Method for machining a workpiece

Abstract

The invention relates to a method for machining a workpiece, in particular for a profiled leaf element of a window leaf frame, wherein the workpiece is initially machined using a first machining device in order to create a machined first surface to which an adhesive tape is to be applied, and the workpiece is further machined once the adhesive tape has been applied.

Claims

1. A method for machining a workpiece for a profiled leaf element of a window leaf frame, the method comprising: in a first step, machining the workpiece using a first machining device to produce a machined first surface and a machined second surface, in a second step, applying an adhesive to the first surface, in a third step, machining the workpiece further using a second machining device after applying the adhesive, wherein the second surface is adjacent to the first surface, wherein the second surface is arranged such that it corresponds substantially to a shadow area of the adhesive applied to the first surface, wherein the shadow area of the adhesive is an area on the second surface which would be obscured by the adhesive when viewing the second surface from an orthogonal vantage point.

2. The method as claimed in claim 1, wherein the first step is carried out in such a way that the first surface is machined to a final dimension as a result.

3. The method as claimed in claim 2, wherein the first step is carried out in such a way that the second surface is machined to a final dimension as a result.

4. The method as claimed in claim 1, wherein the third step includes machining of at least individual remaining surfaces of the workpiece to final dimension.

5. The method as claimed in claim 4, wherein the third step is carried out in one machining operation or multiple machining operations.

6. The method as claimed in claim 1, wherein the first step is carried out on a planing machine or a milling machine.

7. The method as claimed in claim 1, wherein the third step is carried out on a profiling machine or on a machining center.

8. The method as claimed in claim 1, wherein, between the first and second steps, the method further comprises cleaning the first surface of the workpiece is pre-treated or cleaned using a cleaning device.

9. The method as claimed in claim 1, wherein the second step is carried out automatically by a laminating device or an application device.

10. The method as claimed in claim 9, wherein the first machining device and the laminating device or application device are coupled or connected to one another, in order to combine the production of the first surface and the application of the adhesive to the first surface with one another.

11. The method as claimed in claim 9, wherein the laminating device or application device and the second machining device are coupled or connected to one another, in order to combine the application of the adhesive to the first surface and the further machining with one another.

12. The method as claimed in claim 1, wherein the adhesive has or is an adhesive tape.

13. The method as claimed in claim 1, wherein the adhesive has or is an adhesive compound which is a pasty or fluid adhesive compound.

14. The method as claimed in claim 1, wherein the workpiece is at least partly miter-sawn or miter-milled to permit the workpiece to be mitered to a second workpiece.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) In the following, the invention will be explained in more detail on the basis of at least one exemplary embodiment and by using the drawings, in which:

(2) FIG. 1 shows a schematic illustration of a workpiece for a leaf profile of a window leaf frame before the first machining,

(3) FIG. 2 shows a schematic illustration of the workpiece for a leaf profile of a window leaf frame according to FIG. 1 after the first machining and after the application of the adhesive strip,

(4) FIG. 3 shows a schematic illustration of a workpiece according to FIG. 2 additionally with an illustration of a profile of an end contour mill, and

(5) FIG. 4 shows a block diagram to explain the method according to the invention.

PREFERRED EMBODIMENT OF THE INVENTION

(6) FIG. 1 shows a workpiece 1 in cross section. The workpiece 1 in the exemplary embodiment of FIG. 1 is formed so as to be substantially rectangular or alternatively square in section and, in the longitudinal direction, not illustrated here, has an elongated rod-like shape. In addition, rebates already provided and otherwise introduced can be provided in the workpiece.

(7) The workpiece 1 is used after the machining for example as a limb or leaf profile of a window leaf frame, which can be assembled to form a window leaf frame and which can then be bonded to a pane of the window leaf.

(8) Before its machining, the workpiece 1 advantageously has four peripheral side surfaces 2, 3, 4 and 5, which are subsequently machined.

(9) FIG. 2 shows the workpiece 1 after first machining in the area of the side surfaces 2 and 5. The workpiece 1 is first machined by means of a first machining device in order to produce a machined first surface 6 for the application of an adhesive tape 7 to the first surface 6.

(10) In the exemplary embodiments, the method according to the invention will be described by using the application of an adhesive tape, wherein an alternative adhesive can also be applied instead of the adhesive tape. The adhesive can generally be the adhesive tape or else an adhesive compound which is applied. Also, in addition to an adhesive tape, an adhesive compound can also be applied. This applies in a corresponding way to all the exemplary embodiments described in the present application documents and will not be explicitly repeated once more below.

(11) The first surface 6 is formed substantially parallel to the side surfaces 3, 5 and is substantially perpendicular to the side surface 2. The first machining for producing the first surface 6 is carried out in such a way that the first surface 6 is machined to a final dimension as a result.

(12) Thus, the adhesive tape 7 can be applied to the first surface 6, so that it is bonded on securely.

(13) It can also be seen that the first machining for producing the first surface 6 also machines a second surface 8, which is adjacent to the first surface 6, wherein the second surface 8 is arranged in such a way that it substantially corresponds to a shadow area of the adhesive tape 7 bonded onto the first surface 6. The second surface 8 is arranged to be substantially perpendicular to the first surface 6 and has a height h which is at least somewhat larger than the height H of the applied adhesive tape 7. The first machining for producing the second surface 8 is also implemented in such a way that, as a result, the second surface 8 is also machined to a final dimension. This is advantageous, since as a result it is possible to avoid subsequent machining of the first surface 6 and also of the second surface 8, during which the applied adhesive tape 7 could be damaged or impaired.

(14) It can also be seen that, above the second surface 8, the side surface 2 is machined as far as the side surface 5 as a surface 9. However, this can be carried out only to a rough dimension of a pre-profile, so that this surface 9 is possibly machined later to an end dimension in a following machining step. Optionally, however, this surface 9 can also be machined to final dimension as part of the second surface 8.

(15) FIG. 2 shows the final dimension 10, 11, 12 to which the workpiece 1 is brought during further machining. This is carried out following the application of the adhesive tape 7 to the first surface 6.

(16) The further machining can be machining of at least individual remaining surfaces of the workpiece to final dimension, wherein the further machining is carried out in one method step or in multiple method steps. FIG. 3 shows, following the application of the adhesive tape 7, that the left-hand side of the workpiece 1 in the areas of the final dimension 11, 12, is machined to its final dimension by means of an end profile mill 13. Then, by means of a further end profile mill, the right-hand side of the workpiece 1 can also be machined finally in the area of the final dimension 10. However, this is not illustrated.

(17) According to the idea of the invention, the first machining is carried out on a first machining device 14, which is constructed as a planing machine or as a milling machine.

(18) The further machining is advantageously carried out on a second machining device 15, such as in particular on a milling machine, which is constructed in particular as a profiling machine or as a machining center. This is illustrated in FIG. 4 in the form of a block diagram 20.

(19) Following the production of the first surface and before the application of the adhesive tape 7, the workpiece 1 or the first surface 6 of the workpiece 1 is cleaned by means of a cleaning device 16. This can be blowing off dust or chips. It can also be another type of cleaning.

(20) Following the cleaning, the adhesive tape 7 is applied. It is advantageous if the application of the adhesive tape 7 is carried out automatically by a laminating device 17. In the event of a different application of the adhesive, instead of a laminating device 17 a general application unit 17 can also be provided, by means of which the adhesive can be applied.

(21) According to the idea of the invention, it is advantageous if the first machining device 14 and the laminating device 17 or application device 17 are coupled or connected to one another, in order to combine the production of the first surface 6 and the application of the adhesive tape 7 to the first surface 6 with one another. Alternatively, this coupling can also be omitted.

(22) Alternatively or additionally, the laminating device 17 or application device 17 and the second machining device 15 can be coupled or combined with one another, in order to combine the application of the adhesive tape 7 to the first surface 6 and the further machining with one another. Alternatively, this coupling can also be omitted.

(23) The laminating device or application device 17 can both apply an adhesive, which is an adhesive compound, an adhesive tape or else an application of an adhesive tape and an adhesive compound. Different adhesives can also be provided. The adhesive or adhesives can, for example, also be covered by means of a protective film or the like. The application device can not only apply an adhesive tape, such as rolling on by means of rollers, it can alternatively or additionally also roll the adhesive on by means of rolls or apply the same by means of spraying, and also apply the same by means of nozzles.

(24) The machined workpieces can advantageously be assembled to form a window frame or a window leaf frame or the like. It is also advantageous if the workpieces are miter-sawn or miter-milled at at least one of their ends, in order to miter two workpieces to one another. Other types of connection can also be chosen, so that the workpieces butt up against one another and, for example, are mortised or joined in another way. However, cutting to length and miter-sawing is associated with the advantage that simple processing and adaptation of the workpieces to be connected is carried out; as a result of the bonding of a pane, this also contributes to the stability and the assembled frame does not need to be designed so strongly in terms of its stability.

LIST OF DESIGNATIONS

(25) 1 Workpiece 2 Side surface 3 Side surface 4 Side surface 5 Side surface 6 First surface 7 Adhesive tape 8 Second surface 9 Surface 10 Final dimension 11 Final dimension 12 Final dimension 13 End profile mill 14 First machining device 15 Second machining device 16 Cleaning device 17 Laminating device, application device 20 Block diagram