LIGHTING DEVICE COMPRISING CIRCUIT BOARD

Abstract

Lighting devices and methods of manufacturing lighting devices are described. A lighting devices includes at least one thermally conductive element, at least one lighting module thermally coupled to the at least one thermally conductive element, and an overmould at least partially encasing the at least one thermally conductive element, the overmould comprising at least one receiving portion. The at least one circuit board is mounted in the at least one receiving portion and is at least partially exposed from the overmould. The at least one circuit board includes at least one connector and at least two bond pads. The at least one connector includes surface accessible conduction lines.

Claims

1. A lighting device, comprising: at least one thermally conductive element; at least one lighting module thermally coupled to the at least one thermally conductive element; an overmould at least partially encasing the at least one thermally conductive element, the overmould comprising at least one receiving portion; at least one circuit board mounted in the at least one receiving portion and at least partially exposed from the overmould, the at least one circuit board comprising at least one connector and at least two bond pads, the at least one connector comprising surface accessible conduction lines.

2. The lighting device according to claim 1, wherein the overmould comprises at least one alignment pin in engagement with the circuit board.

3. The lighting device according to claim 1, further comprising an adhesive between the at least one circuit board and the overmould.

4. The lighting device according to claim 1, further comprising at least one screw mechanically coupled to the at least one circuit board and the overmould.

5. The lighting device according to claim 1, wherein the at least one connector and the at least two bond pads are disposed on opposite sides of the circuit board, and the circuit board further comprises vias formed therein and electrically coupled between the at least one connector and the at least two bond pads.

6. The lighting device according to claim 1, further comprising openings in the circuit board configured for electrical coupling to an external direct connector-plug.

7. The lighting device according to claim 6, wherein the openings comprise at least one of cut outs, holes an slits.

8. The lighting device according to claim 1, further comprising at least two single addressable lighting modules.

9. The lighting device according to claim 1, wherein the at least one circuit board further comprises at least one of: at least one thermistor, at least one bin code resistor, at least one protecting capacitor, and at least one transient voltage suppressor diode.

10. The lighting device according to claim 9, wherein the at least one thermistor includes at least one of a negative temperature coefficient thermistor and a positive temperature coefficient thermistor.

11. The lighting device according to claim 1, wherein the at least one thermally conductive element comprises at least one of a heat sink and a lead frame.

12. A method for producing a lighting device, the method comprising: providing at least one thermally conductive element comprising a mounting region; overmoulding the at least one thermally conductive element such that the at least one thermally conductive element is at least partially encased in the overmould with the mounting region of the thermally conductive element at least partially exposed and the overmould comprises at least one circuit board receiving portion; and arranging at least one circuit board in the at least one circuit board receiving portion.

13. The method according to claim 12, the method comprising: arranging at least one lighting module on the mounting region such that the at least one lighting module is thermally coupled to the at least one thermally conductive element; and electrically connecting the lighting module to the at least one circuit board.

14. The method of claim 13, wherein the electrically connecting comprises one of ribbon and wire bonding the lighting module to the at least one circuit board.

15. The method according to claim 12, wherein the circuit board receiving portion comprises at least one alignment pin, and the arranging the at least one circuit board comprises arranging the at least one circuit board such that the at least one alignment pin engages the at least one circuit board.

16. The method according to claim 15, further comprising hot stacking the at least one circuit board to the overmould via the at least one alignment pin.

17. The method according to claim 12, further comprising gluing the circuit board to the overmould.

18. The method of claim 12, further comprising screwing the at least one circuit board to the overmould.

19. The method of claim 12, further comprising mounting at least one lighting module to the mounting region of the thermally conductive element.

Description

BRIEF DESCRIPTION OF THE DRAWING(S)

[0037] Examples of the invention will now be described in detail with reference to the accompanying drawing, in which:

[0038] FIG. 1 shows an overmoulded heat sink for a lighting device according to the invention in a perspective view;

[0039] FIG. 2 shows an overmoulded heat sink with a PCB for a lighting device according to the invention in a perspective view;

[0040] FIG. 3 shows an embodiment of a lighting device according to the invention in a perspective view; and

[0041] FIG. 4 shows an embodiment of a lighting device according to the invention in a perspective view.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

[0042] FIG. 1 shows an overmoulded heat sink for a lighting device 1 in a perspective view. A substantially H-shaped heat sink 2 is provided and overmoulded, so that the heat sink 2 is partially encased by an overmould 3, while a mounting surface region 25 of heat sink 2 is provided. The mounting surface region 25 is exposed and can be accessed from the outside. Two alignment pins 32 are integrally formed with the overmould 3 and a receiving portion 34 in form of an opening defining a contact plane for a printed circuit board (PCB) 4 is formed in the overmould.

[0043] FIG. 2 shows an overmoulded heat sink with a PCB 4 for a lighting device 1 in a perspective view. The PCB 4 is arranged and mounted in the receiving portion 34, wherein the two alignment pins 32 are in engagement with the PCB 4 via two suitable alignment holes of the PCB 4. The PCB 4 is partially exposed and can be accessed from the outside.

[0044] FIG. 3 shows an embodiment of a lighting device 1 in a perspective view. The lighting device 1 comprises a substantially H-shaped heat sink 2, a lighting module 5 thermally connected with the at least one heat sink and/or lead frame, an overmould 3 configured to at least partially encase the at least one heat sink 2, wherein the overmould 3 comprises at least one receiving portion 34 configured for receiving a circuit board 4, and a circuit board 4 comprising two bond pads 41 for establishing a connection 45 to the lighting module 5 mounted in the receiving portion 34. The connection 45 is established by ribbon bonds 45. The lighting module 5 comprises three LED dies 51 and is arranged and mounted on a mounting surface portion 25 of the heat sink 2. The circuit board 4 is a PCB 4 comprising a connector 42. The PCB 4 is mounted by hot stacking in the receiving portion 34 via two alignment pins 32, integrally formed with the overmould 3, which are in engagement with the PCB 4. Due to the hot stacking, the open top portions of the alignment pins 32 are melted and re-solidified in a semi-spherical shape fixating the PCB 4 to the overmould 3. The PCB 4 furthermore comprises a connector 42, wherein the connector 42 and the two bond pads 41 are situated on opposite sides of the PCB 4 connected using vias (not shown).

[0045] FIG. 4 shows an embodiment of a lighting device 1 in a perspective representation from a bottom view. The connector 42 is mounted on the PCB 4, which PCB 4 is mounted in a receiving portion 34 of the overmould 3 at least partially encasing the heat sink 2.