ASSEMBLY AND METHOD FOR THE TREATMENT OF OBJECTS

Abstract

An assembly and a method for treating at least one object are disclosed. An ionization chamber/plasma chamber is provided which is connected to a high-voltage source via a high-voltage line. A first valve group has a node and a second valve group has a node, a pump being provided between the first valve group and the second valve group. A treatment chamber is fluidic connectable to the first valve group and the second valve group, and the ionization chamber/plasma chamber is also fluidic connectable to the first valve group and the second valve group.

Claims

1. An assembly for treating at least one object, comprising: an ionization chamber/plasma chamber, connected to a high-voltage source via a high-voltage line; a first valve group having a plurality of valves; a second valve group comprising a plurality of valves, wherein a pump being provided between a node of the first valve group and a node of the second valve group; a treatment chamber, wherein the treatment chamber in fluidic connection with the first valve group via a valve of the first valve group and via a valve of the second valve group, and the ionization chamber/plasma chamber in fluidic connection to the first valve group via a valve of the first valve group and via a valve of the second valve group; at least one gas inlet connected to the first valve group via at least one valve of the first valve group, and a gas outlet connected to the second valve group via at least one valve.

2. The assembly of claim 1, wherein the treatment chamber is in fluidic connection via a line to one of the valves of the first valve group and is in fluidic connection via a line to one of the valves of the second valve group.

3. The assembly of claim 1, wherein the ionization chamber/plasma chamber is in fluidic connection via a line to one of the valves of the first valve group, and is in fluidic connection via a line to one of the valves of the second valve group.

4. The assembly of claim 1, wherein the at least one gas inlet is in fluidic connection via a line to one of the valves of the first valve group, and the gas outlet is in fluidic connection via a line to one of the valves of the second valve group.

5. The assembly of claim 1, wherein a controller is connected to the assembly via a communication link, and, by means of the controller, at least the valves of the first valve group, the valves of the second valve group, the high-voltage source, a discharge structure and the pump are controlled according to need and in time.

6. A method for treating at least one object, characterized by the following steps: placing the at least one object into a treatment chamber; generating a negative pressure in the treatment chamber with a pump which is provided between a node of a first valve group with a plurality of valves and a node of a second valve group with a plurality of valves; filling an ionization chamber/plasma chamber with a process gas via a gas inlet which is connected to a valve of the first valve group and a valve of the second valve group; activating a discharge structure in the ionization chamber/plasma chamber so that the process gas is ionized or activated; extracting the activated or ionized process gas from the ionization chamber/plasma chamber into the treatment chamber by the negative pressure in the treatment chamber via a valve of the first valve group and a valve of the second valve group; pumping off and subsequently ventilating the treatment chamber after an exposure time of the object to the activated or ionized process gas; and, removing the at least one treated object from the treatment chamber.

7. The method of claim 6, wherein, by means of the pump, an enrichment cycle of activated or ionized process gas in the ionization chamber/plasma chamber is carried out, wherein the discharge structure in the ionization chamber/plasma chamber is activated, and a valve of the first valve group and a valve of the second valve group are open so that the ionization chamber/plasma chamber is in fluidic connection to the pump by a circuit.

8. The method of claim 6, wherein the at least one object is placed in the treatment chamber via an airlock, wherein a valve of the second valve group and a further valve of the second valve group are open, so that the treatment chamber forms a fluidic connection via the second valve group with a gas outlet.

9. The method of claim 6, wherein the pump is activated for generating the negative pressure in the treatment chamber, and a valve of the first valve group and a valve of the second valve group are open, so that the treatment chamber forms a fluidic connection to a gas outlet.

10. The method of claim 6, wherein for filling the ionization chamber/plasma chamber with the process gas a valve of the first valve group and a valve of the second valve group are open so that a gas inlet forms a fluidic connection to the ionization chamber/plasma chamber.

11. The method of claim 6, wherein an ionization or activation of the process gas takes place in the ionization chamber/plasma chamber at the activated discharge structure, wherein a valve of the first valve group and a valve of the second valve group are open so that there is a fluidic connection from the treatment chamber via the pump to the gas outlet.

12. The method of claim 6, wherein the activated or ionized process gas is extracted from the ionization chamber/plasma chamber into the treatment chamber, a valve and a further valve of the first valve group being open, so that a fluidic connection exists from the ionization chamber/plasma chamber to the treatment chamber, and the valve and the further valve of the first valve group remain open during an exposure time.

13. The method of claim 6, wherein for pumping off the treatment chamber a valve of the first valve group and a valve of the second valve group are open so that there is a fluidic connection from the treatment chamber via the pump to a gas outlet.

14. The method of claim 6, wherein for ventilating the treatment chamber a valve and a further valve of the second valve group are open so that a fluidic connection is formed from the treatment chamber to a gas outlet.

15. The method of claim 6, wherein a controller is communicatively connected to the assembly so that at least the discharge structure of the ionization chamber/plasma chamber, the valves of the first valve group and the valves of the second valve group are controlled in time.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The embodiments are best understood with reference to the accompanying figures. The size proportions in the figures do not always correspond to the actual size proportions, since some shapes are shown simplified and other shapes are shown enlarged in relation to other elements for better illustration.

[0051] FIG. 1 is a schematic representation of a possible embodiment of the assembly according to the invention for the treatment of at least one object;

[0052] FIG. 2 is a schematic representation of the assignment of a controller to the assembly according to the invention;

[0053] FIG. 3 is a flow chart of the method according to the invention for the treatment of at least one object;

[0054] FIG. 4 illustrates a circuit with the ionization chamber/plasma chamber;

[0055] FIG. 5 illustrates the fluid connection of the treatment chamber to the gas outlet;

[0056] FIG. 6 illustrates the fluid connection for generating the negative pressure in the treatment chamber;

[0057] FIG. 7 illustrates the fluid connection of the gas inlet with the ionization chamber/plasma chamber;

[0058] FIG. 8 illustrates the fluidic connection of the treatment chamber to the gas outlet;

[0059] FIG. 9 illustrates the fluidic connection from the ionization chamber/plasma chamber to the treatment chamber;

[0060] FIG. 10 illustrates the fluidic connection for pumping the process gas out of the treatment chamber; and,

[0061] FIG. 11 illustrates the fluidic connection for ventilating the treatment chamber.

DETAILED DESCRIPTION OF THE DRAWINGS

[0062] Identical reference signs are used for identical elements of the invention or elements of like function. Furthermore, for the sake of clarity, only the reference signs required for the description of the respective figures are shown in the individual figures. The following discussion of the figures describes the assembly and method with a first group of valves comprising three valves and a second group of valves also comprising three valves. This is for descriptive purposes only and should not be construed as a limitation of the invention.

[0063] FIG. 1 shows a schematic representation of a possible embodiment of the assembly 1 according to the invention for the treatment of at least one object 8. The assembly 1 has an ionization chamber/plasma chamber 4 in which a discharge structure 10 is provided. A high-voltage source 2 is connected to the discharge structure 10 in the ionization chamber/plasma chamber 4 via a high-voltage line 3. Assembly 1 also includes a treatment chamber 6 provided with an airlock 7. Via airlock 7 at least one object 8 can be brought into treatment chamber 6. A first valve group 11 and a second valve group 12 are assigned to assembly 1. The first valve group 11 has a node 16 and the second valve group 12 a node 18. The first node 16 and the second node 18 are defined by the meeting of the lines from the valves 3.sub.1, 3.sub.2, and 3.sub.3 of the first valve group 11 and by the meeting of the lines from the valves 4.sub.1, 4.sub.2, and 4.sub.3 of the second valve group 12. A pump 14 connects the first valve group 11 with the second valve group 12 via nodes 16 and 18.

[0064] In assembly 1 the treatment chamber 6 is in fluidic connection to the first valve group 11 and to the second valve group 12. The ionization chamber/plasma chamber 4 is also in fluidic connection to the first valve group 11 and the second valve group 12. In addition, a gas inlet 21 is connected to the first valve group 11 and a gas outlet 22 to the second valve group 12.

[0065] The treatment chamber 6 is in fluidic connection by a line 13 to the first valve 3.sub.1 of the first valve group 11 and is in fluidic connection by a line 15 to the first valve 4.sub.1 of the second valve group 12. The ionization chamber/plasma chamber 4 is in fluidic connection via a line 9 to the second valve 3.sub.2 of the first valve group 11 and is in fluidic connection via a line 5 to the second valve 4.sub.2 of the second valve group 12. Gas inlet 21 is in fluidic connection to the third valve 3.sub.3 of the first valve group 11 via a line 17. The gas outlet 22 is in fluidic connection to the third valve 4.sub.3 of the second valve group 12 via a line 19.

[0066] FIG. 2 shows a schematic representation of the assignment of a controller 50 to the assembly 1 according to the invention. The controller 50 is connected to assembly 1 via a communication link 52. With the controller 50, at least the valves 3.sub.1, 3.sub.2, and 3.sub.3 of the first valve group 11, the valves 4.sub.1, 4.sub.2, and 4.sub.3 of the second valve group 12, the high-voltage source 2, the discharge structure 10, and the pump 14 can be controlled and regulated as required and in time. Communication link 52 can be wired or wireless.

[0067] FIG. 3 shows a flowchart of the method according to the invention for the treatment of at least one object 8. First, the at least one object 8 is brought into a treatment chamber 6 of assembly 1 for treatment. This is done via an airlock 7. Once the at least one object 8 is located in the treatment chamber 6 and the airlock 7 has been closed, a pump 14 is activated. The pump 14 generates a negative pressure in the treatment chamber 6. For generating the negative pressure, the first valve 3.sub.1 of the first valve group 11 and the third valve 4.sub.3 of the second valve group 12 are opened so that the treatment chamber 6 forms a fluidic connection 103 to the gas outlet 22. The remaining valves 3.sub.2 and 3.sub.3 of the first valve group 11 and the valves 4.sub.1 and 4.sub.2 of the second valve group 12 remain closed.

[0068] Then the ionization chamber/plasma chamber 4 is filled with a process gas 20 via the gas inlet 21. Therein a third valve 3.sub.3 of the first valve group 11 and a second valve 4.sub.2 of the second valve group 12 are open. The gas inlet 21 thus is in fluidic connection to the ionization chamber/plasma chamber 4 via the first valve group 11 and the second valve group 12. The discharge structure 10 in the ionization chamber/plasma chamber 4 is activated by the high-voltage source 2 so that ionization or activation of the process gas 20 occurs. Here the remaining valves 3.sub.1 and 3.sub.2 of the first valve group 11 and the valves 4.sub.1 and 4.sub.3 of the second valve group 12 are closed.

[0069] The activated or ionized process gas 20 is extracted by means of negative pressure from the ionization chamber/plasma chamber 4 into the treatment chamber 6. The negative pressure in the treatment chamber 6 ensures that the activated or ionized process gas 20 passes from the ionization chamber/plasma chamber 4 into the treatment chamber 6. Therein the first valve 3.sub.1 and the second valve 3.sub.2 of the first valve group 11 are open, thus the ionization chamber/plasma chamber 4 and the treatment chamber 6 are in fluidic connection to each other.

[0070] The first valve 3.sub.1 and the second valve 3.sub.2 remain open during an exposure time. The valve 3.sub.3 of the first valve group 11 and the valves 4.sub.1, 4.sub.2, and 4.sub.3 of the second valve group 12 remain closed.

[0071] After the exposure time of the object 8 to the activated or ionized process gas 20, the process gas 20 is pumped out of treatment chamber 6. The treatment chamber 6 then is ventilated. Finally, the at least one treated object 8 is removed from the treatment chamber 6 via the airlock 7.

[0072] FIG. 4 shows a representation of the formation of a circuit 101 in assembly 1, where the ionization chamber/plasma chamber 4 is integrated into the circuit 101. Pump 14 is used to perform an enrichment cycle of activated or ionized process gas 20 in the ionization chamber/plasma chamber 4. For the enrichment cycle, the second valve 3.sub.2 of the first valve group 11 and the second valve 4.sub.2 of the second valve group 12 are open. This defines the circuit 101 so that the ionization chamber/plasma chamber 4 and the pump 14 are in fluidic connection to each other.

[0073] FIG. 5 shows a fluidic connection 102 between the treatment chamber 6 and the gas outlet 22. To realize the fluidic connection 102, the first valve 4.sub.3 and the third valve 4.sub.3 of the second valve group 12 are open, so that the treatment chamber 6 forms the fluidic connection 102 via the second valve group 12 with the gas outlet 22.

[0074] FIG. 6 shows a representation of the fluidic connection 103 for generating the negative pressure in the treatment chamber 6. The fluidic connection 103 runs from the treatment chamber 6 via the first valve 3.sub.1 of the first valve group 11, the pump 14 and the third valve 4.sub.3 of the second valve group 12 to the gas outlet 22. The negative pressure in the treatment chamber 6 is generated by means of the pump 14. Therein the first valve 3.sub.1 of the first valve group 11 and the third valve 4.sub.3 of the second valve group 12 are open.

[0075] FIG. 7 shows the fluidic connection 104 of the gas inlet 21 with the ionization chamber/plasma chamber 4. The fluidic connection 104 runs from the gas inlet 21 via the third valve 3.sub.3 of the first valve group 11 and the second valve 4.sub.2 of the second valve group 12 to the ionization chamber/plasma chamber 4. Via the fluidic connection 104 the ionization chamber/plasma chamber 4 can be filled with the process gas 20. The third valve 3.sub.3 of the first valve group 11 and the second valve 4.sub.2 of the second valve group 12 are open.

[0076] FIG. 8 is a representation of the fluidic connection 105 of the treatment chamber 6 to the gas outlet 22 of the treatment chamber 6. At the activated discharge structure 10 in the ionization chamber/plasma chamber 4 the process gas 20 is ionized or activated. The fluidic connection 105 runs from the treatment chamber 6 via a line 13 to the first valve 3.sub.1 of the first valve group 11, the pump 14, and the third valve 4.sub.3 of the second valve group 12 to the gas outlet 22. Therein the first valve 3.sub.1 of the first valve group 11 and the third valve 4.sub.3 of the second valve group 12 are open.

[0077] FIG. 9 shows the fluidic connection 106 from the ionization chamber/plasma chamber 4 to the treatment chamber 6. The activated or ionized process gas 20 is extracted from the ionization chamber/plasma chamber 4 into the treatment chamber 6. Therein the fluidic connection 106 runs from the ionization chamber/plasma chamber 4 via the second valve 3.sub.2 and the first valve 3.sub.1 of the first valve group 11 to the treatment chamber 6. Therein the first valve 3.sub.1 and the second valve 3.sub.2 of the first valve group 11 are open. The first valve 3.sub.1 and the second valve 3.sub.2 remain open during an exposure time of the object in the treatment chamber 6 to the activated or ionized process gas 20.

[0078] FIG. 10 shows the fluidic connection 107 for pumping the process gas 20 out of the treatment chamber 6. The fluidic connection 107 for pumping off the treatment chamber 6 runs from the treatment chamber 6 via the first valve 3.sub.1 of the first valve group 11, the pump 14 and the third valve 4.sub.3 of the second valve group 12 to the gas outlet 22. The first valve 3.sub.1 of the first valve group 11 and the third valve 4.sub.3 of the second valve group 12 are open.

[0079] FIG. 11 shows the fluidic connection 108 for ventilating the treatment chamber 6. The fluidic connection 108 for ventilation runs from treatment chamber 6 via the first valve 4.sub.1 and the third valve 4.sub.3 of the second valve group 12 to the gas outlet 22. The first valve 4.sub.1 and the third valve 4.sub.3 of the second valve group 12 are open.

[0080] The invention has been described with reference to preferred embodiments. However, it would have been obvious to a person skilled in the art that changes and modifications can be made without leaving the scope of protection of the appended claims.

REFERENCE SIGNS

[0081] 1 Assembly [0082] 2 High-voltage source [0083] 3 High-voltage line [0084] 3.sub.1, 3.sub.2, . . . , 3.sub.N Valve [0085] 4 Ionization chamber/Plasma chamber [0086] 4.sub.1, 4.sub.2, . . . , 4.sub.N Valve [0087] 5 Line [0088] 6 Treatment chamber [0089] 7 Airlock [0090] 8 Object [0091] 9 Line [0092] 10 Discharge structure [0093] 11 First valve group [0094] 12 Second valve group [0095] 13 Line [0096] 14 Pump [0097] 15 Line [0098] 16 Node [0099] 17 Line [0100] 18 Node [0101] 19 Line [0102] 20 Process gas [0103] 21 Gas inlet [0104] 22 Gas outlet [0105] 50 Controller [0106] 52 Communication link [0107] 101 Circuit [0108] 102 Fluidic connection [0109] 103 Fluidic connection [0110] 104 Fluidic connection [0111] 105 Fluidic connection [0112] 106 Fluidic connection [0113] 107 Fluidic connection [0114] 108 Fluidic connection