the liquid pressure and the flow speed are much lower in the connecting passages 9. The process solution 6, having reached the rear face 3 of the flow distribution body 1, is re-pumped into the inlet opening 5 by means of a drain 18 of the process basin 17 and a pump (not illustrated).
[0069] In order to avoid any rigid flow vectors, and instead achieving a convection of the reacting surface areas of the substrate 4 that are as even as possible, the flow distribution body 1 and the substrate 4 are in a relative movement parallel to each other from up to 1 mm in both directions, wherein in the present case both bodies are moved parallel to the incoming flow 13, or the backflow 14, respectively.
[0070] According to the present invention, a distribution system 40 for chemical and/or electrolytic surface treatment of a substrate 4 in a process fluid 6 is presented. The distribution system 40 comprises a distribution body 1 and a substrate holder (not shown). The substrate holder is configured to hold at least one substrate 4 relative to an outlet array 20 of the distribution body 1.
[0071] According to the present invention, the distribution body 1 comprises a front face 2, a rear face 3, at least an inlet 5, an outlet array 20, and a flow control array 21. The front face 2 is directed towards the substrate 4 for the surface treatment of the substrate 4. The rear face 3 is arranged opposite to the front face 2.
[0072] The inlet 5 is an entry of the process fluid 6 into the distribution body 1. The outlet array 20 comprises several outlets 8, which are an exit of the process fluid 6 out of the distribution body 1 and towards the substrate 4. The flow control array 21 is arranged upstream of the outlet array 20 with respect to a flow of the process fluid 6 and comprises several flow control elements 30.
[0073] The arrangement of several flow control elements 30 upstream of the outlet array 20 allows equilibrating the flow of electrolyte towards the jet holes. A uniform distribution of the liquid flow within the HSP in horizontal and vertical direction is obtained. The uniform flow distribution leads to a uniform plating process and plating result on the substrate 4 without reducing the overall flow speed of the electrolyte.
[0074] Preferably, the distribution body 1 comprises exactly or at least two different kinds of flow control elements 30, which means flow control elements 30, which differ in view of their (cross sectional) size, shape and/or distance. More preferably, the distribution body 1 comprises two different kinds of flow control elements 30, which differ in view of their (cross sectional) size, which means a group of larger flow control elements 30 and a group of smaller flow control elements 30. The larger flow control elements 30 are arranged closer to the inlet 5, the smaller flow control elements 30 are arranged closer to the outlet array 20 for the process fluid 6.
[0075] The arrangement of several flow control elements 30 upstream of the outlet array 20 in particular equilibrates the flow of electrolyte towards the jet holes by eliminating laminar flow areas. The flow control elements 30 are therefore arranged in a pattern to achieve a turbulent flow of the process fluid 6 towards the outlet array 20. In particular, the flow control elements 30 are arranged in a pattern to achieve Reynolds numbers of at least 5000 in the process fluid 6.
[0076] The pattern can comprise (when seen in a flow direction of the fluid) a first row of flow control elements 30 of a first size, first shape and/or arranged with a first distance relative to each other and at least a second row of flow control elements 30 of a second size, second shape and/or arranged with a second distance relative to each other. The row extends perpendicular to the flow direction of the fluid and comprises several flow control elements 30 of the same kind (size, shape and/or distance) when seen in the fluid flow direction. The first size and/or distance may be larger than the second size and/or distance. Adjacent flow control members are displaced relative to each other and not aligned with each other.
[0077]
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[0084] It has to be noted that embodiments of the invention are described with reference to different subject matters. In particular, some embodiments are described with reference to method type claims whereas other embodiments are described with reference to the device type claims. However, a person skilled in the art will gather from the above and the following description that, unless otherwise notified, in addition to any combination of features belonging to one type of subject matter also any combination between features relating to different subject matters is considered to be disclosed with this application. However, all features can be combined providing synergetic effects that are more than the simple summation of the features.
[0085] While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The invention is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing a claimed invention, from a study of the drawings, the disclosure, and the dependent claims.
[0086] In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single unit may fulfil the functions of several items re-cited in the claims. The mere fact that certain measures are re-cited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.