ELECTRONICS CONNECTOR FOR FACILITATING TREATMENT
20200091640 ยท 2020-03-19
Inventors
Cpc classification
H01R12/737
ELECTRICITY
Y02P70/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01R13/62994
ELECTRICITY
H05K3/3436
ELECTRICITY
H01R12/721
ELECTRICITY
H01R13/514
ELECTRICITY
H01R43/0256
ELECTRICITY
International classification
H01R12/73
ELECTRICITY
H01R43/20
ELECTRICITY
Abstract
In the production of certain components, the components must pass through an existing treating device with limited clearance. This limited clearance will cause unwanted physical contact between the component and the existing treatment apparatus, such as a reflow oven for treating electronic components, such as an M.2 connector. In such a situation, it will be necessary to practice a method of separating the component into subassemblies or modules; separately treating the subassemblies or modules in the reflow oven; and then reassembling the subassemblies and modules after the reflow treatment.
Claims
1.-9. (canceled)
10. An M.2 connector comprising: an M.2 connector base, the M.2 connector base further comprising a pair of apertures, into which apertures can be fitted a pair of pivots; a pair of pivots; and a pair of latches, each of said pair of latches structured so as to be received on opposite ends of the M.2 base, each of the pair of latches defining an aperture therein, each of the apertures being positioned on the latch so as to receive one of the pair of pivots to removably couple the latch to the M.2 connector base; whereby the pair of latches being pivotably mounted on the M.2 connector base.
11. The M.2 connector of claim 10, further comprising a printed circuit board upon which the M.2 connector base is mounted.
12. The M.2 connector of claim 11, wherein the pair of latches, when pivoted toward the printed circuit board, provides a total height to the M.2 connector which is less than the height of the M.2 connector when the latches are pivoted to a vertical position.
13. The M.2 connector of claim 10, further comprising an electronic module mounted to said M.2 connector base and held by said pair of latches.
14. The M.2 connector of claim 13, wherein the electronic module is 110 mm in length.
15. An M.2 connector comprising: a first subassembly, the first subassembly comprising an M.2 connector base and a printed circuit board upon which the M.2 connector base is mounted; a second subassembly, the second subassembly comprising a one-part latch; the one-part latch comprising a longitudinal portion and two depending legs unitary with and extending from the longitudinal portion, whereby the longitudinal portion and the two depending legs are configured to all rotate in an identical direction relative to the M.2 connector base and the printed circuit board; each of the first and the second subassemblies being heat treated before the first and second subassemblies are connected to each other.
16. (canceled)
17. The M.2 connector of claim 15, wherein the first and second subassemblies can be assembled together by relative rotational motion.
18. The M.2 connector of claim 15, further comprising an electronic module inserted into the second subassembly comprising the one-part latch, wherein the one-part latch is connectable to the M.2 connector base by relative vertical motion.
19. The M.2 connector of claim 15, further comprising an electronic module inserted into the M.2 connector base of the first subassembly.
20. The M.2 connector of claim 10, further comprising a replacement pair of latches having a length different than the length of the pair of latches, wherein the pair of latches is removable from the M.2 connector base for replacement with the replacement pair of latches.
21. The M.2 connector of claim 15, further comprising a replacement second subassembly having a length different than the length of the second subassembly, wherein the second subassembly is removable from the first subassembly for replacement with the replacement second subassembly.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] The present invention is described with reference to the attached figures, where like reference numerals are used throughout the figures to designate similar or equivalent elements. The figures are not drawn to scale and are provided merely to illustrate the instant invention. Several aspects of the invention are described below with reference to example applications for illustration. It should be understood that numerous specific details, relationships, and methods are set forth to provide a full understanding of the invention. Those skilled in the art will appreciate that not every element is visible in each figure of the drawings. One having ordinary skill in the relevant art, however, will readily recognize that the invention can be practiced without one or more of the specific details, or with other methods. In other instances, well-known structures or operations are not shown in detail to avoid obscuring the invention. The present invention is not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. Furthermore, not all illustrated acts or events are required to implement a methodology in accordance with the present invention.
[0024] M.2 (formerly known as the Next Generation Form Factor (NGFF)) is a specification for internally mounted computer expansion cards and associated connectors. It replaces the mSATA standard, which uses the PCI Express mini Card physical card layout and connectors. M.2's more flexible physical specification allows for different module widths and lengths; and makes the M.2 more suitable than mSATA for solid-state storage application in general and particularly for the use in small devices, such as ultrabooks or tablets. Such flexibility in dimensions have not only made the M.2 connector more popular, but has also produced demands by the industry to increase its size. However, existing reflow ovens and other treatment apparatus were sized without taking into account the possible larger dimensions to which the M.2 connectors are currently being manufactured. Thus, it is difficult, or impossible, to feed oversize M.2 connectors through existing reflow ovens or other treatment apparatus without encountering contact interference of the connector and oven clearances. Thus, this disclosure provides several alternatives to treat the oversized M.2 connector and other oversized connectors in existing reflow ovens or other existing treatment apparatus of limited dimensional clearance.
[0025] Although the various embodiments will be described primarily with reference to reflow ovens for M.2 connectors, the present disclosure is not limited in this regard. Rather the present disclosure contemplates that the teachings herein are applicable to configuring any type of electronic components for use with any type of treatment apparatus with a limited size opening or aperture.
[0026] In a reflow oven, a previously applied solder paste liquefies under the heat of the oven and bonds the parts of an M.2 connector. Thus, it is essential that the arrangement of the parts being treated is not disturbed via unwanted physical contact with the oven before the final bond is formed. This challenge is described below with respect to
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[0029] Turning now to
[0030] Turning first to
[0031] Alternatively, the latches can be repositioned via rotation. The provision of rotation is permitted due to the presence of pivots 82, 83 in base 30 as shown in
[0032] As shown in
[0033] In other embodiments, securing of a module is not limited to the configuration illustrated in
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[0035] In other embodiments, securing of a module is not limited to the dual latch configuration described above. Rather, the present disclosure also contemplates that an M.2. connector can be configured to use a one-part latch. This is illustrated in
[0036] Although the embodiments in
[0037] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms a, an, and the are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, to the extent that the terms including, includes, having, has, with, or variants thereof are used in either the detailed description and/or the claims, such terms are intended to be inclusive in a manner similar to the term comprising.
[0038] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Furthermore, terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.