SMARTCARD WITH DISPLAY AND ENERGY HARVESTING

Abstract

According to the invention, generally, a wireless connection may be established between two electronic modules (M1, M2) disposed in module openings (MO-1, MO-2) of a smartcard so that the two modules may communicate (signals, data) with each other. The connection may be implemented by a booster antenna (BA) having two coupler coils (CC-1, CC-2) disposed close to the two modules, and connected with one another. The booster antenna may also harvest energy from an external device such as a card reader, POS terminal, or a smartphone. A coupling antenna (CPA) may have only the two coupler coils connected with one another, without the peripheral card antenna (CA) component of a conventional booster antenna. A module may be disposed in only one of the two module openings.

Claims

1. Smartcard comprising: a card body (CB); a first module (M1) disposed in the card body; a second module (M2) disposed in the card body and which is physically separate from the first module; and a booster antenna (BA) disposed in the card body; wherein there is no hardwire connection between the first and second modules.

2. Smartcard, according to claim 1, wherein: the first module comprises a chip module (CM); and the second module comprises a display module (DM).

3. Smartcard, according to claim 2, wherein: the chip module (CM) is a dual-interface module having contact pads (CP).

4. Smartcard, according to claim 1, wherein: there is a wireless connection between the first and second modules.

5. Smartcard, according to claim 1, wherein: the booster antenna comprises first and second coupler coils (CC-1, CC-2) associated with the two modules (M1, M2); and the first and second coupler coils are connected with one another.

6. Smartcard, according to claim 5, wherein: the chip module (CM) comprises a first module antenna (MA-1); the display module (DM) comprises a second module antenna (MA-2); the first coupler coil (CC-1) is disposed in proximity with the first module antenna; and the second coupler coil (CC-2) is disposed in proximity with the second module antenna.

7. Smartcard, according to claim 5, wherein: the booster antenna further comprises a card antenna (CA) component disposed about a peripheral area of the card.

8. Smartcard, according to claim 1, further comprising: at least one coupling frame (CF) disposed in the card body.

9. Smartcard, according to claim 1, wherein: the first module (M1) is disposed in a first opening (MO-1) in the card body; and the second module (M2) is disposed in a second opening (MO-2) in the card body.

10. Smartcard, according to claim 1, wherein: the two modules are physically separated from one another in the card body, yet need to communicate with one another, and both of the two modules requiring power to operate; and a wireless RF connection is established between the two modules.

11. Smartcard comprising: a metal layer (ML) or metal card body (MCB) having a first opening (MO-1) for a first module (M1) and a second opening (MO-2) for a second module (M2): wherein: the two modules are physically separated from one another in the card body, yet need to communicate with one another, and both of the two modules requiring power to operate; and a wireless RF connection is established between the two modules.

12. Smartcard, according to claim 11, wherein: the first module is a transponder chip module (TCM); and the second module is a display module (DM).

13. Smartcard, according to claim 11, further comprising: a first slit (S1) extending from the first opening to an edge of the metal layer or metal card body; and a second slit (S2) extending from the first opening to an edge of the metal layer or metal card body.

14. Method of providing data to a display module (DM) of a smartcard (SC) comprising: from a chip module (CM) of the smartcard, communicating wirelessly with the data module (DM).

15. The method of claim 14, wherein: the chip module (CM) and data module (DM) each harvest energy from an external device.

16. The method of claim 15, wherein: the external device is an ATM or a POS terminal or a smartphone.

17. The method of claim 14, wherein: only one of the modules harvests energy from an external device provides energy to the other module.

18. The method of claim 14, wherein: a third, energy-harvesting module harvests energy from an external device.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0088] Reference will be made in detail to embodiments of the disclosure, non-limiting examples of which may be illustrated in the accompanying drawing figures (FIGS.). Some figures may be in the form of diagrams. Some elements in the figures may be exaggerated, others may be omitted, for illustrative clarity.

[0089] Any text (legends, notes, reference numerals and the like) appearing on the drawings are incorporated by reference herein.

[0090] Some elements may be referred to with letters (AM, BA, CB, CCM, CM, MA, MT, PA, TCM, etc.) rather than or in addition to numerals. Some similar (including substantially identical) elements in various embodiments may be similarly numbered, with a given numeral such as 310, followed by different letters such as A, B, C, etc. (resulting in 310A, 310B, 310C), and variations thereof, and may be collectively (all of them at once) or individually (one at a time) referred to simply by the numeral (310).

[0091] The figures presented herein may show different embodiments of RFID devices, such as smart cards or payment objects such as wearable devices. Some of the drawings may omit components such as the transponder chip module or module antenna, for illustrative clarity. Some of the figures may show only components of an RFID device, such as coupling frames.

[0092] FIG. 1 is a block diagram of a typical dual-interface smartcard, having a card body (CB), a chip module (CM) and a booster antenna (BA).

[0093] FIG. 2 is a block diagram of a smartcard having a display, according to an embodiment of the invention.

[0094] FIG. 3 is a diagram of a booster antenna having two coupler coils, according to an embodiment of the invention.

[0095] FIG. 4A is a diagram of a smartcard having a coupling frame with two openings, for respective two modules.

[0096] FIG. 4B is a diagram of a smartcard having two coupling frames, each with an opening for a module.

[0097] FIG. 4C is a diagram of a smartcard having a coupling frame with two openings, one (or both) of which may be populated with a module.

DETAILED DESCRIPTION

[0098] Various embodiments (or examples) may be described to illustrate teachings of the invention(s), and should be construed as illustrative rather than limiting. It should be understood that it is not intended to limit the invention(s) to these particular embodiments. It should be understood that some individual features of various embodiments may be combined in different ways than shown, with one another. Reference herein to one embodiment, an embodiment, or similar formulations, may mean that a particular feature, structure, operation, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Some embodiments may not be explicitly designated as such (an embodiment).

[0099] The embodiments and aspects thereof may be described and illustrated in conjunction with systems, devices and methods which are meant to be exemplary and illustrative, not limiting in scope. Specific configurations and details may be set forth in order to provide an understanding of the invention(s). However, it should be apparent to one skilled in the art that the invention(s) may be practiced without some of the specific details being presented herein. Furthermore, some well-known steps or components may be described only generally, or even omitted, for the sake of illustrative clarity. Elements referred to in the singular (e.g., a widget) may be interpreted to include the possibility of plural instances of the element (e.g., at least one widget), unless explicitly otherwise stated (e.g., one and only one widget).

[0100] In the following descriptions, some specific details may be set forth in order to provide an understanding of the invention(s) disclosed herein. It should be apparent to those skilled in the art that these invention(s) may be practiced without these specific details. Any dimensions and materials or processes set forth herein should be considered to be approximate and exemplary, unless otherwise indicated. Headings (typically underlined) may be provided as an aid to the reader, and should not be construed as limiting.

[0101] Some processes may be presented and described in a series (sequence) of steps. It should be understood that the sequence of steps is exemplary, and that the steps may be performed in a different order than presented, some steps which are described may be omitted, and some additional steps may be omitted from the sequence and may be described elsewhere.

[0102] Reference may be made to disclosures of prior patents, publications and applications. Some text and drawings from those sources may be presented herein, but may be modified, edited or commented to blend more smoothly with the disclosure of the present application. Citation or identification of any reference should not be construed as an admission that such reference is available as prior art to the disclosure.

[0103] FIG. 1 shows a smartcard (SC) comprising a card body (CB) and a chip module (CM). The chip module (CM) comprises an integrated circuit (or semiconductor) chip (IC) and a module antenna (MA). The module antenna (MA) may be disposed around a peripheral area of the chip module (CM).

[0104] The chip module (CM) may have contact pads (CP) disposed on its front surface. Typically, there are 6 or 8 contact pads.

[0105] When the chip module (CM) is disposed in the card body (CB), the front surface and corresponding contact pads (CP) of the chip module (CM) may be coincident with the front surface of the card body (CB). The chip (IC) may be a banking chip. This is sufficient to effect a contact interface (ISO 7816) between the smart card (SC) and contacts (not shown) of an external device, such as an automated teller machine (ATM) terminal.

[0106] The chip (IC) may comprise (not shown) various circuits and elements, such as a microprocessor and memory. The memory may comprise either or both of volatile and non-volatile memory.

[0107] The chip module (CM), comprising integrated circuit chip (IC) and module antenna (MA), may be referred to as an antenna module (AM) or as a transponder chip module (TCM). See, for example U.S. Pat. Nos. 9,475,086, 9,798,968, 9,390,364, 9,697,459, incorporated by reference herein.

[0108] The smartcard may also comprise a booster antenna (BA). The booster antenna (BA) may comprise a card antenna (CA) component (shown in dashed lines) extending around a periphery of the card body (CB), for contactless coupling (ISO 14443 and NFC/ISO 15693) with an antenna (not shown) of an external device, such as a point-of-sale (POS) terminal. The booster antenna (BA) may further comprise a coupler coil (CC) component disposed at the location in the card body (CB) which is closely adjacent, including surrounding the chip module (CM), for coupling with the module antenna (MA) of the chip module (CM).

[0109] The proximity of the coupler coil (CC) with the module antenna (MA) allows the chip module to harvest energy from the external device (or reader), such as the aforementioned POS terminal, and also allows for data to be passed back-and-forth between the chip module (CM) and the external device.

[0110] The smartcard (SC) described in FIG. 1 is representative of a typical dual interface card which has both contact and contactless interfaces. Such a card may also have numbers (which may be embossed) on its front surface numbers, other information (user name, bank name, hologram, etc.) visible on its front surface, and a magnetic stripe and signature panel (not shown) disposed on its back surface.

[0111] As discussed in WO 2017198842, a smartcard may be provided with a display module (140) which may, for example, be an e-paper type screen which requires power only when the display changes.

[0112] FIG. 2 shows a smartcard (SC) comprising a chip module (CM, or M1) and booster antenna (BA), comparable to those shown in FIG. 1.

[0113] The smartcard (SC) further comprises a display module (DM, or M2) disposed in the card body (CB), and having a surface which may be substantially coincident with the front or rear surface of the card body (CB), for displaying information, such as a card verification value (CVV), to the card-holder (user).

[0114] The display module (DM, M2) is physically separate (spaced-apart) and distinct from the chip module (CM, M1) and is not connected by wires to the chip module (CM). The display module (DM, M2) is disposed in a different area of the card body than the chip module (CM, or M1).

[0115] The booster antenna (BA) shown in FIG. 2 is different than the booster antenna shown in FIG. 1, in that it may comprise two coupler coil (CC-1, CC-2) components, which may be spaced-apart from one another.

[0116] The coupler coil component CC-1 may be disposed at a location in the card body (CB) aligned with the chip module (CM, M1). The coupler coil component CC-2 may be disposed at a location in the card body (CB) aligned with the display module (DM, M1). See also FIG. 3.

[0117] The chip module (CM, M1) may comprise a module antenna (MA-1) for coupling with a first of the coupler coils (CC-1), for harvesting energy, as was described with respect to FIG. 1, from an external device such as a POS terminal. The module antenna (MA-1) and coupler coil (CC-1) are disposed in close proximity (such as aligned) with one another. The module antenna (MA-1) may be disposed around a peripheral area of the chip module (CM, M1).

[0118] The display module (DM, M2) may comprise a module antenna (MA-2) for coupling with a second of the coupler coils (CC-2), for harvesting energy from the POS terminal. The module antenna (MA-2) and coupler coil (CC-2) are disposed in close proximity (such as aligned) with one another. The module antenna (MA-2) may be disposed around a peripheral area of the display module (DM, M2).

[0119] The chip module (CM, M1) may comprises an integrated circuit chip (IC-1) for managing communications with the external device (such as POS terminal), for managing communication with the display module (DM), and (optionally) for generating a CVV code. The chip module (CM, M1) may further comprise a power module, or energy harvesting circuit (not shown) for harvesting energy from the external device (such as POS terminal). The energy harvesting circuit may be incorporated into the integrated circuit chip (IC-1).

[0120] The display module (DM, M2) comprises an integrated circuit chip (IC-2) for managing communication with the chip module (CM). The display module (DM) may further comprise a power module, or energy harvesting circuit (not shown) for harvesting energy from the external device (such as POS terminal). The energy harvesting circuit may be incorporated into the integrated circuit chip (IC-2).

[0121] A simple energy harvesting circuit may comprise a bridge rectifier (four diodes). An energy harvesting circuit may be incorporated into each of the chip module (CM, M1) and the display module (DM, M2).

[0122] The chip module (CM, M1) and display module (DM, M2) may communicate with one another, via their respective module antennas (MA-1, MA-2) and the booster antenna (BA).

[0123] Additionally, energy may be harvested by each of the chip module (CM, M1) and display module (DM, M2) via the booster antenna (BA) and respective coupler coils (CC-1, CC-2). Both of the modules (M1, M2) may harvest energy from an external source (POS terminal). One of the two modules may harvest energy, and provide energy to the other module, in which case only one of the modules would need an energy harvesting circuit. A third, energy-harvesting module (not shown) may harvest energy from an external device, and provide the energy to the other two modules (M1, M2), and the booster antenna may have a third coupler coil (CC-3) associated therewith.

[0124] FIG. 3 shows an arrangement of a booster antenna (BA) in a card body (CB), wherein the booster antenna (BA) comprises a first coupler coil (CC-1) component disposed at a location of the chip module (CM, M1), and a second coupler coil (CC-2) component disposed at a location of the display module (DM, M2). The diagram is greatly simplified, showing only a few turns (coils) of wire for each of the booster antenna components (CA, CC-1, CC-2). The two coupler coils (CC-1, CC-2) may be connected with one another, as illustrated.

[0125] The pattern for the booster antenna (BA) and its components (or portions) may be formed other than by embedding wire, such as by a subtractive (etching) or additive (depositing) process.

[0126] The card antenna (CA) component may be disposed around the periphery of the card body (CB), then the booster antenna (BA) may continue to the interior of the card body (CB) to form a coupler coil (CC-1) component at the location of the module antenna (MA-1) of the chip module (CM, M1), then the booster antenna (BA) may continue across the card body (CB) to form a coupler coil (CC-2) component at the location of the module antenna (MA-2) of the display module (DM, M2).

[0127] A coupler coil (CC-1, CC-2) may be approximately coplanar with its respective module antenna (MA-1, MA-2), surrounding the module antenna (so to speak).

[0128] Alternatively, the coupler coils (CC-1, CC-2) may be arranged above or below their respective module antenna (MA-1, MA-2) so that at least a portion of each coupler coil (CC-1, CC-2) may overlap at least a portion of its respective module antenna (MA-1, MA-2). The coupler coil (CC-1) may extend underneath (behind) the chip module (CM, M1) so that it overlaps (including completely) the module antenna (MA-1). The coupler coil (CC-2) may extend over (above) the display module (DM, M2) so that it overlaps (including completely) the module antenna (MA-2).

[0129] As mentioned above, the module antennas (MA-1, MA-2) may be disposed around a peripheral area of their respective chip module (CM, M1) and display module (DM, M2). And, the coupler coils (CC-1, CC-2) may be disposed in close proximity with their respective module antennas (MA-1, MA-2) including aligned directly over or under their respective module antennas (MA-1, MA-2).

[0130] The windings of the booster antenna (BA) or component elements thereof may overlap the windings of a the module antennas (MA-1, MA-2) to enhance inductive coupling, including energy transfer, and also to support the transfer of data.

[0131] In FIG. 3, one end of the card antenna (CA) component is shown as a free end (not connected with anything), and one end of the coupler coil (CC-2) is shown as a free end. These two free ends could be connected with one another, directly, or via an electronic component such as a capacitor. Other arrangements and connections are possible.

[0132] The booster antenna described herein, having coupler coils disposed at the location of two module openings may be contrasted with the teachings of U.S. Pat. No. 9,390,364. For example . . . [0133] In FIGS. 6C,D of U.S. 9,390,364, a coupler coil is shown at the location of a single opening (OP) for a transponder chip module (TCM). [0134] The booster antenna disclosed herein has two coupler coils (CC-1, CC-2) associated with respective two module openings (MO-1, MO-2), at least one of, including both of which may have modules with module antennas disposed therein, and the two coupler coils are connected with one another. [0135] In FIGS. 6E,F of U.S. Pat. No. 9,390,364, two separate and distinct coils are shown disposed in two openings in a coupling frame. The two coils are not connected with each other. [0136] The booster antenna disclosed herein has two (or more) coupler coils which are connected with one another.

[0137] FIG. 3 also shows that a smartphone (SP) may be used as an external device to power (as well as communicate with) the smartcard (SC), and its respective chip module (CM, M1) and display module (DM, M2).

[0138] A third, energy-harvesting module (not shown) may harvest energy from the external device and provide it to one or both of the two modules (CM, DM).

[0139] As discussed in WO 2017198842, incorporated by reference herein, the information displayed by the display module (140) may comprise data, such as a card verification value (CVV), which may be updated (changed) on a per-transaction (per-use) basis. The CVV may be generated by the chip module (CM) within the card as a result of pairing of the card and a smartphone. In WO 2017198842,the display module (140) is connected by wires (3, 4) to other circuits (120, 130) in the smartcard.

[0140] In contrast with WO 2017198842, the display module (DM, M2) is not wired to other circuits (or modules) in the card. Rather, the chip module (CM, M1) may communicate data (such as an updated CVV) wirelessly with the display module (DM, M2) via the respective module antennas (MA-1, MA-2) which are both inductively coupled with the respective coupler coils (CC-1, CC-2) of the booster antenna (BA).

[0141] A super capacitor may be integrated into the card construction as an energy storage device.

[0142] The smartphone may run an app to synchronize a time stamp with a central server. Compare WO 2017198842.

[0143] The techniques (methods and apparatus) disclosed herein may be applied in the context of pairing with a smartphone to generate a dynamic CVV, and communicating with a bank computer server 600, such as disclosed in the aforementioned WO 2017198842 (ASK), resulting in a system for effecting banking transactions. Other applications are possible, such as cards generating one-time passwords for online banking. If the card does not have its own battery, it can be powered by a smartphone running a simple app which may simply turn on the NFC field in the phone.

[0144] U.S. Pat. No. 9,475,086, discussed above, discloses metal layers (ML) in a card body (CB), and metal card bodies (MCB) having slits (S) to allow the metal layer or metal card body to act as a coupling frame (CF). The coupling frame (CF) may substitute for the booster antenna (BA) in a smartcard, including a dual-interface metal card, and may be adapted to drive a the chip module (CM, M1) and the display module (DM, M2) in a manner comparable to that of a booster antenna (see FIG. 2). Data may also be transferred using the metal (layer or card body).

[0145] FIG. 4A shows, in the manner of FIG. 11A of U.S. Pat. No. 9,697,459, a single coupling frame having a first opening MO-1 for accepting a first module M1, and a second opening MO-2 for accepting a second module M2.

[0146] FIG. 4A shows a smart card (SC), which may have a metal layer (ML) which may be a metal card body (CB, MCB) formed with an opening (MO-1) for a transponder chip module (TCM, CM, M1), a slit (S1) extending from the opening to an edge (left, as viewed) of the metal card body, turning the card body into a coupling frame (CF). The opening MO-1 may be at the position prescribed by the ISO standard (near the left edge of the card body (CB) for the transponder chip module (TCM).

[0147] Another opening (MO-2) is formed on an opposite (right) side of the metal layer (ML) or metal card body (MCB) and has a slit (S2) extending from the opening to the edge (right, as viewed) of the card body/coupling frame (CB/CF). A display module (DM, M2) may be disposed in the opening (MO-2).

[0148] The dashed line around the coupling frame CF (lower right corner only) is intended to indicate that the coupling frame (CF) may be a metal layer (ML), or metal slug, disposed in a plastic card body (CB). Reference U.S. 20150021403 (particularly FIG. 9), incorporated by reference herein.

[0149] This arrangement provides a smartcard (SC) with a metal layer (ML) or metal card body (MCB) powering and supporting communication between two distinct modules (M1, M2).

[0150] FIG. 4B shows, in the manner of FIG. 11B of U.S. Pat. No. 9,697,459, a first coupling frame CF-1 having a first opening MO-1 for accepting a first module M1, and second coupling frame CF-2 having a second opening MO-2 for accepting a second module M2.

[0151] FIG. 4B shows a smart card (SC) having two coupling frames, and a card body (CB) which may have at least one metal layer (ML) modified to provide a first coupling frame (CF-1) on the left (as viewed) side of the card body (CB) and a second coupling frame (CF-2) on the right (as viewed) of the card body (CB).

[0152] A first opening (MO-1) for a transponder chip module (TCM, M1) may be formed in the left coupling frame (CF-1), with a slit (S1) extending from the opening (MO-1) to the left (as viewed) edge of the metal card body. The opening MO-1 may be located at the position prescribed by the ISO standard (near the left edge of the card body).

[0153] Another opening (MO-2) is formed on an opposite (right) side of the metal card body, in the second coupling frame (CF-2), and similarly has a slit (S2) extending from the opening (MO-2) to the right edge (as viewed) of the card body/coupling frame. A display module (DM, M2) may be disposed in the opening (MO-2).

[0154] The two coupling frames (CF-1, CF-2) may be formed of a single metal layer (ML), and may be substantially coplanar with one another. The single metal layer maybe a metal card body with a recess for receiving a ceramic insert. Reference U.S. Pat. No. 9,697,459 (particularly FIG. 3D), incorporated by reference herein.

[0155] The two coupling frames (CF-1, CF-2) may be formed of two metal layers (ML-1, ML-2) which overly (overlay) each other, and are electrically isolated from one another. Reference U.S. Pat. No. 9,697,459 (particularly FIG. 9A), incorporated by reference herein.

[0156] The first coupling frame (CF-1) may have a larger surface area than the second coupling frame (CF-2).

[0157] Some features of both the booster antenna (BA) and coupling frame (CF) versions (embodiments) could be combined in a single smartcard (SC). And, it may be beneficial to incorporate a layer of ferrite shielding material between the booster antenna (BA) and the coupling frame (CF).

[0158] An example of such a hybrid solution may be a card body (CB) having two module openings (MO-1, MO-2), two coupler coils (CC-1, CC-2), no peripheral card antenna (CA) component, and a coupling frame (CF) incorporated into the lay-up of the card body (CB).

[0159] FIG. 4C shows a metal layer (ML) with two module openings (MO-1, MO-2) and respective two slits (S1, S2). Compare FIG. 4A.

[0160] FIG. 4C additionally shows a coupling antenna (CPA) which may similar to the booster antenna (BA) shown in FIG. 3, but without the peripheral card antenna (CA) component. In other words, the coupling antenna (CPA) is shown having two coupler coils (CC-1) and (CC-2) overlapping, within or in close proximity to respective two module openings (MO-1, MO-2) of the card body (CB) and coupling frame (CF). The two coupler coils (CC-1, CC-2) may both have free ends (.circle-solid.). Alternatively, the ends of the two coupler coils could be connected with one another, as illustrated by the dashed line.

[0161] The coupling antenna (CPA) may be formed other than by embedding wire, such as by etching (subtractive process) a conductive layer, or depositing (additive process) a conductive pattern.

[0162] A transponder chip module (TCM) may be disposed in the first module opening (MO-1). The second module opening MO-2 may be left empty, or a circuit, a module, or a component (such as an LED) may be disposed in the second module opening (MO-2).

[0163] The coupling antenna (CPA) may serve to harvest energy from the second module opening (MO-2) and increase power delivery to the transponder chip module (TCM) in the first module opening (MO-1), via inductive coupling.

[0164] When there is no module disposed in the second module opening (MO-2), the coupling antenna's purpose is to increase energy harvesting, without the need for data transfer.

[0165] The second module opening (MO-2) and its slit (S2) may be located at a different position on the card, such as along a top or bottom edge thereof. The module opening (MO-2) may be omitted, leaving just the slit (S2). The coupling antenna (CPA) may traverse the slits (S1, S2). A portion of the coupling antenna (CPA), more particularly of the coupling coils (CC-1, CC-2) may be disposed adjacent (such as parallel) to the slits (S1, S2).

[0166] The addition of the coupling antenna (CPA) may improve the performance of the card, making coupling with an external reader more uniform from various positions of the card.

[0167] The coupling antenna (CPA) may have open ends or may be a closed circuit. The coupling antenna (CPA) may be connected in series or parallel with other devices or circuits. For example, a light emitting diode (LED) may be connected across the coupling antenna (CPA) and housed within the second module opening (MO-2).

[0168] The coupling antenna (CPA) may be connected to capacitors and/or resistors in order to tune the signal within the coupling antenna (CPA), thus improving coupling to the transponder chip module (TCM) and increasing the communication performance of the card.

[0169] While the invention(s) has/have been described with respect to a limited number of embodiments, these should not be construed as limitations on the scope of the invention(s), but rather as examples of some of the embodiments. Those skilled in the art may envision other possible variations, modifications, and implementations that are also within the scope of the invention(s), and claims, based on the disclosure(s) set forth herein.