Anti-wetting coating for Si-based MEMS fluidic device, and method of application of same

Abstract

A photo-patterned fluorocarbon monolayer directly grafted to Si surface atoms provides anti-wetting performance at controlled locations, wherein the Si surface oxide is etched and reacted with fluorocarbon chains with a terminal CC double bond, resulting in SiC surface. As the direct SiC linkages are chemically robust, and much more resistant to decomposition than SiOC bonds, the resulting surface does not suffer from the shortcomings of current MEMS dispensers.

Claims

1. A method for coating a silicon substrate on a microelectromechanical system fluid dispenser including one or more nozzles, the method comprising: removing an oxide layer from a surface of the silicon substrate, the surface of the silicon substrate including an area around the one or more nozzles; and treating a portion of the surface of the silicon substrate with radiation to react the portion of the surface of the silicon substrate with CCCH.sub.2CF.sub.2CF.sub.2CF.sub.3, wherein the area of the surface of the silicon substrate around the one or more nozzles is not treated with the radiation.

2. The method of claim 1, wherein the removing the oxide layer includes treating the silicon substrate with a hydrogen fluoride compound.

3. The method of claim 1, wherein the radiation is selected from the group consisting of UV light, electromagnetic radiation, thermal radiation, infrared (IR), derivatives thereof, and combination therefrom.

4. The method of claim 3, further comprising positioning a photomask between the surface of the silicon substrate and the radiation such that the portion of the surface of the silicon substrate is treated with the radiation and the area of the surface of the silicon substrate around the one or more nozzles is not treated with the radiation.

5. The method of claim 3, further comprising adding a sacrificial electron acceptor to accelerate the reacting the portion of the surface of the silicon substrate with the CCCH.sub.2CF.sub.2CF.sub.2CF.sub.3.

6. The method of claim 1, further comprising controlling a degree of reaction of the portion of the surface of the silicon substrate with the CCCH.sub.2CF.sub.2CF.sub.2CF.sub.3.

7. The method of claim 1, wherein the radiation is UV light.

8. The method of claim 1, wherein the one or more nozzles comprises a plurality of nozzles.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Further objects, features and advantages of the present invention will become apparent from the following detailed description when taken in conjunction with the accompanying figures showing illustrative embodiments of the present invention.

(2) FIG. 1 provides an illustration of one or more chemical reaction steps associated with one or more embodiments of the present subject matter.

(3) FIG. 2a illustrates a top perspective image of the inkjet chip surface, according to one or more embodiments of the present subject matter.

(4) FIG. 2b illustrates a top perspective image of the photomask surface, according to one or more embodiments of the present subject matter.

(5) FIG. 2c illustrates a top perspective image of the functionalized inkjet chip surface, according to one or more embodiments of the present subject matter.

(6) FIG. 2d provides a side perspective image of the functionalized inkjet chip surface, according to one or more embodiments of the present subject matter.

(7) Throughout the Figures, the same reference numerals and characters, unless otherwise stated, are used to denote like features, elements, components or portions of the illustrated embodiments. Moreover, while the subject invention will now be described in detail with reference to the Figures, it is done so in connection with the illustrative embodiments. It is intended that changes and modifications can be made to the described embodiments without departing from the true scope and spirit of the subject disclosure as defined by the appended paragraphs.

DETAILED DESCRIPTION OF THE DISCLOSURE

(8) The present disclosure incorporates the understanding that SiC carbon linkages are far more chemically robust than other linkages, such as SiOSi linkages, to develop an anti-wetting surface.

(9) Various methods disclosed herein provide an effective, stable, and long-lasting coating which would be advantageous in the art, and help prevent particulation if the film degrades by having the coating be covalently bonded to the surface of the faceplate, not physisorbed. In the case of a Si device, this represents bonding between a Si surface and some other chemical species. Other advantages include having more stable covalent bonds which provide hydrolytic stability, thus reducing break-down over the life of the dispenser. Further advantages of the present disclosure include a coating which is chemically compatible with the resist, and capable of selective application to the faceplate, without making the immediate nozzle area, or especially the interior of the nozzle, anti-wetting, thus eliminating poor contact between the fluid and the nozzle or channel walls which can significantly degrade jetting performance.

(10) FIG. 1 provides one or more chemical reaction steps associated with one or more embodiments of the present subject matter. This chemical reaction is performed by introducing the Si surface oxide chip 10 to dilute hydrogen fluoride 12 (HF) or buffered NH.sub.4F for etching the chip 10, resulting in a SiH terminated surface 14. The SiH terminated surface 14 is reacted with fluorocarbon chains having a terminal CC double bond, in the presence of radiation (e.g. UV light), resulting in the SiC bonded chip 16. This reaction in the presence of UV light is one example for treating the surface of the silicon substrate so as to prevent degradation during use as well as subsequent processing steps, should they be necessary. Although the treatment step may be performed at room temperature, the process may be accelerated by elevated temperatures. The treatment may further occur in ambient air or in a vacuum.

(11) FIG. 1 also depicts the optional use of a sacrificial electron acceptor 18, which may be utilized to accelerate the fluorinated alkyl chain having a terminal alkene to form a SiC bond.

(12) As provided in FIG. 2a, an inkjet chip 20 having a bare single crystal Si surface 22 can be chemically etched (using dilute HF, buffered oxide etch, or NH.sub.4F) to remove the native oxide layer on the surface 22, leaving the surface 22 terminated by SiH bonds. The nozzles 24 are for ink (fluid) distribution, applicable in a MEMS dispenser.

(13) The surface 22 is chemically stable against reoxidation for tens of minutes, thus providing sufficient time to chemically modify the surface 22 without using any special precautions against ambient air. Organic molecules with terminal CC double bonds are introduced to react with SiH light under radiation, thus stabilizing the surface of the silicon substrate. In various embodiments this reaction may be accelerated with the use of a sacrificial electron acceptor. Forms of radiation which may be used include, but are not limited to: ultraviolet (UV) light; electromagnetic radiation, such as radio waves, microwaves, visible light, x-rays, and gamma radiation; thermal radiation; infrared (IR); derivatives thereof; and combination therefrom.

(14) As provided in FIG. 2b, a photomask 26 may be used for patterning with a collimated radiation source, or a focused radiation source, and a scanning substrate stage to selectively control which areas of the surface are irradiated, and subsequently reacted. In this embodiment, the photomask 26 is configured to not radiate the areas 28 around the nozzles 24. By using functional groups with, for example, a CC bond on one end of a hydrocarbon chain and a carboxylic acid group on the other end, it is possible to create selective binding sites on the surface 22. Functional groups have also been used as a method to electrically passivate Si surfaces and reduce carrier recombination due to surface trap states at the Si/SiO2 interface.

(15) Alternatively, a sufficiently focused radiation source can be used without a photomask, thus allowing for focused illumination treatment of the surface wherein the radiation source may be maneuvered such that the areas 28 are not exposed, thus allowing for targeted treatment of the surface 22.

(16) By using a fluorocarbon with a terminal alkene group, a highly anti-wetting layer can be attached to the Si surface by means of SiC linkages. The use of shorter alkyl chains, which are less sterically constrained, allows for faster reaction times, allowing more surface sites to be covered, whereas longer chains provide a higher percentage of perfluoro groups. Optimization of the length of the alkyl chain results in chain lengths of 6-12 (e.g., perfluorohexane is one such compound. This optimal chain length ensures better coverage of the alkyl monolayer on the surface.

(17) Photopatterning, via the photomask 26, will prevent the anti-wetting coating from affecting the immediate nozzle 24 area, allowing optimized jetting while preventing excess fluid from accumulating on the faceplate and causing defects. In various embodiments, the degree of fluorination on the surface groups can be controlled during synthesis, by allowing a spacer between fluorinated groups and the SiC linkage to further improve stability or further adjust the contact angle. (A spacer is defined as an additional 1 carbon spacer (CH.sub.2) which may be optimal for added stability while still having adequate fluorination for anti-wetting propertiesE.g. CCCH.sub.2CF.sub.2CF.sub.2CF.sub.3 is one such compound).

(18) In addition, degree of fluorination on the surface groups can be further controlled by adjusting the degree of reaction, i.e., how many reactive sites on the Si substrate are actually reacted with the fluorinated alkene. For example, a branched fluoro alkene will create more steric hindrance to reactive sites as compared to an unbranched fluoro alkene, resulting in relatively less fluorine coverage across the same area. Similarly, in the case of UV activated reaction, a lower UV dosage will lower the amount of reaction taking place and thus lower fluorine coverage.

(19) FIG. 2c provides one embodiment of a functionalized inkjet chip 20 depicting the effects of the photopatterning on the Si surface 22 using the photomask 26. As depicted, the nozzles 24, and areas 28 around the nozzles, are not coated by the anti-wetting coating 30, thus keeping the Si surface bare around the nozzles 24.

(20) FIG. 2d provides a side perspective view of one embodiment of a functionalized inkjet chip 20 depicting the effects of the photopatterning on the Si surface 22 using the photomask 26. As depicted, the photomask 26 is positioned between the chip surface 22 having the anti-wetting coating 30, and the UV light source 32, thus exposing only the desired portions of the anti-wetting coating 30 to the UV light source 32.

(21) One of the aspects of the subject disclosure is to provide an anti-wetting coating capable of maintaining a high contact angles (i.e., 90 degrees or greater) after extended exposure of the coating to the environment (e.g. air and/or water). The anti-wetting coating provides for maximized surface coverage, thereby limiting water molecules from reaching the surface, and further forms linkages having a kinetically stable SiC bonds that are resistant to hydrolysis.

(22) Contact angle may be measured using any number of methods known in the art. In the present disclosure static contact angle measurements can be performed on the coatings by the sessile drop method using deionized water and a contact angle instrument (goniometer), with an average angle calculated in an effort to minimize error. Contact angles greater than 90 degrees can be observed after exposure to water for up to 30 days, up to 90 days, and up to 180 days or more.