ENCAPSULATING COMPOSITION

Abstract

The present application relates to an encapsulating composition, an organic electronic device, a method for evaluating reliability of the organic electronic device and a method for preparing the organic electronic device, and provides an encapsulating composition which can improve flatness and adhesion of an organic layer sealing an organic electronic element to effectively block moisture or oxygen introduced into an organic electronic device from the outside, thereby securing the lifetime of the organic electronic device.

Claims

1. An encapsulating composition comprising a curable compound, wherein the curable compound includes 5 to 50 parts by weight of a curable compound having a cyclic structure in its molecular structure and 25 parts by weight to 80 parts by weight of a vinyl ether curable compound, and wherein, when the encapsulating composition is in a state of being cured to have a form of an organic layer that comprises a primary pattern which is extended in one direction and a secondary pattern which is extended in one direction and formed adjacent to the primary pattern, the organic layer satisfies a ratio (h/H100) of the height h of the groove portion between the primary pattern and the secondary pattern to the thickness H of the organic layer, of 50% or less.

2. The encapsulating composition according to claim 1, wherein the primary pattern or the secondary pattern has a width in a range of 2 to 150 mm.

3. The encapsulating composition according to claim 1, wherein the thickness H of the organic layer is in a range of 2 to 25 m.

4. (canceled)

5. The encapsulating composition according to claim 1, wherein the curable compound comprises at least one or more curable functional groups.

6. (canceled)

7. The encapsulating composition according to claim 1, wherein the curable compound further comprises a curable compound having an oxetane group.

8. The encapsulating composition according to claim 7, wherein the curable compound having an oxetane group is comprised in an amount of 5 to 90 parts by weight relative to 100 parts by weight of the vinyl ether curable compound.

9. The encapsulating composition according to claim 1, further comprising a surfactant.

10. The encapsulating composition according to claim 1, further comprising a photoinitiator.

11. The encapsulating composition according to claim 1, further comprising a photosensitizer.

12. An organic electronic device comprising: a substrate; an organic electronic element formed on the substrate; and an organic layer sealing the entire surface of the organic electronic element, wherein the organic layer, in a state of being cured, has a primary pattern which is extended in one direction and a secondary pattern which is extended in one direction and formed adjacent to the primary pattern, and has a ratio (h/H100) of the height h of the groove portion between the primary pattern and the secondary pattern to the thickness H of the organic layer, of 50% or less.

13. A method for evaluating reliability of an organic electronic device, comprising: providing an organic electronic device including a substrate; an organic electronic element formed on the substrate; and an organic layer sealing the entire surface of the organic electronic element, wherein the organic layer, in a state of being cured, has a primary pattern which is extended in one direction and a secondary pattern which is extended in one direction and formed adjacent to the primary pattern; measuring a ratio h/H100 of the height h of the groove portion between the primary pattern and the secondary pattern to the thickness H of the organic layer; and determining whether the ratio is within a range of 50% or less.

14. A method for preparing an organic electronic device comprising a step of forming an organic layer on a substrate in which an organic electronic element is formed on its upper part, so that the encapsulating composition of claim 1 seals the entire surface of the organic electronic element.

15. The method for preparing an organic electronic device according to claim 14, wherein the step of forming an organic layer proceeds with inkjet printing, gravure coating, spin coating, screen printing or reverse offset coating.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0071] FIGS. 1 and 3 are cross-sectional views showing an organic electronic device according to one example of the present invention.

[0072] FIG. 2 is a cross-sectional view showing a primary pattern (Pattern 1) and a secondary pattern (Pattern 2) of an organic layer according to one example of the present invention.

EXPLANATION OF REFERENCE NUMERALS

[0073] 3: organic electronic device [0074] 31: substrate [0075] 32: organic electronic element [0076] 33: organic layer [0077] 34: inorganic layer [0078] 35: protective layer [0079] 36: bag structure [0080] 37: encapsulation film [0081] 38: cover substrate

BEST MODE

[0082] Hereinafter, the present invention will be described in more detail through Examples according to the present invention and Comparative Examples not complying with the present invention, but the scope of the present invention is not limited by the following examples.

Example 1

[0083] An alicyclic epoxy compound Celloxide 2021P from Daicel (hereinafter, CEL2021P) and limonene dioxide (LDO) were used as curable compounds having a cyclic structure. As a vinyl ether curable compound, 1,4-cyclohexanedimethanol divinyl ether (CHDVE) was used. As an oxetane group-containing curable compound, OXT-221 from TOAGOSEI was used. Furthermore, TTA UV-694 (hereinafter, UV694) of an iodonium salt photoinitiator from Tetrachem, was used as a photoinitiator, and F430 from DIC of a fluorine-based surfactant was used as a surfactant. In addition, a silane coupling agent (KBM-403) was used as a coupling agent, and 2-isopropylthioxanthone (ITX) was used as a photosensitizer. Also, 2,6-di-tert-butyl-p-cresol (BHT from SIGMA aldrich) was used as a heat stabilizer.

[0084] The above compositions were formulated in weight ratios as in Table 1 below, and introduced into a mixing vessel. In the mixing vessel, a uniform encapsulating composition ink was prepared using a planetary mixer (Kurabo, KK-250s).

[0085] The encapsulating composition prepared above was subjected to ink jetting using Unijet UJ-200 (Inkjet head-Dimatix 10Pl 256) to form an organic layer. More specifically, a primary pattern extended in one direction was formed on a substrate, on which an organic electronic element was formed, with the encapsulating composition, and after leaving an interval of 20 seconds, a secondary pattern extended in one direction was printed so as to be formed adjacent to the primary printed pattern. The inkjet conditions are as follows.

[0086] Inkjet Conditions:

[0087] WaveformVar1: 2 s, Main: 8 s, Var2: 2 s, Heating temperature: 45 C.

[0088] Jetting Voltage100V, Jetting Frequency1000 Hz

[0089] The printed organic layer was subjected to a planarization step for 40 seconds, and the planarized organic layer was irradiated with UV of 1000 mJ/cm.sup.2 having a wavelength range of 395 nm at an intensity of 1000 mW/cm.sup.2 using an LED lamp and cured.

Example 2

[0090] An organic layer was formed in the same manner as in Example 1, except that a fluorine-based surfactant F-444 (Megaface) was used instead of F430 as a surfactant.

Example 3

[0091] An organic layer was formed in the same manner as in Example 1, except that a fluorine-based surfactant F-251 (Megaface) was used instead of F430 as a surfactant.

Example 4

[0092] An organic layer was formed in the same manner as in Example 1, except that a fluorine-based surfactant F-510 (Megaface) was used instead of F430 as a surfactant.

Comparative Examples 1 to 3

[0093] Encapsulating compositions and organic layers were formed in the same manner as in Example 1, except that materials were formulated in the weight ratios as in Table 1 below and introduced into a mixing container. In Table 1, the unit is part by weight.

TABLE-US-00001 TABLE 1 Comparative Example Example 1 1 2 3 LDO 10 5 5 5 CEL2021P 10 40 50 52 CHDVE 55 30 30 30 OXT-221 17 23 7 5 UV694 1 1 1 1 F430 1 1 1 1 KBM-403 5 5 5 5 ITX 0.5 0.5 0.5 0.5 BHT 0.5 0.5 0.5 0.5

[0094] Physical properties in Examples and Comparative Examples were evaluated in the following manner.

[0095] 1. Flatness Measurement

[0096] For the cured organic layers prepared in Examples, a ratio h/H100 of the height h of the groove portion between the primary pattern and the secondary pattern to the thickness H of the organic layer was measured and calculated. The lower the value, it represents more excellent flatness.

[0097] In the measurement, the thickness H and the height h of the groove portion were measured using an Alpha step (KLA-Tencor).

[0098] 2. Spreadability

[0099] After the encapsulating compositions prepared in Examples were each applied with 10 pL of one droplet through an inkjet, it was held for 60 seconds and then photo-cured to measure a spreading degree through an optical microscope. The larger the dot size, the better the spreadability, where it was applied by having the same Dimatix 10 pL Q head nozzle spacing and setting the dot pitch to be 254 m and then measured. The diameter of the applied encapsulating composition to a single dot was measured. The spreadability is classified as very good in the case of 210 m or more and as good in the case of 180 m or more.

TABLE-US-00002 TABLE 2 Flatness (h/H 100, %) Spreadability (m) Example 1 43.91 210 Example 2 38.64 210 Example 3 38.06 215 Example 4 40.66 215 Comparative Example 1 50.21 170 Comparative Example 2 60.12 165 Comparative Example 3 65.85 160