Radiating fin formed of aluminum alloy and method for producing the same

Abstract

An aluminum alloy has high thermal conductivity without requiring an addition of metal elements such as iron and a method for producing the aluminum alloy. The aluminum alloy is obtained from a semi-solid material with a chemical composition containing 2 to 6 wt % of silicon (Si) and 0.7 wt % or less of magnesium (Mg), with the balance being aluminum (Al) and unavoidable impurities. It has a granular crystalline structure. The aluminum alloy is produced by a heating step of semi-solid material. A forming step is performed with semi-solid material obtained in the heating step S1. After the forming step, a heat treatment step is performed at 190 C. to 290 C. for 1 to 5 hours.

Claims

1. A radiating fin obtained by injecting a semi-solid material into a mold to perform semi-solid forming at a speed of 0.15 to 0.4 (m/s) and a pressure of 15 to 30 (MPa) and heat treating at 190 C. to 290 C. for 1 to 5 hours, and the fin comprising an aluminum alloy material with a chemical composition containing 2 to 6 wt % of silicon (Si) and 0.7 wt % or less of magnesium (Mg), and the balance being aluminum (Al) devoid of iron and unavoidable impurities with no additional iron other than what may occur as an unavoidable impurity, the material contains only silicon (Si) and magnesium (Mg) as additives and the fin has a granular crystalline structure.

2. A radiating fin of claim 1 further comprising a thermal conductivity greater than or equal to 180 W/(m.Math.k).

Description

DRAWINGS

(1) The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

(2) FIG. 1 is a flowchart illustrating a production process of an aluminum alloy.

(3) FIG. 2 is a graph illustrating thermal conductivity plotted against silicon (Si) content in Examples and Comparative Examples.

(4) FIG. 3 is a graph illustrating thermal conductivity and hardness plotted against annealing temperature in Examples and Comparative Examples.

DETAILED DESCRIPTION

(5) Hereafter, embodiments of the present disclosure will be specifically described with reference to the attached drawings.

(6) An aluminum alloy according to this embodiment is obtained from a semi-solid material that has a chemical composition containing 2 to 6 wt % of silicon (Si) and 0.7 wt % or less of magnesium (Mg). The balance is aluminum (Al) and unavoidable impurities. The material has a granular crystalline structure to improve formability. The aluminum alloy has a thermal conductivity of 180 W (m.Math.K) or more.

(7) The aluminum alloy is preferably obtained by performing semi-solid forming on a semi-solid material. The material has a chemical composition containing 2 to 6 wt % of silicon (Si) and 0.7 wt % or less of magnesium (Mg). The balance is aluminum (Al) and unavoidable impurities. The materials have a granular crystalline structure. Heat treatment at 190 C. to 290 C. for 1 to 5 hours is then performed. The semi-solid material is preferably a material that contains only silicon (Si) and magnesium (Mg) as additives. The material does not contain and is devoid of iron (Fe). From a practical viewpoint for cost reasons or the like or the requirement of strength or the like, the semi-solid material may be a material that does not contain magnesium (Mg) or a material that contains iron (Fe) as an unavoidable impurity as long as the thermal conductivity does not decrease.

(8) Pure aluminum has the highest thermal conductivity. The thermal conductivity of aluminum decreases proportionately as amounts of added elements increase. However, pure aluminum has low strength. Additionally, pure aluminum does not have a solid-liquid coexisting region for semi-solid forming. Thus, it is impossible to perform semi-solid forming with pure aluminum. Therefore, in order to improve the thermal conductivity while achieving high strength, the amount of added elements need to be decreased as much as possible. This creates a condition in the material where semi-solid forming can be performed.

(9) Accordingly, the added additive (element) to pure aluminum in this embodiment is at least silicon (Si). When magnesium (Mg) is added, the amount of magnesium added is 0.7 wt % or less. Addition of magnesium (Mg) is not necessarily required. However, the addition of magnesium (Mg) can improve the strength of a formed article. Silicon (Si) is required to provide a solid-liquid coexisting state during heating. This enables semi-solid forming. Also, it improves the fluidity of molten metal for a mold. Magnesium (Mg) is required to improve the strength of the formed article. Thus, there is no need for adding iron (Fe). Iron (Fe) has been required for conventional die casting alloys. The reason for this is as follows. Iron (Fe) added to die casting alloys is required to prevent seizure of aluminum onto a die. However, when semi-solid forming is employed, as in this embodiment, there is no need for adding iron (Fe). This is due to the casting temperature being about 100 C. lower than that in a conventional die casting method. Thus, a semi-solid material can be injected at low speed and low pressure.

(10) The semi-solid material includes both a material obtained by melting metal to a solid-liquid coexisting state (thixocasting) and a material obtained by cooling molten metal to a solid-liquid coexisting state (rheocasting). Here, the semi-solid material includes both forms (semi-solid). In such a forming method that uses a semi-solid material (semi-solid forming method), the cooling rate during forming is high. Thus, fine-grained crystals are formed. Accordingly, a high-strength formed article is produced. This improves the mechanical properties of the material. Furthermore, a uniform structure is formed at low pressure. Thus, formation of shrinkage holes and segregation hardly occur. This provides a high-quality formed article with actual strength that does not decrease.

(11) The semi-solid material according to this embodiment is obtained by, for example, a method for mechanically or electromagnetically stirring molten metal, a method for performing granulation during recrystallization by imparting strains, or a method using solidification control. The semi-solid material includes a granular primary crystal. When the semi-solid material is formed, forming is caused from a solid-liquid coexisting region. The coexisting region increases the cooling rate and thus improves the mechanical properties of products. Furthermore, the semi-solid material includes a granular primary crystal. Thus, semi-solid material has better fluidity than molten metal. Even if the semi-solid material is injected at low speed and low pressure, a mold can be satisfactorily filled with the semi-solid material. That is, by using a semi-solid material with good fluidity, formed articles with complicated shapes and with thin-walls can be produced with high precision.

(12) The semi-solid forming may be performed using any material having a semi-solid state. Therefore, a variety of materials can be used. Such material is ones having high thermal conductivity. The semi-solid forming method includes perforating heat treatment. This achieves low microporosity. Thus, the thermal conductivity can be further improved. Accordingly, by injecting the semi-solid material into a mold at low speed and low pressure, an aluminum alloy can be satisfactorily produced in the mold.

(13) The thermal conductivity and strength are improved in the aluminum alloy according to this embodiment by performing heat treatment after the semi-solid forming. The heat treatment temperature is 190 C. to 290 C. The heat treatment time is 1 to 5 hours. As a result of the heat treatment, the solubility of silicon (Si) in a primary -Al phase decreases. This increases the concentration of aluminum (Al) and thus improves the thermal conductivity. A heat treatment temperature of lower than 190 C. or a heat treatment time of less than 1 hour causes insufficient heat treatment. Thus, high strength is not achieved. A heat treatment temperature of higher than 290 C. causes overaging. This decreases strength. A heat treatment time of more than 5 hours decreases strength and degrades the productivity.

(14) The amounts of components other than silicon (Si) and magnesium (Mg) need to be decreased as much as possible in order to improve thermal conductivity. However, this increases cost. Therefore, the inclusion of impurities, unavoidable impurities, is permissible. For example, as long as the thermal conductivity is not less than 180 W/(m.Math.K) impurities are tolerable. Examples of the unavoidable impurities include copper (Cu), zinc (Zn), iron (Fe), manganese (Mn), nickel (Ni), titanium (Ti), lead (Pb), tin (Sn), and chromium (Cr). However, if a secondary ingot is used for the semi-solid materials, it is difficult to decrease the iron (Fe) content. Thus, 0.3% or less of iron (Fe) may be contained. Manganese (Mn) and titanium (Ti) considerably decrease the thermal conductivity. Thus, 0.05% or less of manganese (Mn) or titanium (Ti) may be contained. Other elements may each be contained in an amount of 0.1% or less.

(15) A production process of an aluminum alloy according to this embodiment will be described with reference to the flowchart in FIG. 1.

(16) The aluminum alloy according to this embodiment includes a heating step S1, a semi-solid forming step S2, and a heat treatment step S3. The steps S1-S3 are conducted in sequence. The heating step S1 comprises heating an alloy under particular conditions. The alloy includes adding silicon (Si) and magnesium (Mg) to aluminum to obtain a semi-solid material with a granular crystalline structure. The alloy has a chemical composition including 2 to 6 wt % of silicon (Si) and 0.7 wt % or less, preferably 0.2 to 0.7 wt %, of magnesium (Mg), with the balance being aluminum (Al) and unavoidable impurities.

(17) The semi-solid forming step S2 comprises semi-solid forming of the semi-solid material obtained in the heating step (S1). The semi-solid material is injected into a desired mold at low speed and low pressure. It is injected into a mold at a speed of 0.15 to 0.4 (m/s) and a pressure of 15 to 30 (MPa). The heat treatment step (S3) comprises heat treatment on the formed article obtained in the semi-solid forming step (S2). The heat treatment is performed at 190 C. to 290 C. for 1 to 5 hours.

(18) The technical advantages of the present disclosure will be described based on Examples and Comparative Examples.

(19) An aluminum alloy with a composition listed in Table 1 below was heated and then poured into a particular container. Solidification control was performed so that a granular primary -Al phase is obtained, thereby producing a billet. The produced billet was reheated to a semi-solid state and subjected to pressure forming, semi-solid forming, into a disc shape. Articles with 0.5% of magnesium (Mg) added during dissolution were formed. Also, formed articles with no magnesium (Mg) were produced.

(20) TABLE-US-00001 TABLE 1 Name of alloy Cu Si Mg Zn Fe Mn Ni Sn Ti Pb Cr Sr Al Al2%Si 0.000 2.183 0.002 0.007 0.138 0.003 0.003 0.001 0.005 0.0012 0.0004 0.0003 Bal. Al3%Si 0.000 3.104 0.002 0.007 0.128 0.003 0.002 0.001 0.006 0.0012 0.0006 0.0003 Bal. Al4%Si No. 1 0.000 4.020 0.003 0.010 0.137 0.004 0.004 0.002 0.009 0.0020 0.0010 0.0004 Bal. Al5%Si 0.000 5.079 0.002 0.007 0.146 0.003 0.003 0.000 0.009 0.0008 0.0010 0.0003 Bal. Al6%Si 0.000 6.013 0.005 0.006 0.132 0.003 0.002 0.000 0.009 0.0006 0.0012 0.0003 Bal. Al7%Si 0.000 6.996 0.005 0.008 0.144 0.003 0.003 0.000 0.010 0.0008 0.0014 0.0003 Bal. Al8%Si 0.000 7.873 0.004 0.003 0.140 0.003 0.013 0.003 0.013 0.0004 0.0015 0.0000 Bal.

(21) The disc-shaped formed articles were subjected to the following treatments: no heat treatment; heat treatment at 540 C. for 6 hours; heat treatment at 160 C. for 6 hours (T6); and heat treatment at 250 C. for 2 hours (T5). The thermal conductivity (W/(m.Math.K)) and Brinell hardness (HBW) of the resulting formed articles were measured. Table 2 below and FIG. 2 show the results. The formed articles with silicon (Si) contents of 7% and 8% correspond to Comparative Examples.

(22) TABLE-US-00002 TABLE 2 0% Mg 0.5% Mg Thermal Thermal conductivity Brinell hardness conductivity Brinell hardness Name of alloy Heat treatment W/(m .Math. K) HBW W/(m .Math. K) HBW Al2% Si - 197 28 186 44 T6 190 34 174 104 T5 204 29 201 52 Al3% Si - 190 35 179 47 T6 188 35 169 109 T5 197 34 198 52 Al4% Si - 164 37 171 50 T6 181 38 170 108 T5 192 40 198 51 Al5% Si - 182 42 162 57 T6 179 38 167 110 T5 187 43 185 64 Al6% Si - 171 46 161 61 T6 179 38 164 109 T5 176 44 181 65 Al7% Si - 169 47 161 66 T6 172 38 157 111 T5 174 49 177 66 Al8% Si - 169 51 158 70 T6 163 41 159 110 T5 169 51 170 66 Heat treatment T6: 540 C. 6 hr-160 C. 6 hr T5: 250 C. 2 hr

(23) As is clear from FIG. 2 and Table 2 above, thermal conductivity increases as the silicon (Si) content decreases. The addition of magnesium (Mg) exhibits a heat treatment effect and improves hardness. Thus, in the case where a formed article is obtained through a known die casting method, the melting temperature increases as the silicon (Si) content decreases. The addition of magnesium (Mg) decreases the fluidity of the molten metal. In contrast, in the case where a formed article is obtained through a semi-solid forming method as in the present disclosure, good fluidity of the molten metal is achieved due to a granular primary -Al phase. Thus, forming can be satisfactorily performed.

(24) The heat treatment of T6 (heat treatment at 540 C. for 6 hours and heat treatment at 160 C. for 6 hours) includes a solution treatment. As is clear from Table 2, the heat treatment of T6 is necessary for improving the strength. However, the formed article is held at high temperatures and then quenched. Therefore, impurities in the structure are trapped in the aluminum in a dissolved manner. This decreases thermal conductivity. Accordingly, the heat treatment of T5 (heat treatment at 250 C. for 2 hours) (i.e., annealing) is performed.

(25) FIG. 3 shows the experimental results of the influence of annealing temperature on thermal conductivity and hardness in the formed article containing 4% silicon (Si). It is clear from the experimental results that the Example where the silicon (Si) content is 4% and the magnesium (Mg) content is 0.5%, that the annealing temperature is preferably set to 190 C. to 290 C. This improves the thermal conductivity while achieving a certain degree of hardness.

(26) The embodiments of the present disclosure have been described so far. However, the present disclosure is not limited to that disclosure. Products obtained through semi-solid forming are applicable to radiating fins. The fins have high thermal conductivity (180 W/(m.Math.K) or more, as in this embodiment, and produce a good heat-radiating effect.

(27) A radiating fin is formed by semi-solid forming of an aluminum alloy. The fin is obtained by injecting a semi-solid material into a mold at a speed of 0.15 to 0.4 (m/s) and a pressure of 15 to 30 (MPa). Heat treatment at 190 C. to 290 C. for 1 to 5 hours is performed on the fin. The semi-solid material has a chemical composition comprising 2 to 6 wt % of silicon (Si), 0.7 wt % or less of magnesium (Mg), with the balance being aluminum (Al) and unavoidable impurities. The alloy contains only silicon (Si) and magnesium (Mg) as additives. The alloy has a granular crystalline structure. A method for producing the radiating fin is disclosed and other embodiments may also be employed.

(28) The present disclosure has been described with reference to the preferred embodiment. Obviously, modifications and alternations will occur to those of ordinary skill in the art upon reading and understanding the preceding detailed description. It is intended that the present disclosure be construed to include all such alternations and modifications insofar as they come within the scope of the appended claims or their equivalents.