SENSOR ARRANGEMENT FOR MEASUREMENT OF THE TEMPERATURE OF A PANE, IN PARTICULAR A WINDSCREEN

Abstract

In a sensor arrangement for measurement of the temperature of a disk, it is provided that the sensor arrangement comprises a circuit carrier with a temperature sensor arranged thereon, wherein the circuit carrier and the temperature sensor are arranged in a housing and an electrical connection and a heat-conducting element are guided out from the housing, the heat-conducting element is configured as a rigid pin, the rigid pin has a thermal connection and a mechanical connection to the circuit carrier, the rigid pin is provided and configured to make a thermal contact with the disk.

Claims

1. A sensor arrangement for measurement of the temperature of a pane, wherein the sensor arrangement comprises a circuit carrier with a temperature sensor arranged thereon, wherein the circuit carrier and the temperature sensor are arranged in a housing and an electrical connection and a heat-conducting element are guided out of the housing, characterized in that the heat-conducting element is configured as a rigid pin, that the rigid pin has a thermal connection and a mechanical connection to the circuit carrier, that the rigid pin is provided and configured to make a thermal contact with the pane.

2. The sensor arrangement according to claim 1, wherein the rigid pin is part of the electrical connection of the sensor arrangement.

3. The sensor arrangement according to claim 1, wherein the printed circuit board has at least two layers and one layer is configured as a thermal guide plate.

4. The sensor arrangement according to claim 3, wherein the thermal guide plate when viewed from the sensor is the second layer.

5. The sensor arrangement according to claim 1, wherein the sensor arrangement has a sensor for measurement of the internal moisture and a sensor for measurement of the internal temperature.

6. The sensor arrangement according to claim 1, wherein the sensor arrangement is integrated in an optoelectronic rain sensor unit for motor vehicles.

7. The sensor arrangement according to claim 1, wherein the rigid pin is connected thermally to a surface element which makes a larger thermal contact with the pane than the rigid pin itself.

8. The sensor arrangement according to claim 7, wherein the surface element is part of the electrical connection.

9. The sensor arrangement according to claim 3, wherein the temperature sensor is connected to the thermal guide plate by a thermally conductive but electrically insulating material.

10. The sensor arrangement according to claim 1, wherein the thermal contact between the pin and the printed circuit board is made from the metallization of the drill hole.

11. The sensor arrangement according to claim 1, wherein the thermal contact with the pane is made in the region of a black film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The invention is explained in further detail hereinafter with reference to an exemplary embodiment shown in the drawings. In detail in the schematic diagrams:

[0016] FIG. 1: shows a schematic view of a sensor arrangement according to the invention;

[0017] FIG. 2: shows a perspective view of a sensor arrangement according to the invention with a view of the connection of the electrical contact to a plug housing.

DETAILED DESCRIPTION OF THE INVENTION

[0018] FIG. 1 shows a schematic view of a sensor arrangement 1 according to the invention. A circuit carrier 2, which is typically a printed circuit board, is accommodated in a housing 4. The circuit carrier 2 has a plurality of metal layers 7, 8 and insulation layers located in between. The housing 4 is adjacent to a pane 10, in particular a windscreen. An electrical connection 5 and a heat-conducting element, which is here configured as a rigid pin 6, are guided out from the housing 4. The rigid pin 6 forms a thermal contact 11 with the pane 10. The rigid pin 6 is pressed into the housing 4, which in particular is a plastic housing, and in the printed circuit board 2 preferably a suitably prepared metallized bore 15 is provided into which the rigid pin 6 is pressed so that an electrical and thermal contacting of the rigid pin 6 to the various layers 7, 8 of the circuit carrier 2 is made. The layer 8, which faces away from the pane 10 and which also faces away from a temperature sensor 3 arranged on the circuit carrier 2 or is further removed from this is configured as a thermal guide plate 9. The thermal guide plate 9 is a layer of the circuit carrier 2 which is configured to be thickened and/or has few interruptions, so that a particularly good thermal conductivity is achieved. As a result, the temperature recorded via the pin 6 is transported into the region of the temperature sensor 3 and the temperature sensor 3 can particularly rapidly and precisely detect the temperature of the pane 10. In addition, an electrically insulating but thermally conductive mass can also be introduced here by means of which the temperature sensor 3 is connected to the thermal guide plate 9. Furthermore a sensor for measuring the internal moisture 12 is provided on the housing 4 which is also electrically contacted via the first layer 7 of the circuit carrier 2. The sensor element 3 is also electrically connected to the first layer 7 of the circuit carrier and is controlled via this. This can comprise a two-pole temperature measuring element or a three-pole temperature measuring element wherein a connection is then a separate thermal connection.

[0019] FIG. 2 shows a complete arrangement with an outer housing 17 which accommodates the sensor arrangement 1 with the circuit carrier 2. The rigid pin 6 is here connected to a surface element 13 which is in contact with the pane 10 on the outer side of the outer housing 17. As a result a particular good thermal contact is possible. The surface element 13 is part of the electrical connection 5 which extends into a plug housing 18 of the outer housing 17. The electrical connection via the rigid pin 6 to the circuit carrier 2 is made there at the same time via this electrical connection 5.

[0020] All the features mentioned in the preceding description and in the claims can be combined in any selection with the features of the independent claim. The disclosure of the invention is thus not restricted to the described or claimed feature combinations, on the contrary all the logical feature combinations within the framework of the invention should be considered to be disclosed.