Microfabricated fractionator for particulate matter monitor
11879819 ยท 2024-01-23
Assignee
Inventors
Cpc classification
B01L2200/0652
PERFORMING OPERATIONS; TRANSPORTING
G01N15/0255
PHYSICS
F04B39/0027
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01L2300/0864
PERFORMING OPERATIONS; TRANSPORTING
F04B43/043
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F04B45/043
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01L3/502761
PERFORMING OPERATIONS; TRANSPORTING
International classification
F04B43/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01L3/00
PERFORMING OPERATIONS; TRANSPORTING
F04B39/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F04B45/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F04B45/047
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G01N15/00
PHYSICS
Abstract
Microfabricated particulate matter (PM) monitors and fractionators within the PM monitors are provided. A primary channel of a vertical or out-of-plane fractionator receives air samples, comprising particles of varying sizes, from the external environment. The air samples then pass through a plurality of microfluidic channels, wherein inertial forces are applied within the microfluidic channels to separate the particles by size. The fractionator comprises a horizontal air outlet for particles having a size below a threshold size and a vertical air outlet for particles having a size above a threshold size. Thus, the proportion of PM in the air sample is reduced prior to deposition on a PM monitor. A virtual cyclone may also be provided that comprises a bend positioned at a flow path through a primary channel of the vertical microfabricated fractionator.
Claims
1. A fractionator for a particulate matter (PM) monitor, comprising: a body defining a vertical air inlet to receive a stream of air from outside the body, the stream of air comprising particles of varying sizes; a plurality of microfluidic channels within the body, wherein inertial forces within the microfluidic channels are configured to separate the particles by size; a horizontal air outlet in fluid communication with at least one of the plurality of microfluidic channels for particles having a size below a threshold size; and a vertical air outlet in fluid communication with at least one of the plurality of microfluidic channels for particles having a size above a threshold size; wherein the fractionator comprises a first wafer and a second wafer bonded together, wherein each wafer comprises a device layer, a buried oxide (BOX) layer, and a handle layer.
2. The fractionator of claim 1, further comprising a filter extending across the vertical air inlet to block particles with an aerodynamic diameter larger than 10 m from entering the vertical air inlet.
3. The fractionator of claim 1, wherein the plurality of microfluidic channels comprises: a primary channel in fluid communication with the vertical air inlet and extending in a substantially straight path from the vertical air inlet to the vertical air outlet exiting the fractionator; and one or more secondary channels extending at an angle from the primary channel.
4. The fractionator of claim 3, wherein the one or more secondary channels extend at a 90 degree angle from the primary channel.
5. The fractionator of claim 3, wherein the vertical air inlet comprises an opening of a first diameter and an acceleration region comprising angled walls extending from the vertical air inlet to the primary channel, the primary channel having substantially parallel walls and a second diameter that is smaller than the first diameter.
6. The fractionator of claim 3, wherein in each wafer, the device layer is affixed to a first side of the BOX layer and the handle layer is affixed to a second side of the BOX layer that is opposite the first side.
7. The fractionator of claim 6, wherein the vertical air inlet is formed through the handle layer of one of the first wafer and the second wafer.
8. The fractionator of claim 7, further comprising a collection probe formed in the device layer of one of the wafers, wherein the collection probe defines an opening, the opening coupling the one or more secondary channels to the vertical air outlet.
9. A method for separating components in an air sample, comprising: directing an airflow through the vertical air inlet of the fractionator of claim 3 and through the primary channel; and applying inertial forces to direct particles having a size below the threshold size to the one or more secondary channels, wherein the one or more secondary channels extend from of the primary channel at an angle; wherein particles having a size above the threshold size continue to flow through the primary channel to the vertical air outlet of the fractionator.
10. The method of claim 9, further comprising: filtering particles with an aerodynamic diameter larger than 10 m in the airflow prior to the vertical air inlet via application of a coarse particle filter.
11. The method of claim 9, wherein the portion of the airflow that proceeds to follow the one or more secondary channels is a major flow.
12. The method of claim 9, wherein the portion of the airflow that proceeds to follow the primary channel to the vertical air outlet is a minor flow.
13. A method to fabricate the fractionator of claim 1, comprising: etching the first wafer and the second wafer, wherein each of the first wafer and the second wafer comprises a three layer stack of the device layer affixed to the buried oxide (BOX) layer affixed to the handle layer; rotating the first wafer such that the device layer of the first wafer faces the device layer of the second wafer; and bonding the device layer of the first wafer to the device layer of the second wafer.
14. The method of claim 13, wherein the etching further comprises: applying a mask to the device layer of the first wafer and the device layer of the second wafer and etching the device layer of the first wafer and the device layer of the second wafer around the mask, wherein the portion of each device layer under the mask forms a collection probe; etching through the handle layer, BOX layer, and device layer of the first wafer to form a first part of a primary channel; and etching through the handle layer, BOX layer, and device layer of the second wafer to form a second part of the primary channel; wherein the handle layer of the first wafer and the handle layer of the second wafer each comprises a first surface and a second surface, each second surface being affixed to each corresponding BOX layer; wherein an opening forming the first part of the primary channel at the first surface of the handle layer of the first wafer comprises a larger diameter than an opening forming the second part of the primary channel at the first surface of the handle layer of the second wafer.
15. The method of claim 14, wherein the device layers of the first wafer and the second wafer are etched using deep reactive-ion etching (DRIE).
16. The method of claim 14, wherein the handle layer, BOX layer, and device layer of the second wafer are etched using a combination of DRIE and one or both of isotropic and nonisotropic etching to form the second part of the primary channel.
17. A particulate matter (PM) monitor, comprising a pump and the fractionator of claim 1, wherein the pump comprises: a body forming a chamber; a membrane disposed in the chamber; an actuator coupled to the membrane; an inlet valve in fluid communication with the chamber; and an outlet valve in fluid communication with the chamber, wherein the actuator is operable to displace the membrane in the chamber to generate a negative pressure that draws air into the chamber via the inlet valve and to expel the air from the chamber via the outlet valve.
18. The particulate matter (PM) monitor of claim 17, wherein the actuator is an electrostatic, piezoelectric, or thermal actuator.
19. The particulate matter (PM) monitor of claim 17, wherein the membrane includes one or more expandable/compressible folded sections.
20. The particulate matter (PM) monitor of claim 17, wherein the body includes one or more additional chambers, the one or more additional chambers including a respective membrane, a respective inlet valve, and a respective outlet valve, the respective membrane being displaceable in the corresponding chamber to generate a respective negative pressure that draws air into the corresponding chamber via the respective inlet valve and to push the air out of the corresponding chamber via the respective outlet valve.
21. The particulate matter (PM) monitor of claim 20, wherein actuation of the membranes in the chambers is synchronized to provide substantially constant airflow in the pump.
22. The particulate matter (PM) monitor of claim 20, wherein the chambers are connected in parallel or in series.
23. The particulate matter (PM) monitor of claim 20, wherein the chambers are connected in parallel and the membranes are actuated with the same frequency, but with a phase offset.
24. The particulate matter (PM) monitor of claim 20, further comprising inlet channels leading to the chambers and configured to provide flow balanced between the chambers.
25. The particulate matter (PM) monitor of claim 20, further comprising one or more reservoirs positioned upstream or downstream of the chambers to provide a laminar airflow in the pump.
26. The particulate matter (PM) monitor of claim 25, wherein the one or more reservoirs include respective reservoir membranes providing active or passive compliance.
27. The particulate matter (PM) monitor of claim 17, further comprising a virtual cyclone, the virtual cyclone comprising a bend positioned at a flow path through a primary channel of the fractionator and a collection chamber positioned at the bend, wherein air in the flow path passes through the bend and PM in the air greater than a threshold size pass into the collection chamber.
28. The particulate matter (PM) monitor of claim 27, wherein the bend is approximately 90.
29. The particulate matter (PM) monitor of claim 27, wherein the collection chamber includes a removable collection surface configured to receive the PM greater than the threshold size.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
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(14) The PM monitor 100 draws air samples from the external environment. Inertial forces filter concentrations of micron-sized PM contained in the air sample. PM pollutants may include, for example, coal dust, vehicle exhaust, tobacco smoke, volcanic ash, and airborne particles to which humans are often allergic, such as pollen and foodstuffs, which range in size from a few nanometers to many tens of microns.
(15) The PM monitor 100 includes a first channel 104 that receives the air sample via an air inlet 102. The PM monitor 100 also includes an air microfluidic circuit 106 in fluid communication with the first channel 104. The microfluidic circuit 106 provides a vertical fractionator, described in further detail below, which divides the air sample into two airstreams: a first airstream continues in the first channel 104 and a second airstream flows via a bend into a second channel 108. Due to inertial forces, PM having a size less than a threshold size (e.g., PM.sub.2.5 with aerodynamic diameter less than 2.5 m) can flow into the bend with the second airstream. Meanwhile the remaining PM having a size greater than the threshold size generally cannot flow into the bend and thus continue with the first airstream.
(16) The PM monitor 100 includes an air pump 110 that can create a pressure gradient to draw the air sample through the air inlet 102, the first channel 104, the microfluidic circuit 106, and out of the PM monitor 100 via an air outlet 112. The PM monitor 100 may also include a power source, such as a battery, to power the air pump 110 and any other components of the PM monitor 100.
(17) A mass-sensitive element 114 is disposed in the second channel 108. The selected PM in the second airstream is deposited onto the mass-sensitive element 114. The mass-sensitive element 114 can be employed to measure a mass of the PM deposition. In some embodiments, the mass-sensitive element 114 may be a resonator that has a resonant frequency that changes in response to the mass of PM that is deposited onto the mass-sensitive element 114. For instance, the mass-sensitive element 114 may be a piezoelectric crystal such as a Film Bulk Acoustic Resonator (FBAR). Without PM deposition, the mass-sensitive element 114 may resonate at a higher frequency (e.g., approximately 1.6 GHz) than with PM deposition on the mass-sensitive element 114. As PM is deposited onto the mass-sensitive element 114, however, the resonant frequency of the mass-sensitive element 114 may decrease proportionally due to the additional mass.
(18) The mass-sensitive element 114 is coupled to circuitry 116 that can measure the changing resonant frequency of the mass-sensitive element 114 in response to the PM deposition. For instance, the circuitry 116 may include a high-speed frequency counter to determine the rate of resonant frequency change for the mass-sensitive element 114. The mass concentration of selected PM in the stream of air can then be determined according to the change in the resonant frequency of the mass-sensitive element 114. The circuitry 116 may be coupled, via wired or wireless communication, to an external device 10 that can further process signals from the circuitry 116 conveying information about the mass concentration of the selected PM.
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(20) In certain embodiments, the fractionator 200 may be designed to select PM having an aerodynamic diameter of 2.5 microns or less (PM.sub.2.5) for deposition onto a collection surface of a mass-sensitive element. The aerodynamic diameter may be selected to match the EPA, NIOSH, or other standards.
(21) Each of two etched silicon-on-insular (SOI) wafers comprises a three layer material stack comprising an active layer of silicon (the device layer 201) affixed to a buried oxide (BOX) layer 203 of electrically insulating silicon dioxide, which is affixed to a bulk silicon support wafer (the handle layer 205). Bonding 207 affixes the device layers 201 of the two wafers to each other.
(22) As shown in
(23) In operation, air samples, propelled by the pressure gradient produced by an air pump, flow through the coarse inlet filter 204 and proceed through the primary channel 206. Major flow, shown by paths 216, turns to follow paths that are in-plane with respect to the PM monitor via the secondary channels 214. Particles smaller than 2.5 microns may be carried in the major flow. The forward movement of the air samples, combined with the angles at which the secondary channels 214 branch from the primary channel 206, effectively strip smaller particles from the initial air stream and into the secondary channels 214. The secondary channels 214 may route PM to a mass-sensitive element for collection and analysis. Particles above a certain size (e.g., 2.5 m) possess so much momentum that they cannot follow the divergent secondary channels 214 and remain in a minor flow path, shown by path 218, through primary channel 206 and then may be exhausted. The primary channel is an out-of-plane (vertical) path that leads to the outlet 220.
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(27) The vertical fractionator 200 provides for the PM to move in a straight path. Prior designs provided an inlet of the monitor having a 90 degree turn before the fractionator and thus larger PM could potentially settle and foul the inlet. The design depicted in
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(29) Each of two etched silicon-on-insular (SOI) wafers comprises a three layer material stack comprising a device layer affixed to a first side of a BOX layer, and a second side opposite the first side of the BOX layer affixed to a handle layer.
(30) The top SOI wafer may be inverted to form the vertical fractionator, such as the fractionator 200. In one example embodiment, the bottom SOI wafer is the middle wafer of the PM monitor from which the microfluidic channels are fabricated. In the present embodiment, the two wafers are first etched separately, then bonded using any of a variety of wafer-to-wafer (W2W) bonding methods to create the primary and secondary pathways. One bonding approach employs a dispenser printed curable resist to bond the two wafers at the die level. According to aspects of the present disclosure, however, an alternative bonding approach involves wafer-level bonding with anodic bonding, thermocompression bonding, or glass frit bonding. Such wafer-to-wafer bonding increases fabrication throughput as it permits wafer processing (versus die-sized) processing of the PM monitor, while providing an improved seal for the middle wafer and the top wafer. In some embodiments, markings are provided on each layer to allow for precise alignment/registration of the various components during fabrication/assembly.
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(32) A second step 302 in
(33) In a third step 303, the inlet 202 and the primary channel 206 are formed through the handle layer 205 and BOX layer 203 using a combination of DRIE and isotropic and/or nonisotropic etching.
(34) The spacing between the outlet of the primary channel and the collection probe, as well as the width of the primary channel and the width of the collection probe can be altered such that the cut point of the fractionator is tailored to a PM mean diameter between 100 nm and 10 um. The spacing can be set during design by using different thicknesses for the device layer of the SOI wafer.
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(37) Accordingly, the pump 500a can be deployed downstream of a virtual impactor outlet and/or of the sensing region of the PM monitor. The inlet valve 504 is in fluid communication with the major and minor channels of the virtual impactor. When the membrane 502a generates the negative pressure in the chamber 501, air is drawn through the major and minor channels and/or across the sensing area of the PM monitor, into the pump 500a to create airflow. The pump 500a then pushes the air via the outlet valve 506 to the outlet (exhaust) of the PM monitor.
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(40) When connected in parallel, the membranes in the chambers 501 may be activated with the same frequency, but with a phase offset, to balance the combined flow. As shown in
(41) The pump 500c includes inlet channels 510 that lead to the chambers 501, respectively. The inlet channels 510 are sized to provide flow balancing between the chambers 501 to promote smooth inflow. The pump 500c also includes outlet channels 512 that lead to the chambers 501, respectively. In some embodiments, one or more reservoirs are formed at the inlet channels 510 and/or the outlet channels to further reduce disruption between layers of fluid flow, or smooth out the flow. As shown in
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(44) Having described the invention in detail and by reference to specific embodiments thereof, it will be apparent that modifications and variations are possible without departing from the scope of the invention as set forth in the present disclosure. More specifically, although some aspects of the present invention are identified herein as particularly advantageous, it is contemplated that the present invention is not necessarily limited to these particular aspects of the invention.