Data Recording on Ceramic Material

Abstract

The present invention relates to a method for recording data in a layer of a ceramic material and to a device for recording data in a layer of a ceramic material.

Claims

1. A method for recording data in a layer of a ceramic material, the method comprising: providing a layer of a ceramic material; and selectively illuminating a plurality of regions of the layer of the ceramic material with a laser beam using a digital micromirror device; wherein the parameters of the laser beam and the time of illumination for each of the selected regions are configured so as to ablate each of the selected regions in order to record data in the layer of the ceramic material by creating recesses, which are open to atmosphere, in the layer of the ceramic material and wherein the laser beam originates from a picosecond laser or from a femtosecond laser; wherein providing the layer of the ceramic material comprises providing a substrate and coating the substrate with the layer of the ceramic material, which is different from the material of the substrate, wherein the layer of the ceramic material has a thickness no greater than 10 μm; wherein the layer of the ceramic material comprises at least one of: a metal nitride, a metal carbide, a metal oxide, a metal boride, and a metal silicide.

2. The method of claim 1, wherein the laser beam is a Bessel beam.

3. The method of claim 1, wherein the layer of the ceramic material is moved laterally during recording and wherein the method further comprises: selectively illuminating a plurality of regions within a first area of the layer of the ceramic material with the laser beam using the digital micromirror device, wherein the first area can be covered by the digital micromirror device; translating the layer of the ceramic material so that a second area different from the first area can be covered by the digital micromirror device; and selectively illuminating a plurality of regions within the second area of the layer of the ceramic material with the laser beam using the digital micromirror device.

4. The method of any of claim 1, wherein the layer of the ceramic material has a thickness no greater than 1 μm.

5. The method of claim 1, wherein the substrate comprises at least 90% by weight of one or a combination of: Al.sub.2O.sub.3, TiO.sub.2, SiO.sub.2, ZrO.sub.2, ThO.sub.2, MgO, Cr.sub.2O.sub.3, Zr.sub.2O.sub.3, V.sub.2O.sub.3.

6. The method of claim 1, wherein the substrate has a thickness of less than 500 μm.

7. The method of claim 1, wherein the substrate has a thickness of less than 100 μm.

8. The method of claim 1, wherein the substrate is transparent to the wavelength of the laser beam.

9. The method of claim 8, wherein the substrate comprises a glassy transparent ceramic material or a crystalline ceramic material.

10. The method of claim 8, wherein the substrate comprises one or a combination of: sapphire (Al.sub.2O.sub.3), silica (SiO.sub.2), zirconium silicate (Zr(SiO.sub.4)), zirconium oxide (ZrO.sub.2), boron monoxide (B.sub.2O), boron trioxide (B.sub.2O.sub.3), sodium oxide (Na.sub.2O), potassium oxide (K.sub.2O), lithium oxide (Li.sub.2O), zinc oxide (ZnO), magnesium oxide (MgO).

11. The method of claim 8, wherein selectively illuminating a plurality of regions of the layer of the ceramic material with a laser beam using a digital micromirror device comprises illuminating the layer of the ceramic material through the transparent substrate.

12. The method of claim 1, wherein selectively illuminating a plurality of regions of the layer of the ceramic material with a laser beam using a digital micromirror device comprises ablating sufficient material at each of the regions that the recesses extend towards the substrate.

13. The method of claim 1, wherein the recesses are created at a subset of predetermined positions and wherein the predetermined positions are arranged in a regular matrix or array.

14. The method of claim 1, further comprising collecting positively charged debris using a negatively charged mesh or sheet.

15. The method of claim 1, wherein the fluence of each of the multiple laser beams emitted by the digital micromirror device is greater than 100 mJ/cm.sup.2.

16. The method of claim 1, wherein the recesses in the layer of the ceramic material are created in the optical far-field of the multiple laser beams.

17. The method of claim 1, wherein the plurality of regions of the layer of the ceramic material are illuminated via focusing optics and wherein the distance between the focusing optics and the layer of the ceramic material is greater than 4 times the wavelength of the laser light.

18. The method of claim 1, wherein, at the layer of the ceramic material, the multiple laser beams emitted by the digital micromirror device are Gaussian beams or Bessel beams.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Preferred embodiments of the present invention will be further elucidated with reference to the figures:

[0050] FIG. 1 shows a schematic view of a device for recording data according to a preferred embodiment;

[0051] FIG. 2a schematically shows a first recording alternative;

[0052] FIG. 2b schematically shows a second recording alternative;

[0053] FIG. 3 schematically shows a device for recording data according to another preferred embodiment; and

[0054] FIG. 4 shows a schematic view of a combination of a polarizer, a zone plate and a lens as well as a graph of the resulting beam shape and focal length along the axis of the laser beam.

DETAILED DESCRIPTION

[0055] FIG. 1 shows a schematic illustration of a device for recording data in a layer of a ceramic material according to a preferred embodiment of the present invention. The device comprises a laser source 2 emitting laser light onto a DMD 3 comprising multiple micromirrors 3a arranged in an array. The DMD 3 is adapted to emit multiple laser beams 4 along either a first direction (i.e., for recording) or along a second direction (indicated with reference numeral 9) for each micromirror being in an “off” state diverting those laser beams 9 into a beam dump (not shown). Usually, the device will further comprise collimating optics (not shown in FIG. 1) for collimating laser light emitted by the laser source 2 onto the DMD 3. The device further comprises a substrate holder 6 for mounting a substrate 7 and focusing optics 8 adapted for focusing each of the multiple laser beams 4 emitted by the DMD onto a substrate 7 mounted on the substrate holder. The focusing optics 8 may, for example, comprise standard microscope optics having a high numerical aperture. The substrate holder 6 is adapted for supporting and preferably mounting the substrate 7 and may be mounted onto or part of an XY-stage.

[0056] In the example shown in FIG. 1, the substrate 7 comprises a ceramic coating or a layer of a ceramic material 1 which is locally ablated by means of the focused laser beams 4. In FIG. 1, the ceramic coating 1 is provided on top of the substrate 7 (see also FIG. 2a). Alternatively, the ceramic coating may be provided on a bottom or back side of the substrate 7 as shown in FIG. 2b. Since the laser beams 4 in this case have to pass through the substrate 7, the material of the substrate 7 need be transparent for the wavelength of the laser light in this case. Moreover, in this case it is preferred that the substrate holder 6 comprises a frame 6a supporting the outer edge of the substrate 7 only (whereas the substrate may be fully supported in case of a top ablation as shown in FIG. 2a). Thus, the part of the ceramic coating 1 being exposed to ablation is not supported due to the free space 6b under that part (see FIG. 2b).

[0057] This is a particularly preferred embodiment because any debris generated during ablation will be separated from the focusing optics 8 by means of the substrate 7. Rather, any material being ablated from the ceramic layer 1 will be emitted into the free space 6b of the sample holder 6 and may be extracted or aspired therefrom. Thus, the focusing optics 8 will not be negatively affected by said debris and it is much easier to clean the surface of the ceramic coating 1 immediately after or even during recording.

[0058] Preferably, the thickness of the substrate is adapted to the focussing optics of the device being used. For example, the thickness of the substrate should be smaller than the focal length of the focussing optics in order to reach the ceramic coating.

[0059] Moreover, the arrangement shown in FIG. 2b does also allow for cooling the ceramic coating 1 during ablation, for example by letting a cooling fluid flow along said ceramic coating 1. This will improve accuracy of the ablation process because heat transfer from the laser focus to surrounding areas may be eliminated. For example, a cross jet of air (e.g., an air blade) or a liquid such as water or other immersion liquids may be provided for this purpose. Said cross jet may, in addition, drain off the debris generated during ablation.

[0060] Such a cross jet may also be provided in case of the arrangement shown in FIG. 2a. However, said cross jet in this embodiment has to be designed so as not to interfere with the optics. For example, if immersion optics is used the immersion liquid may be provided in a cross flow which is preferably laminar in order to avoid any optical effects due to turbulences within the immersion liquid.

[0061] Since such a cross jet of air or a liquid may generate vibrations which may jeopardize the recording accuracy and since it will be intricate to use a cross jet for the embodiment shown in FIG. 2a, it is preferred to provide a negatively charged mesh or sheet 15 as shown in FIGS. 2a and 2b. As explained above, the use of a picosecond or femtosecond laser will create a plasma in the ceramic material to be ablated. Simply speaking, parts of the atomic shells of the ceramic material will be removed due to the interaction with the laser pulses. The remaining, positively charged atomic cores are then expelled during a so-called Coulomb explosion. These positively charged atomic cores may then be attracted by the negatively charged mesh or sheet 15. This is particularly advantageous in case of the embodiment shown in FIG. 2a where the laser beams 4 may pass through an opening in the mesh or plate. All debris will then be collected by the charged mesh or plate and can, thus, not negatively affect, e.g., the focussing optics 8.

[0062] More details of another preferred embodiment of the inventive device are shown in FIG. 3. For example, FIG. 3 shows the collimating optics 5 for collimating laser light emitted by the laser source 2 onto the DMD 3 as well as further optical components such as a spatial filter 10, 11. The substrate holder 6 is, in case of FIG. 3, a XY positioning system for translating the substrate 7 along the x-y-plane (with z being perpendicular to the surface of the substrate 7). Both the DMD 3 and the XY positioning system 6 are controlled by a computer 13 which is configured to control the DMD 3 and the XY positioning system 6 so as to perform the following steps: selectively illuminating a plurality of regions within a first area of the layer 1 of the ceramic material with the laser beam using the DMD 3, wherein the first area can be covered by the DMD 3; translating the layer 1 of the ceramic material (i.e., the entire substrate 7 in the present case) so that a second area different from the first area can be covered by the DMD 3; and selectively illuminating a plurality of regions within the second area of the layer 1 of the ceramic material with the laser beam using the DMD 3.

[0063] As discussed previously, the device preferably comprises a beam shaping device to achieve, e.g., Bessel beams. For example, a matrix of laser zone plates 12 may be provided between the DMD 3 and the focusing optics 8 so as to shape each of the laser beams 4 (see FIG. 1) into a Bessel beam shape. Each Bessel beam is then focussed onto the substrate 7 by means of an attributed lens (e.g. Fresnel lens) 8. In order to properly illuminate the matrix of laser zone plates 12 additional collimating optics 14a and 14b may be provided. This principle is further elucidated in FIG. 4 which shows (for a single beamlet) how a Bessel beam is generated by a combination of an optical element 12a creating circularly polarized light and a binary phase element 12b for creating a Bessel beam which is then focused onto the substrate 7 by means of an attributed high NA lens 8 (or a Fresnel lens 8). As indicated also in FIG. 4, a focus length of at least 4 times the wavelength of the laser light may be achieved by using such a Bessel beam. Moreover, the focus has a much more cylindrical shape than a Gaussian beam.