Method for modifying surface of non-conductive substrate and sidewall of micro/nano hole with rGO

Abstract

Non-conductive substrates, especially the sidewalls of micro/nano holes thereof are chemically modified (i.e., chemically grafted) by reduced graphene oxide (rGO). The rGO possesses excellent electrical conductivity and therefore the modified substrates become conductive, so that it can be directly electroplated. These rGO-grafted holes can pass thermal shock reliability test after electroplating. The rGO grafting process possesses many advantages, such as a short process time, no complex agent (i.e., no chelator), no toxic agents (i.e., formaldehyde for electroless Cu deposition). It is employed in an aqueous solution instead of an organic solvent, and therefore is environmentally friendly and beneficial for industrial production.

Claims

1. A method for modifying surfaces of a substrate and sidewalls of high aspect ratio holes of the substrate with reduced graphene oxide (rGO), the method comprising the steps of: (a) contacting the substrate with an aqueous solution of a conditioner including an amino compound at 40-80 C. for 3-10 minutes to form layers of the amino compound on surface of the substrate and sidewalls of the holes, wherein the amino compound has a concentration of 0.1-3 g/L; (b) contacting the substrate with a graphene oxide (GO) solution for 5-10 minutes to bond the GO with the amino compound, wherein the GO solution has a pH value 3-6, a temperature of 35-80 C. and a solid content of 0.1-1 g/L; and (c) contacting the substrate with a solution containing a reducing agent at 60-90 C. for 5-10 minutes to reduce the GO and modify the surfaces of the substrate with the reduced GO (rGO), wherein the solution containing the reducing agent has a pH value 3-10 and a concentration of 0.5-2 M.

2. The method of claim 1, wherein the amino compound is polyamine.

3. The method of claim 2, wherein the polyamine has a structural formula (1): ##STR00002## wherein R.sub.1 is one of formulae (2)-(9) ##STR00003## R.sub.2 is one formulae (10)-(14) ##STR00004## wherein X of the formula (12) is one of formulae (12-1)-(12-6) ##STR00005## wherein A of the formula (13) is one of formulae (13-1)-(13-4), B is one of formulae (13-5)-(13-10) ##STR00006## wherein Y of the formula (14) is one of formulae (14-1)-(14-6) ##STR00007##

4. The method of claim 1, wherein the amino compound of step (a) is alkamine.

5. The method of claim 4, wherein the alkamine has a formula (15) or (16)
NH.sub.3m(C.sub.2H.sub.4).sub.m(OH).sub.m, m=1, 2 or 3(15)
N.sub.n(C.sub.2H.sub.4).sub.2n+1(OH).sub.2n+1, n=2, 3 or 4(16).

6. The method of claim 1, wherein the amino compound is a polymer having a quaternary ammonium group.

7. The method of claim 6, wherein the polymer having a quaternary ammonium group is selected from the group consisting of quaternary polyvinylimidazole (PVI), polyamidoamine-epichlorohydrin (PAE), hyperbranched gemini quaternary ammonium salt, poly(acrylamide-co-diallyldimethylammonium chloride) (PACD), poly(diallyldimethylammonium chloride) (PDACH), and polyquaternium-2.

8. A method for modifying surfaces of a substrate and sidewalls of blind vias or through holes of the substrate with reduced graphene oxide (rGO), the method comprising the steps of: (a) contacting the substrate with an aqueous solution containing a conditioner including a polymer with a quaternary ammonium group and alkamine at 40-80 C. for 3-10 minutes to form layers of the polymer having a quaternary ammonium group on surfaces of the substrate and sidewalls of the blind vias or the through holes, wherein the polymer with a quaternary ammonium group has a concentration of 0.5-3 g/L and alkamine has a concentration of 10-50 g/L; (b) contacting the substrate with a graphene oxide (GO) solution for 5-10 minutes to bond the GO with the polymer having a quaternary ammonium group, wherein the GO solution has a pH value 3-6, a temperature of 35-80 C. and a solid contant of 0.1-1 g/L; and (c) contacting the substrate with a solution containing a reducing agent at 60-90 C. for 5-10 minutes to reduce the GO and modify the surfaces of the substrate and the sidewalls of the blind vias or the through holes with the reduced GO (rGO), wherein the solution of the reducing agent has a pH value 3-10 and a concentration of 0.5-2 M.

9. The method of claim 8, wherein the alkamine of step (a) has a formula (1) or (2)
NH.sub.3m(C.sub.2H.sub.4).sub.m(OH).sub.m, m=1, 2 or 3(1)
N.sub.n(C.sub.2H.sub.4).sub.2n+1(OH).sub.2n+1, n=2, 3 or 4(2).

10. The method of claim 8, wherein the polymer having a quaternary ammonium group is selected from the group consisting of quaternary polyvinylimidazole (PVI), polyamidoamine-epichlorohydrin (PAE), hyperbranched gemini quaternary ammonium salt, poly(acrylamide-co-diallyldimethylammonium chloride) (PACD), poly(diallyldimethylammonium chloride) (PDACH), and polyquaternium-2.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawings will be provided by the Office upon request and payment of the necessary fee.

(2) FIG. 1 shows the substrate for the over plating test of Example 1.

(3) FIGS. 2 and 3 show the Cu depositions on the substrates of Example 1 wherein the conditioners are polyamines in concentrations of 1 g/L and 2 g/L, respectively.

(4) FIGS. 4 and 5 show the Cu depositions on the substrates of Example 1 wherein the conditioners are alkamines having a formula (2) in concentrations of 10 g/L and 30 g/L, respectively.

(5) FIGS. 6 and 7 show the Cu depositions on the substrates of Example 1 wherein the conditioners are alkamines having a formula (3) in concentrations of 10 g/L and 30 g/L, respectively.

(6) FIG. 8 shows the Cu deposition on the substrates of Example 1 wherein the conditioner is PVI in concentrations of 1 g/L.

(7) FIGS. 9 and 10 show the Cu depositions on the substrates of Example 1 wherein the conditioners are PQT-2 in concentrations of 1 g/L and 3 g/L, respectively.

(8) FIGS. 11-16 show the Cu depositions on the substrates of Example 2 wherein the conditioners are PVI, PAE, Gemini, PACD, PDACH and PQT-2, respectively.

(9) FIG. 17 shows the OM image of the copper plated through hole in the PCB before thermal shock test.

(10) FIG. 18 shows the SEM image of the copper-filled blind via by electroplating after thermal reliability test.

(11) FIGS. 19A, 19B and 19C respectively show the OM 100, 200 and 500 images of the through hole in the substrate of Example 1 after copper electroplating and the thermal shock test.

(12) TABLE-US-00001 Reference Characters in the drawings are listed below: Substrate 10 front side 11 non-conductive strips 111 conductive back side 12 non-conductive area 121 area 112

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

EXAMPLE 1

(13) The method for modifying surfaces of an non-conductivesubstrate and sidewalls of micro/nano holes with reduced graphene oxide (rGO) includes the following steps.

(14) (a) Contact a substrate with an aqueous conditioner solution including an amino compound at 40-80 C. for 3-10 minutes to form a layer of the amino compound on the surface of the substrate and sidewalls of the holes. The amino compound has a concentration of 0.1-3 g/L.

(15) (b) Contact the substrate with a graphene oxide (GO) solution for 5-10 minutes to chemically bond the GO with the amino compound. The GO solution has a pH value of 3-6, a temperature of 35-80 C. and a solid content of 0.1-1 g/L. Preferably, the substrate is immersed in the GO solution for 10 minutes using ultrasonic vibration for 5 seconds. The GO solution preferably has a pH value of 3.5-4.5, a temperature of 60 C. and a solid content of 0.25-0.5 g/L. The substrate is then rinsed by deionized water and dried with nitrogen gas. According to this procedure, the negative-charged oxide functional groups on the graphene oxide are physically adsorbed and chemically bonded to the amino compound layer.

(16) (c) Contact the substrate with a reducing agent solution at 60-90 C. for 5-10 minutes to reduce the GO and modify the surfaces of the substrate with the reduced GO (rGO), wherein the solution of the reducing agent has a pH value of 2-10 and a concentration of 0.2-2M. Preferably, the substrate is immersed in the solution of the reducing agent for 10 minutes using ultrasonic vibration for 5 seconds. The solution preferably has a pH value of 10, a temperature of 60 C. and a concentration of 1M. The substrate is then rinsed by deionized water and dried with nitrogen gas. According to this procedure, the GO is reduced to reduced GO (rGO), whereby the surfaces of the substrate and sidewalls of the holes possess electrical conductivity.

(17) The amino compound of step (a) can be either polyamines or alkamines.

(18) The polyamines can have a structural formula (1).

(19) ##STR00001##

(20) The alkamines can have a formula either (2) or (3).
NH.sub.3m(C.sub.2H.sub.4).sub.m(OH).sub.m, m=1, 2 or 3(2)
N.sub.n(C.sub.2H.sub.4).sub.2n+1(OH).sub.2n+1, n=2, 3 or 4(3)

(21) The polymer bearing a quaternary ammonium group is selected from the group consisting of quaternary polyvinylimidazole (PVI), polyamidoamine-epichlorohydrin (PAE), hyperbranched gemini quaternary ammonium salt, poly(acrylamide-co-diallyldimethylammonium chloride) (PACD), poly(diallyldimethylammonium chloride) (PDACH) and polyquaternium-2.

(22) The reducing agent can be inorganic or organic. The inorganic reducing agent can be but is not limited to SnCl.sub.2, NaHPO.sub.4, NaBH.sub.4 or HI. The organic reducing agent can be but is not limited to N.sub.2H.sub.4, vitamin C, urea, heparin, amino acid, garlic acid, microorganisms, glucose, fructose, protein, peptides, hormones, neurotransmitters, extract of plant, quaternary ammonium compound or precursors of conductive polymers. The amino acid can be but is not limited to cysteine, lysine or aspartic acid. The microorganism can be but is not limited to Shewanella. The protein and peptide can be but is not limited to Bovine serum albumin. The hormones can be but is not limited to melatonin. The neurotransmitters can be but is not limited to dopamin. The extract of plant can be but is not limited to spinach, tea or garlic. The precursor of conductive polymer can be but is not limited to pyrrole, thiophene or aniline. Vitamin C is used as the organic reducing agent in Examples of this invention.

EXAMPLE 2

(23) (a) Contact a substrate with an aqueous conditioner solution containing a quaternary ammonium polymer and alkamine at 40-80 C. for 5-20 minutes, and preferably at 60 C. for 10 minutes. The solvent is deionized (DI) water. The quaternary ammonium polymer has a concentration of 0.5-3 g/L, and preferably 1 g/L. The alkamine has a concentration of 10-50 g/L, and preferably 30 g/L. Furthermore, the conditioner includes a surfactant in a concentration of 25-200 ppm, preferably 50 ppm. Preferably, the substrate is immersed in the conditioner at 60 C. for 10 minutes using ultrasonic vibration for 5 seconds. The substrate is then rinsed by DI water and dried with nitrogen gas.

(24) (b) The procedure is the same as (b) of Example 1.

(25) (c) The procedure is the same as (c) of Example 1.

(26) In step (a), the alkamine and surfactant are added to clean the surfaces of the substrate and sidewalls of the holes to remove grease and impurities. Thereby a uniform layer of quaternary ammonium polymer can be formed on surfaces of the substrate and sidewalls of the holes. The alkamine has a formula (2) or (3) aforementioned, for example, ethylamine, diethanolamine and triethanolamine. The quaternary ammonium polymer is selected from the group consisting of quaternary polyvinylimidazole (PVI), polyamidoamine-epichlorohydrin (PAE), hyperbranched gemini quaternary ammonium salt, poly(acrylamide-co-diallyldimethylammonium chloride) (PACD), poly(diallyldimethylammonium chloride) (PDACH) and polyquaternium-2. The surfactant can be polythylene glycol or t-Octylphenoxypolyethoxyethanol (Triton-X100).

(27) Over Plating Experiments

(28) FIG. 1 shows a substrate 10 provided for the over plating tests. There are seven non-conductive strips 111 with various widths on the front side 11 of the substrate 10. A copper clad conductive area 112 is formed between the non-conductive strips 111. The non-conductive strips 111 are made of resin. A non-conductive area 121 is formed over the back side 12 of the substrate 10.

(29) Experiment 1 for the Substrate of Example 1

(30) Two substrates are modified with rGO on both sides according to the method of Example 1, to which polyamines of 1 g/L and 2 g/L are respectively applied. Procedures and operating conditions for over plating are well known. FIGS. 2 (1 g/L) and 3 (2 g/L) show that the Cu depositions throughout the front sides and the back sides of the substrates are uniform and dense.

(31) Experiment 2 for the Substrate of Example 1

(32) Two substrates are modified with rGO on both sides according to the method of Example 1, to which alkamine having the formula (2) of 10 g/L and 30 g/L are respectively applied. FIGS. 4 (10 g/L) and 5 (30 g/L) show that the Cu is deposited partially over the front sides and the back sides of the substrates.

(33) Experiment 3 for the Substrate of Example 1

(34) Two substrates are modified with rGO on both sides according to the method of Example 1, to which alkamine having the formula (3) of 10 g/L and 30 g/L are respectively applied. FIGS. 6 (10 g/L) and 7 (30 g/L) show that the Cu is deposited throughout the front sides and partially over the back sides of the substrates.

(35) Experiment 4 for the Substrate of Example 1

(36) Three substrates are modified with rGO on both sides according to the method of Example 1, to which PVI (1 g/L), PQT-2 (1 g/L), PQT-2 (3 g/L) are respectively applied. FIGS. 8-10 show that the Cu is deposited throughout the front sides and partially over the back sides of the substrates.

(37) Experiment 1 for the Substrate of Example 2

(38) Six substrates are modified with rGO on both sides according to the method of Example 2, to which PVI, PAE, Gemini, PACD, PDACH and PQT-2 are respectively applied. FIGS. 11-16 show that the Cu is deposited almost throughout the front sides and the back sides of the substrates. Particularly, the substrates immersed in the conditioner solutions containing Gemini or PQT-2 perform better in terms of density and uniformity after copper electroplating.

(39) Plating Through Holes with Copper Prepared According to Example 1

(40) A printed circuit board (PCB) is prepared according to the method of Example 1, to which polyamines of 1 g/L or 2 g/L is applied. Thereby the rGO can be grafted on the surfaces and sidewalls of high-aspect through holes in the PCB. The through holes have diameters of 500 m and 250 m. Copper seed on the sidewall can be deposited by the electroless copper plating process. Procedures and operating conditions are well known and unrestricted. In this preferred embodiment, the plating solution includes a copper compound (0.6-1.0M), H.sub.2SO.sub.4 (2-4 v/v %), halide ions such as chloride ions (20-90 ppm), polyethylene glycol (PEG, 200 ppm), bis(3-Sufopropy)disulfide (SPS) (1-3 ppm) and one or two levelers such as N-heterocyclic compounds (1-3 ppm). The copper electroplating is carried out at a current density of 15ASF and at temperature of 28 C. for 1.5 hours. The copper electroplating solution is stirred by air bubbles (3 NL/min).

(41) FIG. 17 shows the OM 100 image of the copper-plated through holes after a thermal reliability test. The test is carried out by dipping the plated PCB in a tin stove at 288 C. for 10 seconds and then picking it out for cooling, and repeating such operation for five times. The result shows that the sidewalls of the through holes are densely coated with the copper deposit without void and leak from the sidewalls.

(42) Copper Filling the Blind Vias Prepared According to Example 1

(43) A printed circuit board (PCB) is prepared according to the method of Example 2. The rGO is grafted on the surfaces and sidewalls of high-aspect blind vias of the PCB. The blind vias have a diameter of 50 m. Copper seed on the sidewall can be deposited by the electroless copper plating process. Procedures and operating conditions are well known and unrestricted. In this preferred embodiment, the copper electroplating solution includes CuSO.sub.4 (0.88M), H.sub.2SO.sub.4 (3 v/v %), Janus Green B (3 ppm), pyridine variant (1 ppm), polyethylene glycol (PEG, 200 ppm), bis(3-Sufopropy)disulfide (SPS) (6 ppm) and CF (60 ppm). The copper electroplating is carried out at a current density of 20 ASF and at temperature of 20 C. for 60 minutes. The copper electroplating solution is stirred by air bubbles (3 NL/min). Copper is deposited in the blind vias in the manner of bottom-up and superfilling without void.

(44) FIG. 18 shows the SEM image of the plated blind via after the thermal reliability test. The test is carried out by dipping the plated PCB in a tin stove at 288 C. for 10 seconds and then picking it out for cooling, and repeating such operation for five times. The result shows that the copper is densely deposited in the blind vias without void and leak from the sidewalls, even after the thermal reliability test.

(45) Plating Through Holes with Copper Prepared According to Example 2

(46) A printed circuit board (PCB) is prepared according to the method of Example 2, whereby the rGO can be grafted on the surfaces and sidewalls of high-aspect through holes in the PCB. Copper seed on the sidewall can be deposited by the electroless copper plating process. Procedures and operating conditions are well known and unrestricted. In this preferred embodiment, the plating solution includes copper ions (0.6-1.0M), H.sub.2SO.sub.4 (2-4 v/v %), halide ions such as chloride ions (20-90 ppm), polyethylene glycol (PEG, 200 ppm), bis(3-Sufopropy)disulfide (SPS) (1-3 ppm) and one or two levelers such as N-heterocyclic compounds (1-3 ppm). The copper plating is carried out at a current density of 15ASF and at temperature of 28 C. for 1.5 hours. The copper electroplating solution is stirred by air bubbles (3NL/min).

(47) FIGS. 19A, 19B and 19C respectively show the OM 100, 200 and 500 images of the plated through holes in the substrate of Example 1 after the thermal reliability test. The test is carried out by dipping the plated PCB in a tin stove at 288 C. for 10 seconds and then picking it out for cooling, and repeating such operation for five times. The results show that the sidewalls of the plated through holes are densely coated with copper deposit without void and leak from the sidewalls after the thermal reliability test.

(48) The present invention can be applied to electroplating of surfaces and filling holes of a substrate. The material used for filling holes is not restricted to copper, and can be other conductive metals such as nickel, cobalt and the alloys thereof.