LIGHTWEIGHT SOLAR POWER GENERATION PANEL AND METHOD OF PREPARING SAME

Abstract

Provided are a lightweight solar power generation panel and a method of preparing the same. The lightweight solar power generation panel comprises a substrate, an insulating layer, a cell layer and a support layer which are stacked in sequence; a material of the substrate comprises any one or a combination of at least two of polypropylene, polyvinyl chloride, polyethylene, polymethyl methacrylate, polycarbonate, polystyrene or an acrylonitrile-butadiene-styrene copolymer. The low-density substrate material is used in the lightweight solar power generation panel provided by the present disclosure so that the entire solar power generation panel is lighter and portable.

Claims

1. A lightweight solar power generation panel, comprising a substrate, an insulating layer, a cell layer and a support layer which are stacked in sequence; a material of the substrate is any one or a combination of at least two of polymethyl methacrylate, polycarbonate, polystyrene or an acrylonitrile-butadiene-styrene copolymer; the substrate is provided with a plurality of through holes to form a hollow structure, a maximum width of a single through hole is less than or equal to 10 mm, and a nearest distance between two adjacent through holes is greater than or equal to 1 mm; the lightweight solar power generation panel is prepared by the following method: performing string welding on a plurality of cell chips to obtain the cell layer, stacking the insulating layer, the cell layer and the support layer in sequence, performing high-temperature lamination on the stacked insulating layer, cell layer and support layer, and then bonding a substrate by low-temperature bonding on a surface of the insulating layer to obtain the lightweight solar power generation panel.

2. The lightweight solar power generation panel according to claim 1, wherein a thickness of the substrate is 1-3 mm, a reinforcing member is provided on a surface of the substrate away from the insulating layer, the reinforcing member is a reinforcing edge, the reinforcing edge is provided along outer peripheral edges of a surface of the substrate, and a height of the reinforcing edge is 1-3 mm.

3. The lightweight solar power generation panel according to claim 1, wherein a weatherproof layer is further provided on a surface of the support layer away from the cell layer, a material of the weatherproof layer is ETFE, and materials of the insulating layer and the support layer are PET.

4. The lightweight solar power generation panel according to claim 1, wherein an adhesive layer is provided between two adjacent layers, and the adhesive layer realizes bonding between layers.

5. The lightweight solar power generation panel according to claim 1, wherein the cell layer comprises a plurality of cell chips, the cell chips are connected in series or in parallel, and a positive electrode and a negative electrode are led out from the cell chips.

6. The lightweight solar power generation panel according to claim 1, wherein a temperature of the high-temperature lamination is 140-160° C., a time of the high-temperature lamination is 15-25 min, and a pressure of the high-temperature lamination is 0.05-0.1 MPa; after the high-temperature lamination, cooling is performed on the obtained semi-finished product, and a time of the cooling is 8-15 min.

7. The lightweight solar power generation panel according to claim 1, wherein the insulating layer, the cell layer, the support layer and a weatherproof layer are stacked in sequence, high-temperature lamination is performed on the stacked insulating layer, cell layer, support layer and weatherproof layer, and two adjacent sides are bonded by coating an adhesive; the method further comprises performing an electrical performance test on the semi-finished product obtained after the high-temperature lamination, and trimming the semi-finished product which passes the test.

8. The lightweight solar power generation panel according to claim 1, wherein the low-temperature bonding process of the substrate comprises coating a UV adhesive on a surface of the support layer of the semi-finished product, bonding the semi-finished product to the substrate, and irradiating the UV adhesive with ultraviolet light at room temperature for light curing; or coating a hot-melt adhesive on a surface of the support layer of the semi-finished product, and bonding the semi-finished product to the substrate by low-temperature bonding, wherein a temperature of the low-temperature bonding is 90-140° C., and a time of the low-temperature bonding is 15-60 s.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0048] FIG. 1 is a structure diagram of a lightweight solar power generation panel provided by an embodiment of the present disclosure;

[0049] FIG. 2 is a structure diagram of a substrate provided by an embodiment of the present disclosure;

[0050] FIG. 3 is a flowchart of the preparation of a lightweight solar power generation panel provided by an embodiment of the present disclosure.

[0051] In the drawings, 101—substrate; 102—first adhesive layer; 103—insulating layer; 104—second adhesive layer; 105—cell layer; 106—third adhesive layer; 107—support layer; 108—fourth adhesive layer; 109—weatherproof layer; 201—through holes; 202—reinforcing member.

DETAILED DESCRIPTION

[0052] It is to be understood that in the description of the present disclosure, orientations or position relations indicated by terms such as “center”, “longitudinal”, “lateral”, “upper”, “lower” “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “in” and “out” are those based on the drawings. These orientations or position relations are intended to facilitate and simplify the description of the present disclosure and not to indicate or imply that a device or element referred to must have a particular orientation or must be constructed or operated in a particular orientation. Thus, these orientations or position relations are not to be construed as limiting the present disclosure. In addition, terms such as “first” and “second” are used herein for purposes of description and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features referred to. Thus, a feature defined by “first”, “second” or the like may explicitly or implicitly include one or more of such features. In the description of the present disclosure, unless otherwise noted, the term “a plurality of” means two or more.

[0053] The technical solutions of the present disclosure are further described below through embodiments.

[0054] In an embodiment, the present disclosure provides a lightweight solar power generation panel. The lightweight solar power generation panel includes a substrate 101, an insulating layer 103, a cell layer 105 and a support layer 107 which are stacked in sequence.

[0055] A material of the substrate 101 includes any one or a combination of at least two of polypropylene, polyvinyl chloride, polyethylene, polymethyl methacrylate, polycarbonate, polystyrene or an acrylonitrile-butadiene-styrene copolymer.

[0056] The low-density substrate material is used in the lightweight solar power generation panel provided by the present disclosure so that the entire solar power generation panel is lighter and portable.

[0057] Furthermore, the substrate 101 is provided with a plurality of through holes 201 to form a hollow structure. The present disclosure has no specific requirement or special limitation on a shape of the through holes 201, and optionally, as shown in FIG. 2, the through holes 201 are circular through holes. However, the present disclosure has requirements on a size of the through holes 201 and a nearest distance between the through holes 201, a maximum width of a single through hole 201 is required to be less than or equal to 10 mm, and a nearest distance between two adjacent through holes 201 is greater than or equal to 1 mm. Since the substrate 101 has the function of supporting and protecting the cell layer 105, the size of a hollowed single through hole 201 cannot be too large, the maximum width of a single through hole 201 is less than or equal to 10 mm, and the shortest distance between the through holes 201 should be greater than or equal to 1 mm. Only in these size ranges can the effective strength be maintained on the premise of reducing the weight of the substrate 101.

[0058] Furthermore, a thickness of the substrate 101 is 1-3 mm. In order to maintain the effective strength of the substrate 101 on the premise of reducing the weight of the substrate 101, the present disclosure particularly defines that the thickness of the substrate 101 is 1-3 mm. If the substrate 101 is too thin, the substrate 101 can be easily bent, causing deformation and damage to the cell layer 105, and if the substrate 101 is too thick, the weight of the solar power generation panel is increased.

[0059] Furthermore, a reinforcing member 202 is provided on a surface of the substrate 101 away from the insulating layer 103. Since the opening of the substrate 101 may cause a decrease in the strength of the substrate 101, in the present disclosure, the reinforcing member 202 is provided on the substrate 101 to increase the mechanical strength of the structure of the substrate 101. The present disclosure has no specific requirement or special limitation on a specific shape and an arrangement position of the reinforcing member 202. The reinforcing member 202 may be a reinforcing rib, a prism or a binding, and the reinforcing member 202 may be arranged around the substrate 101, may be evenly distributed on the surface of the substrate 101, or may be centrally arranged on the central region of the substrate 101.

[0060] Optionally, as shown in FIG. 2, the reinforcing member 202 is a reinforcing edge, and the reinforcing edge is provided along outer peripheral edges of a surface of the substrate 101. A height of the reinforcing edge is 1-3 mm.

[0061] Furthermore, a weatherproof layer 109 is further provided on a surface of the support layer 107 away from the cell layer 105. A material of the weatherproof layer 109 may optionally be ETFE (ethylene-tetrafluoroethylene, a copolymer). Materials of the insulating layer 103 and the support layer 107 may optionally be PET (polyethylene terephthalate).

[0062] Furthermore, an adhesive layer is provided between two adjacent layers, and the adhesive layer realizes bonding between layers. Specifically, as shown in FIG. 1, a substrate 101, a first adhesive layer 102, an insulating layer 103, a second adhesive layer 104, a cell layer 105, a third adhesive layer 106, a support layer 107, a fourth adhesive layer 108 and a weatherproof layer 109 are stacked in sequence.

[0063] Furthermore, the cell layer 105 includes a plurality of cell chips, the cell chips are connected in series or in parallel, and a positive electrode and a negative electrode are led out from the cell chips.

[0064] In another embodiment, the present disclosure provides a method of preparing the lightweight solar power generation panel described in the preceding embodiments. As shown in FIG. 3, the method specifically includes steps S1 to S6 described below.

[0065] S1 cell chip string welding: cell chips are connected in a manner of series and parallel to form a group with a certain voltage and current, and a positive electrode and a negative electrode are led out to obtain the cell layer 105.

[0066] S2 material stacking: a high-temperature cloth is spread on a carrier, and from bottom to top, the weatherproof layer 109 (ETFE), the fourth adhesive layer 108, the support layer 107 (PET), the third adhesive layer 106, the cell layer 105, the second adhesive layer 104 and the insulating layer 103 (PET) are stacked on the carrier in sequence.

[0067] S3 high-temperature lamination: Teflon is arranged on a surface of the insulating layer 103 (PET) which is stacked uppermost to keep the surface clean and protect the surface from adhesive, the stacked layers are put into a laminator with the carrier for high-temperature lamination, where a temperature of the high-temperature lamination is 140-160° C., a time of the high-temperature lamination is 15-25 min and a pressure of the high-temperature lamination is 0.05-0.1 MPa, and after the high-temperature lamination, the obtained semi-finished product is cooled for 8-15 min.

[0068] S4 test and trimming: an electrical performance test is performed on the semi-finished product obtained after the high-temperature lamination, and the semi-finished product is trimmed which passes the test.

[0069] S5 low-temperature bonding: a UV adhesive is coated on the surface of the insulating layer 103 of the semi-finished product, the semi-finished product is bonded to the substrate 101, and the UV adhesive is irradiated with ultraviolet light at room temperature for light curing (the first adhesive layer 102 is formed after the UV adhesive is cured); or a hot-melt adhesive is coated on the surface of the insulating layer 103 of the semi-finished product, and the semi-finished product is bonded to the substrate by low-temperature bonding in a short time (the first adhesive layer 102 is formed after the hot-melt adhesive is cured), where a temperature of the low-temperature bonding is 90-140° C., and a time of the low-temperature bonding is 15-60 s.

[0070] S6 junction box installation: positive and negative electrode leads of the module are led out of the junction box.

[0071] Since the substrate material adopted by the present disclosure is not resistant to high temperatures, the present disclosure also improves the method of preparing the lightweight solar power generation panel, and the material lamination is achieved by combining high-temperature hot pressing with low-temperature bonding. Hot pressing is only performed on the insulating layer 103, the cell layer 105, the support layer 107 and the weatherproof layer 109 in the high-temperature hot pressing process, the substrate 101 does not need to be treated in a high-temperature laminator, and the semi-finished product obtained after the high-temperature lamination is bonded to the substrate 101 under the low-temperature condition. In such preparation method, the temperature resistance requirement of the substrate is reduced, and the structure and shape of the material are no longer completely limited to the planar structure. Therefore, the applicable substrate has wider material scope, higher compatibility in shape and structure, and lower cost.

EXAMPLE 1

[0072] This example provides a method of preparing a lightweight solar power generation panel. The preparation method specifically includes steps S1 to S6 described below.

[0073] S1 cell chip string welding: cell chips were connected in a manner of series and parallel to form a group with a certain voltage and current, and a positive electrode and a negative electrode were led out to obtain a cell layer 105.

[0074] S2 material stacking: a high-temperature cloth was spread on a carrier, and from bottom to top, a weatherproof layer 109 (ETFE), a fourth adhesive layer 108, a support layer 107 (PET), a third adhesive layer 106, the cell layer 105, a second adhesive layer 104 and an insulating layer 103 (PET) were stacked on the carrier in sequence.

[0075] S3 high-temperature lamination: Teflon was arranged on a surface of the insulating layer 103 (PET) which was stacked uppermost to keep the surface clean and protect the surface from adhesive, the stacked layers were put into a laminator with the carrier for high-temperature lamination, where a temperature of the high-temperature lamination was 140° C., a time of the high-temperature lamination was 25 min and a pressure of the high-temperature lamination was 0.05 MPa, and after the high-temperature lamination, the obtained semi-finished product was cooled for 8 min.

[0076] S4 test and trimming: an electrical performance test was performed on the semi-finished product obtained after the high-temperature lamination, and the semi-finished product was trimmed which passed the test.

[0077] S5 low-temperature bonding: a UV adhesive was coated on the surface of the insulating layer 103 of the semi-finished product, and the semi-finished product was bonded to a substrate 101, where the UV adhesive was irradiated with ultraviolet light at room temperature for light curing, and a first adhesive layer 102 was formed after the UV adhesive was cured.

[0078] S6 junction box installation: positive and negative electrode leads of the module were led out of the junction box.

EXAMPLE 2

[0079] This example provides a method of preparing a lightweight solar power generation panel. The preparation method specifically includes steps S1 to S6 described below.

[0080] S1 cell chip string welding: cell chips were connected in a manner of series and/or parallel to form a group with a certain voltage and current, and a positive electrode and a negative electrode were led out to obtain a cell layer 105.

[0081] S2 material stacking: a high-temperature cloth was spread on a carrier, and from bottom to top, a weatherproof layer 109 (ETFE), a fourth adhesive layer 108, a support layer 107 (PET), a third adhesive layer 106, the cell layer 105, a second adhesive layer 104 and an insulating layer 103 (PET) were stacked on the carrier in sequence.

[0082] S3 high-temperature lamination: Teflon was arranged on a surface of the insulating layer 103 (PET) which was stacked uppermost to keep the surface clean and protect the surface from adhesive, the stacked layers were put into a laminator with the carrier for high-temperature lamination, where a temperature of the high-temperature lamination was 145° C., a time of the high-temperature lamination was 23 min and a pressure of the high-temperature lamination was 0.06 MPa, and after the high-temperature lamination, the obtained semi-finished product was cooled for 10 min.

[0083] S4 test and trimming: an electrical performance test was performed on the semi-finished product obtained after the high-temperature lamination, and the semi-finished product was trimmed which passed the test.

[0084] S5 low-temperature bonding: a UV adhesive was coated on the surface of the insulating layer 103 of the semi-finished product, and the semi-finished product was bonded to a substrate 101, where the UV adhesive was irradiated with ultraviolet light at room temperature for light curing, and a first adhesive layer 102 was formed after the UV adhesive was cured.

[0085] S6 junction box installation: positive and negative electrode leads of the module were led out of the junction box.

EXAMPLE 3

[0086] This example provides a method of preparing a lightweight solar power generation panel. The preparation method specifically includes steps S1 to S6 described below.

[0087] S1 cell chip string welding: cell chips were connected in a manner of series and parallel to form a group with a certain voltage and current, and a positive electrode and a negative electrode were led out to obtain a cell layer 105.

[0088] S2 material stacking: a high-temperature cloth was spread on a carrier, and from bottom to top, a weatherproof layer 109 (ETFE), a fourth adhesive layer 108, a support layer 107 (PET), a third adhesive layer 106, the cell layer 105, a second adhesive layer 104 and an insulating layer 103 (PET) were stacked on the carrier in sequence.

[0089] S3 high-temperature lamination: Teflon was arranged on a surface of the insulating layer 103 (PET) which was stacked uppermost to keep the surface clean and protect the surface from adhesive, the stacked layers were put into a laminator with the carrier for high-temperature lamination, where a temperature of the high-temperature lamination was 150° C., a time of the high-temperature lamination was 20 min and a pressure of the high-temperature lamination was 0.08 MPa, and after the high-temperature lamination, the obtained semi-finished product was cooled for 12 min.

[0090] S4 test and trimming: an electrical performance test was performed on the semi-finished product obtained after the high-temperature lamination, and the semi-finished product was trimmed which passed the test.

[0091] S5 low-temperature bonding: a hot-melt adhesive was coated on the surface of the insulating layer 103 of the semi-finished product, and the semi-finished product was bonded to a substrate 101 by low-temperature bonding in a short time, and a first adhesive layer 102 was formed after the hot-melt adhesive was cured, where a temperature of the low-temperature bonding was 90° C., and a time of the low-temperature bonding was 60 s.

[0092] S6 junction box installation: positive and negative electrode leads of the module were led out of the junction box.

EXAMPLE 4

[0093] This example provides a method of preparing a lightweight solar power generation panel. The preparation method specifically includes steps S1 to S6 described below.

[0094] S1 cell chip string welding: cell chips were connected in a manner of series and parallel to form a group with a certain voltage and current, and a positive electrode and a negative electrode were led out to obtain a cell layer 105.

[0095] S2 material stacking: a high-temperature cloth was spread on a carrier, and from bottom to top, a weatherproof layer 109 (ETFE), a fourth adhesive layer 108, a support layer 107 (PET), a third adhesive layer 106, the cell layer 105, a second adhesive layer 104 and an insulating layer 103 (PET) were stacked on the carrier in sequence.

[0096] S3 high-temperature lamination: Teflon was arranged on a surface of the insulating layer 103 (PET) which was stacked uppermost to keep the surface clean and protect the surface from adhesive, the stacked layers were put into a laminator with the carrier for high-temperature lamination, where a temperature of the high-temperature lamination was 155° C., a time of the high-temperature lamination was 18 min and a pressure of the high-temperature lamination was 0.09 MPa, and after the high-temperature lamination, the obtained semi-finished product was cooled for 14 min.

[0097] S4 test and trimming: an electrical performance test was performed on the semi-finished product obtained after the high-temperature lamination, and the semi-finished product was trimmed which passed the test.

[0098] S5 low-temperature bonding: a hot-melt adhesive was coated on the surface of the insulating layer 103 of the semi-finished product, and the semi-finished product was bonded to a substrate 101 by low-temperature bonding in a short time, and a first adhesive layer 102 was formed after the hot-melt adhesive was cured, where a temperature of the low-temperature bonding was 110° C., and a time of the low-temperature bonding was 40 s.

[0099] S6 junction box installation: positive and negative electrode leads of the module were led out of the junction box.

EXAMPLE 5

[0100] This example provides a method of preparing the lightweight solar power generation panel. The preparation method specifically includes steps S1 to S6 described below.

[0101] S1 cell chip string welding: cell chips were connected in a manner of series and/or parallel to form a group with a certain voltage and current, and a positive electrode and a negative electrode were led out to obtain a cell layer 105.

[0102] S2 material stacking: a high-temperature cloth was spread on a carrier, and from bottom to top, a weatherproof layer 109 (ETFE), a fourth adhesive layer 108, a support layer 107 (PET), a third adhesive layer 106, the cell layer 105, a second adhesive layer 104 and an insulating layer 103 (PET) were stacked on the carrier in sequence.

[0103] S3 high-temperature lamination: Teflon was arranged on a surface of the insulating layer 103 (PET) which was stacked uppermost to keep the surface clean and protect the surface from adhesive, the stacked layers were put into a laminator with the carrier for high-temperature lamination, where a temperature of the high-temperature lamination was 160° C., a time of the high-temperature lamination was 15 min and a pressure of the high-temperature lamination was 0.1 MPa, and after the high-temperature lamination, the obtained semi-finished product was cooled for 15 min.

[0104] S4 test and trimming: an electrical performance test was performed on the semi-finished product obtained after the high-temperature lamination, and the semi-finished product was trimmed which passed the test.

[0105] S5 low-temperature bonding: a hot-melt adhesive was coated on the surface of the insulating layer 103 of the semi-finished product, and the semi-finished product was bonded to a substrate 101 by low-temperature bonding in a short time, and a first adhesive layer 102 was formed after the hot-melt adhesive was cured, where a temperature of the low-temperature bonding was 140° C., and a time of the low-temperature bonding was 15 s.

[0106] S6 junction box installation: positive and negative electrode leads of the module were led out of the junction box.

[0107] The applicant has stated that the above are only the embodiments of the present disclosure and not intended to limit the scope of the present disclosure. Those skilled in the art should understand that modifications or substitutions within the technical scope disclosed in the present disclosure, which are obvious to those skilled in the art, all fall within the protection scope and the disclosed scope of the present disclosure.