METHOD AND DEVICE FOR PRODUCING A PLASTICS COMPONENT, AND A PLASTICS COMPONENT

Abstract

A method for producing at least one plastic component (1), wherein in the method the following steps, preferably in the following sequence, preferably cyclically in the following sequence, are carried out: a) providing at least one film (2) and at least one sensor film (3), wherein the at least one film (2) and/or the at least one sensor film (3) has at least one thermoplastic material or at least one thermoplastic polymer; b) applying the at least one sensor film (3) to at least one first region of a surface of the at least one film (2); c) forming the at least one film (2) having the at least one sensor film (3), wherein one or more formed film bodies (4) are made; d) punching out one or more film elements (4a) made from at least one second region of the one or more formed film bodies (4), and a device (10) and a plastic component (1).

Claims

1-70. (canceled)

71. A method for producing at least one plastic component, wherein, in the method the following steps, are carried out: a) providing at least one film and at least one sensor film, wherein the at least one film and/or the at least one sensor film has at least one thermoplastic material or at least one thermoplastic polymer, b) applying the at least one sensor film to at least one first region of a surface of the at least one film, c) forming the at least one film comprising the at least one sensor film, wherein one or more formed film bodies are made, d) punching out one or more film elements made from at least one second region of the one or more formed film bodies, wherein the at least one sensor film and/or the at least one film in step a) has polyethylene terephthalate as at least one thermoplastic material or as at least one thermoplastic polymer and the thickness of the at least one film in step a) and/or b) is greater than the thickness of the at least one sensor film in step a) and/or b).

72. The method according to claim 71, wherein the at least one film and/or the at least one sensor film in step a) has polycarbonate as at least one thermoplastic material or as at least one thermoplastic polymer.

73. The method according to claim 71, wherein the at least one film in step a) has a thickness of from 250 μm to 3000 μm.

74. The method according to claim 71, wherein the at least one film in step a) has a tensile strength of between 20 MPa and 100 MPa.

75. The method according to claim 71, wherein the at least one film in step a) is flexible at least in regions or over the whole surface.

76. The method according to claim 71, wherein the at least one film in step a) is provided as a film composite, which is flexible at least in regions or over the whole surface.

77. The method according to claim 71, wherein the at least one sensor film in step a) has a tensile strength of between 150 MPa and 500 MPa.

78. The method according to claim 71, wherein the tensile strength of the at least one film in step a) and/or b) is at most the tensile strength of the at least one sensor film in step a) and/or b) multiplied by a factor of ⅔.

79. The method according to claim 71, wherein the thickness of the at least one film in step a) and/or b) is at least the thickness of the at least one sensor film in step a) and/or b) multiplied by a factor of ½.

80. The method according to claim 71, wherein step b) comprises one or more steps of the following further steps: b1) providing at least one carrier substrate; b2) applying at least one electrically conductive layer to the carrier substrate, wherein the at least one electrically conductive layer makes an electrical functional structure in at least one functional region, wherein the at least one electrically conductive layer, in at least one contacting region, makes at least one contacting structure for contacting the electrical functional structure; b3) applying at least one adhesion-promoting layer for applying the at least one sensor film to the at least one film in such a way that the adhesion-promoting layer, when observed perpendicular to a plane spanned by the at least one carrier substrate, does not cover the at least one contacting region at least in regions or wherein the at least one adhesion-promoting layer, when observed perpendicular to a plane spanned by the at least one carrier substrate, is applied over the whole surface.

81. The method according to claim 71, wherein the method comprises the following further step: e) injection molding the one or more punched-out film elements; and wherein step e) comprises one or more steps of the following further steps: e1) providing at least one decorative film; e2) introducing at least one decorative element of at least one decoration into the at least one decorative film by processing in at least one processing station; e3) inserting the one or more punched-out film elements and the at least one decorative film into an injection-molding station, wherein the injection-molding station comprises a first mold half and a second mold half, wherein the first mold half and the second mold half, make an injection-molding cavity for molding at least one plastic body, wherein the at least one punched-out film element is attached to a first wall of the injection-molding cavity and/or the at least one decorative film is attached to a second wall of the injection-molding cavity; e4) injection molding the one or more punched-out film elements and the at least one decorative film with a plastic material to make a plastic component comprising the at least one plastic body in such a way that the one or more punched-out film elements make a first surface of the plastic component and the at least one decorative film makes a second surface of the plastic component; e5) opening the injection-molding station by moving the first mold half and the second mold half apart; e6) removing the plastic component.

82. The method according to claim 71, wherein the radius of curvature of the plastic component after step e) is smaller than 1000 mm, at least in regions, and/or wherein the stretching of the plastic component after step e) is greater than or equal to 1%.

83. A device for producing at least one plastic component wherein the device has at least one feed station, which is designed in such a way that the at least one feed station provides at least one film and provides at least one sensor film, wherein the at least one film and/or the at least one sensor film has at least one thermoplastic material or at least one thermoplastic polymer, and wherein the device has at least one applying station, which is designed in such a way that the at least one applying station applies the at least one sensor film to at least one first region of a surface of the at least one film, and wherein the device has at least one forming station, which is designed in such a way that the at least one forming station forms the at least one film comprising the at least one sensor film to make at least one formed film body, and wherein the device has at least one punching station, which is designed in such a way that the at least one punching station punches at least one film element out of at least one second region of the at least one formed film body, wherein the at least one sensor film and/or the at least one film has polyethylene terephthalate as at least one thermoplastic material or has at least one thermoplastic polymer and the at least one film has a thickness of from 250 μm to 3000 μm, wherein the at least one sensor film has a thickness of from 25 μm to 150 μm.

84. The device according to claim 83, wherein the at least one film is flexible at least in regions or over the whole surface.

85. The device according to claim 83, wherein the at least one film is provided as a film composite, which is flexible at least in regions or over the whole surface.

86. The device according to claim 83, wherein the at least one sensor film is applied to the at least one film by means of hot lamination in at least one hot-laminating station and/or by means of hot stamping and/or cold lamination and/or adhesive bonding.

87. The device according to claim 83, wherein the device comprises one or more stations of the following further stations: feed station for providing at least one carrier substrate; applying station for applying at least one electrically conductive layer to the carrier substrate in such a way that the at least one electrically conductive layer makes an electrical functional structure in at least one functional region, wherein the at least one electrically conductive layer, in at least one contacting region, makes at least one contacting structure for contacting the electrical functional structure; applying station for applying at least one adhesion-promoting layer for applying the at least one sensor film to the at least one film in such a way that the adhesion-promoting layer, when observed perpendicular to a plane spanned by the at least one carrier substrate, does not cover the at least one contacting region at least in regions, or wherein the at least one adhesion-promoting layer, when observed perpendicular to a plane spanned by the at least one carrier substrate, is applied over the whole surface.

88. The device according to claim 87, wherein the at least one electrically conductive layer comprises at least one metal layer and/or a layer of ITO and/or AZO and/or PEDOT and/or conductive varnishes.

89. The device according to claim 83, wherein the forming station and/or the device for forming the at least one film comprising the at least one sensor film comprises one or more of the following forming stations, deep-drawing station, thermoforming station, High Pressure Forming station, injection-molding station.

90. The device according to claim 83, wherein the device comprises one or more stations of the following further stations: inserting station for inserting the one or more punched-out film elements and/or at least one decorative film into a first mold recess of a first mold half of an injection-molding station and for fixing the one or more punched-out film elements and/or the at least one decorative film; further inserting station for inserting an in-mold labeling molded part or IML molded part into a second mold recess of a second mold half of an injection-molding station and fixing the IML molded part; injection-molding station, which has a first mold half comprising a first mold recess and a second mold half comprising a second mold recess, wherein the first mold half is made movable and the second mold half is made not movable; demolding station for removing the plastic component.

91. The device according to claim 83, wherein the device comprises one or more stations of the following further stations: at least one laminating station, at least one lining station.

92. A plastic wherein the plastic component comprises a punched-out and back-injection-molded film element comprising at least one formed film and at least one formed sensor film, wherein the at least one formed film and/or the at least one formed sensor film has at least one thermoplastic material or at least one thermoplastic polymer, and wherein the radius of curvature of the plastic component is smaller than 1000 mm, at least in regions, and/or in that the stretching of the plastic component is greater than or equal to 1%, wherein the at least one formed sensor film and/or the at least one formed film has polyethylene terephthalate as at least one thermoplastic material or as at least one thermoplastic polymer and the thickness of the at least one film is greater than the thickness of the at least one sensor film.

93. The plastic component according to claim 92, wherein the at least one formed film and/or the at least one formed sensor film has polycarbonate as at least one thermoplastic material or as at least one thermoplastic polymer.

94. The plastic according to claim 92, wherein the at least one formed film has a thickness of from 250 μm to 3000 μm.

95. The plastic component according to claim 92, wherein the at least one formed film has a tensile strength of between 20 MPa and 100 MPa.

96. The plastic component according to claim 92, wherein the at least one formed sensor film has a thickness of from 25 μm to 150 μm.

97. The plastic component according to claim 92, wherein the at least one formed sensor film has a tensile strength of between 150 MPa and 500 MPa.

98. The plastic component according to claim 92, wherein the tensile strength of the at least one formed film is at most the tensile strength of the at least one formed sensor film multiplied by a factor of ⅔.

99. The plastic component according to claim 92, wherein the thickness of the at least one formed film is at least the thickness of the at least one formed sensor film multiplied by a factor of ½.

100. The plastic component according to claim 92, wherein the thickness of the at least one film in step a) and/or b) is at least the thickness of the at least one sensor film in step a) and/or b) multiplied by a factor of 2, 3, 4 or 5.

101. The plastic component according to claim 92, wherein the plastic component and/or the at least one formed film and/or the at least one formed sensor film has at least one decoration and/or at least one decorative film in regions.

Description

[0480] The invention is explained by way of example below with reference to several embodiment examples with the aid of the attached drawings. There are shown in:

[0481] FIG. 1 a schematic representation of a method,

[0482] FIG. 2 a schematic representation of a method step as well as a film and a sensor film,

[0483] FIG. 3 a schematic representation of a method step as well as a film and a sensor film,

[0484] FIG. 4 a schematic representation of a method step as well as a film and a sensor film,

[0485] FIG. 5 a schematic representation of a method step as well as a station of a device as well as a film and a sensor film,

[0486] FIG. 6 a schematic representation of a method step and of a station of a device as well as a film and a sensor film,

[0487] FIG. 7 a schematic representation of a plastic component,

[0488] FIG. 8 a schematic representation of a method step and of a station of a device as well as a film and a sensor film,

[0489] FIG. 9 a schematic representation of a plastic component.

[0490] FIG. 1 shows a method for producing at least one plastic component 1, wherein in the method the following steps a, b, c and d, preferably in the following sequence, preferably cyclically in the following sequence, are carried out: [0491] a providing at least one film 2 and at least one sensor film 3, wherein the at least one film 2 and/or the at least one sensor film 3 has at least one thermoplastic material or at least one thermoplastic polymer, [0492] b applying the at least one sensor film 3 to at least one first region of a surface of the at least one film 2, [0493] c forming the at least one film 2 comprising the at least one sensor film 3, wherein one or more formed film bodies 4 are made, [0494] d punching out one or more film elements 4a made from at least one second region of the one or more formed film bodies 4.

[0495] The at least one film 2 and/or the at least one sensor film 3 in step a preferably has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic polymer.

[0496] The at least one sensor film 3 and/or the at least one film 2 in step a further preferably has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic polymer.

[0497] FIG. 2 shows a film 2, in particular in the case of a provision according to step a, which preferably has a thickness of from 50 μm to 3000 μm, in particular of from 300 μm to 2000 μm, and/or a tensile strength of between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa. The film 2 is preferably flexible at least in regions or over the whole surface.

[0498] It is possible for the film 2 to be provided as a film composite, which is flexible at least in regions or over the whole surface and/or which comprises one or more films, in particular comprises one or more films flexible at least in regions or over the whole surface.

[0499] FIG. 2 further shows a sensor film 3, in particular in the case of a provision according to step a, which preferably has a thickness of from 25 μm to 150 μm, in particular of from 25 μm to 125 μm, and/or a tensile strength of between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa.

[0500] FIG. 3 shows a film 2 and a sensor film 3, in particular after application of the sensor film 3 to a region of a surface of the film 2 according to step b.

[0501] The at least one film 2 in step a preferably has a thickness of from 50 μm to 3000 μm, in particular of from 300 μm to 2000 μm, and/or a tensile strength of between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa. The at least one film 2 in step a is preferably flexible at least in regions or over the whole surface. In particular, the at least one film 2 in step a is provided as a film composite, which is flexible at least in regions or over the whole surface and/or which comprises one or more films, in particular comprises one or more films flexible at least in regions or over the whole surface.

[0502] It is possible for the at least one sensor film 3 in step a to have a thickness of from 25 μm to 150 μm, in particular of from 25 μm to 125 μm, and/or for the at least one sensor film 3 in step a to have a tensile strength of between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa.

[0503] Further, it is possible for the tensile strength of the at least one film 2 in step a and/or b to be at most the tensile strength of the at least one sensor film 3 in step a and/or b multiplied by a factor of ⅔ and/or for the thickness of the at least one film 2 in step a and/or b to be at least the thickness of the at least one sensor film 3 in step a and/or b multiplied by a factor of ½.

[0504] In the embodiment represented, the thickness of the film 2 is greater than the thickness of the sensor film 3. In the embodiment represented, the thickness of the at least one film 2 in step a and/or b is at least the thickness of the at least one sensor film 3 in step a and/or b multiplied by a factor of approx. 3.

[0505] Furthermore, it is possible for the at least one film 2 in step a to be transparent, translucent or opaque at least in regions or over the whole surface and/or for the at least one sensor film 3 in step b to be transparent, translucent or opaque at least in regions.

[0506] The at least one sensor film 3 in step b is preferably applied to the at least one film 2 by means of hot lamination and/or by means of hot stamping and/or cold lamination and/or adhesive bonding, in particular cold bonding.

[0507] It is possible for step b to comprise one or more steps of the following further steps, in particular for producing the at least one sensor film 3 and/or for applying the at least one sensor film 3 to the at least one film 2, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclic sequence: [0508] b1 providing at least one carrier substrate 30; [0509] b2 applying at least one electrically conductive layer 31 to the carrier substrate 30, wherein the at least one electrically conductive layer 31 makes an electrical functional structure in at least one functional region 32, wherein the at least one electrically conductive layer 31, in at least one contacting region 34, makes at least one contacting structure for contacting the electrical functional structure; [0510] b3 applying at least one adhesion-promoting layer 35 for applying the at least one sensor film 3 to the at least one film 2 in such a way that the adhesion-promoting layer 35, when observed perpendicular to a plane spanned by the at least one carrier substrate 30, does not cover the at least one contacting region 34 at least in regions or wherein the at least one adhesion-promoting layer 35, when observed perpendicular to a plane spanned by the at least one carrier substrate 30, is applied over the whole surface.

[0511] Further, it is possible for the at least one electrically conductive layer 31 in step b2 and/or b3 at least one metal layer and/or a layer of ITO and/or AZO and/or PEDOT and/or conductive varnishes, in particular wherein step b comprises one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclic sequence: [0512] b4a applying the at least one electrically conductive layer in one or more partial steps; [0513] b4b structuring the at least one electrically conductive layer by removing the at least one electrically conductive layer at least in regions in one or more partial steps; and/or [0514] b5 applying the at least one electrically conductive layer in structured form in one or more partial steps.

[0515] In particular, the at least one sensor film of the at least one sensor film 3 in step b has one or more sensors and/or electrical components, in particular LEDs, in particular one or more touch sensors and/or one or more display devices.

[0516] At least one sensor film of the at least one sensor film 3 in step b preferably has one or more contact regions, in particular wherein one or more contact regions of the one or more contact regions are covered at least in regions by no film or layer, preferably wherein one or more contact regions of the one or more contact regions are arranged on a surface of the at least one sensor film of the at least one sensor film 3 facing away from the at least one film 2.

[0517] The at least one film 2 in step a and/or the at least one sensor film 3 in step b and/or the at least one film 2 and/or the at least one sensor film 3 a further step further preferably has at least one decoration and/or at least one decorative film 5 at least in regions.

[0518] The forming of the at least one film 2 comprising the at least one sensor film 3 in step c is preferably carried out by means of one or more forming processes, in particular selected from the following forming processes: deep drawing, thermoforming, High Pressure Forming, injection-molding process.

[0519] The radius of curvature of the at least one film 2 and/or of the at least one sensor film 3 after step c is preferably smaller than 1000 mm, in particular smaller than 200 mm, further preferably smaller than 100 mm, at least in regions, and/or the stretching of the at least one film 2 and/or of the at least one sensor film 3 after step c is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, in particular preferably greater than or equal to 300%.

[0520] It is possible for the method and/or step d to comprise the following further step: [0521] e injection molding the one or more punched-out film elements 4a.

[0522] In particular, in step d one or more holes or through punches are introduced into the one or more film elements 4a, in particular wherein one or more holes of the one or more holes have the function of an injection duct for a plastic material during the injection molding in step e.

[0523] It is possible for step e to comprise one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclic sequence: [0524] e1 providing at least one decorative film 5a, which in particular has at least one opaque coating 50 at least partially; [0525] e2 introducing at least one decorative element of at least one decoration into the at least one decorative film 5a by processing in at least one processing station; [0526] e3 inserting the one or more punched-out film elements 4a and the at least one decorative film 5a into an injection-molding station 15, wherein the injection-molding station 15 comprises a first mold half 15a and a second mold half 15b, wherein the first mold half 15a and the second mold half 15b, in particular in a closed state, make an injection-molding cavity 15c for molding at least one plastic body 7a, wherein the at least one punched-out film element 4a is attached to a first wall 15aa of the injection-molding cavity 15c and/or the at least one decorative film 5a is attached to a second wall 15bb of the injection-molding cavity 15c, in particular wherein the second wall 15bb is arranged lying opposite the first wall 15aa; [0527] e4 injection molding the one or more punched-out film elements 4a and the at least one decorative film 5a with a plastic material to make a plastic component 1 comprising the at least one plastic body 7a in such a way that the one or more punched-out film elements 4a make a first surface of the plastic component 1 and the at least one decorative film 5a makes a second surface of the plastic component 1, in particular wherein the first surface lies opposite the second surface; [0528] e5 opening the injection-molding station 15 by moving the first mold half 15a and the second mold half 15b apart, in particular at the end of a cooling time of the at least one plastic body 7a comprised in the plastic component 1; [0529] e6 removing the plastic component 1.

[0530] Further, it is possible for step e to comprise one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclic sequence: [0531] e7 inserting a first punched-out film element 4aa of the one or more punched-out film elements 4a and/or a second punched-out film element 4ab of the one or more punched-out film elements 4a into an injection-molding station 16, wherein the injection-molding station 16 comprises a first mold half 16a and a second mold half 16b, wherein the first mold half 16a and the second mold half 16b, in particular in a closed state, make an injection-molding cavity 16c for molding at least one plastic body 7b, wherein the first punched-out film element 4aa is attached to a first wall 16aa of the injection-molding cavity 16c and/or the second punched-out film element 4ab is attached to a second wall 16bb of the injection-molding cavity 16c, in particular wherein the second wall 16bb is arranged lying opposite the first wall 16aa; [0532] e8 injection molding the first punched-out film element 4aa and/or the second punched-out film element 4ab with a plastic material to make a plastic component 1 comprising the at least one plastic body 7b in such a way that the first punched-out film element 4aa makes a first surface of the plastic component 1 and/or that the second punched-out film element 4ab makes a second surface of the plastic component 1, in particular wherein the first surface lies opposite the second surface; [0533] e9 opening the injection-molding station 16 by moving the first mold half 16a and the second mold half 16b apart, in particular at the end of a cooling time of the at least one plastic body 7b comprised in the plastic component 1; [0534] e10 removing the plastic component 1.

[0535] It is further possible for steps d and/or e to be carried out using an injection-molding station 17, wherein the injection-molding station 17 has a first mold half 17a comprising a first mold recess 170a and a second mold half 17b, wherein the first mold half 17a and/or the second mold half 17b has at least one injection duct 17d, wherein the first mold half 17a and the second mold half 17b, in particular in a closed state, make an injection-molding cavity 17c for molding at least one plastic body 7c, wherein steps d and/or e comprise one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclic sequence: [0536] e11 providing the one or more punched-out film elements 4a and/or at least one section of at least one decorative film 5b on the first mold half 17a and/or on the second mold half 17b in such a way that, when the first mold half 17a and second mold half 17b are closed, the one or more punched-out film elements 4a and/or the at least one decorative film 5b rest on an end face 17aa of the raised edge region 170b bordering the first mold recess 170a and surrounding the first mold recess 170a; [0537] e12 closing the first mold half 17a and the second mold half 17b until, in the region of the end face 17aa of the raised edge region 170b between the first mold half 17a and the second mold half 17b, a gap is formed between the end face 17aa of the raised edge region 170b of the first mold half 17a and the corresponding end face 17bb of the second mold half 17b at least over a partial region, and the gap is sealed by the one or more punched-out film elements 4a squeezed in the region of the gap and/or the at least one interposed decorative film 5b squeezed in the region of the gap; [0538] e13 injection molding a plastic material through the injection duct 17d into the injection-molding cavity 17c made by the closed first and second mold halves 17a, 17b, wherein the at least one decorative film 5b and/or the one or more film elements 4a are back-injection molded in the region enclosed by the raised edge region 170b with the plastic material, in particular without plastic material seeping through the sealed gap, wherein a plastic component 1 comprising the at least one plastic body 7c is made; [0539] e14 opening the first and second mold halves 17a, 17b by moving the first and/or second mold halves 17a, 17b away from one another and removing the plastic component 1 comprising the at least one plastic body 7c from the injection-molding station 17; [0540] e15 removing the remaining section of the at least one decorative film 5b and providing at least one further section of the at least one decorative film 5b.

[0541] Furthermore, it is possible for step e to be carried out using an injection-molding station 18, wherein the injection-molding station 18 has a first mold half 18a comprising a first mold recess 180a and a second mold half 18b comprising a second mold recess 180b, wherein the first mold half 18a is made movable and the second mold half 18b is made not movable,

wherein step e comprises one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclic sequence: [0542] e16 inserting the one or more punched-out film elements 4a and/or at least one decorative film 5c into the first mold recess 180a of the first mold half 18a and fixing the one or more punched-out film elements 4a and/or the at least one decorative film 5c; [0543] e17 inserting an in-mold labeling molded part 6 or IML molded part 6 into the second mold recess of the second mold half 18b and fixing the IML molded part 6, wherein the IML molded part 6 comprises an insert decorative ply 50b and a backing film 50c; [0544] e18 closing the injection-molding station 18 by lowering the first mold half 18a onto the second mold half 18b, wherein an injection-molding cavity 18c for molding at least one plastic body 7d is made; [0545] e19 injection molding a plastic material into the second mold recess 180b of the second mold half 18b, wherein the plastic material releases the IML molded part 6 from the second mold half 18b and presses it against the one or more punched-out film elements 4a and/or the at least one decorative film 5c in the first mold recess 180a of the first mold half 18a, wherein a plastic component 1 comprising the at least one plastic body 7d is made; [0546] e20 opening the injection-molding station 18 by moving the first mold half 18a away from the second mold half 18b, in particular at the end of a cooling time of the at least one plastic body 7d comprised in the plastic component 1; [0547] e21 removing the plastic component 1.

[0548] The radius of curvature of the plastic component 1 after step e is preferably smaller than 1000 mm, in particular smaller than 200 mm, further preferably smaller than 100 mm, at least in regions, and/or the stretching of the plastic component 1 after step e is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, in particular preferably greater than or equal to 300%.

[0549] A device 10 for producing at least one plastic component 1, in particular for carrying out one method of the above methods, preferably has one or more stations of the following stations: [0550] feed station 11, which is designed in such a way that the at least one feed station 11 provides at least one film 2 and provides at least one sensor film 3, wherein the at least one film 2 and/or the at least one sensor film 3 has at least one thermoplastic material or at least one thermoplastic polymer, [0551] applying station 12, which is designed in such a way that the at least one applying station 12 applies the at least one sensor film 3 to at least one first region of a surface of the at least one film 2, [0552] forming station 13, which is designed in such a way that the at least one forming station 13 forms the at least one film 2 comprising the at least one sensor film 3 to make at least one formed film body 4, [0553] punching station 14, which is designed in such a way that the at least one punching station 14 punches at least one film element 4a out of at least one second region of the at least one formed film body 4.

[0554] The at least one film 2 and/or the at least one sensor film 3 preferably has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic polymer.

[0555] The at least one sensor film 3 and/or the at least one film 2 further preferably has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic polymer.

[0556] The sensor film 3 preferably has one or more sensors, in particular one or more touch sensors and/or one or more displays or display devices.

[0557] The sensor film 3 preferably has one or more contact regions, in particular wherein one or more contact regions of the one or more contact regions are covered at least in regions by no film or layer, preferably wherein one or more contact regions of the one or more contact regions are arranged on a surface of the at least one sensor film of the sensor film 3 facing away from the film 2.

[0558] It is possible for the tensile strength of the film 2 to be at most the tensile strength of the sensor film 3 multiplied by a factor of ⅔ and/or for the thickness of the film 2 to be at least the thickness of the sensor film 3 multiplied by a factor of ½.

[0559] In particular, the film 2 is transparent, translucent or opaque at least in regions or over the whole surface and/or the sensor film 3 is transparent, translucent or opaque at least in regions.

[0560] It is possible for the sensor film 3 to be applied to the film 2 by means of hot lamination in at least one hot-laminating station and/or by means of hot lamination and/or by means of hot stamping and/or cold lamination and/or adhesive bonding, in particular cold bonding, in particular in at least one hot-stamping station and/or cold-laminating station and/or adhesive-bonding station.

[0561] It is possible for the device 10 to comprise one or more stations of the following further stations, in particular for making the sensor film 3: [0562] feed station for providing at least one carrier substrate 30; [0563] applying station for applying at least one electrically conductive layer 31 to the carrier substrate 30 in such a way that the at least one electrically conductive layer 31 makes an electrical functional structure in at least one functional region 32, wherein the at least one electrically conductive layer 31, in at least one contacting region 34, makes at least one contacting structure for contacting the electrical functional structure; [0564] applying station for applying at least one adhesion-promoting layer 35, for applying the at least one sensor film 3 to the at least one film 2, in such a way that the adhesion-promoting layer 35, when observed perpendicular to a plane spanned by the at least one carrier substrate 30, does not cover the at least one contacting region 34 at least in regions or wherein the at least one adhesion-promoting layer 35, when observed perpendicular to a plane spanned by the at least one carrier substrate 30, is applied over the whole surface.

[0565] Furthermore, it is possible here for the at least one electrically conductive layer 31 to comprise at least one metal layer and/or a layer of ITO and/or AZO and/or PEDOT and/or conductive varnishes, in particular wherein the device 10 comprises one or more stations, preferably for carrying out one or more steps of the steps b4a, b4b and/or b5, of the following further stations: [0566] applying station for applying the at least one electrically conductive layer; [0567] structuring station for structuring the at least one electrically conductive layer by removing the at least one electrically conductive layer at least in regions; [0568] applying station for applying the at least one electrically conductive layer in structured form.

[0569] It is possible for the film 2 and/or the sensor film 3 to have at least one decoration and/or at least one decorative film 5 at least in regions.

[0570] The forming station 13 and/or the device 10 for forming the at least one film 2 comprising the at least one sensor film 3 preferably has one or more of the following forming stations, in particular selected from: deep-drawing station, thermoforming station, High Pressure Forming station, injection-molding station.

[0571] It is possible for the film 2 and/or the sensor film 3 to be formed in the forming station 13 in such a way that the radius of curvature of the film 2 and/or of the sensor film 3 and/or of the formed film body 4 is smaller than 1000 mm, in particular smaller than 200 mm, further preferably smaller than 100 mm, at least in regions, and/or that the stretching of the film 2 and/or of the sensor film 3 is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, in particular preferably greater than or equal to 300%.

[0572] FIG. 4 shows a formed film body 4, which has been formed in particular according to step c and comprises the film 2 shown in FIGS. 2 and 3 as formed film 2 and the sensor film 3 shown in FIGS. 2 and 3 as formed sensor film 3.

[0573] FIG. 5 shows the formed film body 4 shown in the in FIG. 4, out of which a film element 4a is punched, in particular according to step d, out of the formed film body 4 out of a second region 141, in particular wherein a punching tool 14a of a punching station 14 is used.

[0574] The device 10 preferably has at least one injection-molding station 15, which is designed in such a way that the at least one injection-molding station 15 back-injection molds the at least one punched-out film element 4a.

[0575] The at least one punching station 14 is preferably designed in such a way that the at least one punching station 14 introduces one or more holes or through punches into the one or more film elements 4a, in particular wherein one or more holes of the one or more holes have the function of an injection duct for a plastic material during the injection molding in the at least one injection-molding station 15.

[0576] FIG. 6 shows the punched-out film body 4a shown in the in FIG. 5, which is located in a second mold half 15b of an injection-molding station 15. Further, the injection-molding station 15 comprises a first mold half 15a. A plastic body 7 is in the injection-molding station 15 according to step e.

[0577] FIG. 8 shows the punched-out film body 4a shown in the in FIG. 5, which is located in a second mold half 15b of an injection-molding station 15. Further, the injection-molding station 15 comprises a first mold half 15a. A plastic body 7 is injection molded in the injection-molding station 15 according to step e.

[0578] It is possible for the device 10 to comprise one or more stations of the following further stations: [0579] feed station for providing at least one decorative film 5a, which in particular has at least one opaque coating 50 at least partially; [0580] processing station for introducing at least one decorative element of at least one decoration into the at least one decorative film 5a; [0581] inserting station for inserting the one or more punched-out film elements 4a and the at least one decorative film 5a into an injection-molding station 15, wherein the injection-molding station 15 comprises a first mold half 15a and a second mold half 15b, wherein the first mold half 15a and the second mold half 15b, in particular in a closed state, make an injection-molding cavity 15c for molding at least one plastic body 7a, wherein the at least one punched-out film element 4a is attached to a first wall 15aa of the injection-molding cavity 15c and/or the at least one decorative film 5a is attached to a second wall 15bb of the injection-molding cavity 15c, in particular wherein the second wall 15bb is arranged lying opposite the first wall 15aa; [0582] injection-molding station for injection molding the one or more punched-out film elements 4a and the at least one decorative film 5a with a plastic material to make a plastic component 1 comprising the at least one plastic body 7a in such a way that the one or more punched-out film elements 4a make a first surface of the plastic component 1 and the at least one decorative film 5a makes a second surface of the plastic component 1, in particular wherein the first surface lies opposite the second surface; [0583] demolding station for removing the plastic component 1.

[0584] Further, it is possible for the device 10 to comprise the following further station: [0585] processing station for inserting a first punched-out film element 4aa of the one or more punched-out film elements 4a and/or a second punched-out film element 4ab of the one or more punched-out film elements 4a into an injection-molding station.

[0586] Furthermore, it is possible for the device 10 to comprise the following further station: [0587] injection-molding station 16 for injection molding the first punched-out film element 4aa and/or the second punched-out film element 4ab with a plastic material to make a plastic component 1 comprising the at least one plastic body 7b in such a way that the first punched-out film element 4aa a first surface of the plastic component 1 and/or that the second punched-out film element 4ab a second surface of the plastic component 1, wherein the injection-molding station 16 comprises a first mold half 16a and a second mold half 16b, wherein the first mold half 16a and the second mold half 16b, in particular in a closed state, make an injection-molding cavity 16c for molding at least one plastic body 7b, wherein the first punched-out film element 4aa is attached to a first wall 16aa of the injection-molding cavity 16c and/or the second punched-out film element 4ab is attached to a second wall 16bb of the injection-molding cavity 16c, in particular wherein the second wall 16bb is arranged lying opposite the first wall 16aa, in particular wherein the first surface lies opposite the second surface; [0588] demolding station for removing the plastic component 1.

[0589] In particular it is possible for the device 10 to comprise one or more stations of the following further stations: [0590] feed station for providing the one or more punched-out film elements 4a and/or at least one section of at least one decorative film 5b on the first mold half 17a and/or on the second mold half 17b in such a way that, when the first mold half 17a and second mold half 17b are closed, the one or more punched-out film elements 4a and/or the at least one decorative film 5b rest on an end face 17aa of the raised edge region 170b bordering the first mold recess 170a and surrounding the first mold recess 170a; [0591] injection-molding station for injection molding a plastic material through the injection duct 17d into the injection-molding cavity 17c made by the closed first and second mold halves 17a, 17b, wherein the at least one decorative film 5b is back-injection molded in the region enclosed by the raised edge region 170b with the plastic material, in particular without plastic material seeping through the sealed gap, wherein a plastic component 1 comprising the at least one plastic body 7c is made, wherein the injection-molding station 17 has a first mold half 17a comprising a first mold recess 170a and a second mold half 17b, wherein the first mold half 17a and/or the second mold half 17b has at least one injection duct 17d, wherein the first mold half 17a and the second mold half 17b, in particular in a closed state, make an injection-molding cavity 17c for molding at least one plastic body 7c; [0592] demolding station for removing the plastic component 1.

[0593] Further, it possible for the device 10 to comprise one or more stations of the following further stations: [0594] inserting station for inserting the one or more punched-out film elements 4a and/or at least one decorative film 5c into a first mold recess 180a of a first mold half 18a of an injection-molding station 18 and for fixing the one or more punched-out film elements 4a and/or the at least one decorative film 5c; [0595] further inserting station for inserting an in-mold labeling molded part 6 or IML molded part 6 into a second mold recess of a second mold half 18b of an injection-molding station 18 and fixing the IML molded part 6; [0596] injection-molding station 18, which has a first mold half 18a comprising a first mold recess 180a and a second mold half 18b comprising a second mold recess 180b, wherein the first mold half 18a is made movable and the second mold half 18b is made not movable; [0597] demolding station for removing the plastic component 1.

[0598] After being removed from the demolding station, the plastic component 1 preferably has a radius of curvature and/or a stretching, wherein the radius of curvature is smaller than 1000 mm, in particular smaller than 200 mm, further preferably smaller than 100 mm, at least in regions, and/or wherein the stretching is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, in particular preferably greater than or equal to 300%.

[0599] FIG. 7 shows a plastic component 1 in cross section, in particular produced according to one method of the above methods, preferably produced by one device of the above devices, wherein the plastic component 1 comprises a punched-out (see for example FIG. 4) and back-injection-molded (see for example FIG. 6 and/or FIG. 8) film element 4b comprising a formed film 2a and a formed sensor film 3a, wherein the at least one formed film 2a and/or the at least one formed sensor film 3a has at least one thermoplastic material or at least one thermoplastic polymer. Further, the plastic component 1 shown in FIG. 7 comprises a plastic body 7 on the surface facing away from the formed sensor film 3a, in particular wherein the plastic body 7 is made in method step e by injection molding in an injection-molding station.

[0600] The at least one formed film 2a and/or the at least one formed sensor film 3a preferably has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic polymer.

[0601] The at least one formed sensor film 3a and/or the at least one formed film 2a further preferably has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic polymer.

[0602] The plastic body 1 shown in FIG. 7 has, in particular in at least four regions, a radius of curvature smaller than 1000 mm, in particular smaller than 200 mm, further preferably smaller than 100 mm, and/or a stretching greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, in particular preferably greater than or equal to 300%.

[0603] The formed film 2a shown in FIG. 7 preferably has a thickness of from 250 μm to 3000 μm, in particular of from 300 μm to 2000 μm, and/or a tensile strength of between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa.

[0604] The formed sensor film 3a shown in FIG. 7 further preferably has a thickness of from 25 μm to 150 μm, in particular of from 25 μm to 125 μm, and/or a tensile strength of between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa.

[0605] The tensile strength of the formed film 2a shown in FIG. 7 is in particular at most the tensile strength of the formed sensor film 3a shown in FIG. 7 multiplied by a factor of ⅔.

[0606] Further, the thickness of the formed film 2a shown in FIG. 7 is preferably at least the thickness of the formed sensor film 3a shown in FIG. 7 multiplied by a factor of ½.

[0607] In the embodiment represented, the thickness of the film 2 is greater than the thickness of the sensor film 3. In the embodiment represented, the thickness of the at least one film 2 in step a and/or b is at least the thickness of the at least one sensor film 3 in step a and/or b multiplied by a factor of approx. 3.

[0608] FIG. 9 shows the plastic component 1 shown in FIG. 7, except that the plastic component 1 comprising a film element 4c and which has a decorative film 5 on the surface of the plastic body 7 facing away from the formed sensor film 3a.

[0609] It is possible for the plastic component 1 and/or the formed film 2a and/or the formed sensor film 3a to have at least one decoration and/or at least one decorative film 5 in regions.

LIST OF REFERENCE NUMBERS

[0610] 1 plastic component [0611] 2 film [0612] 2a formed film [0613] 3 sensor film [0614] 30 carrier substrate [0615] 31 electrically conductive layer [0616] 32 functional region [0617] 34 contacting region [0618] 35 adhesion-promoting layer [0619] 3a formed film [0620] 4 formed film body [0621] 4a punched-out film element [0622] 4b punched-out and back-injection-molded film element [0623] 4c punched-out, back-injection-molded and decorated film element [0624] 5, 5a, 5b, 5c decorative film [0625] 50a opaque coating [0626] 50b insert decorative ply [0627] 50c backing film [0628] 6 in-mold labeling or IMD molded part [0629] 7, 7a, 7b, 7c, 7d plastic body [0630] 10 device [0631] 11 feed station [0632] 12 applying station [0633] 13 forming station [0634] 14 punching station [0635] 14a punching tool [0636] 141 punching region [0637] 15, 16, 17, 18 injection-molding station [0638] 15a, 16a, 17a, 18a first mold half [0639] 15b, 16b, 17b, 18b second mold half [0640] 15c, 16c, 17c, 18d injection-molding cavity [0641] 15aa first wall [0642] 15bb second wall [0643] 17aa, 17bb end face [0644] 17d injection duct [0645] 170a, 180a first mold recess [0646] 170b edge region [0647] 180b second mold recess [0648] a, b, c, d, e method steps [0649] b1, b2, b3, b4a, b4b, b5 method steps [0650] e1, e2, e3, e4, e5, e6 method steps [0651] e7, e8, e9, e10, e11 method steps [0652] e12, e13, e14, e15 method steps [0653] e16, e17, e18, e19 method steps [0654] e20, e21 method steps