Floor Sanding Device, Floor Treatment Plate and Method for Sanding a Floor

Abstract

The present invention relates to a floor sanding device for sanding a floor. The invention further relates to a floor treatment plate and a method for sanding a floor. The floor sanding device comprises: —a carrier plate and a drive for driving the carrier plate; —a treatment plate for treating a surface of a floor, wherein the treatment plate is operatively coupled to the carrier plate; and —an intermediary plate that is arranged between the carrier plate and the treatment plate, wherein the intermediary plate comprises at least one compartment for receiving at least one pressure member for providing a higher local pressure.

Claims

1. A floor sanding device, comprising: a carrier plate and a drive for driving the carrier plate; a treatment plate for treating a surface of a floor, wherein the treatment plate is operatively coupled to the carrier plate; and an intermediary plate that is arranged between the carrier plate and the treatment plate, wherein the intermediary plate comprises at least one compartment for receiving at least one pressure member for providing a higher local pressure.

2. The floor sanding device according to claim 1, wherein the floor sanding device further comprises at least one pressure member that is configured for placement in the at least one compartment, wherein a stiffness of the at least one pressure member is higher than a stiffness of the intermediary plate.

3. The floor sanding device according to claim 2, wherein the at least one pressure member is removably provided in the at least one compartment.

4. The floor sanding device according to claim 2, wherein a ratio between the stiffness of the at least one pressure member to the stiffness of the intermediary plate is greater than 1.5, preferably greater than 5 and most preferably greater than 10.

5. The floor sanding device according to claim 2, wherein the at least one pressure member comprises rubber.

6. The floor sanding device according to claim 1, wherein the compartments are disc-shaped.

7. The floor sanding device according to claim 1, wherein the intermediary plate comprises three compartments that are symmetrically distributed around a center point of the intermediary plate.

8. The floor sanding device according to claim 1, wherein the floor sanding device is a planetary floor sanding device.

9. The floor sanding device according to claim 1, wherein the intermediary plate is at least partially flexible.

10. The floor sanding device according to claim 1, further comprising a damping plate that is arranged between the carrier plate and the intermediary plate for partially dampening the sanding during use.

11. The floor sanding device according to claim 1, wherein the treatment plate comprises air holes.

12. The floor sanding device according to claim 11, wherein the air holes are distributed unevenly on the floor treatment plate.

13. The floor sanding device according to claim 12, wherein the air holes are distributed such that they are located in a different location than the at least one compartment of the treatment plate as seen in a direction perpendicular to a plane parallel to the floor.

14. The floor sanding device according to claim 11, wherein the intermediary plate comprises air holes, wherein the air holes are located at substantially the same location as the air holes in the treatment plate as seen in a direction perpendicular to a plane parallel to the floor.

15. The floor sanding device according to claim 11, wherein the carrier plate comprises air holes, wherein the air holes are located at substantially the same location as the air holes in the treatment plate and/or intermediary plate as seen in a direction perpendicular to a plane parallel to the floor.

16. The floor sanding device according to claim 1, wherein the intermediary plate is attached to the carrier plate with a hook-and-loop fastener connection.

17. The floor treatment plate for use with a floor sanding device according to claim 1, the floor treatment plate comprising air holes that are distributed unevenly over the floor treatment plate for providing cooling and/or suctioning of dust.

18. The floor treatment plate according to claim 17, wherein the air holes are distributed in three groups, and wherein each of the three groups has a group center point, wherein the group center points are provided at 120° from each other around a treatment center point from the floor treatment plate.

19. A method for sanding a floor, comprising: providing a floor sanding device according to claim 1; and sanding the floor with the floor sanding device.

20. The method for sanding a floor of claim 19, further comprising: changing the at least one pressure member from the intermediary plate.

Description

[0060] Further advantages, features and details of the invention are elucidated on the basis of preferred embodiments thereof, wherein reference is made to the accompanying drawings, in which:

[0061] FIG. 1 shows an example of a floor sanding device according to the invention;

[0062] FIG. 2A shows an example of a carrier plate according to the invention;

[0063] FIG. 2B shows an example of a damping plate according to the invention;

[0064] FIG. 2C shows an example of an intermediary plate according to the invention;

[0065] FIG. 2D shows an example of pressure members according to the invention;

[0066] FIG. 2E shows an example of a treatment plate according to the invention; and

[0067] FIG. 3 shows an example of a intermediary plate according to the invention.

[0068] Floor sanding device 2 (FIG. 1) comprises transport cart 4 that is connected with pivot connection 6 to housing 8. Housing 8 comprises top plate 10 whereon drive system 12 is provided. Drive system 12 comprises motor 14 that is connected to transmission 16. Via transmission 16 drive motor 14 is operatively coupled to carrier plate 20 that is provided under top plate 10. It is clear for the skilled person that instead of transport cart 4 use can be made of a floating floor sanding device.

[0069] In the illustrated embodiment floor sanding device further comprises dust container 27. Dust container 27 is via dust tube 28 connected to dust opening 30 that is provided on top plate 10. In this way dust collected during sanding of floor 3 can be easily stored in dust container 27.

[0070] Top plate 10 comprises water opening 15 that is connectable to a water supply for supplying water to floor sanding apparatus 2. Housing 8 of floor sanding device 2 further comprises, seen in a direction from top to bottom, damping plate 22, intermediary plate 24 and treatment plate 26. Carrier plate 20, damping plate 22, intermediary plate 24 and treatment plate 26 can be connected in various ways, for example with screws, with glue and/or with hook-and-loop fasteners, and are in use operatively connected to carrier plate 20. In this example at least the connection between damping plate 22 and intermediary plate 24 is provided by a hook-and-loop connection.

[0071] Carrier plate 120 (FIG. 2A), in this example made of metal, comprises dust holes 130. In the illustrated embodiment dust holes 130 are distributed unevenly over carrier plate 120, and are more specifically grouped symmetrically around center point 132 of carrier plate 120 in a rotational manner Dust holes 130 are divided in three triangular groups 130a, 130b and 130c. Groups 130A, 130B and 130C are positioned such that one corner is pointing towards center point 132. Further provided on carrier plate 120 are connection holes 134. Connection holes 134 are configured to be operatively connected to motor 14 of drive system 12, such that carrier plate 20 can be given the desired movement. Instead of using connection holes 134 carrier plate 20 can also be connected to motor 14 in various other ways, for example with screws and/or glue.

[0072] Damping plate 222 (FIG. 2B) also comprises dust holes 230. Dust holes 230 are, when seen in a direction A that is in use substantially perpendicular to floor 3, positioned at the same location as dust holes 130. This achieves that dust created by sanding floor 3 can be effectively transported to dust container 27. Further provided in damping plate 222 are connection holes 234 for connecting damping plate 222 to carrier plate 120. Alternatively, damping plate 222 can also be connected to carrier plate 120 via a hook-and-loop connection. In this example damping plate 222 is substantially made of foam rubber. This achieves that the pressure provided by floor sanding apparatus 2 is reduced. This is advantageous if one wants reduce the depth of sanding, or when one wants to polish floor 3 instead of sanding it. A further advantage of the damping plate is that the pressure member is forced to be parallel to the floor.

[0073] Intermediary plate 324 (FIG. 2C) also comprises dust holes 330, provided at the same location as dust holes 230 and 130 as seen in direction A. Further provided in intermediary plate 324 are compartments 340 that are configured to receive pressure members 342 (FIG. 2D). In the illustrated embodiment, intermediary plate 324 comprises three compartments 340 such that three pressure members 342 can be placed therein.

[0074] In this exemplified embodiment pressure members 342 are substantially made of rubber, while intermediary plate 324 is substantially made of foam rubber. Therefore, the stiffness of pressure members 342 is higher than the stiffness of intermediary plate 324. In this exemplified embodiment the stiffness of pressure members is about three times as high as the stiffness of the foam rubber is, i.e. the Young's modulus of pressure members 342 is about three times as high as the Young's modulus of intermediary plate 324.

[0075] Pressure members 342 are replaceably provided in compartments 340, such that pressure members 342 can be replaced by elements having the same shape as pressure members 342 and having a different stiffness. For example, elements with the same material or at least material with the same stiffness as intermediary plate 324 can be placed in compartments 340. This realizes that floor sanding device 2 can easily apply different kinds of pressure on floor 3, thus realizing a very versatile floor sanding device 2. In an alternative embodiment it is also possible that compartments 340 are not complete openings in intermediary plate 324, but still have a small layer of intermediary plate 324 left, wherein the small layer is positioned near carrier plate 120. This gives pressure members 342 the ability to more easily move along with irregularities in floor 3, thereby reducing the risk of unwanted scratches in floor 3.

[0076] In an example it is possible to replace pressure members 342 with other pressure members. Alternatively it is possible to remove pressure members 342 without replacement, such that floor sanding device 2 can be used for polishing. Optionally it is possible to rotate treatment late 324 such that compartments 340 are located at the location of dust holes 230 and 430. In the illustrated embodiment this would amount to a rotation of about 60°. It is possible that compartments 330, pressure members 342 and groups 130A, 130B and 130C have a similar shape and/or design. In an example, compartments 330, pressure members 342 and groups 130A, 130B and 130C could all be substantially triangular-shaped, rectangular-shaped or disc-shaped. It will be understood that other shapes can also be envisaged according to the invention.

[0077] Treatment plate 426 (FIG. 2E) is also provided with dust holes 430, at the same location as dust holes 330, 230 and 130 as seen in direction A. Thereby an effective transport of dust from floor 3 to dust container 27 is made possible. Lower side 450 of treatment plate 426 is provided with an abrasive topping, such that floor 3 can be effectively sanded by floor sanding device 2.

[0078] It will be that alternative configurations of carrier plate 20, 120, damping plate 22, 222, intermediary plate 24, 324 and/or treatment plate 26, 426 can be designed and/or configured in different ways according to the present invention.

[0079] It is clear for the skilled person that dust holes 130 and 230 are not essential. It is also possible to transport dust from intermediary plate 324 in a sideways direction through a dust channel. This dust channel could for example be provided in damping plate 222, but is not limited thereto.

[0080] Through the pressure of pressure members 542 local pressure field 544 (FIG. 3) is created surrounding center point 532. In local pressure field 544 there is a substantially higher pressure provided to floor 2 when pressure members 442 have a higher stiffness than intermediary plate 426. As a consequence of local pressure field 544 dust 546 is being collected near locations with a lower pressure, in particular the location of groups 530a, 530b and 530c. Groups 530a, 530b and 530c have group center points 560a, 560b and 560c respectively, which are positioned at angle α of 120° from each other around center point 532. Thus with the exemplified embodiment the location of where dust holes 530 are positioned function as a ‘vacuum’ and undesired dust 546 is easily removed. This increases the effectiveness of floor sanding device 2.

[0081] In an embodiment according to the invention floor sanding device 2 is brought into a to be sanded floor 2. Motor 14 then brings, through transmission 16, carrier plate 20 in movement. As treatment plate 26 is operatively coupled to carrier plate 20, treatment plate 26 will sand the floor. During sanding dust 546 is created and subsequently transported through dust holes 430, 330, 230 and 130 respectively, via dust tube 28 into dust container 27. After sanding floor 2, pressure members 342 can be removed from compartments 340 of intermediary plate 324. Afterwards elements that have the same or a similar stiffness as intermediary plate 324 can be placed in compartments 340, such that floor 2 can also be polished by floor sanding device 2.

[0082] The present invention is by no means limited to the above described preferred embodiments thereof. The rights sought are defined by the following claims within the scope of which many modifications can be envisaged.