Light-emitting arrangement and light-emitting system
10598353 ยท 2020-03-24
Assignee
Inventors
Cpc classification
F21V17/16
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V19/003
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V19/004
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
H01L2224/48137
ELECTRICITY
F21Y2115/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F21V19/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V17/16
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
Described is an arrangement and system for precise angular and directional positioning of light-emitting diodes (LED). An LED component includes a base body with a light-emitting region, a first connector, and a second connector, where the connectors are electrically conductively connected to the light-emitting region. The base body includes at least two fixing regions and the connectors each include a bending portion and a contact area for surface mounting. Each of the bending portions is arranged between the base body and the contact area. A supporting frame includes a plinth region to align the supporting frame on a surface and includes an outwardly open recess, a support region to receive a component in the supporting frame and at least two fixing elements to fix the component above the support region. A base area of the plinth region and a base area of the support region enclose an acute angle.
Claims
1. A light-emitting diode (LED) component, comprising: a base body having a light-emitting region and comprising at least two fixing regions, wherein the base body comprises a smooth lower surface with a square cross-section, four side faces and an upper surface including the light-emitting region; a first connector comprising a bending portion and a contact area configured for surface mounting, wherein the bending portion of the first connector is arranged between the base body and the contact area of the first connector; and a second connector comprising a bending portion and a contact area configured for surface mounting, wherein the bending portion of the second connector is arranged between the base body and the contact area of the second connector, wherein the first connector and the second connector are configured as strip-type wires with the width of the second connector being larger than the width of the first connector, wherein the first connector and the second connector are electrically conductively connected to the light-emitting region without any further connectors, wherein the bending portion of the first connector and the bending portion of the second connector comprise continuous notches running transversely to a predefined bending direction, which reduce a thickness of the connectors locally and restrict the bending of the first connector and the second connector to particular sections as predetermined bending points, wherein to each notch of the bending portion of one connector a corresponding notch of the bending portion of the other connector is parallelly arranged in the same distance from the base body.
2. The LED component according to claim 1, wherein the at least two fixing regions are configured in steps by recesses in a surface of the base body.
3. The LED component according to claim 1, wherein the contact area is configured as SMT soldered connections.
4. The LED component according to claim 1, wherein a sectional plane of the square cross-section lies parallel to a surface of the light-emitting region.
5. The LED component according to claim 1, wherein the at least two fixing regions are configured in steps by recesses in a surface of the base body.
6. The LED component according to claim 5, wherein four periodically arranged stepped fixing regions form an octagonal border of the light-emitting region with an outer edge of the base body.
7. The LED component according to claim 6, wherein the octagonal border is configured as a uniformly octagonal border.
8. The LED component according to claim 1, wherein the contact area is configured as SMT soldered connections.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The invention will be explained hereinafter in embodiment examples with reference to the accompanying drawings, wherein:
(2)
(3)
(4)
(5)
(6)
(7)
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
(8)
(9) The base body 110 comprises a square cross-section. The fixing regions 112 are configured in a stepped form by recesses in the surface of the base body 110. In particular, four periodically arranged stepped fixing regions 112 configure an octagonal border of the light-emitting region 120 with the outer edge of the base body 110. A uniformly octagonal border of the light-emitting region 120 is shown, in which the length of the maximum extent of the stepped fixing regions 112 corresponds to the length of the adjoining border areas of the base body 110 in each case.
(10)
(11) The fixing elements 230 are configured as clamping elements in the form of self-retaining pressure clampings. The fixing elements 230 comprise lateral chamfers 232 which include the support region 220 of the supporting frame 200 above the support region 220 at least in sections. The chamfers 232 hereby form the mating part of an octagonal border of the light-emitting region 120 of an LED component 100 according to the invention in accordance with the embodiment described in
(12)
(13)
(14) The size of the base area of the plinth region 210 of the supporting frame 200 in a preferred embodiment is approx. 3.83.8 mm; the height is approx. 3 mm. The size of the base area of the plinth region 210 of the supporting frame 200 is preferably less than 10 mm10 mm, more preferably less than 5 mm5 mm. The height is preferably less than 10 mm, preferably less than 5 mm.
(15)
(16) In addition, the light-emitting system on the circuit carrier 300, which is shown in
(17)
(18) The LED component 100 represented shows an octagonal border of the light-emitting region 120 (drawn in only as a position mark). Inside this border, the LED component 100 preferably comprises an emission region configured as a reflector. The emission region can, as shown, in particular configure a concave form with respect to the corresponding surface area of the LED component 100. The emission region is preferably mirrored and configured such that radiation emitted in a divergent manner by the light-emitting region 120 is concentrated into a common beam direction. The light-emitting region 120 is not explicitly shown in
LIST OF REFERENCE NUMERALS
(19) 100 LED component 110 Base body 112 Fixing regions 120 Light-emitting region 130 First connector 132 Contact area (first connector) 134 Bending portion (first connector) 140 Second connector 142 Contact area (second connector) 144 Bending portion (second connector) 200 Supporting frame 210 Plinth region 212 Recess 220 Support region 230, 230 Fixing elements 232 Lateral chamfers 300 Circuit carrier Angle