OLED array substrate, manufacturing method thereof and touch display device
11563061 · 2023-01-24
Assignee
- Boe Technology Group Co., Ltd. (Beijing, CN)
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. (Sichuan, CN)
Inventors
Cpc classification
H10K71/00
ELECTRICITY
G06F3/0446
PHYSICS
G06F2203/04103
PHYSICS
International classification
Abstract
An OLED array substrate, a manufacturing method thereof and a touch display device. The OLED array substrate includes a base substrate, a transistor on the base substrate, and a planarization layer covering the transistor. The OLED array substrate further includes a touch sensor integrated in the OLED array substrate, wherein the touch sensor is located on a side of the planarization layer facing away from the transistor, and the touch sensor includes first touch electrodes and second touch electrodes insulated from each other.
Claims
1. An Organic Light-Emitting Diode (OLED) array substrate, comprising: a base substrate; a transistor comprising a source electrode and a drain electrode on the base substrate; a planarization layer on the base substrate and covering the transistor; a touch sensor on a side of the planarization layer facing away from the base substrate; and a pixel definition layer on a side of the planarization layer facing away from the transistor and comprising a plurality of openings, wherein the touch sensor comprises first touch electrodes and second touch electrodes insulated from each other, wherein the touch sensor is between the pixel definition layer and the planarization layer, and an orthogonal projection of the touch sensor on the base substrate overlaps an orthogonal projection of the pixel definition layer on the base substrate, wherein the first touch electrodes extend in a first direction, the second touch electrodes extend in a second direction, and the first direction is perpendicular to the second direction, wherein sides of the first touch electrodes extending in the first direction on an upper surface of the first touch electrodes facing away from the base substrate are inwardly recessed, outwardly protruding, or in a shape of sawteeth; wherein sides of the second touch electrodes extending in the second direction on an upper surface of the second touch electrodes facing away from the base substrate are inwardly recessed, outwardly protruding, or in a shape of sawteeth; wherein the touch sensor further comprises a dielectric layer, by which the first touch electrodes and the second touch electrodes are insulated from each other; wherein the first touch electrodes are strip electrodes extending in the first direction, and the second touch electrodes comprise block electrodes arranged in a matrix between the strip electrodes of the first touch electrodes and bonding wires electrically connected to adjacent block electrodes in the second direction; wherein the first touch electrodes and the block electrodes are located in a same layer, and the bonding wires are located in a different layer from the first touch electrodes and the block electrodes, and wherein sides of the block electrodes extending in the second direction on the upper surface of the block electrodes facing away from the base substrate are inwardly recessed, outwardly protruding or in a shape of sawteeth.
2. The OLED array substrate according to claim 1, further comprising an anode on a side of the planarization layer facing away from the base substrate, wherein the first touch electrodes and the second touch electrodes are arranged in a same layer and made of a same material as the anode.
3. The OLED array substrate according to claim 2, wherein the pixel definition layer comprises first portions extending in the first direction and second portions extending in the second direction, the first portions and the second portions enclosing the plurality of openings, wherein orthogonal projections of the bonding wires on the base substrate overlap orthogonal projections of the second portions on the base substrate.
4. The OLED array substrate according to claim 1, further comprising an anode on a side of the planarization layer facing away from the base substrate, wherein the bonding wires are arranged in a same layer and made of a same material as the anode.
5. A touch display device, comprising the OLED array substrate according to claim 1.
6. The touch display device according to claim 5, further comprising a flexible encapsulation layer for encapsulating the OLED array substrate.
7. A method for manufacturing an OLED array substrate, comprising: forming a transistor comprising a source electrode and a drain electrode on a base substrate; forming a planarization layer covering the transistor on the base substrate on which the transistor has been formed; forming first touch electrodes and second touch electrodes insulated from each other on the base substrate on which the planarization layer has been formed, and forming a pixel definition layer on the base substrate on which the first touch electrodes and the second touch electrodes have been formed, the pixel definition layer comprising a plurality of openings, wherein the first touch electrodes and the second touch electrodes constitute a touch sensor, wherein an orthogonal projection of the touch sensor on the base substrate overlaps an orthogonal projection of the pixel definition layer on the base substrate, wherein the first touch electrodes extend in a first direction, the second touch electrodes extend in a second direction, and the first direction is perpendicular to the second direction, wherein sides of the first touch electrodes extending in the first direction on an upper surface of the first touch electrodes facing away from the base substrate are inwardly recessed, outwardly protruding, or in a shape of sawteeth; wherein sides of the second touch electrodes extending in the second direction on an upper surface of the second touch electrodes facing away from the base substrate are inwardly recessed, outwardly protruding, or in a shape of sawteeth; wherein the touch sensor further comprises a dielectric layer, by which the first touch electrodes and the second touch electrodes are insulated from each other; wherein the first touch electrodes are strip electrodes extending in the first direction, and the second touch electrodes comprise block electrodes arranged in a matrix between the strip electrodes of the first touch electrodes and bonding wires electrically connected to adjacent block electrodes in the second direction; wherein the first touch electrodes and the block electrodes are located in a same layer, and the bonding wires are located in a different layer from the first touch electrodes and the block electrodes, and wherein sides of the block electrodes extending in the second direction on the upper surface of the block electrodes facing away from the base substrate are inwardly recessed, outwardly protruding or in a shape of sawteeth.
8. The method for manufacturing the OLED array substrate according to claim 7, wherein forming the first touch electrodes and the second touch electrodes insulated from each other comprises: depositing a first conductive material layer on the base substrate on which the planarization layer has been formed, and forming by one patterning process strip-shaped first touch electrodes, the block electrodes arranged in a matrix between the strip-shaped first touch electrodes as well as an anode; forming the dielectric layer on the base substrate on which the first touch electrodes, the block electrodes and the anode have been formed, and forming via holes in positions of the dielectric layer corresponding to the block electrodes; depositing a second conductive material layer on the base substrate on which the dielectric layer has been formed, and forming the bonding wires by a patterning process, wherein the bonding wires are electrically connected to the block electrodes through the via holes in the second direction, and wherein the bonding wires and the block electrodes constitute the second touch electrodes.
9. The method for manufacturing the OLED array substrate according to claim 7, wherein forming the first touch electrodes and the second touch electrodes insulated from each other comprises: depositing a first conductive material layer on the base substrate on which the planarization layer has been formed, and forming by one patterning process strip-shaped first touch electrodes and the block electrodes arranged in a matrix between the strip-shaped first touch electrodes; forming the dielectric layer on the base substrate on which the first touch electrodes and the block electrodes have been formed, and forming via holes in positions of the dielectric layer corresponding to the block electrodes; and depositing a second conductive material layer on the base substrate on which the dielectric layer has been formed, and forming by one patterning process bonding wires and an anode, wherein the bonding wires are electrically connected with the block electrodes through the via holes in the second direction, and wherein the bonding wires and the block electrodes constitute the second touch electrodes.
Description
BRIEF DESCRIPTION OF DRAWINGS
(1) In order to illustrate technical solutions in embodiments of the present disclosure more clearly, drawings to be used in depictions of embodiments of the present disclosure will be briefly introduced below. Apparently, the drawings in the depictions below are only some embodiments of the present disclosure. For a person having ordinary skills in the art, other drawings can be further obtained from these drawings without any inventive efforts.
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(16)
(17)
DETAILED DESCRIPTION OF EMBODIMENTS
(18) Technical solutions in embodiments of the present disclosure shall be described clearly and completely as follows with reference to the drawings in embodiments of the present disclosure. Obviously, the described embodiments are only part of embodiments of the present disclosure, instead of all. Based on embodiments in the present disclosure, all other embodiments obtainable by a person having ordinary skills in the art without any inventive efforts shall fall within the protection scope of the present disclosure.
(19) The following reference signs will be used in the drawings:
(20) 01—OLED array substrate; 101—base substrate; 102—display sub-pixel; 103—touch sub-pixel; 11—planarization layer; 20—touch sensor; 201—first touch electrode; 202—second touch electrode; 21—dielectric layer; 22—bonding wire; 110—anode; 120—organic material function layer; 121—cathode; 122—polarizer; 123—thin film encapsulation layer; 30—pixel definition layer; 3011—first portion; 3012—second portion; 302—opening; A—display region; and B—non-display region.
(21) Embodiments of the present disclosure provide an OLED array substrate 01, as shown in
(22) Based on that, the OLED array substrate 01 further comprises a touch sensor 20 integrated in the OLED array substrate 01 and located on a side of the planarization layer 11 facing away from the TFT. The touch sensor 20 comprises first touch electrodes 201 and second touch electrodes 202 insulated from each other.
(23) It should be noted that the first touch electrodes 201 and the second touch electrodes 202 insulated from each other mean that the first touch electrodes 201 and the second touch electrodes 202 are arranged in different layers, as shown in
(24) When the first touch electrodes 201 and the second touch electrodes 202 are arranged in different layers, the first touch electrodes 201 and the second touch electrodes 202 can be both strip-shaped, as shown in
(25) In the matrix arrangement as shown in
(26) Alternatively, as shown in
(27) In the bridge arrangement as shown in
(28) Shape of an upper surface of the strip-shaped first touch electrodes 201 or second touch electrodes 202 facing away from the base substrate is not limited in the present disclosure. For example, in the arrangement as shown in
(29) Alternatively, in the arrangement as shown in
(30) By altering the shape of the upper surface of the first touch electrodes and/or the second touch electrodes facing away from the base substrate, visibility of the touch sensor can be reduced, thereby preventing a user from seeing the touch sensor on the OLED display device and avoiding influences on the display effect. In the meanwhile, the arrangement of the touch sensor can be further adapted to the available space in the OLED array substrate, thereby promoting integration of the touch sensor in the OLED array substrate.
(31) Based on that, the OLED array substrate 01 has a plurality of sub-pixels arranged in a matrix, each sub-pixel being provided with a pixel circuit which consists of a TFT and a capacitor. The pixel circuit can drive a lighting device (e.g., an OLED device) in each sub-pixel to emit light.
(32) It should be noted that TFT can be any of amorphous silicon TFTs, low-temperature polycrystalline silicon TFTs, oxide TFTs and organic TFTs. Moreover, TFTs in the OLED array substrate can be all of a same type, or the OLED array substrate can comprise at least two different types of TFTs.
(33) Besides, when the OLED array substrate 01 is used for manufacturing a flexible AMOLED display, the base substrate 101 is made of a flexible material (e.g., a flexible transparent resin material).
(34) Furthermore, as shown in
(35) As shown in
(36) In the OLED array substrate 01 provided by embodiments of the present disclosure, the touch sensor 20 is manufactured on a side of the planarization layer 11 of the OLED array substrate 01 facing away from the transistor TFT. I.e., the touch sensor 20 is integrated on the OLED array substrate 01 by an In-Cell process, and thereby a touch AMOLED is provided. In this way, when the touch AMOLED is a flexible display device, the touch integration process will not be influenced by any TFE process of the touch AMOLED, which improves the applicable range of flexible AMOLEDs.
(37) Correspondingly, embodiments of the present disclosure provide a display device. As shown in
(38) A plurality of display sub-pixels 102 are arranged in a matrix in the display region A of the display device. A touch member of the display device comprises a plurality of touch sub-pixels 103 arranged in a matrix, each touch sub-pixels 103 being provided with one touch sensor 20. In this case, when each of the touch sensors 20 is arranged in the non-display region B, the display sub-pixels 102 do not overlap the touch sub-pixels 103.
(39) However, with the increasing development of touch technologies, the user performs touch operations in the display region A more and more frequently. So, arranging the touch sensor 20 in the display region A has become a trend of development for touch display devices in the future. In this case, the display sub-pixels 102 overlap the touch sub-pixels 103 partly. The size of the overlapping region is not limited in the present disclosure. For example, the display sub-pixels 102 can overlap the touch sub-pixels 103 in a ratio of 1:1. I.e., one touch sub-pixel 103 corresponds to one display sub-pixel 102. Alternatively, one touch sub-pixel 103 can correspond to a plurality of display sub-pixels 102. This is not limited in the present disclosure.
(40) Based on that, in a case where the touch sensor 20 is arranged in the display region A, the touch sensor can be arranged such that an orthogonal projection thereof on the base substrate overlaps an orthogonal projection of the pixel definition layer on the base substrate, in order to avoid influences on the display effect when the OLED array substrate further comprises a pixel definition layer. Therefore, the touch sensor arranged in the display region A will not occlude the OLED device in the opening. For example, the orthogonal projection of the touch sensor on the base substrate can fall within the orthogonal projection of the pixel definition layer on the base substrate.
(41) Specific arrangements in which the position of the touch sensor corresponds to the position of the pixel definition layer will be illustrated by examples when the first touch electrodes and the second touch electrodes in the touch sensor are arranged in different manners.
(42) In an exemplary embodiment, the first touch electrodes 201 and the second touch electrodes 202 of the touch sensor 20 are arranged in a matrix, as shown in
(43) In this case, as shown in
(44) In this case, as shown in
(45) It should be noted that, as used herein, the term of “patterning process” refers to processes for forming a predetermined pattern such as photolithography, photolithography and etching, printing, ink jetting and the like. As used herein, photolithography refers to a process that comprises steps such as film forming, exposure and developing, and forms patterns by using a photoresist, a mask, an exposure machine and so on. Corresponding patterning processes can be selected depending on the structure as formed in the present disclosure. In particular, the one patterning process refers to a process during which different exposure regions are formed by one mask process and then subjected to many removing processes such as etching and ashing, so as to obtain an expected pattern finally.
(46) In another exemplary embodiment, as shown in
(47) It should be noted that in the case of
(48) In yet another exemplary embodiment, the first touch electrodes 201 and the second touch electrodes 202 of the touch sensor 20 are arranged in a form of bridge, as shown in
(49) In this case, as shown by
(50) Based on that, the first touch electrodes 201 and the second touch electrodes 202 of
(51) In another exemplary embodiment, as shown in
(52) It should be noted that in the case of
(53) In the above exemplary embodiments, the conductive material comprises but is not limited to Mo, Al, Cu, Ag, Ti, In—Sn—O (ITO), In—Zn—O (IZO), Al—Zn—O (AZO), graphene, carbon nanotubes and so on, or a composite material consisting of at least two of the above materials.
(54) In the above exemplary embodiments, the orthogonal projection of the touch sensor 20 on the base substrate 101 overlaps the orthogonal projection of the pixel definition layer 30 on the base substrate 101, and the touch sensor 20 is located between the pixel definition layer 30 and the planarization layer 11. In this case, the manufacture of touch sensor 20 has been completed, when the OLED device comprising the anode 110 and the organic material function layer 120 as shown in
(55) Embodiments of the present disclosure further provide a touch display device, comprising any OLED array substrate as mentioned above. The touch display device can achieve the same beneficial effects as the OLED array substrate provided by the above embodiments, which will not be repeated herein for simplicity.
(56) In particular, as shown in
(57) In a further embodiments, the present disclosure provides a method for manufacturing an OLED array substrate.
(58) As shown in
(59) It should be noted that in order that a source or a drain of the TFT can be connected with an anode of the OLED device, it is necessary to arrange via holes in the planarization layer 11 such that the anode can be connected with the source or the drain of the TFT through the via holes.
(60) In step S103, first touch electrodes and second touch electrodes insulated from each other are formed on the base substrate on which the planarization layer has been formed. The first touch electrodes and the second touch electrodes constitute a touch sensor.
(61) The method for manufacturing an OLED array substrate can achieve the same beneficial effects as the OLED array substrate provided in the above embodiments, which will not be repeated herein for simplicity.
(62) Based on that, in order to avoid influences of the manufacture process of touch sensor on the manufacture of organic light emitting layer of the OLED device, in some exemplary embodiments, after the step S103, the method for manufacturing an OLED array substrate can further comprise forming a pixel definition layer 30 on the base substrate on which the touch sensor has been formed. In this way, after the manufacture of touch sensor has been completed, the organic material function layer of the OLED device is manufactured in the openings.
(63) In view of above, when the touch sensor is arranged in the display region of the display device, in some exemplary embodiments, an orthogonal projection of the touch sensor on the base substrate can overlap an orthogonal projection of the pixel definition layer on the base substrate, as shown in
(64) The step S103 will be illustrated in detail by examples.
(65) In an exemplary embodiment, the first touch electrodes 201 and the second touch electrodes 202 are arranged in a matrix, as shown in
(66) It should be noted that the conductive material for forming the conductive material layer is the same as described above, which will not be repeated herein for simplicity. When the first conductive material layer is mainly made of a metallic material, the patterns of anode 110 and strip-shaped first touch electrodes 201 can be obtained by a photolithography process, including steps of applying a photoresist, exposing, developing and etching. When the first conductive material layer is mainly made of nano silver, graphene, carbon nanotubes and so on, the patterns of anode 110 and strip-shaped first touch electrodes 201 can be prepared using liquid conductive solutions, such as silver nano paste, a graphene solution and a carbon nanotube solution, by ink-jet printing and screen printing for instance, and then subjected to UV curing and/or thermal curing.
(67) Next, the step S103 further comprises forming a dielectric layer 21 on the base substrate 101 on which the first touch electrodes 201 have been formed.
(68) It should be noted that the material for forming the dielectric layer 21 is the same as described above, which will not be repeated herein for simplicity. Specifically, when the material for forming the dielectric layer 21 comprises at least one of SiOx, SiNx, AlOx and SiOxNy, the pattern of dielectric layer 21 can be formed by a photolithography process, comprising steps of applying a photoresist, exposing, developing and etching. When the material for forming the dielectric layer 21 comprises an organic insulating material, the pattern of dielectric layer 21 can be formed using an organic insulating material solution by ink-jet printing and screen printing for instance, and then subjected to UV curing and/or thermal curing.
(69) Next, the step S103 further comprises depositing a second conductive material layer on the base substrate 101 on which the dielectric layer 21 has been formed, and forming by a patterning process strip-shaped second touch electrodes 202 intersecting the first touch electrodes 201.
(70) It should be noted that the material for forming the first conductive material layer and the material for forming the second conductive material layer can be the same, or different, which will not be limited in the present disclosure.
(71) In an alternative embodiment, the step S103 can comprise firstly depositing a first conductive material layer on the base substrate 101 on which the planarization layer 11 has been formed, and forming strip-shaped first touch electrodes 201 as shown in
(72) Next, the step S103 further comprises forming by a patterning process a dielectric layer 21 on the base substrate 101 on which the first touch electrodes 201 have been formed.
(73) Next, the step S103 further comprises depositing a second conductive material layer on the base substrate 101 on which the dielectric layer 21 has been formed, and forming by one patterning process an anode 110 and strip-shaped second touch electrodes 202 intersecting the first touch electrodes 201.
(74) In another exemplary embodiment, the first touch electrodes 201 and the second touch electrodes 202 are arranged in a form of bridge, as shown in
(75) Next, the step S103 further comprises forming a dielectric layer 21 on the base substrate on which the first touch electrodes 201 and the block electrodes 2021 have been formed, and forming via holes in positions of the dielectric layer 21 corresponding to the block electrodes 2021.
(76) Next, the step S103 further comprises depositing a second conductive material layer on the base substrate 101 on which the dielectric layer 21 has been formed and forming by a patterning process bonding wires 22. As shown in
(77) In an alternative exemplary embodiment, the step S103 can comprise firstly depositing a first conductive material layer on the base substrate on which the planarization layer 11 has been formed, and forming by one patterning process strip-shaped first touch electrodes 201 as shown in
(78) Next, the step S103 comprises forming a dielectric layer 21 on the base substrate 101 on which the first touch electrodes 201 and the block electrodes 2021 have been formed, and forming via holes in positions of the dielectric layer 21 corresponding to the block electrodes 202, as shown in
(79) Next, the step S103 further comprises depositing a second conductive material layer on the base substrate on which the dielectric layer 21 has been formed, and forming by one patterning process bonding wires 22 and an anode 110. As shown in
(80) Based on that, after the manufacture of OLED array substrate according to any of
(81) In particular, the touch display device can further comprise a gap control layer on a side of the pixel definition layer 30 facing away from the base substrate 101, the gap control layer having a support function such that the display side of the touch display device is flush.
(82) The descriptions above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure shall not be limited thereto. Any variation or substitution easily conceivable within the technical range disclosed by the present disclosure for a skilled person, who is familiar with this technical field, shall fall within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.