Holding System for Holding Substrates during a Processing of the Surfaces of the Substrates

20230026860 · 2023-01-26

    Inventors

    Cpc classification

    International classification

    Abstract

    The invention relates to a holding system (1) for holding substrates (12) for use in a surface processing system having a covering area (20), comprising a plurality of fixing elements (2), a body (24) arranged within the covering area (20) for receiving the fixing elements (2), and a positioning element (26) for adjusting the covering and a machining area (20, 22), wherein a plurality of substrates (12) can be fixed by the fixing elements (2) and processed within the machining area (22).

    Claims

    1-27. (canceled)

    28. A holding system for holding substrates for use in a surface treatment system having a cover area, comprising, a plurality of fixing elements, a body arranged within the cover area for receiving the fixing elements, a positioning element for adjusting the covering area and a machining area, wherein a plurality of substrates can be fixed by the fixing elements and processed within the machining area.

    29. The holding system according to claim 28, wherein the positioning element comprises a disc-shaped first part for separating the cover area from the machining area and a bolt-shaped second part for positioning the disc-shaped first part.

    30. The holding system according to claim 28, wherein the positioning element has a plurality of recesses for the feedtrough of a respective substrate.

    31. The holding system according to claim 28, wherein an anti-rotation element is provided for preventing unintentional rotation about the axis of rotation, it being possible for the anti-rotation element to be connected fixedly to the body and to the positioning element in order to prevent unintentional rotation of the positioning element.

    32. The holding system according to claim 30, wherein the anti-rotation element is formed in the form of a securing pin which can be fixed at its first end within the body and can be firmly connected via its other end to the positioning element.

    33. The holding system according to claim 28, wherein at least one guide element is provided for guiding substrates.

    34. The holding system according to claim 28, wherein the guide element has a plurality of recesses for the feedthrough of a respective substrate.

    35. The holding system according to claim 28, wherein at least one connecting element is provided for connection to a movement unit.

    36. The holding system according to claim 28, wherein the fixing elements have a fixing area for force-fit fixing of the substrates, the fixing area being configured in the form of a locally limited sub-area.

    37. The holding system according to claim 28, wherein the fixing elements are configured in such a way that the substrates can be rotated by at least 90°, about one or more axes x, y, z by means of force-fitting fixing by the fixing elements during processing.

    38. The holding system according to claim 28, wherein the fixing elements have at least an upper part-circular section for the feedthrough of a substrate or a lower part-circular section, arranged at least opposite the upper section, for the feedthrough of a substrate or a fixing area, arranged between the upper and lower sections, for the force-fitting fixing of the substrate.

    39. The holding system according to claim 38, wherein the waist of the fixing elements is arranged centrally between the upper and lower sections.

    40. The holding system according to claim 38, wherein a recess arranged longitudinally along the fixing elements is provided.

    41. The holding system according to claim 38, wherein the fixing area of the fixing elements has a plurality of lamellae.

    42. The holding system according to claim 38, wherein the number of lamellae correlates with the diameter along the waist.

    43. The holding system according to claim 38, wherein the diameter along the waist is at least less than 80% of the diameter along the upper or lower section.

    44. The holding system according to claim 38, wherein the fixing elements are formed at least partially from a temperature-resistant and corrosion-resistant material.

    45. The holding system according to claim 38, wherein the fixing elements are designed in such a way that substrates can be fixed with a pull-off force of 2 to 6.1 N.

    46. The holding system according to claim 38, wherein the fixing elements are formed in the form of spring elements.

    47. A method for processing substrates using a holding system according to claim 28, comprising: Inserting a plurality of substrates into a holding system, Positioning the substrates by means of a positioning element within a covering and a machining area of the holding system.

    Description

    [0034] It shows:

    [0035] FIG. 1 a,b a schematic representation of a fixing element according to the invention for fixing a substrate for use in a holding system of a surface treatment system in a front view (a) and a rear view (b),

    [0036] FIG. 2 a schematic representation of a fixing element according to the invention for fixing a substrate for use in a holding system for use in a surface treatment system in a plan view,

    [0037] FIG. 3 a schematic representation of a holding system according to the invention for holding substrates in a sectional view,

    [0038] FIG. 4 a schematic representation of a holding system according to the invention for holding substrates in a spatial representation,

    [0039] FIG. 5 a schematic representation of the individual steps of a method for processing substrates according to the invention.

    [0040] FIG. 1 a,b shows a schematic representation of a fixing element 2 according to the invention for fixing a substrate 12 for use in a holding system 1 in a front view (a) and a rear view (b).

    [0041] The fixing element 2 comprises an upper semi-circular section 4 for the passage of the substrate 12, a lower part-circular section 6 arranged opposite the upper semi-circular section 4 for the passage of the substrate 12, and a fixing area 8 arranged between the upper and lower sections 4, 6 for the force-fit fixing of the substrate 12. In this case, the fixing area 8 is formed in the shape of a waist and has a waist 10 which is arranged between the upper and lower sections 4, 6, so that the diameter D of the fixing area 8 decreases from the upper section 4 towards the waist 10 and the lower diameter D of the fixing area 8 decreases from the lower section 6 towards the waist 10.

    [0042] As can be seen in the present case, the waist 10 of the fixing element 2 is arranged centrally between the upper and lower sections 4, 6.

    [0043] Furthermore, it can be seen that the fixing element 2 has a recess 14 arranged on the longitudinal side, which completely cuts through the fixing element 2 along a longitudinal extension L, so that the recess 14 completely cuts through both the upper and lower sections 4, 6, and the fixing area 8. Here, the width of the recess 14 is smallest along the waist 10 and increases towards the upper and lower sections 4, 6.

    [0044] Furthermore, it can be seen that the fixing area 8 has a plurality of lamellae 16, with an inner recess 18 being arranged between each two lamellae 16. This structure serves in particular to provide a precisely adjustable and adaptable force for the force-fit fixation of substrates 12. The number of lamellae 16 can correlate here in particular with the diameter D along the waist 10.

    [0045] FIG. 2 shows a schematic representation of a fixing element 2 according to the invention for fixing a substrate 12 for use in a holding system 1 in a plan view.

    [0046] According to this top view of the upper part-circular section 4 for the passage of a substrate 12, the recess 14 as well as the individual lamellae 16 with inner recesses 18 arranged between the lamellae 16 can once again be seen clearly. Furthermore, it can be seen that the inner diameter D along the waist 10 is significantly smaller than the diameter D along the opening of the upper semi-circular section 4.

    [0047] FIG. 3 shows a schematic representation of a holding system 1 according to the invention for holding substrates 12 in a sectional view.

    [0048] Here, the holding system 1 according to the invention has a covering area 20 and comprises a plurality of fixing elements 2 described above, a body 24 arranged within the covering area 20 for receiving the fixing elements 2, and a positioning element 26 for adjusting the covering area 20 and the machining area 22. Here, a plurality of substrates 12 are fixed by the fixing elements 2 and can be processed within the machining area 22.

    [0049] As can be seen in the present case, the covering area 20 has a greater longitudinal extension than the machining area 22. It is understood that the covering area 20 can also have a smaller longitudinal extension than the machining area 22. Furthermore, the body 24 has a cylindrical shape, which in the present case has approximately the same length as the fixing elements 2 arranged inside the body 24.

    [0050] The positioning element 26 further comprises a disc-shaped first part 26a for separating the covering area 20 from the machining area 22, and a bolt-shaped second part 26b for positioning the disc shaped first part 26a. Further, the positioning member 26 comprises a plurality of recesses 28 for passing a respective substrate 12 therethrough, the recesses 28 being presently disposed in the disc shaped first part 26a.

    [0051] In addition, as can be seen in the present case, the holding system 1 comprises an anti-rotation element 30 for preventing unintentional rotation about the axis of rotation D.sub.x, which in the present case is fixedly connected to the body 24 and the positioning element 26 in order to prevent unintentional rotation of the positioning element 26 during processing of substrates 12.

    [0052] Furthermore, the holding system 1 comprises a guide element 32 for guiding substrates 12, which in the present case is arranged between the body 24 and the disc shaped first part 26a of the positioning element 26 and likewise has a plurality of recesses 28 for the passage of a substrate 12 in each case. The recesses 28 are arranged here corresponding to the arrangement of the recesses 28 within the body 24 and to the arrangement of the recesses 28 within the disc shaped first part 26a of the positioning element 26.

    [0053] FIG. 4 shows a schematic representation of a holding system 1 according to the invention for holding substrates 12 in a spatial representation. In this spatial representation, the arrangement of a connecting element 34 for connecting the holding system 1 to a movement unit 36 can also be seen. In the present case, the connecting element 34 is also cylindrical in shape and is arranged directly on the body 24 of the holding system 1. Via the connecting element 34, the holding system 1 can advantageously be gripped by a movement unit 36 for exerting a translatory and rotatory movement in order to enable easy transport or processing of substrates 12 arranged within the holding system 1.

    [0054] FIG. 5 shows a schematic representation of the individual steps/stages of a method for processing substrates 12 according to the invention.

    [0055] Here, the method for processing substrates 12 comprises the steps of introducing 40 a plurality of substrates 12 into a holding system 1 and positioning the substrates 42 by means of a positioning element 24 within a covering and the machining area 20, 22 of the holding system 1, as well as the additional optional steps/stages of processing 44 the substrates 12 within the machining area 22 and post-processing 46 the substrates 12. As possible processing methods, surface processing methods, for example abrasive, chemical, thermal, electrolytic or similar surface processing methods can preferably be provided.

    [0056] According to the method according to the invention, it can be provided in particular that the substrate 12 is rotated by at least 90°, preferably by at least 180°, during processing.

    [0057] By means of the holding system 1 according to the invention and the method for using a holding system 1 according to the invention, it is in particular possible to achieve a fixation of a substrate 12, in particular of a workpiece, such as a tool to be machined, in a simple manner, wherein the fixation allows a particularly simple transport, in particular a simple handling of the substrate 12 before, during and after a machining operation, and the substrate 12 can be handled, for example, rotated or upside down during a machining operation by means of the present fixation.

    LIST OF REFERENCE SIGNS

    [0058] 1 Holding system [0059] 2 Fixing element [0060] 4 Upper semi-circular section [0061] 6 Lower semi-circular section [0062] 8 Fixing area [0063] 10 Waist [0064] 12 Substrate [0065] 14 Recess [0066] 16 Lamellae [0067] 18 Inner recess [0068] 20 Covering area [0069] 22 Machining area [0070] 24 Body [0071] 26 Positioning element [0072] 26a Disc shaped first part [0073] 26b Bolt-shaped second part [0074] 28 Recesses for the passage of substrates [0075] 30 Anti-rotation element [0076] 32 Guide element [0077] 34 Connecting element [0078] 36 Movement unit [0079] 40 Introducing a plurality of substrates [0080] 42 Positioning the substrates [0081] 44 Processing the substrates [0082] 46 Post-processing the substrates [0083] D Diameter [0084] L Longitudinal extension [0085] H Height [0086] D.sub.x Rotation axis