Method for making cost-effective nickel-63 radiation source for true random number generators

Abstract

A method for electro-depositing a radioactive material onto a metal substrate is disclosed. This is particularly well-suited for true random number generators. The method includes (a) at least partially masking the metal substrate to expose a metallic surface on the metal substrate; (b) connecting the metal substrate to a cathode of a current source; (c) submersing the exposed metallic surface into a solution containing radioactive metal ions, wherein the solution is connected to an anode of the current source; (d) removing the exposed metallic surface from the solution; (e) removing the solution from the exposed metallic surface; (f) measuring the amount of radioactivity emitted from the exposed metallic surface; and (g) repeating steps (c) through (f) until the amount of radioactivity measured in step (f) stabilizes relative to a previous measurement.

Claims

1. A method for electro-depositing a radioactive material onto a metal substrate comprising: a. at least partially mask the metal substrate to define a deposition surface on the metal substrate; b. connect the metal substrate to a cathode of a current source; c. submerse the deposition surface into a solution containing radioactive metal ions, wherein the solution is connected to an anode of the current source; d. remove the deposition surface from the solution; e. remove the solution from the deposition surface; f. measure the amount of radioactivity emitted from the deposition surface; g. repeat steps (c) through (f) until the amount of radioactivity measured in step (f) stabilizes relative to a previous measurement.

2. The method of claim 1, wherein the metal substrate comprises an exposed current connection surface, wherein in step (b) comprises connecting the cathode to the exposed current connection surface, the method further comprising: after step (g) detach the exposed current connection surface from the metal substrate.

3. The method of claim 2, wherein the exposed current connection surface comprises a loop or a tab.

4. The method of claim 1, wherein the radioactive metal ions are nickel-63.

5. The method of claim 1, wherein the measurements in step (f) are taken from a same geometry of measurement.

6. The method of claim 1, further comprising: h. provide an un-enclosed micro-chip comprising a detector with a detection surface; i. after step (g), align the deposition surface of the metal substrate with the detection surface; j. bind the metallic substrate with the un-enclosed micro-chip to form an enclosed microchip, wherein the binding (1) maintains the alignment of step (i) and (2) prevents the emission of electrons from the deposition surface to the outside of the enclosed microchip.

7. A true random number generator (TRNG) comprising: an enclosure comprising a radioactive source constructed according to the method of claim 1; a cavity separating the radioactive source from a detector, wherein the detector is constructed to detect electrons within the cavity from the decay of the radioactive source and to produce a signal for the detected energy; and a processor connected to the detector and constructed to produce a true random number based on the signal for the detected energy.

Description

5.0 BRIEF DESCRIPTION OF DRAWINGS

[0016] The invention can be better understood with reference to the following figures. The components within the figures are not necessarily to scale, emphasis instead being placed on clearly illustrating example aspects of the invention. In the figures, like reference numerals designate corresponding parts throughout the different views and/or embodiments. Furthermore, various features of different disclosed embodiments can be combined to form additional embodiments, which are part of this disclosure. It will be understood that certain components and details may not appear in the figures to assist in more clearly describing the invention.

[0017] FIG. 1A illustrates a metallic substrate with a current connection surface.

[0018] FIG. 1B illustrates a mask with an exposure window.

[0019] FIG. 1C illustrates the metallic substrate masked to expose a metallic surface.

[0020] FIG. 2 illustrates a method for electro-depositing a radioactive material onto the metal substrate.

[0021] FIG. 3A illustrates the metallic substrate with radioactive material deposited on the exposed metallic surfaces, which will be used as the upper enclosed of the microchip.

[0022] FIG. 3B illustrates detaching the current connection surface.

[0023] FIGS. 4A-4D illustrate the construction of an enclosed microchip. Specifically, the upper enclosure of the microchip with radioactive material deposited on the inside surface (FIG. 4A, shown in cross-sectional side view) is combined with the un-enclosed microchip containing a detector (FIG. 4B, shown in cross-sectional side view). Prior to binding, the upper enclosure and the un-enclosed microchip are aligned (FIG. 4C, shown in cross-sectional side view), then both parts are bound to each other (FIG. 4D, shown in cross-sectional side view).

[0024] FIG. 5 is a flow diagram of the various components that may be place on the integrated circuit.

6.0 DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0025] Reference is made herein to some specific examples of the present invention, including any best modes contemplated by the inventor for carrying out the invention. Examples of these specific embodiments are illustrated in the accompanying figures. While the invention is described in conjunction with these specific embodiments, it will be understood that it is not intended to limit the invention to the described or illustrated embodiments. On the contrary, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims.

[0026] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. Particular example embodiments of the present invention may be implemented without some or all of these specific details. In other instances, process operations well known to persons of skill in the art have not been described in detail in order not to obscure unnecessarily the present invention. Various techniques and mechanisms of the present invention will sometimes be described in singular form for clarity. However, it should be noted that some embodiments include multiple iterations of a technique or multiple mechanisms unless noted otherwise. Similarly, various steps of the methods shown and described herein are not necessarily performed in the order indicated, or performed at all in certain embodiments. Accordingly, some implementations of the methods discussed herein may include more or fewer steps than those shown or described. Further, the techniques and mechanisms of the present invention will sometimes describe a connection, relationship, or communication between two or more entities. It should be noted that a connection or relationship between entities does not necessarily mean a direct, unimpeded connection, as a variety of other entities or processes may reside or occur between any two entities. Consequently, an indicated connection does not necessarily mean a direct, unimpeded connection unless otherwise noted.

[0027] The following list of example features corresponds to the attached figures and is provided for ease of reference, where like reference numerals designate corresponding features throughout the specification and figures:

TABLE-US-00001 Metallic Substrate 5 Current Connection Surface 10 Mask 15 Exposure Window 15 Masked Metallic Substrate 25 Current Source 26 Exposed Metallic Surface 30 Exposed Current Connection Surface 35 Upper Enclosure of the Microchip 40 Enclosure Inside Surface with Electro-deposited 45 Radioactive Material Exposed Current Connection Surface with 50 Electro-deposited Radioactive Material Un-enclosed Microchip 55 Detectors 60 Detection Surface 62 Integrated Circuit 63 Enclosed Microchip 65 Cavity 70 Enclosure 75 Amplifier 80 Filter 82 Processor 85 Signal Processor 87 Memory 89 Cryptographical Client 90 Method for Electro-Depositing a Radioactive 110-165. Material Onto the Metal Substrate

[0028] This is related to our previous published US patents and applications listed above, in which we described the general idea of using pure beta minus (electron emission) nuclear decay as a medium or source of entropy for generating true random numbers by detecting emitted electrons on-chip through an electronic sensor or array of sensors. In this application, we present an approach to manufacture the radiation source to be used in the previously disclosed TRNGs, as a thin layer without the handling concerns. The radioactive source may be electrodeposited. 63Ni is available in a solution as nickel chloride.

[0029] FIG. 1 illustrates a metallic substrate 5 with a current connection surface 10. a mask 15 with an exposure window 15 is shown in FIG. 1B. Masking may be done with laser-cut self-adhesive foils that are resistant to water. It is advantageous to cover both sides of the metallic substrate 5 with the mask 15, because electrodeposition of the radioactive material in any area but the area exposed by the exposure window 15 would be detrimental and would affect the operations of the TRNG and well-being of the whole IC (radiation damages). However, the metallic substrate 5 being electroplated needs to be connected to a source of electric current (26, shown in FIG. 2). Thus, a portion of the metallic substrate 26 should also be exposed to allow connection to the current source. This is shown as a small loop, tab or other current connection surface 10 that can be used to hang the metallic substrate 5 on the production rack before submerging it into the electroplating tank. Since the current connection surface will be loaded with radioactive material during electroplating, it is preferred to remove the current connection surface 10 after electroplating. This is discussed below with reference to FIGS. 3A and 3B.

[0030] Before detailing this construction, the method for electrodepositing the correct amount of radioactive material will first be disclosed. Adding more radioactive material than needed can be costly when manufacturing thousands of IC devices. To prevent too thick deposition, one should consider how the thickness of the deposited material will be estimated during the deposition of the radioactive source. Typically for electroplating, this is done by measuring the current and time of electroplating. Since electroplating in the case of an expensive solution will be done in a small volume tank, one needs to account for the changes in time of the current flowing through the whole system. This is usually done by integrating the total charge using the third electrode. To estimate if enough of the material was already deposited, one needs to check from time to time the thickness of the deposited layer. This can be done by removing the substrate being covered from the bath, cleaning and drying them (electrons are absorbed even in a thin layer of water—the range of 70 keV electrons in water is about 78 microns only), and measuring the radioactivity of the radioactive surfaces. If the readings of counts per second on the radioactivity counter are stable from previous readings, and they are no longer increasing when the same geometry of measurement is maintained, then enough radioactive material has been deposited. Otherwise, if the counts are still increasing one needs to place the substrate into the bath for more electroplating.

[0031] FIG. 2 presents a flowchart for the just-described method. The masked metallic substrate 25 is connected to the current source 26 in step 110, usually the cathode or negative electrode of the current source 26. A bath is prepared containing the radioactive metal ions 115 and the bath is also connected to the current source in step 120, usually the anode or positive electrode of the current source 26. The masked metallic substrate 25 is submersed in the electroplating bath (step 125). To begin checking whether sufficient radioactive material has electrodeposited, the masked metallic substrate 25 is removed from the electroplating bath (step 130) and the solution is cleaned and dry from the masked metallic substrate 25 (step 135). The radioactivity is measured at step 140 and the masked metallic substrate 25 is returned to the electroplating bath in step 145. Again, the masked metallic substrate 25 is removed from the bath, cleaned and dried (steps 150, 155) and the radioactivity is measured at step 160 to determine if the measurement has stabilized from previous measurements. If it has not, the masked metallic substrate 25 is returned to the bath in step 145 and the process is repeated. However, if at step 160 the radioactivity measurements have stabilized, the masked metallic substrate 25 can then be packaged in a microchip (step 165).

[0032] In FIG. 3A, the post electroplated masked metallic substrate, which will now be used as the upper enclosure of the microchip 40 (and referred to herein as such) contains an inside surface with electrodeposited radioactive material 45 and an exposed current connection surface with electrodeposited radioactive material 50. In FIG. 3B the exposed current connection surface with electrodeposited radioactive material 50 is removed so that upper enclosure of the microchip 40 may be used as the radiation source for a TRNG microchip, the construction of which is shown in FIGS. 4A-5D.

[0033] FIG. 4A illustrates the upper enclosure of the microchip 40, while FIG. 4B shows the un-enclosed microchip 55. The un-enclosed microchip 55 may include an integrated circuit 63 with detectors 60 that form a detection surface 62 to detect electrons from the decay of the radioactive source and to produce a signal for the detected energy. The upper enclosure of the microchip 40 is first aligned with the un-enclosed microchip 55 in FIG. 4C. Alignment means that the enclosure inside surface with electro-deposited radioactive material 45 aligns with the detection surface 62. The two parts are then bound together to form enclosed microchip 65 with an enclosure 75 (shown in cross-hatch). Binding (1) maintains the alignment and (2) prevents the emission of electrons from the exposed metallic surface 45 to the outside of the enclosed microchip 65. Within the enclosed microchip 65 may be a cavity 70 separating the enclosure inside surface with electro-deposited radioactive material 45 from the detection surface 62. Binding also maintains the distance across the cavity 70 so that the TRNG microchip will operate in a consistent and reliable manner.

[0034] As shown in FIG. 5, the integrated circuit 63 that may further include an amplifier 80 (such as a low noise charge-sensitive preamplifier and pulse shaping amplifier), a filter 82, and processor 85, as shown in FIG. 2. The filtered signal is processed by processor 85 to determine if the signal corresponds to the electron emitted in a decay of radioactive material and not by other energetic ionizing particle(s). The processor 85 may include a signal processor 87 that performs this function, and may dump its results to a memory 89. The processor 85 may produce a true random number based on the signal from the detectors 60. The operation of these electrical subcomponents is discussed in the above-referenced patent applications, and is incorporated herein.

[0035] Any of the suitable technologies, materials, and designs set forth and incorporated herein may be used to implement various example aspects of the invention as would be apparent to one of skill in the art.

[0036] Although exemplary embodiments and applications of the invention have been described herein including as described above and shown in the included example Figures, there is no intention that the invention be limited to these exemplary embodiments and applications or to the manner in which the exemplary embodiments and applications operate or are described herein. Indeed, many variations and modifications to the exemplary embodiments are possible as would be apparent to a person of ordinary skill in the art. The invention may include any device, structure, method, or functionality, as long as the resulting device, system, or method falls within the scope of one of the claims that are allowed by the patent office based on this or any related patent application.