System and method for a magnetically coupled inductor boost and multiphase buck converter with split duty cycle
10574144 ยท 2020-02-25
Assignee
Inventors
- Ramanujam Ramabhadran (Niskayuna, NY, US)
- Kum-Kang Huh (Niskayuna, NY)
- Mohammed Agamy (Niskayuna, NY)
- Ahmed Elasser (Niskayuna, NY)
Cpc classification
H02M1/0064
ELECTRICITY
H02M3/158
ELECTRICITY
Y02T10/72
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H02M3/156
ELECTRICITY
H02M1/14
ELECTRICITY
Y02T90/14
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H02M3/1584
ELECTRICITY
B60L53/20
PERFORMING OPERATIONS; TRANSPORTING
Y02T10/70
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H02M3/1588
ELECTRICITY
H02M1/084
ELECTRICITY
B60L58/20
PERFORMING OPERATIONS; TRANSPORTING
Y02T10/7072
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
H02M3/158
ELECTRICITY
B60L53/20
PERFORMING OPERATIONS; TRANSPORTING
H02M1/084
ELECTRICITY
Abstract
According to various embodiments, a DC/DC conversion system is disclosed. The DC/DC conversion system includes a boost converter coupled to a plurality of parallel buck converters. The boost converter and plurality of buck converters each include an inductor, where the inductors are magnetically coupled to each other. The DC/DC conversion system further includes a control system configured to control the boost converter and plurality of buck converters such that combined duty cycles of the plurality of buck converters are about equal to a duty cycle of the boost converter and the duty cycles of the plurality of buck converters are modulated out of phase.
Claims
1. A DC/DC conversion system comprising: a boost converter coupled to a plurality of parallel buck converters, the boost converter and plurality of buck converters each comprising an inductor, the inductors being magnetically coupled to each other; and a control system configured to control the boost converter and plurality of buck converters such that combined duty cycles of the plurality of buck converters are about equal to a duty cycle of the boost converter, and the duty cycles of the plurality of buck converters are modulated out of phase.
2. The DC/DC conversion system of claim 1, further comprising a voltage source coupled to an input of the boost converter.
3. The DC/DC conversion system of claim 2, wherein the voltage source comprises at least one of a battery, ultracapacitor, and fuel cell.
4. The DC/DC conversion system of claim 1, further comprising a voltage load coupled to outputs of the plurality of buck converters.
5. The DC/DC conversion system of claim 4, wherein the voltage load comprises one of a battery and ultracapacitor.
6. The DC/DC conversion system of claim 1, wherein the boost converter further comprises a diode coupled to a switching device.
7. The DC/DC conversion system of claim 1, wherein each of the buck converters further comprises a switching device coupled to a diode.
8. A method of operating a DC/DC conversion system, the DC/DC conversion system including a boost converter coupled to two parallel buck converters, the method comprising: controlling a switching device in the boost converter to be conducting for about an equal amount of time that a switching device in each of the two buck converters is conducting combined; and controlling the switching device in each of the two buck converters such that one switching device in one buck converter is not conducting when the other switching device in the other buck converter is conducting.
9. The method of claim 8, wherein the DC/DC conversion system further comprises a voltage source.
10. The method of claim 8, wherein the DC/DC conversion system further comprises a voltage load.
11. The method of claim 8, wherein the boost converter further comprises a diode coupled to a switching device.
12. The method of claim 8, wherein each of the two buck converters further comprises a switching device coupled to a diode.
13. A DC/DC conversion system comprising: a first boost converter coupled to a first plurality of parallel buck converters, the first boost converter and first plurality of buck converters each comprising an inductor, this first plurality of inductors being magnetically coupled to each other; a second boost converter coupled to a second plurality of parallel buck converters, the second boost converter and second plurality of buck converters each comprising an inductor, this second plurality of inductors being magnetically coupled to each other; and a control system configured to control the first boost converter, second boost converter, first plurality of buck converters, and second plurality of buck converters such that: combined duty cycles of the first plurality of buck converters is about equal to a duty cycle of the first boost converter, and the duty cycles of the first plurality of buck converters are modulated out of phase; combined duty cycles of the second plurality of buck converters is about equal to a duty cycle of the second boost converter, and the duty cycles of the second plurality of buck converters are modulated out of phase; and duty cycles of the first and second boost converters are modulated out of phase.
14. The DC/DC conversion system of claim 13, further comprising a voltage source coupled to an input of the first boost converter and an input of the second boost converter.
15. The DC/DC conversion system of claim 14, wherein the voltage source comprises at least one of a battery, ultracapacitor, and fuel cell.
16. The DC/DC conversion system of claim 13, further comprising a voltage load coupled to outputs of the first and second plurality of buck converters.
17. The DC/DC conversion system of claim 16, wherein the voltage load comprises one of a battery and ultracapacitor.
18. The DC/DC conversion system of claim 13, wherein the first and second boost converters are bi-directional.
19. The DC/DC conversion system of claim 13, wherein each of the buck converters are bi-directional.
20. The DC/DC conversion system of claim 13, further comprising a resonant circuit coupled to each of the buck converters.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) In order for the advantages of the invention to be readily understood, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings. Understanding that these drawings depict only exemplary embodiments of the invention and are not, therefore, to be considered to be limiting its scope, the invention will be described and explained with additional specificity and detail through the use of the accompanying drawings, in which:
(2)
(3)
(4)
(5)
(6)
DETAILED DESCRIPTION OF THE INVENTION
(7) Disclosed herein is a boost buck multiphase DC/DC conversion system for a 48V to 12V system. The inductors are magnetically coupled and the duty cycle of the buck component is split so that the total ON time of the buck component is equivalent to the ON time of the boost component.
(8)
(9) According to various embodiments,
(10) The voltage source 102 is coupled to a boost converter 104. The boost converter includes an inductor 106 coupled to a diode 108 and a switching device 110. The switching device 110 may include an antiparallel diode. As nonlimiting examples, the switching device 110 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. In an alternative embodiment, diode 108 may be replaced with another switching device to allow for bi-directional operation. The polarity of the inductor depends on whether ripple reduction is achieved at the input or output.
(11) The boost converter 104 is coupled to a buck converter 112. The buck converter 112 includes a switching device 114 and a diode 116 coupled to an inductor 118. The switching device 114 may include an antiparallel diode. As nonlimiting examples, the switching device 114 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. In an alternative embodiment, diode 116 may be replaced with another switching device to allow for bi-directional operation. The polarity of the inductor depends on whether ripple reduction is achieved at the input or output.
(12) The inductor 106 of the boost converter 104 and the inductor 118 of the buck converter 112 are magnetically coupled together, as shown by the dashed double lines. The polarities of the inductors 106 and 118 should be the same. Magnetically coupling the inductors 106 and 118 reduces ripple and obtains higher dynamic impedance.
(13) The switching devices 110 and 114 of the boost converter 104 and buck converter 112 are pulse width modulated are the same time, with the same duty cycle and frequency.
(14) A voltage load 120 is coupled to the buck converter 112. The voltage load 120 may be a second energy storage device, such as a battery, capacitor, or ultracapacitor, as nonlimiting examples. In an exemplary embodiment, the voltage load 120 is about 12V, but other voltages may be used in other embodiments. The voltage load 120 may also be an electrical machine, such as a traction motor or other permanent magnet or induction motor.
(15) In an alternative embodiment, where diodes 108 and 116 are replaced with switching devices to allow for bi-directional operation, voltage source 102 and voltage load 120 may be reversed such that voltage source 102 would be the load and voltage load 120 would be the source.
(16) A filter capacitor 122 may also be included between the boost converter 104 and buck converter 112. The system also includes a control system 124 configured to operate the switching devices 110 and 114.
(17) According to an exemplary embodiment,
(18) The voltage source 202 is coupled to a boost converter 204. The boost converter includes an inductor 206 coupled to a diode 208 and a switching device 210. The switching device 210 may include an antiparallel diode. As nonlimiting examples, the switching device 210 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. In an alternative embodiment, diode 208 may be replaced with another switching device to allow for bi-directional operation. The polarity of the inductor depends on whether ripple reduction is achieved at the input or output. It is also to be noted that the boost converter 204 may be used for power factor correction, particularly in an embodiment where the voltage source 202 is an external voltage source.
(19) The boost converter 204 is coupled to a plurality of buck converters, the plurality of buck converters being coupled to each other in parallel. In the embodiment shown, the boost converter 204 is coupled to a first buck converter 212 and a second buck converter 214. However, any number of buck converters coupled in parallel may be included in alternative embodiments. The first buck converter 212 includes a switching device 216 and a diode 218 coupled to an inductor 220. The switching device 216 may include an antiparallel diode. As nonlimiting examples, the switching device 216 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. In an alternative embodiment, diode 218 may be replaced with another switching device to allow for bi-directional operation. The polarity of the inductor depends on whether ripple reduction is achieved at the input or output. The second buck converter 214 includes a switching device 222 and a diode 224 coupled to an inductor 226. The switching device 222 may include an antiparallel diode. As nonlimiting examples, the switching device 222 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. In an alternative embodiment, diode 224 may be replaced with another switching device to allow for bi-directional operation. The polarity of the inductor depends on whether ripple reduction is achieved at the input or output.
(20) The inductor 206 of the boost converter 204, and the inductors 220 and 226 of the first and second buck converters 212 and 214, respectively, are magnetically coupled together, as shown by the dashed double lines. The polarities of the inductors 206, 220, and 226 should be the same. Magnetically coupling the inductors 206, 220, and 226 reduces ripple and obtains higher dynamic impedance.
(21) A voltage load 228 is coupled to the plurality of buck converters. In this embodiment, the voltage load 228 is coupled to the first buck converter 212 and the second buck converter 214. The voltage load 228 may be a second energy storage device, such as a battery, capacitor, or ultracapacitor, as nonlimiting examples. In an exemplary embodiment, the voltage load 228 is about 12V, but other voltages may be used in other embodiments. The voltage load 228 may also be an electrical machine, such as a traction motor or other permanent magnet or induction motor.
(22) In an alternative embodiment, where diodes 208, 218, and 224 are replaced with switching devices to allow for bi-directional operation, voltage source 202 and voltage load 228 may be reversed such that voltage source 202 would be the load and voltage load 228 would be the source.
(23) A filter capacitor 230 may also be included between the boost converter 204 and the plurality of buck converters (e.g. first and second buck converters 212 and 214). The system also includes a control system 232 configured to operate the switching devices 210, 216, and 222.
(24)
(25) According to an alternative embodiment,
(26) The voltage source 302 is coupled to a plurality of boost converters, the plurality of boost converters being coupled to each other in parallel. In the embodiment shown, the voltage source 302 is coupled to a first boost converter 304 and a second boost converter 306. The first boost converter 304 includes an inductor 308 coupled to switching devices 310 and 312. The switching devices 310 and 312 may include an antiparallel diode. As nonlimiting examples, the switching devices 310 and 312 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. The polarity of the inductor 308 depends on whether ripple reduction is achieved at the input or output. It is also to be noted that switching devices 310 and 312 are included for bi-directional operation, but switching device 310 may be replaced with a diode for a unidirectional boosting operation.
(27) The second boost converter 306 includes an inductor 314 coupled to switching devices 316 and 318. The switching devices 316 and 318 may include an antiparallel diode. As nonlimiting examples, the switching devices 316 and 318 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. The polarity of the inductor 314 depends on whether ripple reduction is achieved at the input or output. It is also to be noted that switching devices 316 and 318 are included for bi-directional operation, but switching device 316 may be replaced with a diode for a unidirectional boosting operation.
(28) Each boost converter in the DC/DC conversion system 300 is coupled to a plurality of buck converters, the plurality of buck converters being coupled to each other in parallel. In the embodiment shown, the first boost converter 304 is coupled to a first buck converter 320 and a second buck converter 322. However, any number of buck converters coupled in parallel may be included in alternative embodiments. The first buck converter 320 includes switching devices 324 and 326 coupled to an inductor 328. The switching devices 324 and 326 may include an antiparallel diode. As nonlimiting examples, the switching devices 324 and 326 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. In an alternative embodiment, switching device 326 may be replaced with a diode for unidirectional bucking operation. The polarity of the inductor 328 depends on whether ripple reduction is achieved at the input or output. The second buck converter 322 includes switching devices 330 and 332 coupled to an inductor 334. The switching devices 330 and 332 may include an antiparallel diode. As nonlimiting examples, the switching devices 330 and 332 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. In an alternative embodiment, switching device 332 may be replaced with a diode for unidirectional bucking operation. The polarity of the inductor 334 depends on whether ripple reduction is achieved at the input or output.
(29) The inductor 308 of boost converter 304, and the inductors 328 and 334 of the first and second buck converters 320 and 322, respectively, are magnetically coupled together. Though not shown in
(30) The second boost converter 306 is coupled to a third buck converter 336 and a fourth buck converter 338. However, any number of buck converters coupled in parallel may be included in alternative embodiments. The third buck converter 336 includes switching devices 340 and 342 coupled to an inductor 344. The switching devices 340 and 342 may include an antiparallel diode. As nonlimiting examples, the switching devices 340 and 342 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. In an alternative embodiment, switching device 342 may be replaced with a diode for unidirectional bucking operation. The polarity of the inductor 344 depends on whether ripple reduction is achieved at the input or output. The second buck converter 338 includes switching devices 346 and 348 coupled to an inductor 350. The switching devices 346 and 348 may include an antiparallel diode. As nonlimiting examples, the switching devices 346 and 348 may be GaN HEMTs, Si or SiC MOSFETs, IGBTs, MCTs, Thyristors, GTOs, or IGCTs, though preferred embodiments would utilize MOSFETs. In an alternative embodiment, switching device 348 may be replaced with a diode for unidirectional bucking operation. The polarity of the inductor 350 depends on whether ripple reduction is achieved at the input or output.
(31) The inductor 314 of second boost converter 306, and the inductors 344 and 350 of the third and fourth buck converters 336 and 338, respectively, are magnetically coupled together. Though not shown in
(32) A voltage load 352 is coupled to each of the buck converters. In this embodiment, the voltage load 352 is coupled to the first buck converter 320, the second buck converter 322, the third buck converter 336, and the fourth buck converter 338. The voltage load 352 may be a second energy storage device, such as a battery, capacitor, or ultracapacitor, as nonlimiting examples. In an exemplary embodiment, the voltage load 352 is about 12V, but other voltages may be used in other embodiments. The voltage load 352 may also be an electrical machine, such as a traction motor or other permanent magnet or induction motor.
(33) A filter capacitor may also be included between each boost converter and buck converter. In the embodiment shown, a first filter capacitor 354 is included between the first boost converter 304 and buck converters 320 and 322, and a second filter capacitor 356 is included between the second boost converter 306 and buck converters 336 and 338.
(34) A resonant circuit system may also be included as well if zero circuit switching is required. Each bucking section would include a resonant inductor and resonant capacitor as shown in
(35) The system also includes a control system 374 configured to operate the switching devices 310, 312, 316, 318, 324, 326, 330, 332, 340, 342, 346, and 348.
(36)
(37) The duty cycle of the switching device 318 of the second boost converter 306 should be equal to the total duty cycle of the switching devices in the second plurality of buck converters. For instance, as shown by
(38) The switching devices of each boost and buck section are also configured to be out of phase. For instance, as shown by
(39) As such, disclosed herein is a split duty cycle control based magnetically coupled inductor boost buck conversion system that can enable multiphase buck or boost converter operation with magnetic coupling of the inductors.
(40) It is understood that the above-described embodiments are only illustrative of the application of the principles of the present invention. The present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. All changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope. Thus, while the present invention has been fully described above with particularity and detail in connection with what is presently deemed to be the most practical and preferred embodiment of the invention, it will be apparent to those of ordinary skill in the art that numerous modifications may be made without departing from the principles and concepts of the invention as set forth in the claims.