CHIP COMPONENT

Abstract

The disclosure provides a chip component including a body and a bracket; the bracket includes a first welding part, a second welding part, and a connection part connecting to the first welding part and the second welding part; the first welding part is configured to be welded to a printed circuit board (PCB); the body includes a first electrode and a second electrode; the first electrode is welded to the second welding part, and the second electrode is configured to weld to the PCB. One of the purposes of the disclosure is to provide a chip component that can meet the needs of automatic production, so as to improve the production efficiency and reduce the cost.

Claims

1. A chip component, comprising: a body comprising: a first electrode; and a second electrode; and a bracket comprising: a first welding part configured to weld to a printed circuit board (PCB); a second welding part; and a connection part connecting to the first welding part and the second welding part; wherein the first electrode is welded to the second welding part, and the second electrode is configured to be welded to the PCB.

2. The chip component of claim 1, wherein the first welding part and the second welding part are disposed at two sides of the connection part, respectively; the first welding part comprises a welding surface facing the PCB; the second electrode comprises a welding surface facing the PCB; and the welding surfaces of the first welding part and the second electrode are the same.

3. The chip component of claim 1, wherein the connection part comprises a first connection plate and a second connection plate connected to the first connection plate; the first connection plate is connected to the first welding part, and the second connection plate is connected to the second welding part.

4. The chip component of claim 3, wherein an angle between the first connection plate and the first welding part is in a range of 90-135.

5. The chip component of claim 4, wherein the angle between the first connection plate and the first welding part is 90.

6. The chip component of claim 3, wherein an angle between the second connection plate and the second welding part is in a range of 90-135.

7. The chip component of claim 3, wherein the connection part further comprises a third connection plate; the first connection plate is connected to the second connection plate via the third connection plate.

8. The chip component of claim 7, wherein the third connection plate and the first welding part are disposed at two sides of the first connection plate, respectively.

9. The chip component of claim 7, wherein an angle between the third connection plate and the first connection plate is 90.

10. The chip component of claim 7, wherein a distance between the third connection plate and the first welding part is larger than a distance between the second welding part and the first welding part.

11. The chip component of claim 1, wherein the bracket is piece-shaped.

12. The chip component of claim 1, wherein the first welding part defines a slit.

13. The chip component of claim 1, wherein the first electrode and the second electrode are disposed on surfaces of the body of the chip component.

14. The chip component of claim 1, wherein the body of the chip component comprises a first surface and a second surface opposite to the first surface; the first electrode is disposed on the first surface and the second electrode is disposed on the second surface; and each edge of the first surface and the second surface is provided with a coating layer.

15. The chip component of claim 14, wherein the coating layer is annular.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] FIG. 1 is a schematic diagram of a first embodiment of a chip component;

[0023] FIG. 2 is a first schematic diagram of a first embodiment of a bracket of the chip component;

[0024] FIG. 3 is a second schematic diagram of a first embodiment of the bracket of the chip component;

[0025] FIG. 4 is a schematic diagram of a second embodiment of the chip component; and

[0026] FIG. 5 is a top view of a second embodiment of a body of the chip component.

[0027] Legends: 1. Body; 11. First electrode; 12. Second electrode; 13. Chromatic circle; 14. Chromatic circle; 2 Bracket; 21. First welding part; 212. Slit; 22. Second welding part; 23. Connection part; 231. First connection plate; 232. Second connection plate; 233. Third connection plate; 3. Printed circuit board.

DETAILED DESCRIPTION

[0028] It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiment described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure.

[0029] As shown in FIGS. 1 and 2, the disclosure provides a chip component comprising a body 1 and a bracket 2. The bracket 2 comprises a first welding part 21, a second welding part 22, and a connection part 23 connecting to the first welding part 21 and the second welding part 22. The first welding part 21 is configured to be welded to a printed circuit board (PCB) 3. The body 1 comprises a first electrode 11 and a second electrode 12 which are respectively disposed on two opposite sides (for example, in FIG. 1, the upper side and the lower side). The first electrode 11 is welded to the second welding part 22, and the second electrode 12 is configured to be welded to the PCB 3.

[0030] In the chip component, because the first electrode 11 of the body 1 is welded to the second welding part 22 of the bracket 2, when the body 1 is welded to the PCB 3, the first welding part 21 of the bracket 2 and the second electrode 12 of the body 1 are welded to the PCB 3, so that the chip component formed by welding the body 1 and the bracket 2 can be welded by using a conventional welding device or method of the chip components. In addition, the body 1 adopts an element commonly used in the market, and the bracket 2 can be a tinned steel strip. Thus, compared with conventional chip components, the chip component provided by the disclosure can be suitable for automated production, and has a relatively low production cost, which is beneficial to improving the market competitiveness.

[0031] As an improvement, the first welding part 21 and the second welding part 22 are disposed at two sides of the connection part 23, respectively. The distance between the first welding part 21 and the second welding part 22 is corresponding to the distance between the first electrode 11 and the second electrode 12. The structure is simple and reasonable, and can ensure that when the chip component is welded to the PCB 3, the welding surface of the first welding part 21 facing the PCB is in the same horizontal plane as the welding surface of the second electrode 12 facing the PCB, so that the chip component can be welded by using a conventional welding device or method, thus meeting the demand of automation production.

[0032] As an improvement, the connection part 23 comprises a first connection plate 231 and a second connection plate 232 connected to the first connection plate 231. The first connection plate 231 is connected to the first welding part 21, and the second connection plate 232 is connected to the second welding part 22.

[0033] An angle between the first connection plate 231 and the first welding part 21 is , which is in a range of 90-135. In this example, preferably, the angle between the first connection plate and the first welding part is 90. The design is beautiful, can prevent the damage of the bracket in a forming process, save the raw materials and reduce the cost of the chip component.

[0034] An angle between the second connection plate 232 and the second welding part 22 is , which is in the range of 90-135. The design is beautiful, and can prevent the damage of the bracket in the forming process, save the raw materials and reduce the cost of the chip component.

[0035] The connection part 23 further comprises a third connection plate 233. The first connection plate 231 is connected to the second connection plate 232 via the third connection plate 233. In addition, the third connection plate 233 and the first welding part 21 are disposed at two sides of the first connection plate 231, respectively.

[0036] An angle between the third connection plate 233 and the first connection plate 231 is 90. The design can save the raw materials and reduce the cost of the chip component. It is understandable that the angle between the third connection plate 233 and the second connection plate 232 is in the range of 90-135.

[0037] The distance between the third connection plate 233 and the first welding part 21 is larger than the distance between the second welding part 22 and the first welding part 21, so as to adjust the position of the first welding part 21 in the welding process, and ensure the welding surface of the first welding part 21 facing the PCB is in the same horizontal plane as the welding surface of the second electrode 12 facing the PCB, which is beneficial to welding.

[0038] As shown in FIG. 3, preferably, the bracket is piece-shaped or plate-shaped. The first welding part 21 is piece-shaped. Preferably, the first welding part 21 defines a slit 212 for welding.

[0039] FIG. 4 is a schematic diagram of a second embodiment of the chip component.

[0040] FIG. 5 is a top view of the second embodiment of the body of the chip component.

[0041] FIGS. 4 and 5 illustrate that the body of the chip component comprises a first surface and a second surface opposite to the first surface. The first electrode 11 and the second electrode 12 are disposed on the first surface and the second surface, respectively. Preferably, the first electrode 11 and the second electrode 12 are disposed on the centers of the first surface and the second surface, respectively. In this example, the areas of the first electrode 11 and the second electrode 12 are less than the areas of the first surface and the second surface. Chromatic circles 13, 14 are coated on the edges of the first surface and the second surface of the body 1, respectively, that is, outside the first electrode 11 and the second electrode 12. Preferably, the chromatic circles 13, 14 are evenly distributed on the edges of the two surfaces of the body 1. The chromatic circles 13, 14 can cover the edges of the first electrode 11 and the second electrode 12, and the centers of the first electrode 11 and the second electrode 12 are naked and exhibit the primary color of the electrode surfaces. The primary color of the electrode surfaces is used for electrical connection of components.

[0042] The chromatic circles 13, 14 can be used to distinguish electrical performance parameters of different specifications, such as blue indicating 270 VDC10% and indicating 271, white indicating 470 VDC10% and indicating 471; yellow indicating 510 VDC10% and indicating 511, and so on. Preferably, the chromatic circles 13, 14 are symmetrically distributed on the first and second surfaces of the body 1 of the chip component. It can be understood that the chromatic circles 13, 14 may also not cover the edges of the electrodes 11, 12.

[0043] In conclusion, because the first electrode 11 of the body 1 of the chip component is welded to the second welding part 22 of the bracket 2, when the body 1 is welded to the PCB 3, the first welding part 21 of the bracket 2 and the second electrode 12 of the body 1 are welded to the PCB 3, so that the chip component formed by welding the body 1 and the bracket 2 can be welded by using a conventional welding device or method of the chip components. In addition, the body 1 and the bracket 2 of the chip component have low raw material costs, compared with conventional chip components, the chip component provided by the disclosure can be suitable for automated production, and has a relatively low production cost, which is beneficial to improving the market competitiveness.

[0044] While particular embodiments of the invention have been shown and described, it will be obvious to those skilled in the art that changes and modifications may be made without departing from the invention in its broader aspects, and therefore, the aim in the appended claims is to cover all such changes and modifications as fall within the true spirit and scope of the invention.