Mixed oxides and sulphides of bismuth and silver for photovoltaic use
10593817 ยท 2020-03-17
Assignee
Inventors
- Thierry Le Mercier (Rosny Sous Bois, FR)
- Philippe BARBOUX (L'Hay Les Roses, FR)
- Tangui Le Bahers (Lyons, FR)
Cpc classification
C01G29/006
CHEMISTRY; METALLURGY
H01L31/032
ELECTRICITY
C01P2004/61
CHEMISTRY; METALLURGY
H01L31/072
ELECTRICITY
Y02E10/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H10K30/152
ELECTRICITY
H10K85/1135
ELECTRICITY
H10K85/111
ELECTRICITY
C01P2004/62
CHEMISTRY; METALLURGY
H10K30/151
ELECTRICITY
Y02E10/549
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
H01L31/032
ELECTRICITY
Abstract
The invention relates to a material comprising at least one compound having formula Bi.sub.1-xM.sub.xAg.sub.1-y-M.sub.yOS.sub.1-zM.sub.z, the methods for producing said material and the use thereof as a semiconductor, such as for photovoltaic or photochemical use and, in particular, for supplying a photocurrent. The invention further relates to photovoltaic devices using said compounds.
Claims
1. A material comprising at least one compound of formula (I): BiAg.sub.1-OS, wherein 00.2.
2. A process for preparing the material according to claim 1, the process comprising solid milling a mixture comprising at least one of the inorganic compounds of bismuth and silver, and optionally at least one oxide, sulfide, oxysulfide, halide or oxyhalide of at least one element chosen from Bi and elements from group (A), and optionally at least one oxide, sulfide, oxysulfide, halide or oxyhalide of at least one element chosen from Ag and elements from group (B).
3. A semiconductor comprising the material according to claim 1.
4. The semiconductor according to claim 3, wherein the compound of formula (I) is in the form of isotropic or anisotropic objects having at least one dimension of less than 50 m.
5. The semiconductor according to claim 4, wherein the compound of formula (I) is in the form of particles with dimensions of less than 10 m.
6. The semiconductor according to claim 5, wherein the compound of formula (I) is in the form of anisotropic particles of platelet type, or of agglomerates of a few dozen to a few hundred particles of this type.
7. The semiconductor according to claim 4, wherein the compound of formula (I) is in a continuous layer based on the compound of formula (I) whose thickness is less than 50 m, said layer comprising the compound of formula (I) in a proportion of at least 95% by mass.
8. The semiconductor according to claim 4, wherein the compound of formula (I) is in a continuous layer based on the compound of formula (I) whose thickness is less than 50 m, said layer comprising a polymer matrix and, dispersed in this matrix, particles based on the compound of formula (I) with dimensions of less than 5 m.
9. A photovoltaic device comprising, between a hole-conducting material and an electron-conducting material, a layer based on a p-type compound of formula (I) according to claim 1, and a layer based on an n-type semiconductor, in which: the layer based on the p-type compound of formula (I) is in contact with the layer based on the n-type semiconductor; the layer based on the p-type compound of formula (I) is close to the hole-conducting material; and the layer based on the n-type semiconductor is close to the electron-conducting material.
10. The semiconductor according to claim 3, wherein the semiconductor is utilized for photoelectrochemical or photochemical application.
11. The semiconductor according to claim 10, wherein the semiconductor is utilized for providing a photocurrent.
12. The semiconductor according to claim 4, wherein the isotropic or anisotropic objects have at least one dimension of less than 20 m.
13. The semiconductor according to claim 7, wherein thickness is less than 20 m.
14. The semiconductor according to claim 8, wherein thickness is less than 20 m.
15. The process of claim 2, wherein milling time is between 20 minutes and 96 hours.
Description
(1) The invention will now be illustrated in greater detail with reference to the illustrative examples given below and to the attached figures, in which:
(2)
(3)
(4)
(5)
(6)
The three electrodes 11, 15 and 16 are immersed in an electrolyte 17 of 1M KCl. The three electrodes are linked via a potentiostat 18.
(7)
(8)
(9)
(10) The placing in contact of a compound of formula (I) according to the invention with an n-type semiconductor ZnO forms a p-n junction. When the device is placed under a light source, the electrons generated move into the ZnO and the holes generated remain in the compound of formula (I) according to the invention. The ZnO is in contact with FTO (electron conductor) to extract the electrons therefrom and the compound of formula (I) according to the invention is in contact with gold (hole conductor) to extract the holes therefrom.
(11) The examples that follow illustrate the invention without, however, limiting the scope.
EXAMPLES
Example 1
(12) Process for Preparing BiAgOS Particles
(13) A BiAgOS powder was prepared by reactive milling at room temperature, according to the following protocol:
(14) 0.685 g of Bi.sub.2S.sub.3, 1.243 g of Bi.sub.2O.sub.3 and 0.991 g of Ag.sub.2S are placed in an agate mortar in the presence of agate milling beads.
(15) The mortar is then covered and placed in a Fritsch No. 6 planetary mill with a spin speed of about 500 rpm. Milling is continued for 120 minutes until a pure phase is obtained.
(16) The compound C.sub.1 obtained characterized by x-ray diffraction has the following tetragonal lattice parameters: a=3.92 , c=9.23 , V=141.7 .sup.3.
Example 2
(17) Use of Compound C.sub.1 in a Photoelectrochemical Device
(18) The device described in