FULL DISPLAY SCREEN AND DISPLAY DEVICE WITH THE FULL DISPLAY SCREEN

Abstract

The present invention provides a full display screen and a display device with the full display screen. The full display screen disposes at least one of a chip on film bonding welding pad and a cell forming test welding pad in a notch, which can realize a super narrow bottom bezel or even no bottom bezel, and can meet the requirements for the cell lighting test of the full display screen and making the qualification rate of bonding the chip onto the flexible circuit board be productive at the same time.

Claims

1. A full display screen, comprising: a display unit comprising a display area and a non-display area; a notch at a top end of the display area is arranged in the non-display area; a chip on film bonding welding pad and a cell forming test welding pad; the chip on film bonding welding pad and the cell forming test welding pad are disposed in the non-display area; the chip on film bonding welding pad is disposed in the notch; the cell forming test welding pad is disposed in the non-display area at a bottom end of the display unit; and a functional component disposed in the notch.

2. A full display screen, comprising: a display unit comprising a display area and a non-display area; a notch at a top end of the display area is arranged in the non-display area; a chip on film bonding welding pad and a cell forming test welding pad; wherein the chip on film bonding welding pad and the cell forming test welding pad are disposed in the non-display area, and at least one of the chip on film bonding welding pad and the cell forming test welding pad is disposed in the notch.

3. The full display screen of claim 2, wherein the chip on film bonding welding pad is disposed in the notch; and the cell forming test welding pad is disposed in the non-display area at a bottom end of the display unit.

4. The full display screen of claim 2, wherein the cell forming test welding pad is disposed in the notch; and the chip on film bonding welding pad is disposed in the non-display area at a bottom end of the display unit.

5. The full display screen of claim 2, wherein the full display screen also comprises a functional component; and the functional component is disposed in the notch.

6. The full display screen of claim 2, wherein the full display screen also comprises a chip on film; the chip on film comprises a flexible circuit board, a bonding component and a driving chip; wherein the bonding component and the driving chip are disposed on a surface of the flexible circuit board; the flexible circuit board is connected to the chip on film bonding welding pad via the bonding component, and bent to a back surface of the display unit.

7. The full display screen of claim 2, wherein the full display screen also comprises a glass cover plate; and the glass cover plate is disposed on a top surface of the display unit.

8. The full display screen of claim 7, wherein the glass cover plate comprises a light-shading layer; the light-shading layer is disposed in an area corresponding to the chip on film bonding welding pad and the cell forming test welding pad.

9. A display device, comprising the full display screen of claim 2 and a backlight module disposed below the full display screen; an area of the display device, corresponding to the chip on film bonding welding pad and cell forming test welding pad, has no backlight emission.

10. The display device of claim 9, wherein an area of the backlight module, corresponding to the chip on film bonding welding pad and cell forming test welding pad is blocked by a light-shading layer.

11. The display device of claim 9, wherein an area of the backlight module, corresponding to the chip on film bonding welding pad and cell forming test welding pad has no backlight source.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to describe clearly the embodiment in the present disclosure or the prior art, the following will introduce the drawings for the embodiment shortly. Obviously, the following description is only a few embodiments, for the common technical personnel in the field it is easy to acquire some other drawings without creative work.

[0026] FIG. 1 is a planform of a full display screen according to a first exemplary embodiment of the present disclosure.

[0027] FIG. 2 is a structure diagram of a chip on film.

[0028] FIG. 3 is a planform of a full display screen according to a second exemplary embodiment of the present disclosure.

[0029] FIG. 4 is a planform of a full display screen according to a third exemplary embodiment of the present disclosure.

[0030] FIG. 5 is a structure diagram of a display device of the present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] The description of following embodiment, with reference to the attached drawings, is used to exemplify specific embodiments which may be carried out in the present disclosure.

[0032] FIG. 1 is a planform of a full display screen according to a first exemplary embodiment of the present disclosure. Referring to FIG. 1, a full display screen 1 provided in the present disclosure comprises a display unit 10 comprising a display area A and a non-display area A, wherein the non-display area B may surround the display area A or may be disposed only above and/or below the display area A.

[0033] A notch 11 on a top end of the display area A is arranged in the non-display area B, that is, there are no images displayed in the notch 11. In the present disclosure, since the notch 11 is arranged in the non-display area B and the other areas of the display unit 10 except the notch 11 are all display area A, the full display screen 1 is a display screen with no bezels.

[0034] The full display screen 1 also comprises a chip on film bonding welding pad 12 and a cell forming test welding pad 13. The chip on film bonding welding pad 12 and the cell forming test welding pad 13 are disposed in the non-display area B, and at least one of them is disposed in the notch 11. Specifically speaking, in the first exemplary embodiment, the chip on film bonding welding pad 12 and the cell forming test welding pad 13 are all disposed in the notch 11.

[0035] The full display screen 1 also comprises a chip on film 14. FIG. 2 is a structure diagram of the chip on film 14. Referring to FIGS. 1 and 2, the chip on film 14 comprises a flexible circuit board 141, a bonding component 142 and a driving chip 143, wherein the bonding component 142 and the driving chip 143 are disposed on a surface of the flexible circuit board 141. The flexible circuit board 141 is connected to the chip on film bonding welding pad 12 via the bonding component 142. The flexible circuit board 141 is bent to a back surface of the display unit 10 and connected to a driving circuit (which is not shown out in the attached drawings) on the back surface of the display unit 10.

[0036] Wherein the full display screen 1 also comprises a functional component 15 disposed in the notch 11. The functional component includes but is not limited to a camera, sensor and other structure. The full display screen 1 also comprises a glass cover plate 17 disposed on a top surface of the display unit 10. The glass cover plate 17 covering the whole surface of the display unit 10. The glass cover plate 17 comprises a light-shading layer 16, and the light-shading layer 16 is disposed in an area corresponding to the chip on film bonding welding pad 12 and the cell forming test welding pad 13, in order to avoid the chip on film bonding welding pad 12 and the cell forming test welding pad 13 being exposed in a display surface of the display unit 10 and affecting the beauty of the full display screen 1. Since the chip on film bonding welding pad 12 and the cell forming test welding pad 13 are shielded by the light-shading layer 16, dotted lines in the attached drawings are used to depict the chip on film bonding welding pad 12 and the cell forming test welding pad 13.

[0037] In the first exemplary embodiment, the full display screen disposes both of the chip on film bonding welding pad 12 and the cell forming test welding pad 13 in the notch 11, and has no bottom bezel and side bezel, and has the non-display area B only in the notch 11, greatly increasing the screen occupation ratio of the full display screen. Moreover, because the chip on film bonding welding pad 12 and the cell forming test welding pad 13 are disposed in the notch 11 instead of a narrow bottom bezel, so the cell lighting test and the qualification rate of bonding the chip onto the flexible circuit board of the full display screen will not be affected.

[0038] FIG. 3 is a planform of a full display screen according to a second exemplary embodiment of the present disclosure. Referring to FIGS. 2 and 3, in the second exemplary embodiment, the chip on film bonding welding pad 12 is disposed in the notch 11, and the cell forming test welding pad 13 is disposed in the non-display area B at a bottom end of the display unit 10, that is, the cell forming test welding pad 13 is disposed in the bottom bezel at the bottom end of the display unit 10. The flexible circuit board 141 of the chip on film is connected to the chip on film bonding welding pad 12 via the bonding component 142, and the flexible circuit board 141 of the chip on film 14 is bent to the back surface of the display unit 10 and connected to the driving circuit (which is not shown out in the attached drawings) on the back surface of the display unit 10.

[0039] Wherein the full display screen 1 also comprises the functional component 15 disposed in the notch 11. The functional component 15 includes but is not limited to a camera, sensor and other structure. The full display screen 1 also comprises the glass cover plate 17 disposed on the top surface of the display unit 10. The glass cover plate 17 covering the whole surface of the display unit 10. The glass cover plate 17 comprises the light-shading layer 16, and the light-shading layer 16 is disposed in the area corresponding to the chip on film bonding welding pad 12 and the cell forming test welding pad 13, in order to avoid the chip on film bonding welding pad 12 and the cell forming test welding pad 13 being exposed on the display surface of the display unit 10 and affecting the beauty of the full display screen 1.

[0040] In the second exemplary embodiment, the full display screen disposes the chip on film bonding welding pad 12 in the notch 11, and disposes the cell forming test welding pad 13 in the bottom bezel at the bottom end of the display unit 10, which can improve the problem that a narrow bottom bezel in the prior art affects the cell lighting test and the qualification rate of bonding the chip onto the flexible circuit board.

[0041] FIG. 4 is a planform of a full display screen according to a third exemplary embodiment of the present disclosure. Referring to FIG. 4, in a third exemplary embodiment, the cell forming test welding pad 13 is disposed in the notch 11, and the chip on film bonding welding pad 12 is disposed in the non-display area B at the bottom end of the display unit 10, that is, the chip on film bonding welding pad 12 is disposed in the bottom bezel at the bottom end of the display unit 10.

[0042] Wherein the flexible circuit board 141 of the chip on film 14 is connected to the chip on film bonding welding pad 12 via the bonding component 142. In FIG. 4, in order to show the relative relation between the chip on film 14 and the chip on film bonding welding pad 12, the chip on film 14 is schematically depicted, while in practice, the flexible circuit board 141 of the chip on film 14 is bent to the back surface of the display unit 10 and connected to the driving circuit (which is not shown out in the attached drawings) on the back surface of the display unit 10.

[0043] Wherein the full display screen 1 also comprises the functional component 15 disposed in the notch 11. The functional component 15 includes but is not limited to a camera, sensor and other structure. The full display screen 1 also comprises the glass cover plate 17 disposed on the top surface of the display unit 10. The glass cover plate 17 covering the whole surface of the display unit 10. The glass cover plate 17 comprises the light-shading layer 16, and the light-shading layer 16 is disposed in the area corresponding to the chip on film bonding welding pad 12 and the cell forming test welding pad 13, in order to avoid the chip on film bonding welding pad 12 and the cell forming test welding pad 13 being exposed on the display surface of the display unit 10 and affecting the beauty of the full display screen 1.

[0044] In the third exemplary embodiment, the full display screen disposes the cell forming test welding pad 13 in the notch 11, and disposes the chip on film bonding welding pad 12 in the bottom bezel at the bottom end of the display unit 10, which can improve the problem that the narrow bottom bezel in the prior art affects the cell lighting test and the qualification rate of bonding the chip onto the flexible circuit board.

[0045] FIG. 5 is a structure diagram of a display device of the present disclosure. Referring to FIG. 5, the display device comprises the above full display screen 1 and a backlight module 2 disposed below the full display screen 1. The full display screen 1 is characterized to display images, and the backlight module 2 is characterized to provide backlight. An area of the display device, corresponding to the chip on film bonding welding pad 12 and cell forming test welding pad 13, has no backlight emission. In the exemplary embodiment, a backlight area corresponding to the chip on film bonding welding pad 12 and cell forming test welding pad 13 is blocked by a light-shading layer 20, in order to make the area of the display device corresponding to the chip on film bonding welding pad 12 and cell forming test welding pad 13 has no backlight emission. Besides, in the other exemplary embodiments of the present disclosure, the backlight area corresponding to the chip on film bonding welding pad 12 and cell forming test welding pad 13 can has no backlight source when light sources are disposed in the backlight module 2, thus making the area of the display device corresponding to the chip on film bonding welding pad 12 and cell forming test welding pad 13 has no backlight emission.

[0046] As is understood by persons skilled in the art, the foregoing preferred embodiments of the present disclosure are illustrative rather than limiting of the present disclosure. It is intended that they cover various modifications and that similar arrangements be included in the spirit and scope of the present disclosure, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structures.

INDUSTRIAL PRACTICABILITY

[0047] The theme of this application can be made and used in industry and has industrial practicability.