Light emitting diode illumination device
10591116 ยท 2020-03-17
Assignee
Inventors
Cpc classification
F21V23/009
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/90
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/238
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/232
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2107/30
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2115/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2107/70
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2107/40
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2101/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V23/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V23/005
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/237
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/70
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2107/50
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F21K9/237
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/90
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V23/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V23/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V3/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/232
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/238
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A light emitting diode illumination device comprises a light-transmitting encapsulant, a transparent core, a light source plate stereoscopic structure and a power supply device. The light-transmitting encapsulant and the transparent core can be made of glass material. The light source plate stereoscopic structure is constituted by a plurality of connecting sub-light source plates. The light source plate stereoscopic structure installed in the light-transmitting encapsulant is connected to the transparent core, and is supported by the transparent core. The sub-light source plate comprises a circuit board body and light-emitting diode dies. The light-emitting diode dies can be installed on one surface of the circuit board body by surface-mount technology. The power supply device is used for supplying power to the sub-light source plates, so that a plurality of sub-light source plates may provide illumination through the light-transmitting encapsulant.
Claims
1. A light emitting diode illumination device, comprising: a light-transmitting encapsulant; a transparent core made by a transparent material; a light source plate stereoscopic structure comprising a plurality of sub-light source plates, the light source plate stereoscopic structure being installed in the light-transmitting encapsulant, wherein the light source plate stereoscopic structure is connected to the transparent core and is supported thereby, the sub-light source plates comprising a circuit board body and light emitting diode dies, wherein the light emitting diode dies are disposed on one side of the circuit board body; and a power supply device used for providing electrical power to the sub-light source plates, so as to allow the plurality of sub-light source plates to provide illumination though the light-transmitting encapsulant, wherein the sub-light source plates are different portions of the light source circuit board, and by folding the light source circuit board, a folding angle between the sub-light source plates are generated, so as to constitute the light source plate stereoscopic structure with a tube having a top end and a bottom end, a portion of the light source circuit board is folded to constitute a top portion of the light source circuit board, the top portion concealing the top end of the tube, and the top portion of the light source circuit board is connected to a top portion of the transparent core and the light source plate stereoscopic structure is supported by the connection of the top portion of the light source circuit board and the top portion of the transparent core, a main portion of the transparent core is extended from a bottom portion to the top portion and the main portion of the transparent core is enclosed by the light source plate stereoscopic structure, the top portion of the light source board is above other portions of the light board; and wherein a portion of the light source circuit board is folded to constitute a bottom portion of the light source circuit board, while the bottom portion of the light source circuit board is connected to a bottom portion of the transparent core and is supported thereby.
2. The light emitting diode illumination device of claim 1, wherein the transparent material is glass.
3. The light emitting diode illumination device of claim 1, wherein the power supply device comprises a driving circuit used for converting the voltage of the indoor power source into a voltage suitable for driving the light emitting diode dies of the sub-light source plate to emit light.
4. The light emitting diode illumination device of claim 3, further comprising a light bulb cap, wherein the driving circuit is housed in an accommodating space of the light bulb cap, and the light source plate stereoscopic structure and the transparent core are visible through the light-transmitting encapsulant while the circuit elements of the driving circuit are not visible.
5. The light emitting diode illumination device of claim 4, further comprising a heat sink disposed in the light bulb cap, wherein the heat sink is used for dissipate heat of the driving circuit and the sub-light source plates.
6. The light emitting diode illumination device of claim 1, wherein a wire is further embedded in the transparent core, and a first group of terminals and a second group of terminals are further provided on both sides of the wire, and the first group of terminals are electrically connected to the sub-light source plates while the second group of terminals are electrically connected to the power supply device.
7. The light emitting diode illumination device of claim 1, wherein the light emitting diode illumination device is a light emitting diode light bulb.
8. The light emitting diode illumination device of claim 1, wherein the top portion of the light source circuit board further comprises light emitting diode dies.
9. The light emitting diode illumination device of claim 1, wherein the top portion of the light source circuit board further comprises buckle structures, so as to be fastened to the top portion of the transparent core.
10. The light emitting diode illumination device of claim 1, wherein the plurality of sub-light source plates are folded to constitute a polygonal column structure.
11. The light emitting diode illumination device of claim 10, wherein two of the sub-light source plates are connected with each other through corresponding buckles, when the light source circuit board is folded to constitute the polygonal column structure.
12. The light emitting diode illumination device of claim 1, wherein the plurality of sub-light source plates have a corresponding surface curvature at the portion facing the light-transmitting encapsulant.
13. The light emitting diode illumination device of claim 1, wherein the sub-light source plate is connected to a heat dissipating material on the back surface facing the light-transmitting encapsulant.
14. The light emitting diode illumination device of claim 13, wherein the heat dissipating material is connected to the transparent core and the sub-light source plates.
15. The light emitting diode illumination device of claim 1, wherein a driving circuit of the power supply device is housed in the inner space surrounded by the plurality of sub-light source plates.
16. The light emitting diode illumination device of claim 1, wherein the plurality of sub-light source plates are individually hung on the transparent core.
17. The light emitting diode illumination device of claim 1, wherein the light emitting diode dies of the sub-light source plates are mounted to the circuit board body in a surface mount device packaging manner.
18. The light emitting diode illumination device of claim 1, further comprising a noble gas filled inside the light-transmitting encapsulant, so as to assist the plurality of sub-light source plates to dissipate heat.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
(11) First, please refer to
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(13) The light source plate stereoscopic structure 102 may be comprised by a plurality of sub-light source plates. The light source plate stereoscopic structure disposed in the light-transmitting encapsulant 101 is connected to and supported by the transparent core 104. The sub-light source plates comprise a circuit board body and one or more light-emitting diode dies 103. The light-emitting diode dies 103 may be arranged in an equal distance, or may be disposed unequally from each other in a predetermined manner, depending on the shape and the design of the illumination device. For example, in order to have more illumination on the side surface and the bottom surface, light emitting diode dies can be disposed more intensively in particular areas of the sub-light source plates. In addition, the surface of the light-emitting diode dies 103 can be coated with phosphors, in order to produce different color temperatures. A plurality of light emitting diode dies having different color temperatures may be provided on the same circuit board body. The light emitting diode dies 103 are disposed on one side of the circuit board body, and are connected with each other in series via various packaging and wiring manners. For example, the light emitting diode dies 103 can be mounted to the circuit board body by a surface mount device (SMD) packaging manner. Also, the present invention can be used in a light source plate comprising the light emitting diodes packaged by the Chip on Board (COB) technology. However, for factories that are already familiar with the surface mount devices, COB technology is not necessarily employed. Therefore, manufacturing flexibility can be greatly enhanced while costs are reduced.
(14) A power supply device supplies power to the sub-light source plates, in order to allow the sub-light source plates to provide illumination through the light-transmitting encapsulant. In the embodiment of the light bulb, the power supply device can be a corresponding driving circuit 1061 and a wire. The driving circuit 1061 may be mounted on the driving circuit board 106. The driving circuit 1061 is adapted to convert the voltage of the indoor power source into a voltage suitable for driving the light emitting diode dies 103 of the sub-light source plate, so as to emit light.
(15) In other embodiments, the power supply device may further comprise a battery or simply a wire, so as to connect with an electrical power source.
(16) When the embodiment of this illumination device is a light bulb, the illumination device may include a light bulb cap 105. The light-transmitting encapsulant 101 may be a light-transmitting encapsulant part corresponding to a variety of different types of light bulbs. For example, for T-type bulb shells, A-type bulb shells, G-type bulb shells, R-type bulb shells, BR-type bulb shells, PAR-type bulb shells, candle-type bulb shells or any other existing bulb shapes.
(17) In the embodiment of the light bulb, the driving circuit 1061 may be housed in an accommodating space of the light bulb cap 105. In other words, only the light source plate stereoscopic structure 102 and the transparent core 104 are visible through the light-transmitting encapsulant 101. The circuit elements of the driving circuit 1061 are not visible. The driving circuit 1061 may be partially shaded, so that the components of the driving circuit 1061 are not exposed directly, affecting the overall appearance of the light bulb product.
(18) A heat sink can be further provided in order to better dissipate heat, so as to increase the life of the light bulb or other illumination device. For example, a cooling cups 108, cooling materials, or various of linings may be placed inside the light bulb cap, so as to dissipate heat of the driving circuit and the sub-light source plates.
(19) In addition, a wire can be embedded in the transparent core 104. A first group of terminals 1081 and a second group of terminals 1082 are provided on both sides of the wire, respectively. The first group of terminals 1081 are electrically connected to the sub-light source plates, while the second group of terminals 1082 are electrically connected to the power supply device, such as a driving circuit 1061. The driving circuit 1061 may further comprises extending external terminals 1071 and 1072, so as electrically connect to the external electrical connection terminals of the light bulb cap 105, such as the sidewall and the bottom terminals 109 of the light bulb cap 105, in order to connect to an external power source of the lamp. Alternatively, the wires may be connected to the sub-light source plates and the power source device along the surface or exterior of the core. In the embodiment, the light source plate stereoscopic structure 102 is a hollow structure. The transparent core 104 penetrates the light source plate stereoscopic structure 102, and the top portion 1042 of transparent core 104 supports the top portion of the light source plate stereoscopic structure 102. The bottom portion 1044 of the transparent core 104 connects to and supports the bottom portion of the light source plate stereoscopic structure 102. The middle portion 1043 of the transparent core 104 is surrounded by the light source plate stereoscopic structure 102.
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(27) In other words, the LED die can be mounted on a large circuit board, then the wires are installed. The circuit board is then cut into a predestinated shape, leaving grooves suitable for folding. Next, each light source circuit board is folded to form a light source plate stereoscopic structure, so as to connect with the transparent core. This approach can significantly reduce costs and reduce the difficulty of installation.
(28) In addition, a portion of the light source circuit board can be folded to constitute a top portion of the light source circuit board. The top portion of the light source circuit board is connected to a top portion of the transparent core, and is supported thereby.
(29) The top of the light source circuit board can further comprises light emitting diode dies. In addition, the top portion of the light source circuit board may further comprise a buckle structure, so as to be fastened to the top of the transparent core. In addition, the top portion of the light source circuit board can also be connected with the transparent core via adhesive or welding. Furthermore, another portion of the light source circuit board may be folded to constitute a bottom portion of the light source circuit board. The bottom portion of the light source circuit board is connected to a bottom portion of the transparent core, and is supported thereby.
(30) The light source circuit board can be folded into a variety of stereoscopic structures. For example, the plurality of sub-light source plates may be folded into a polygonal column structure. In order to ensure the modularity and stability of the light source plate stereoscopic structure, when the light source circuit board is folded into the polygonal column structure, two of the sub-light source plates are connected with each other through corresponding buckles. In other words, when the light source circuit board is folded into a polygonal shape, the last two side ends can be fastened by buckle structures, so as to form a hollow cylinder structure. In addition, the shape of the light source plate stereoscopic structure can also be ensured by adhesive or welding. Furthermore, these sub-light source plates can also be connected with the connecting structure between the transparent core, so as to provide more support and stability.
(31) The surface of the sub-light source plates may be planar, or may have a certain degree of curvature. For example, the plurality of sub-light source plates may have a corresponding surface curvature at the portion facing the light-transmitting encapsulant.
(32) In addition, the sub-light source plate may be connected to the heat dissipating material on the back surface facing the light-transmitting encapsulant.
(33) In other words, an aluminum sheet, a thermal adhesive or other heat dissipating materials may be applied to the back of the circuit board body in respect to the light emitting diode die, so as to facilitate heat dissipation. The heat dissipation material may be further connected to the transparent core. In other words, the heat of the sub-light source plates can be dissipated by transmitting through the transparent core.
(34) In addition to be placed at the light bulb cap portion, the driving circuit of the power supply device may be housed in the inner space surrounded by the plurality of sub-light source plates. Moreover, the circuit board of the driving circuit may be a supporting structure of the sub-light source boards. Furthermore, the plurality of sub-light source plates may be individually hung on the transparent core, so as to form a stereoscopic structure. The sub-light source plates may be individually connected to the power supply device, so as to obtain power. The light source plate stereoscopic structure is not necessarily formed by the manner of folding the light source plate.
(35) In addition, a radiating noble gas, such as helium, may be filled inside the light-transmitting encapsulant to assist the plurality of sub-light source plates to dissipate heat.
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(37) In addition to the above-described examples, other modifications and variations are intended to be included within the scope of the present invention as long as they are within the scope of the present invention.