Glass article and method for producing the same
11708301 · 2023-07-25
Assignee
Inventors
- Hoi Kwan Lee (Suwon-si, KR)
- Sung Hoon Kim (Seoul, KR)
- Seung Ho Kim (Asan-si, KR)
- Sook Kyung You (Seoul, KR)
- An Na Ryu (Hwaseong-si, KR)
- Jeong Seok Lee (Suwon-si, KR)
Cpc classification
C03C19/00
CHEMISTRY; METALLURGY
B32B17/10128
PERFORMING OPERATIONS; TRANSPORTING
C03C21/002
CHEMISTRY; METALLURGY
C03C15/00
CHEMISTRY; METALLURGY
International classification
C03C15/00
CHEMISTRY; METALLURGY
C03C21/00
CHEMISTRY; METALLURGY
C03C19/00
CHEMISTRY; METALLURGY
Abstract
A method for producing a glass article is provided. The method for producing a glass article, the method including preparing a glass to be processed, the glass comprising a glass bulk and a low-refractive surface layer disposed on the glass bulk, and etching away the low-refractive surface layer to form an etched glass, wherein the etching away the low-refractive surface layer comprises: cleaning the low-refractive surface layer with an acid solution; and cleaning the low-refractive surface layer with a base solution after the cleaning it with the acid solution.
Claims
1. A method for producing a glass article, the method comprising: preparing a glass to be processed, strengthening the glass by ion exchange process so that the glass becomes a strengthened glass and includes a first portion and a second portion disposed on the first portion, wherein the strengthening the glass is performed without using any acid solution and under a condition that a ratio of a silicon content of the second portion to a silicon content of the first portion of the strengthened glass becomes between 1.2 and 1.4 and a thickness of the second portion becomes a first thickness after the strengthening the glass; and etching away the second portion to form an etched glass, wherein the etching away the second portion comprises: applying the second portion with an acid solution, wherein the thickness of the second portion becomes a second thickness which is not greater than the first thickness after the applying the second portion with the acid solution; and applying the second portion with a base solution such that the thickness of the second portion becomes smaller than the second thickness after applying the second portion with the base solution, and wherein the applying the second portion with the acid solution includes transforming the second portion into a state that is removed by a base cleaning process using the base solution.
2. The method of claim 1, wherein the cleaning with the acid solution is carried out for 0.5 to 5 minutes using an acidic solution containing nitric acid in an amount between 2 wt % and 5 wt %, and wherein the cleaning with the base solution is carried out for 0.5 to 5 minutes using a base solution containing sodium hydroxide in an amount between 2 wt % and 5 wt %.
3. The method of claim 2, wherein the second portion is not removed during the applying with the acid solution, and is removed during the applying with the base solution.
4. The method of claim 1, wherein a thickness of the second portion of the glass ranges from 100 to 500 nm.
5. The method of claim 4, wherein the etching away the second portion to form the etched glass comprises removing the second portion completely.
6. The method of claim 1, wherein the thickness of the second portion is less than 100 nm after the etching away the second portion to form an etched glass.
7. The method of claim 1, wherein the glass comprises a compressive region disposed adjacent to a surface thereof and a tensile region disposed inside of the compressive region, wherein the second portion is disposed in the compressive region, and wherein a thickness of the second portion is smaller than a compression depth of the compressive region.
8. The method of claim 7, wherein a maximum compressive stress of the etched glass is less than a maximum compressive stress of the glass.
9. The method of claim 8, wherein a difference between the maximum compressive stress of the glass and the maximum compressive stress of the etched glass ranges from 10 MPa to 100 MPa.
10. The method of claim 7, wherein a compression depth of the etched glass is equal to the compression depth of the glass.
11. The method of claim 7, wherein a maximum tensile stress (CT1) of the etched glass satisfies
CT1≥−37.6*ln(t)+48.7, where CT1 is expressed in MPa, and t denotes the thickness of the etched glass in mm.
12. The method of claim 11, wherein a maximum tensile stress of the glass satisfies
CT1′>−37.6*ln(t′)+48.7, where CT1′ is expressed in MPa, and t′ denotes the thickness of the glass in mm.
13. The method of claim 7, wherein the compressive region has a maximum compressive stress at a surface of the second portion.
14. The method of claim 1, wherein a refractive index of the second portion is smaller than a refractive index of the first portion and is greater than a refractive index of air.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The above and other aspects and features of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:
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DETAILED DESCRIPTION OF THE EMBODIMENTS
(23) Advantages and features of the present disclosure and methods of accomplishing the same may be understood more readily by reference to the following detailed description of exemplary embodiments and the accompanying drawings. The present disclosure may, however, be embodied in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the present disclosure to those skilled in the art, and the present disclosure will only be defined within the scope of the appended claims.
(24) It will be understood that when an element or layer is referred to as being “on”, “connected to” or “coupled to” another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. In the drawings, like reference numerals indicate like elements. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
(25) As used herein, “glass article” refers to an article that is entirely or partially made of glass.
(26) Exemplary embodiments of the present disclosure will hereinafter be described with reference to the accompanying drawings.
(27) The glass is used as a window for protecting a display, a substrate for a display panel, a substrate for a touch panel, an optical member such as a light guide plate, etc. in electronic devices including a display, such as a tablet PC, a notebook PC, a smart phone, an electronic book, a television and a PC monitor as well as a refrigerator and a cleaning machine including a display screen. Glass may also be employed as a cover glass for an instrument panel in a vehicle, a cover glass for solar cells, interior materials for construction materials, windows for buildings and houses, etc.
(28) Some glass articles are required to have high strength. For example, when glass is employed as a window, it is desirable to have a small thickness and a high strength that is not easily broken by an external impact since it is required to have a high transmittance and a small weight. Glass having a high strength can be produced by, for example, chemical strengthening or thermal strengthening. Examples of strengthened glass are shown in
(29)
(30) Referring to
(31)
(32) Referring to
(33) The first surface US and the second surface RS are opposed to each other in the thickness (t) direction. When the glass article 100 serves to transmit light like a window of a display, the light may be mainly incident on the first surface US or the second surface RS to exit through the other.
(34) The thickness t of the glass article 100 is defined as the distance between the first surface US and the second surface RS. The thickness t of the glass article 100 may range, but is not limited to, from 0.1 to 2 mm. In an exemplary embodiment, the thickness t of the glass article 100 may be approximately 0.8 mm or less. In another exemplary embodiment, the thickness t of the glass article 100 may be approximately 0.65 mm or less. In yet another exemplary embodiment, the thickness t of the glass article 100 may be approximately 0.55 mm or less. In yet another exemplary embodiment, the thickness t of the glass article 100 may be approximately 0.5 mm or less. In yet another exemplary embodiment, the thickness t of the glass article 100 may be approximately 0.3 mm or less. Although the glass article 100 has the uniform thickness t, it may have different thicknesses for different regions.
(35) The strengthened glass article 101 includes compressive regions CSR1 and CSR2 and a tensile region CTR. The compressive regions CSR1 and CSR2 refer to regions where compressive stress act, and the tensile region CTR refer to a region where tensile stress acts. The compressive regions CSR1 and CSR2 are disposed adjacent to the surfaces US, RS and SS of the glass article 100. The tensile region CTR is disposed in the inside (or center) of the glass article 100. The compressive regions may be disposed adjacent to the side surfaces SS as well as the first surface US and the second surface RS. The depths (compression depths) of the compressive regions CSR1 and CSR2 extending in the depth direction from each of the surfaces US, RS and SS may be, but is not limited to being, substantially uniform. The tensile region CTR may be surrounded by the compressive regions CSR1 and CSR2.
(36)
(37) Referring to
(38) The first compressive region CSR1 and the second compressive region CSR2 are resistant to an external impact, thereby suppressing cracks in the glass article 100 or damage to the glass article 100. It can be said that the larger the maximum compression stresses CS1 and CS2 of the first and second compressive regions CSR1 and CSR2 are, the higher the strength of the glass article 100 is. Since an external impact is usually transmitted through the surfaces US, RS and SS of the glass article 100, it is advantageous to have the maximum compressive stresses CS1 and CS2 at the surfaces US, RS and SS of the glass article 100 in terms of durability. The maximum compressive stresses CS1 and CS2 of the first and second compressive regions CSR1 and CSR2 may be 700 MPa or more. For example, the maximum compressive stresses CS1 and CS2 of the first and second compressive regions CSR1 and CSR2 may be in the range of 800 MPa to 1,050 MPa. In an exemplary embodiment, the maximum compressive stresses CS1 and CS2 of the first and second compressive regions CSR1 and CSR2 may be in the range of 850 MPa to 1,000 MPa.
(39) The first compression depth DOL1 and the second compression depth DOL2 suppress cracks or grooves formed in the first and second surfaces US and RS from propagating to the tensile region CTR inside the glass article 100. The larger the first and second compression depths DOL1 and DOL2 are, the better the propagation of cracks and the like can be prevented.
(40) The first and second compression depths DOL1 and DOL2 may be in the range of 20 μm to 150 μm. In an exemplary embodiment, the first and second compression depths DOL1 and DOL2 may be in the range of 50 μm to 100 μm. In a particular exemplary embodiment, the first and second compression depths DOL1 and DOL2 may range from 70 to 85 μm.
(41) In some exemplary embodiments, the first and second compression depths DOL1 and DOL2 may satisfy the following relationship with respect to the thickness t of the glass article 100, although not limited thereto:
DOL1,DOL2≥0.1*t [Mathematical Expression 1]
(42) In the exemplary embodiment of
(43)
(44) Referring to
(45) Referring again to
(46) The absolute value of the slope of the compressive stress in the stress profile may be greater than the absolute value of the slope of the tensile stress. On the inner side of the glass article 100, there may be a wide section exhibiting tensile stress and having the average slope of zero. The width of the section of the tensile region CTR in which the average slope is zero (i.e., the thickness of the glass article) may be, but is not limited to being, larger than the first and second compression depths DOL1 and DOL2.
(47) The tensile stress in the tensile region CTR may balance the compression stresses of the first and second compressive regions CSR1 and CSR2. That is to say, in the glass article 100, the sum of the compressive stresses may be equal to the sum of tensile stresses. When the stress profile in the glass article 100 is represented by the function f(x), the following relationship can be established:
∫.sub.0.sup.tf(x)dx=0 [Mathematical Expression 2]
(48) For the glass article 100 in which the maximum compression stresses CS1 and CS2 and the compression depths DOL1 and DOL2 of the first compression region CSR1 and the second compression region CSR2 are equal to each other and their profiles approximate a triangular shape, and the profile of the tensile region CTR generally approximates a rectangular shape, the following relationship may be established:
CT1=(CS1*DOL1)/(t−2*DOL1) [Mathematical Expression 3]
where CT1 denotes the maximum tensile stress of the tensile region CTR, and CS1 denotes the maximum compressive stress of the first compressive region CSR1.
(49) The larger the tensile stress inside the glass article 100 is, the more likely the fragments to be vigorously released when the glass article 100 is broken, and the more likely the glass article 100 is to be crushed from the inside. The maximum tensile stress that meets the frangibility requirements of the glass article 100 may satisfy the following relationship:
CT1≤−37.6*ln(t)+48.7 [Mathematical Expression 4]
where CT1 is expressed in MPa, thickness t is expressed in mm, and ln(t) denotes the natural logarithm with respect to thickness t.
(50) Although it is desired that the compressive stresses CS1 and CS2 and the compression depths DOL1 and DOL2 have large values in order to increase the strength of the glass article 100, the tensile stress is also increased with the sum of the compressive stresses. In order to meet the frangibility requirements while having a high strength, it is desired to adjust the stress profile such that the maximum compressive stresses CS1 and CS2 and the compression depths DOL1 and DOL2 have large values while the sum of the compressive stresses (e.g., the area of the compressive regions in
(51) According to some exemplary embodiments of the present disclosure, the maximum tensile stress CT1 of the glass article 100 can satisfy the condition of Equation 4 above within the range defined by Equation 5 below:
−37.6*ln(t)+10≤CT1≤−37.6*ln(t)+48 [Mathematical Expression 5]
(52) According to an exemplary embodiment of the present disclosure, the glass article 100 may have no low-refractive surface layer on the first surface US and the second surface RS or may have a low-refractive surface layer having a very small thickness (e.g., less than 100 nm). This is in contrast to glass having a low-refractive surface layer with a thickness of 100 nm to 500 nm on the surface via an ion exchange process. The glass article 100 according to the exemplary embodiment of the present disclosure may be produced by preparing a strengthened glass including a low-refractive surface layer and removing all or a part of the low-refractive surface layer. Removing the low-refractive surface layer may be carried out by etching or polishing. More detailed description thereon will be given below with respect to the following exemplary embodiments.
(53)
(54) Referring to
(55)
(56) Referring to
(57) The ion exchange process can introduce compressive stress in the vicinity of the surface of the glass while forming a low-refractive surface layer 130 on the surface. The low-refractive surface layer 130 may be formed on all surfaces (the first surface US, the second surface RS, and the side surfaces SS) of the strengthened glass 101. The low-refractive surface layer 130 is located on the surfaces US, RS and SS of the strengthened glass 101 in the compressive regions CSR1 and CSR2. The low-refractive surface layer 130 has a thickness less than the compression depth. The thickness of the low-refractive surface layer 130 may range from 100 nm to 500 nm. The compressive regions CSR1 and CSR2 may have the maximum compressive stress at the surface of the low-refractive surface layer 130.
(58) The low-refractive surface layer 130 may not be distinguished by naked eyes from the bulk BLK of the strengthened glass 101 (the portion of the strengthened glass except the low-refractive surface layer). That is to say, unlike typical layer structures, the bulk BLK of the strengthened glass 101 may not be distinguished from the low-refractive surface layer 130 by naked eyes. However, the low-refractive surface layer 130 may be distinguishable from the bulk BLK of the strengthened glass 101 by an optical method, by compositions thereof, or the like.
(59) The low-refractive surface layer 130 has a lower refractive index than the refractive index of the bulk BLK of the strengthened glass 101. The refractive index of the low-refractive surface layer 130 is larger than the refractive index of air and smaller than the refractive index of the bulk BLK of the strengthened glass 101. When the refractive index of the bulk BLK of the strengthened glass 101 is 1.5, the refractive index or the average refractive index of the low-refractive surface layer 130 may be equal to 1.48 or less, equal to 1.45 or less, and in some exemplary embodiments equal to 1.3 or less. The low-refractive surface layer 130 may form an optical interface with the bulk BLK of the strengthened glass.
(60) The low-refractive surface layer 130 may include fine pores or fine grooves therein. The fine pores or fine grooves may be filled with the air to lower the average refractive index of the low-refractive surface layer 130.
(61) The low-refractive surface layer 130 may be a silicon rich layer. The low-refractive surface layer 130 may have a silicon content higher than that of the bulk BLK of the strengthened glass 101. The silicon content of the low-refractive surface layer 130 is higher because the alkali metal or alkaline earth metal is removed during a high-temperature salt treatment process for ion exchange of the strengthened glass 101. In an exemplary embodiment, the ratio of the silicon content of the low-refractive surface layer 130 to the silicon content of the bulk BLK of the strengthened glass 101 may be, but is not limited to, 1.2 to 1.4.
(62) The low-refractive surface layer 130 may be a sodium poor layer. Since the low-refractive surface layer 130 is located on the surfaces US, RS and SS of the strengthened glass 101, the sodium may be largely discharged through the ion exchange, such that the sodium content of the low-refractive surface layer 130 may be significantly smaller that the sodium content of the bulk BLK of the strengthened glass 101.
(63) The low-refractive surface layer 130 may include a fine crack 135. The fine crack 135 may be formed by a small friction, impact, or reaction with moisture in the air during the process of producing glass. The fine crack 135 may be generated during a process of strengthening the glass and may become larger under high temperature conditions of the strengthening process.
(64) The low-refractive surface layer 130 is located at the outermost side of the strengthened glass 101 and may include defects such as the fine crack 135. Such defects on the surface may lower the strength of the strengthened glass 101.
(65) Accordingly, according to an exemplary embodiment of the present disclosure, the method for producing glass article includes etching and removing the low-refractive surface layer 130 of the strengthened glass 101 which is to be processed. By removing the low-refractive surface layer 130, it is possible to improve the transmittance of the glass article 100 (see
(66) The etching the low-refractive surface layer 130 may include an acid cleaning process and a base cleaning process. The acid cleaning process may be carried out using an acidic solution containing at least one of: inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid and hydrogen fluoride; and organic acids such as formic acid, oxalic acid, citric acid, acetic acid, and benzoic acid. The base cleaning process may be carried out using a base solution containing at least one of: hydroxides of alkali metals such as sodium hydroxide, potassium hydroxide and lithium hydroxide; hydroxides of alkaline earth metal such as calcium hydroxide; inorganic alkali metal salts such as sodium carbonate; organic alkali metal salts such as sodium acetate, and ammonia water.
(67)
(68) Referring to
(69) The content of nitric acid in the acid solution may be, e.g., approximately 6 wt % or less, e.g., approximately 2 wt % to 5 wt %. The pH of the acidic solution may range from 1 to 3. The acid cleaning process may be carried out at a temperature of 30° C. to 50° C. for 0.5 to 5 minutes or 2 to 4 minutes.
(70) Even after the above-described acid cleaning process has been completed, the low-refractive surface layer 130 is hardly removed.
(71)
(72) After the acid cleaning process, the strengthened glass 101 is cleaned with a basic solution containing sodium hydroxide (NaOH). Although the base cleaning process may be carried out by immersing the strengthened glass 101 into a base solution to stir it, it may also be carried out by spraying or other methods.
(73) The content of sodium hydroxide in the base solution may be, e.g., approximately 6 wt % or less, e.g., approximately 2 wt % to 5 wt %. The pH of the base solution may range from 12 to 14. The base cleaning process may be carried out at a temperature of 30° C. to 50° C. for 0.5 to 5 minutes or 2 to 4 minutes.
(74) After the base cleaning process has been completed, the surface of the strengthened glass 101 may be etched to a depth of approximately 500 nm, such that the low-refractive surface layer 130 may be removed. The fine crack 135 formed on the surface can also be removed together with the low-refractive surface layer 130. After the low-refractive surface layer 130 has been completely removed, a glass article as shown in
(75) In some implementations, a part of the low-refractive surface layer 130 may remain, in which case the thickness of the low-refractive surface layer 130 is still reduced. Since the fine crack 135 penetrate in the depth direction from the surface, such a fine crack may be removed or reduced if the low-refractive surface layer 130 is removed in the depth direction from the surface by the etching process. Accordingly, even if the low-refractive surface layer 130 remains at a small thickness of less than 100 nm, the strength of the glass article 100 can be enhanced by the etching process.
(76) As described above, the low-refractive surface layer 130 is removed mainly by the base cleaning process. However, when the base cleaning process alone is performed without the acid cleaning process, the low-refractive surface layer 130 is not efficiently etched away. It is believed that the acid cleaning process itself does not remove the low-refractive surface layer 130 but serves to transform the low-refractive surface layer 130 into a state that can be easily removed by the base cleaning process. For the same reason, it is preferable to carry out the acid cleaning process first and then the basic cleaning process.
(77) The etching process including the acid cleaning and base cleaning processes mainly etches the low-refractive surface layer 130. In an exemplary embodiment, the etch rate of the bulk BLK of the strengthened glass 101 with respect to the cleaning solution is lower than the etch rate of the low-refractive surface layer 130. After the low-refractive surface layer 130 has been completely removed, the surface of the bulk BLK of the strengthened glass may be exposed to the cleaning solution depending on the concentration of the cleaning solution, time, temperature, etc. However, if the etch rate of the bulk BLK of the strengthened glass is low, it is possible to prevent the bulk BLK from being overly etched.
(78) When the surface of the strengthened glass 101 is etched, the stress profile inside it may change as well.
(79)
(80) Referring to
(81) Since the surface of the strengthened glass having the maximum compressive stress CS1′ before the etching is removed by the etching, the maximum compressive stress CS1 after the etching is lower than the maximum compressive stress CS1′ before the etching. Although the thickness removed by the etching is merely a very small fraction of the compression depth, the reduction rate of the maximum compressive stress may vary depending on the slope of the compressive stress profile. If the slope of the compressive stress profile CS1′ near the surface is steep, the maximum compressive stress CS1 may be significantly reduced even if a small thickness of the surface has been etched away.
(82) In an exemplary embodiment, the reduction rate of the maximum compressive stress by the etching ((CS1′−CS1)/CS1′) may be equal to or less than 10%. The reduction in the maximum compressive stress (CS1′−CS1) by the etching may range from 10 MPa to 100 MPa. For example, the reduction (CS1′−CS1) may be in the range of 50 MPa to 100 MPa, or in the range of approximately 60 MPa to 70 MPa.
(83) As the maximum compressive stress CS1 decreases after the etching, the sum of the compressive stresses of the compressive regions can also be reduced. Accordingly, the sum of the tensile stresses of the tensile regions can also be reduced to satisfy Equation 2 above. As the sum of tensile stresses changes, the stress profile in the tensile region changes, and the neutral stress point also changes. As can be seen from results of the experiments, the first compression depth DOL1′ before the etching is substantially the same as the first compression depth DOL1 after the etching, without any significant change. This means that the neutral stress point has moved to the inside of the strengthened glass.
(84) The maximum tensile stress can also be reduced as the sum of the tensile stresses is reduced by the etching. The present disclosure, however, is not limited thereto. The maximum tensile stress may be maintained if it is possible to compensate for the reduced stress only by a change in the neutral stress point and/or a change in the slope of the tensile stress profile.
(85) In an exemplary embodiment where the maximum tensile stress is reduced by the etching, the frangibility requirements of the glass article of Equation 4 above is applied to the glass article after the etching. The strengthened glass before the etching, which is not a complete article yet, may not necessary have to meet the requirements. In view of the above, according to some exemplary embodiments of the present disclosure, the strengthened glass before the etching and the glass article after the etching may satisfy the following relationship:
CT1′>−37.6*ln(t′)+48.7, CT1≤−37.6*ln(t)+48.7 [Mathematical Expression 6]
where CT1′ denotes the maximum tensile stress before the etching, t′ denotes the thickness of the strengthened glass, CT1 denotes the maximum tensile stress after the etching, and t denotes the thickness of the glass article.
(86) According to Equation 6 above, the strengthened glass can be produced under conditions exceeding the frangibility requirements according to Equation 4, and the tensile stresses can be adjusted to satisfy Equation 4 by the etching. The present disclosure, however, is not limited thereto. The maximum tensile stresses CT1′ and CT1 of the strengthened glass before as well as after the etching may satisfy Equation 4.
(87)
(88) Hydrofluoric acid (HF) can also be effectively used to remove fine cracks on the surface of the strengthened glass. For example, a fine crack can be removed by processing the surface of the strengthened glass with hydrofluoric acid (HF), and polishing or etching away the periphery of the fine crack so that a gentle recess is formed around the fine crack. However, since the etching with hydrofluoric acid (HF) leaves recesses in the shape of rice grains on the surface of the glass article as shown in
(89) In contrast, if the etching is carried out with an acid solution containing nitric acid and a basic solution containing sodium hydroxide, fine cracks can be removed without leaving recesses in the shape of rice grains on the surface of the glass article, to provide a substantially flat surface as shown in
(90) Hereinafter, a method for producing strengthened glass will be described, which is prepared before the etching process of the low-refractive surface layer.
(91) Initially, the glass is prepared, which is not strengthened yet. The glass before it is strengthened may be produced by various techniques such as a floating method, a fusion method, and a slot down-draw method. The glass before it is strengthened may be an alkali aluminosilicate glass or the like. The compositions of the glass before it is strengthened may include SiO.sub.2 and Al.sub.2O.sub.3. The compositions of the glass before it is strengthened may further include Na.sub.2O. The compositions of the glass before it is strengthened may include at least one of K.sub.2O, B.sub.2O.sub.3, Li.sub.2O, MgO, CaO, ZnO, ZrO.sub.2, Fe.sub.2O.sub.3, SnO.sub.2 and P.sub.2O.sub.5. In some exemplary embodiments, the glass before it is strengthened may contain substantially no Li.sub.2O and P.sub.2O.sub.5. In some exemplary embodiments, the glass before it is strengthened may contain substantially no Li.sub.2O, P.sub.2O.sub.5 and B.sub.2O.sub.3. According to the exemplary embodiment, even if the glass article contains no Li.sub.2O, P.sub.2O.sub.5 and/or B.sub.2O.sub.3, it can have a compressive stress of 700 MPa or higher via the strengthening process and the process of removing the low-refractive surface layer and can have a sufficient depth for satisfying Equation 1 above.
(92) Subsequently, the glass is strengthened. The glass may be strengthened by a first ion exchange process and a second ion exchange process.
(93) The first ion exchange process may include exposing the glass to a molten salt containing potassium ions (K+). The molten salt may be, for example, a salt mixed with sodium nitrate (NaNO3) and potassium nitrate (KNO.sub.3). The first ion exchange process may be carried out at a temperature of ±20° C., which is lower than the strain point by 50° C. For example, if the strain point of the glass is approximately 580° C., the first ion exchange process may be carried out at a temperature of approximately 500° C. or higher (e.g., 530° C.). The time for which the first ion exchange process is carried out may range, but is not limited to, 3 hours to 8 hours (e.g., approximately 5 hours). Through the first ion exchange process, potassium ions may enter the glass to introduce compressive stress near the surface of the glass.
(94) After the first ion exchange process, a stress-relieving process may be further carried out. The stress-relieving process may be carried out at a temperature of approximately 500° C. or higher (e.g., approximately 530° C.) for 1 to 3 hours (e.g., approximately 2 hours). Via the stress-relieving process, the maximum compressive stress may be reduced, and the potassium ions diffuse into the inside and the compression depth may be increased. The stress-relieving process may be carried out in air or in liquid. The stress-relieving process may be carried out in a liquid by immersing it into in a salt mixture of potassium ions and sodium ions to perform heat treatment. The stress-relieving process may be eliminated.
(95) After the stress-relieving process, the second ion exchange process is carried out. The second ion exchange process may be carried out by exposing the glass to a molten single salt containing potassium ions. The second ion exchange process may be carried out at a lower temperature and for a shorter time than the first ion exchange process. For example, the second ion exchange process may be carried out at a temperature from 380° C. to 460° C. (e.g., approximately 420° C.) for 1 to 3 hours or 1.3 to 2 hours.
(96) After the second ion exchange process is carried out, the compressive stress can be increased greatly at a shallow position of the surface of the glass.
(97) After the first ion exchange process, the stress-relieving process and second ion exchange process, the glass article may have a high surface compressive stresses and a sufficient compression depth. The compressive stress profile may have a steep slope near the surface of the glass article, and may have a slope becoming gentler toward the inside of the glass article. For example, the compressive stress profile may include a first section having the average slope (absolute value) of 40 MPa/μm to 200 MPa/μm from the surface to a first point, and a second section more distant from the surface than the first section and having the average slope (absolute value) equal to or less than 2 MPa/μm. Both the first section and the second section may lie within the compressive region. The first section may be extended from the surface to a depth exceeding 15 μm. In some exemplary embodiments, the compressive stress profile may include a point in the compressive region at which the average slope is 0 MPa/μm.
(98)
(99) In the graph shown in
(100) In the graph shown in
(101) Referring to
(102) A more detailed description and various embodiments of the above-mentioned method for producing strengthened glass are disclosed in Korean Patent Application No. 10-2017-0048080 filed by the applicant on Apr. 13, 2017, the entirety of which is incorporated herein by reference.
(103)
(104) Referring to
(105) The preparing the strengthened glass including the low-refractive surface layer (step S21) is identical to that of the exemplary embodiments of
(106) Subsequently, the low-refractive surface layer is polished (step S22).
(107)
(108) Referring to
(109) The polishing thickness may be adjusted, for example, in the range of 100 nm to 1,000 nm (e.g., approximately 500 nm). The first and second surfaces may be polished to the same depth or different depths.
(110)
(111) Referring to
(112) As the low-refractive surface layer 131 remains on the side surfaces SS of the glass article 102, there may be fine cracks or variations in optical characteristics. However, unlike the first surface US or the second surface RS, the side surfaces SS of the glass article 102 do not contribute greatly to light transmission. Therefore, the fine cracks on the side surfaces SS have little effect on the overall strength of the glass article 102. Therefore, the glass article 102 of
(113) The polishing process according to the exemplary embodiment of the present disclosure can also be utilized to achieve the uniform compressive stress characteristics at the first surface and the second surface of the glass article.
(114) For example, the floating method, which is one of the techniques for producing a glass plate, is carried out by flowing glass compositions into a tin bath. In doing so, the surface of the glass plate in contact with the bath may have different compositions from the surface not in contact with the bath. As a result, after the process of strengthening the glass, there may be deviations in the compressive stress of approximately 40 MPa between the surface in contact with the tin bath (e.g., the first surface) and the surface not in contact with the tin bath (e.g., the second surface). In this regard, by removing the surface of the glass to an appropriate thickness by polishing, it is possible to reduce the deviations in the compressive stresses between the surfaces. For example, it is possible to reduce the deviations in the compressive stresses to 20 MPa or less, or 10 MPa or less. In the polishing process, it is possible to select whether or not to polish each surface, and the polishing thickness of the first surface and the second surface can be adjusted differently. Thus, the compressive stress of the surface in contact with the tin bath and the surface not in contact with the tin bath can be controlled individually. For example, by polishing more the surface with relatively high compressive stress, it is possible to more easily control the deviations in the compressive stress between the surfaces.
(115) The polishing of the surface of the glass article may be used in combination with the etching. For example, if the compressive stress at the first surface is greater or is expected to be greater than the compressive stress at the second surface after the etching of the glass article, the first surface may be polished to reduce the compressive stress at the first surface so that it becomes substantially equal to the compressive stress at the second surface. On the contrary, prior to the etching the glass article, the polishing process may be carried out to reduce deviations in the compressive stress between the surfaces.
(116) On the other hand, if the glass article 102 is polished using the polishing slurry 520, there may be a certain surface roughness depending on the particle size of the polishing slurry 520.
(117) To find out the effects of the polishing process on the surface roughness of the glass article 102, two glass article samples that had been subjected to the polishing process were prepared.
(118)
(119) It can be seen from
(120) To meausre the surface roughness, the value of surface roughness Ra and the values of surface roughness Rz of glass article samples 1 and 2 were obtained. The glass article before the polishing had the value of Ra of 0.444 nm and the value of Rz of 7.1297 nm. Glass article sample 1 after the polishing had the value of Ra of 1.633 nm and the value of Rz of 44.286 nm. Glass article sample 2 after the polishing had the value of Ra of 1.404 nm and the value of Rz of 22.928 nm. Although the roughness was slightly increased by the polishing, it still lies within the range of 0.5 nm to 50 nm, which allows for the transmittance. Thus, it can be seen that the increase in the roughness due to the polishing hardly affects the optical characteristics of the glass article.
(121) To evaluate the effects of the etching processes on the strength of the glass articles according to the exemplary embodiments, iron ball drop tests were conducted on several glass article samples. The iron ball drop tests were carried out by dropping approximately 150 g of an iron (Fe) ball onto the glass article samples to measure the drop height to break the glass article samples. The higher the drop height is, the higher the strength of the glass article sample is, which means that the sample can withstand stronger impact.
(122)
(123) The glass article samples of
(124) The glass article samples of
(125) Similarly to the samples of
(126) All of the tests of
(127) Referring to
(128) Referring to
(129) Referring to
(130) It can be seen that the breakage heights of all the samples of
(131) In order to evaluate how the compressive stress and compressive depth vary with the etching process (the acid cleaning process and then the base cleaning process), compressive stress and compression depth before and after the etching were measured for 21 glass article samples. The results are shown in Table 1 and in the graphs of
(132) TABLE-US-00001 TABLE 1 Before Etching After Etching CS(MPa) DOL(μm) CS(MPa) DOL(μm) 982.8 75.4 904.5 75.2 950.1 82.5 891.6 77 948.2 81.5 899.8 77.4 963.8 76.6 834.5 81.5 947.4 78.2 858.9 79.4 930 78.2 853.9 78.2 955.9 78.9 842.7 78.9 968.3 78.3 879.8 77.6 958.4 78.6 893.9 78.6 959.7 76.5 874.2 81.1 947.1 79 875.5 80.6 937.5 79.2 862.3 78.8 949.1 82 850.7 80.4 964.7 80.5 844.7 80.9 937.7 80.9 867.3 81.4 955.9 80.9 895.2 80.1 943.2 81.3 885.1 80.4 944.8 78 853.5 80 926.4 81.6 895.5 76.7 944 80.4 865.8 80.3 950.7 79.4 871.5 79.2
(133)
(134) Referring to Table 1 and
(135) Referring to Table 1 and
(136) Next, in order to evaluate how the compressive stress and compressive depth vary with the polishing process, the compression stress and compression depth before and after the etching were measured for 38 glass article samples. The results are shown in Table 2 and in the graphs of
(137) TABLE-US-00002 TABLE 2 Before Polishing After Polishing CS(MPa) DOL(μm) CS(MPa) DOL(μm) 907 75 874 75.6 935 74 893 73.7 902 74 880 75.7 946 72 896 73.5 912 75 878 75.4 940 73 906 73.4 916 75 878 75.7 945 72 906 73.2 910 75.3 877 75.8 935 72.4 898 73.6 910 76.2 873 75.6 947 73.2 906 72.7 918 75.6 880 72.7 942 73.8 903 73.5 908 75.8 895 71.7 934 73.4 877 74.5 904 73.8 891 74.9 940 73.4 895 73.7 907 75.4 898 72.7 930 71.4 888 73.6 905 75.4 890 74.6 933 74.6 904 73.4 910 74.8 900 72.7 938 71.9 892 74.3 902 75.1 897 77 927 72.8 915 73.1 896 76.1 933 72.3 932 71.7 920 75 924 73.7 898 72.7 895 75.3 888 73.6 897 75.2 890 74.6 928 73 904 73.4 900 75.1 900 72.7 928 74 892 74.3 932 72.9 897 77 902 75.1 915 73.1 936 72.7 933 72.3 903 75.7 920 75
(138)
(139) Referring to Table 2 and
(140) Referring to Table 2 and
(141) While exemplary embodiments are described above, it is not intended that these embodiments describe all possible forms of the inventive concept of the present disclosure. Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the inventive concept of the present disclosure. Additionally, the features of various implementing embodiments may be combined to form further exemplary embodiments of the present disclosure.