DURABLE WATER AND OIL REPELLENT POLYMERIC DEVICES
20230226777 · 2023-07-20
Inventors
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
B29L2031/772
PERFORMING OPERATIONS; TRANSPORTING
B29K2083/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A durable superomniphobic device is presented where the polymeric device has a surface that includes doubly re-entrant micropillars residing within pockets that are partitioned within a matrix of interconnected doubly re-entrant walls. The doubly re-entrant matrix can be in a pattern where walls that are equal to or greater in height to the micropillars intersect or otherwise contact to provide protection to the more fragile micropillars. These durable superomniphobic devices can be formed by injection molding and can repel liquids having a surface tension of about 18 to about 98 mN m.sup.−1 and display liquid contact angle of greater than or equal to 150°.
Claims
1. A durable superomniphobic device, comprising a polymer having a surface that comprises a plurality of doubly re-entrant micropillars residing within a plurality of pockets partitioned within a matrix comprising interconnected doubly re-entrant walls.
2. The durable superomniphobic polymeric device according to claim 1, wherein the polymer comprises a thermoplastic.
3. The durable superomniphobic polymeric device according to claim 2, wherein the thermoplastic is polypropylene (PP), polystyrene (PS), polyethylene terephthalate (PET), terephthalate copolymer polyester (Tritan), styrene acrylonitrile (SAN), polyacrylic acids (PAA), acrylonitrile butadiene styrene (ABS), nylon, polylactic acid (PLA), polybenzimidazole (PBI), polycarbonate (PC), polyetherimide (PEI), polyphenylene sulfide (PPS), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polyurethane (PU), Teflon, or fluorinated poly(ethylene-co-propylene) (FEP).
4. The durable superomniphobic polymeric device according to claim 1, wherein the polymer comprises a thermosetting resin.
5. The durable superomniphobic polymeric device according to claim 4, wherein the thermosetting resin is polydimethylsiloxane (PDMS), polyester, vinylester, epoxy, phenolic, polyamide (PA), and bismaleimide (BMI).
6. The durable superomniphobic polymeric device according to claim 1, wherein the polymer includes an additive.
7. The durable superomniphobic polymeric device according to claim 6, wherein the additive is one or more of a catalyst, particulate filler, or a stabilizer.
8. The durable superomniphobic polymeric device according to claim 1, wherein the doubly re-entrant matrix comprises a pattern that is periodic, quasiperiodic, random, or any combination thereof.
9. The durable superomniphobic polymeric device according to claim 1, wherein the doubly re-entrant matrix comprises a pattern comprising squares, rectangles, triangles, hexagons, intersecting circles, or intersecting ovals.
10. The durable superomniphobic polymeric device according to claim 1, wherein a liquid contact angle of a fluid with a surface tension of about 18 to about 98 mN m.sup.−1 is greater than or equal to 150°.
11. A method of producing a superomniphobic polymeric device, comprising: providing a mold for a superomniphobic polymeric device, the superomniphobic polymeric device comprising a plurality of doubly re-entrant micropillars residing within a plurality of pockets partitioned within a matrix comprising interconnected doubly re-entrant walls having the micropillars and reentrant armor matrix; injecting a fluid polymer into the mold; solidifying the fluid polymer to yield the superomniphobic polymeric device within the mold; and releasing the superomniphobic polymeric device from the mold.
12. The method according to claim 11, wherein providing comprises: forming the mold about a master device, wherein the mater device comprises a structure of the superomniphobic polymeric device; and removing the master device from the mold.
13. The method according to claim 12, further comprising: staging a photosensitive resin or a plurality of metal particles within a 3D printer; irradiating the photosensitive resin or the plurality of metal particles with at least one laser beam; curing volumes of the photosensitive resin or fusing volumes of the plurality of metal particles irradiated by the laser beam to form the master device; and isolating the master device from the photosensitive resin or the plurality of metal particles not irradiated by the laser beam.
14. The method according to claim 12, wherein forming the mold comprises: casting a polydimethylsiloxane (PDMS) resin about the master device; gelling the PDMS resin to form the mold around the master device; and removing the master device from the mold.
15. The method according to claim 14, wherein removing is delaminating or peeling the mold from the master device.
16. The method according to claim 12, wherein the master device is a previously manufactured superomniphobic polymeric device.
17. The method according to claim 11, wherein the mold is reusable.
18. A composite device, comprising a durable superomniphobic polymeric device laminated to a substrate device, wherein the durable superomniphobic polymeric device comprises a polymer having a surface that comprises a plurality of doubly re-entrant micropillars residing within a plurality of pockets partitioned within a matrix comprising interconnected doubly re-entrant walls.
19. The composite device according to claim 18, wherein the substrate device comprises a metal, polymer, ceramic, wood, paper, fabric, or glass.
20. The composite device according to claim 16, wherein the durable superomniphobic polymeric device comprises a thermoplastic or a thermosetting resin.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DISCLOSURE OF THE INVENTION
[0019] Embodiments are directed to devices with at least one component that provides doubly re-entrant micropillars and at least one second component that provides an interconnected double re-entrant matrix projected from a base surface, an armor, to form a partitioned elevated surface that imparts a resistance to normal impact or abrasion during use of the device so as to maintain the device's superpomniphobic. The re-entrant micropillars reside in pockets defined by the intersection or otherwise connection and mutual reinforcement of walls that form the re-entrant matrix. The re-entrant structure at the top of the walls retain the superpomniphobic nature of the surface, unlike equivalent walls absent the re-entrant structure.
[0020] The structure of individual re-entrant micropillars are equivalent in function to that illustrated in
[0021] The height of the armor walls of the re-entrant matrix are equal to or greater than the height of the micropillars, for example, but not necessarily, 1.01 to about 2 times the height of the micropillars. The re-entrant matrix resists deformation upon impact and abrasion, such that the re-entrant micropillars within the pockets are protected within the volume defined by the walls of the matrix. The matrix can have any pattern, for example a square, rectangular, triangular, hexagonal, intersecting circles, intersecting ovals, or any periodic, quasiperiodic, or random pattern of one or more shapes such that a double re-entrant armor matrix can protect the re-entrant micropillars within the pockets from damage by normal abrasion or impact experienced when using the superpomniphobic device. The material of construction is a polymeric material resulting in a device that is super-repellent to all liquids with surface tension of about 18 to about 98 mN m.sup.−1. The protective double re-entrant matrix, according to embodiments, provides the polymeric device with a surface that is robust and durable. The durable superpomniphobic device can be a sheet or have any geometry for a structure that benefits from its superpomniphobicity, where the durable superpomniphobic surface can be on an exterior face, such as, but not limited to a building, furniture, tools, or utensils, or an interior face, such as, but not limited to, the interior of a tube or pipe.
[0022] As shown in
[0023] In embodiments, the polymer can be a thermoplastic, such as, but not limited to, polypropylene (PP), polystyrene (PS), polyethylene terephthalate (PET), terephthalate copolymer polyester (Tritan), styrene acrylonitrile (SAN), polyacrylic acids (PAA), acrylonitrile butadiene styrene (ABS), nylon, polylactic acid (PLA), polybenzimidazole (PBI), polycarbonate (PC), polyetherimide (PEI), polyphenylene sulfide (PPS), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polyurethane (PU), Teflon, fluorinated poly(ethylene-co-propylene) (FEP), or any polymer that can be injection molded. Any available thermoplastics can be used for the inj ection-molding without the requirement of any additives, or additives can be included to modify and supplement the properties, formation, or fixing of the polymer as the superomniphobic device. The polymer can be a thermosetting resin that can be reactive injection molded, or any other molding process where a fluid polymer or prepolymer can flow into a mold and be fixed by chemical or physical associations within the polymer. The thermosetting resin can be, but is not limited to, polydimethylsiloxane (PDMS), polyester, vinylester, epoxy, phenolic, polyamide (PA), and bismaleimide (BMI). In embodiments, a transparent polymer is used, leading to a device that is transparent or nearly transparent, as shown in
[0024] The superomniphobic device formed in this manner can be used as molded or can be laminated to a surface of a substrate device to form a composite device where the superomniphobic device imparts the superhydrophobicity to the composite device. The substrate device can be a metal, polymer, wood, paper, fabric, ceramic, or glass device, where the durable superomniphobic device adheres, coheres, or is otherwise fixed mechanically to at least a portion of the surface of the substrate device. The nature of the adhesive, cohesive process, or fixing process can be any practiced in the art to couple two defined solid surfaces, as would be appreciated by the skilled artisan.
[0025] These polymeric superomniphobic devices have excellent repellency to diverse liquids, as illustrated by fluid beads on the surfaces of a device in
[0026] According to an embodiment, injection molding can be employed to produce the durable superomniphobic polymeric device. The fabrication method is outlined in
[0027] Depending upon the 3D printing system, including the supporting tray employed to support the build during printing, adhesion of the master, particularly the doubly re-entrant armour, to the tray may be problematic and should be avoided or alleviated. For example, the mold master may be produced with precision using a stereolithographic (SLA) 3D printer with a precision of at least 10 μm where a sacrificial layer is deposited on the tray that can be removed with destruction of it as a layer but without imposing a load on the re-entrant structures. For example, the layer may be one that can be liquified, for example, by dissolving and draining from the superomniphobic structure formed. For example, a polyvinyl alcohol layer of about 1 to about 5 μm, may be used as the support during printing and subsequently dissolved in water, which is readily shed by the mold master, as illustrated in
[0028] The master device can be formed of a material that is dissimilar in material to that of the mold and the master device can be a previously prepared polymeric superomniphobic device. The generally, but not necessarily, harder material master device, relative to that of the mold, permits the mold to be cleanly removed from the master device, such that the mold can be used subsequently to generate a plurality of durable superomniphobic devices. Although the exemplary mold is formed by the gelling of a PDMS resin, other rubbery materials can be used to form the mold, requiring only that the mold material does not adhere or deform during the molding process with the master device material or the polymeric material of the durable superomniphobic device. When the durable superomniphobic device is an elastomeric device, the mold may be a rigid material and the delamination of the elastomeric superomniphobic device can occur by the shape deformation of the elastomeric device during release from the rigid mold.
[0029] All patents, patent applications, provisional applications, and publications referred to or cited herein are incorporated by reference in their entirety, including all figures and tables, to the extent they are not inconsistent with the explicit teachings of this specification.
[0030] It should be understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application. In addition, any elements or limitations of any invention or embodiment thereof disclosed herein can be combined with any and/or all other elements or limitations (individually or in any combination) or any other invention or embodiment thereof disclosed herein, and all such combinations are contemplated with the scope of the invention without limitation thereto.
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