Electronic device grade single crystal diamonds and method of producing the same
10550492 ยท 2020-02-04
Inventors
Cpc classification
C30B25/186
CHEMISTRY; METALLURGY
International classification
C30B25/20
CHEMISTRY; METALLURGY
H05H1/30
ELECTRICITY
Abstract
A method utilising microwave plasma chemical vapour deposition (MPCVD) process of producing electronic device grade single crystal diamond comprising of: (a) selecting a diamond seed or substrate having a pre-determined orientation, (b) cleaning and/or etching of non-diamond phases and other induced surface damages from the diamond seed or substrate, whereby this step can be performed one or more times, (c) growing a layer of extremely low crystal defect density diamond surface on the cleaned/etched diamond seed or substrate, whereby this step can be performed one or more times, and (d) growing electronics device grade single crystal diamond on top of the layer of the low crystal defect density diamond surface.
Claims
1. A method utilising microwave plasma chemical vapour deposition (MPCVD) process of producing electronic device grade single crystal diamond comprising: (a) selecting a diamond seed or substrate having a pre-determined orientation having non-diamond phases or other induced surface damages, (b) pre-growth conditioning the seed diamond or substrate by cleaning and etching of said non-diamond phases and other induced surface damages from the diamond seed or substrate, whereby this step is performed one or more times, and wherein this step comprises removing non-diamond phases from the substrate by cleaning it in a boiling acid bath having temperature greater than 300 C. and subsequently plasma etching for 30 to 180 minutes, at an etching temperature from 700 C. to 1200 C. in a MPCVD chamber having an atmosphere with a pressure of 13.3 to 40 kPa (100 to 300 torr), and wherein the atmosphere therein comprises of 0.1% to 10% oxygen per unit of hydrogen; (c) growing a layer of extremely low crystal defect density diamond surface on the cleaned/etched diamond seed or substrate one or more times wherein the growth process takes place at a temperature from about 700 C. to about 1200 C. in a MPCVD chamber, wherein the atmosphere comprises 1% to 15% CH.sub.4 per unit of H.sub.2 and from 1% to 50% 02 per unit of CH.sub.4; and (d) thereafter growing electronics device grade single crystal diamond on top of the layer or layers of the low crystal defect density diamond surface at a temperature of about 700 C. to about 1200 C. in the MPCVD chamber, wherein the pressure comprises about 100 to about 300 torr and the atmosphere comprises a mixture of about 0.1% to about 15% CH.sub.4 per unit of H.sub.2 only, the growth rate of the electronic device grade single crystal diamond being 1 m/hour to 15 m/hour.
2. The method according to claim 1, wherein the diamond seed or substrate have an orientation of {100}.
3. The method accordingly to claim 1, wherein step (a) comprises of looking at the high magnification optical images of 100 to check for surface defects, polishing induced defects, etch pits and inclusions.
4. The method according to claim 1, wherein step (a) further comprises of subsequently performing cross-polarised imaging on the diamond seed to check for the presence of any lattice imperfection as a result of strain, and performing crystal-axis check of the substrate to ensure that off-axis angle relative to the {100} orientation axis does not exceed 3 degrees, and if necessary, etching the top surface to reveal and/or remove the surface damage to reduce the overall defect density.
5. The method according to claim 1, wherein the plasma etching method for diamond preparations take place in a MPCVD chamber considerably free of nitrogen, and the MPCVD chamber comprises gas precursors which are well purified such that the total impurities are less than 500 ppb.
6. The method of claim 1 wherein there is no traces of detectable nitrogen at 270 nm in the UV region spectrum.
Description
BRIEF DESCRIPTION OF DRAWINGS
(1) The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
(2) This then generally describes the invention but to assist with understanding reference will now be made to the accompanying drawings which show preferred embodiments of the invention.
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DETAILED DESCRIPTION
(15) The Figures are diagrammatic and not drawn to scale. In the Figures, elements which correspond to elements already described have the same reference numerals.
(16) According to an aspect of the present invention, there is provided a method utilising microwave plasma chemical vapour deposition (MPCVD) process to produce electronic device grade single crystal diamonds.
(17) The first step comprises of selecting a diamond seed or substrate having a pre-determined orientation. In a preferred embodiment of the present invention, the orientation of the diamond seeds or substrate is {001}. In a preferred embodiment of the present invention, the selection of the substrate having a pre-determined orientation is performed by looking at the high magnification optical images of 100 to check for surface defects, polishing induced defects, etch pits and inclusions. In another embodiment of the present invention, the high magnification optical images of 40 may be used. In a preferred embodiment of the present invention, a cross-polarized imaging may be performed on the High Pressure, High Temperature (HPTH) grown, natural, or MPCVD grown diamond to check for the presence of any lattice imperfection as a result due to strain. Crystal-axis check of the substrate is also performed to ensure that off-axis angle relative to the {100} orientation axis does not exceed 3 degrees. If necessary, etching the top surface of the substrate to reveal and/or remove the surface damage is performed to reduce the overall defect density.
(18) The second step comprises of cleaning and/or etching of non-diamond phases and other induced surface damages from the diamond seed or substrate. Non-diamond phases are removed from the substrate by cleaning it in a boiling acid bath having temperature greater than 300 C. and subsequently underwent different plasma etching for 30 to 180 minutes. Plasma etching of acid cleaned substrates by microwave plasma chemical vapour deposition (MPCVD) involves etching temperature from about 700 C. to about 1200 C. in a MPCVD chamber having an atmosphere with a pressure of about 100 to 300 torr, wherein the atmosphere therein comprises of about 0.1% to about 10% oxygen per unit of hydrogen. The plasma etching method for substrate preparations take place in a MPCVD chamber considerably free of nitrogen. The MPCVD chamber also comprises of gas precursors which are well purified such that the total impurities is less than 500 ppb in a preferred embodiment of the present invention. In other embodiments, the impurities may be less than 1 ppm.
(19) The third step comprises of growing a layer of extremely low crystal defect density diamond surface on the cleaned/etched diamond seed or substrate. The pre-growth process for production of electronic device grade single crystal diamond by microwave plasma chemical vapour deposition (MPCVD) on the growth surface of the diamond seeds takes place at a temperature from about 700 C. to about 1200 C. in a MPCVD chamber, wherein the atmosphere therein comprises of a mixture of about 1% to about 15% CH.sub.4 per unit of H.sub.2 only or with some additional mixture of about 1% to about 50% O.sub.2 per unit of CH.sub.4.
(20) The fourth step comprises of growing electronic device grade single crystal diamond on top of the layer of low crystal defect density diamond surface. The method of growing electronic device grade single crystal diamond includes controlling temperature of a growth surface of about 700 C. to about 1200 C. in a MPCVD chamber, wherein the pressure therein comprises of about 100 to about 300 torr and the atmosphere therein comprises of a mixture of about 0.1% to about 15% CH.sub.4 per unit of H.sub.2.
(21) It is submitted that the growth rate of electronic device grade single crystal diamond is about 1 m/hour to 15 m/hour.
(22) In other embodiments of the present invention, the second and third steps may be repeated more than one time so as to achieve a desired and optimum result.
(23) During the whole process of pre-growth and growth of electronic device grade single-crystal diamond, the incorporation of impurities is well controlled by making sure that the MPCVD chamber where the diamond growth takes place is considerably free of nitrogen. In addition, gas precursors are also well purified such that the total impurities is less than 500 ppb in a preferred embodiment of the present invention. In other embodiments, the impurities may be less than 1 ppm.
(24) It is submitted that the method produces an electronic device grade single-crystal diamond with the characteristics as described hereinafter.
(25) In accordance with an aspect of the present invention, the electronic device grade single-crystal diamond comprises of a charge collection efficiency (CCE) of 100% when the bias field of at least 0.2V/m as shown in
(26) In accordance with an aspect of the present invention, the electronic device grade single crystal diamond exhibits a low level of nitrogen. The low level of nitrogen is determined in photoluminescence spectrum in
(27) As shown in a typical FTIR spectrum in
(28) In other embodiments, the level of nitrogen may be quantified by other suitable experimental techniques.
(29) In accordance with an aspect of the present invention, the electronic device grade single crystal diamond also exhibits concentration of silicon related vacancies of <50 ppb. The concentration of silicon related vacancies of <50 ppb using photoluminescence spectroscopy as shown in a plot of the UV-VIS spectrum measured from the diamond is shown in
(30) In a preferred embodiment of the present invention, the resistance of the electronic device grade single crystal diamond produced by MPCVD process at room temperature is greater than 110.sup.15 as obtained from I-V measurement. The CV measurements show that the capacitance of less than 2 pF can be easily obtained. The capacitance approaches close to the theoretical limit.
(31) In accordance with an aspect of the present invention, the electronic device grade single crystal diamond has low field electron mobility .sub.0,e greater than 1800 cm.sup.2/Vs and low field hole mobility .sub.0,h greater than 2600 cm.sup.2/Vs for both electrons and holes at room temperature respectively. The saturation velocity (v.sub.sat) for electrons and holes are v.sub.sat,e>1.010.sup.7 cm/s and v.sub.sat,h>1.410.sup.7 cm/s respectively. The carrier mobility and drift velocity of the diamond are obtained by transient current technique (TCT) as shown in
(32) In a preferred embodiment of the present invention, the charge signal distribution of the electronic device grade single crystal diamond has the shape of a Landau distribution curve where the most probable peak of the charge signal distribution depends on the density of defects and impurities in the electronic device grade single crystal diamond. The ratio of full-width-at-half-maximum (FWHM) to the most probable peak (MP) from charge (positive Landau) signal distribution (FHWM/MP) is smaller than 0.3. The charge signal distribution measured from the electronic device grade single crystal diamond detector is obtained when it is exposed to a radiation source in the form of Strontium (.sup.90Sr) radiation source is shown in
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in order to obtain the most probably peak (x.sub.0) for CCE calculation. The width of the energy spectrum provides the energy resolution response of the diamond based detector which can be obtained from parameter B. The fitting results are depicted at the inset labelled as FWHM/Width. As shown, although the level of fluorescence intensities (impurities) of the 3 samples are the same, but the level of CCE of the three diamond based detectors are different.
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(36) The ratio of full-width-at-half-maximum (FWHM) to the most probable peak (MP) from charge (negative Landau) signal distribution is FHWM/MP <3.0% when the electronic device grade single crystal diamond detector is exposed to a radiation source in the form of Americium (.sup.241Am) radiation source is shown in
(37) This result implies that the energy resolution of the diamond based detector is mostly affected by the value of RC width distribution. The smaller the RC width distribution, the higher the CCE, as shown in
(38) Thus, the electronic device grade single diamond has a low lattice defect when the energy resolution of the diamond based detectors is low, which correspond to a small rocking curve (RC) width distribution which result in a high CCE. As shown in
(39) Thus, the RC width distribution is a method used to further assess the electronic properties (i.e. CCE) of the electronic device grade single crystal diamond. However, such a method is restricted to only for diamond with already very low impurities. Hence, RC width as well as the ultra-low fluorescence play a very important role in making a good detector base on diamond.
(40) In a preferred embodiment of the present invention, the ratio of the 2.sup.nd order Raman peak (596 nm) to the photoluminescence line of negatively charged nitrogen vacancy (NV.sup.=637 nm) and silicon vacancy (SiV=738 nm) is greater than 2.5 as shown in the photoluminescence spectrum in
(41) In accordance with an aspect of the present invention, the electronic device grade single diamond having a thickness up to 2500 m is produced. In a preferred embodiment of the present invention, a diamond seed layer having a thickness of less than 2500 m may be attached to a substrate.
(42) Beside impurities which affects the electronic device grade single crystal diamond's electronic properties, it is found that lattice defects and dislocations reduce the carrier lifetimes by trapping radiation generated charges at the defect sites. The electronic device grade single crystal diamond of the present invention has a very narrow average rocking curve width that does not exceed 40 micro radians in at least 90% volume of the electronic device grade single diamond as shown in the map of the rocking curve in
(43) Cross-polarized image showing nearly an absence of brighter areas indicates that the electronic device grade single crystal diamond has substantially low stress and low lattice imperfection as shown in
(44) It is submitted that the inclusion in the electronic device grade single crystal diamond affects the electronic characteristics in a detrimental manner. It is preferably that the aerial density of inclusions must be <10.sup.3/m.sup.2 so as not to affect the electronic characteristics of the electronic device grade single crystal diamond.
(45) It is apparent to a person skilled in the art that many modifications, alternatives and variations may be made to the preferred embodiment of the present invention as described above without departing from the spirit and scope of the present invention. Accordingly, it is intended to embrace all such modifications, alternatives and variations that fall within the scope of the included claims.