HIGHLY REFLECTIVE GAIN TYPE PHOTOVOLTAIC PACKAGING ADHESIVE FILM AND USAGE

Abstract

A highly reflective gain type photovoltaic packaging adhesive film and usage are provided. The packaging adhesive film is composed of an packaging layer and a reflecting layer, wherein the packaging layer has a thickness of 200 to 500 m, and is made by mixing a first primary resin, a modified auxiliary, an ultraviolet auxiliary, an anti-thermal oxidation ageing agent and an initiator and melting and coat casting the same at 60 C. to 200 C. to form a film; and the reflecting layer has a thickness of 5 to 200 m and is made by mixing a second primary resin, an auxiliary resin, a first filler, a second filler, modified auxiliary, a diluent and an ultraviolet auxiliary, an anti-thermal oxidation ageing agent and an initiator and coating the same on the surface of the packaging layer and curing the same at 30 C. to 150 C.

Claims

1. A high reflection gain type photovoltaic encapsulating film, comprising: an encapsulating layer; and a reflecting layer, wherein the encapsulating layer has a thickness of 200 m to 500 m and is prepared by mixing 60 wt % to 90 wt % of a first matrix resin, 0.5 wt % to 30 wt % of a modified additive, 0.1 wt % to 10 wt % of an ultraviolet stabilizer, 0.1 wt % to 3 wt % of an anti-thermo-oxidative aging agent and 0.1 wt % to 3 wt % of an initiator, then melting at a temperature of 60 C. to 200 C. and casting into a film; the first matrix resin is prepared by copolymerizing ethylene and one or two monomers selected from propylene, butene, heptene, octene, norbornene, vinyl acetate, methyl acrylate, and methyl methacrylate; the reflecting layer has a thickness of 5 to 200 m, and is prepared by mixing 60 wt % to 85 wt % of a second matrix resin, 3 wt % to 30 wt % of an auxiliary resin, 3 wt % to 30 wt % of a first filler, 0 wt % to 20 wt % of a second filler, 0.5 wt % to 10 wt % of a modified additive, 0.5 wt % to 20 wt % of a diluent, 0 wt % to 1 wt % of an ultraviolet stabilizer, 0.001 wt % to 5 wt % of an anti-thermo-oxidative aging agent and 0.001 wt % to 5 wt % of an initiator, then coating the mixture on a surface of the encapsulating layer and then curing at a temperature of 30 C. to 150 C.

2. The high reflection gain type photovoltaic encapsulating film according to claim 1, wherein the second matrix resin is composed of one or more, mixed in any ratio, of a hydroxy acrylic resin, a hydroxyl-terminated polyolefin resin, a polycarbonate diol, a polycaprolactone diol, and polytetrahydrofuran diol; the auxiliary resin is composed of one or more, mixed in any ratio, of a bisphenol A type epoxy resin, a phenolic epoxy resin, a bisphenol A type epoxy vinyl ester resin, a novolac epoxy vinyl ester resin, an acrylic vinyl ester resin, and a polyurethane vinyl ester resin.

3. The high reflection gain type photovoltaic encapsulating film according to claim 1, wherein the first filler is formed by mixing 0 w % to 40 w % of one or more selected from flake-like wet mica powder, talc powder, calcined kaolin, zinc oxide and montmorillonite that have a particle diameter in a range of 1 um to 40 um, 0 to 40 wt % of one of spherical glass microbeads, ceramic microbeads, aluminium oxide, magnesium oxide, boron nitride and zinc oxide, having a particle diameter in a range of 1 um to 50 um, and 20 wt % to 100 wt % of titanium dioxide having a particle diameter in a range of 0.2 um to 1.0 um; the second filler is composed of one or more, mixed in any ratio, of polymethyl methacrylate micropowder, polyamide micropowder, polyester micropowder, polystyrene micropowder, polyethylene micropowder and polypropylene micropowder that have a particle diameter in a range of 5 um to 100 um.

4. The high reflection gain type photovoltaic encapsulating film according to claim 1, wherein the modified additive is composed of one or more, mixed in any ratio, of 3-(methacryloyl chloride)propyltrimethyloxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyl tri(-methoxy ethoxy)silane, N-(2-aminoethyl-3-aminopropyl)trimethoxysilane, and 3-(2,3-epoxypropoxy)propylmethyldiethoxysilane.

5. The high reflection gain type photovoltaic encapsulating film according to claim 1, wherein the diluent is composed of one or more, mixed in any ratio, of alkyl acrylate, ether acrylate, hydroxy acrylate, diol diacrylate, trihydroxy triacrylate, glycidyl acrylate, ethoxylated bisphenol A acrylate, alkyl methacrylate, ether methacrylate, hydroxy methacrylate, diol dimethacrylate, trihydroxy trimethacrylate, glycidyl methacrylate, and ethoxylated bisphenol A methacrylate.

6. The high reflection gain type photovoltaic encapsulating film according to claim 1, wherein patterns of the reflecting layer are regularly arranged and are consistent with shapes of gaps between silicon cells, and the reflecting layer is coated through one of anilox coating, mask coating, spray coating, and transfer printing modes.

7. The high reflection gain type photovoltaic encapsulating film according to claim 1, wherein the curing of the reflecting layer adopts one or more of heat curing, radiation curing, ultraviolet curing, and microwave curing.

8. A use of the high reflection gain type photovoltaic encapsulating film according to claim 1, wherein the high reflection gain type photovoltaic encapsulating film is used for encapsulating crystalline silicon cell photovoltaic modules, the modules having an improved power by increasing a light reflectivity of a gap between silicon cells.

9. The use according to claim 8, wherein the crystalline silicon cell photovoltaic module is preferably a bifacial photovoltaic module generating electricity on both the frontside and the back side of the cells.

10. The use according to claim 9, wherein the high reflection gain type photovoltaic encapsulating film is used as a front encapsulating film or a back encapsulating film; in use for encapsulating the photovoltaic module, a front panel glass, the front encapsulating film, silicon cells, the backencapsulating film and a back panel transparent material are sequentially laminated, put in a laminator and laminated at a temperature of 140 C. to 160 C. for 5 to 18 minutes; the back panel transparent material is glass or a transparent photovoltaic backing plate.

Description

DESCRIPTION OF DRAWINGS

[0019] FIG. 1 is a schematic diagram of a high reflection gain type photovoltaic encapsulating film for encapsulating a double-sided power generation cell module according to the present disclosure;

[0020] FIG. 2 is a schematic diagram of a high reflection gain type photovoltaic encapsulating film for encapsulating a half cell module according to the present disclosure; and

[0021] FIG. 3 is a schematic diagram of a high reflection gain type photovoltaic encapsulating film for encapsulating a laminated cell module according to the present disclosure.

[0022] In the above figures, A is a high reflection region of the encapsulating film, and B is a high light-transmittance region of the encapsulating film.

DESCRIPTION OF EMBODIMENTS

[0023] The present disclosure will be further described below in conjunction with the embodiments, but the scope of the present disclosure is not only limited to the embodiments. The shape of a reflection region can be designed according to the design of a silicon cell and a photovoltaic module, and can be applied to modules of double-sided power generation cell, single-sided power generation cell, laminated cell and half cell.

[0024] It should be noted that the performance indexes of a photovoltaic encapsulating film were measured by the methods as described below:

[0025] 1. Reflectivity and Light Transmittance

[0026] The test method refers to a spectrophotometer method with an integrating sphere in the standard GB/T 29848 ethylene-vinyl acetate copolymer (EVA) film for photovoltaic module encapsulating.

[0027] Test instrument: UV-visible spectrophotometer.

[0028] Test conditions: 380 nm to 1100 nm.

[0029] 2. Volume Resistivity

[0030] The test method refers to the standard GB/T 29848 ethylene-vinyl acetate copolymer (EVA) film for photovoltaic module encapsulating.

[0031] Sample size: 100 mm*100 mm.

[0032] Test conditions: test voltage 1000V.

[0033] 3. Degree of Crosslinking

[0034] The test method refers to the standard GB/T 29848 ethylene-vinyl acetate copolymer (EVA) film for photovoltaic module encapsulating.

[0035] Sample size: 100 mm*100 mm.

[0036] Test conditions: test voltage 1000V.

[0037] 4. Shrinkage Ratio

[0038] The test method refers to the standard GB/T 29848 ethylene-vinyl acetate copolymer (EVA) film for photovoltaic module encapsulating.

[0039] Sample size: 100 mm*100 mm.

[0040] Test conditions: 120 C., 3 min.

[0041] 5. Glass/EVA Peeling Strength

[0042] The test method refers to the standard GB/T 29848 ethylene-vinyl acetate copolymer (EVA) film for photovoltaic module encapsulating.

[0043] Sample size: 300 mm*10 mm.

[0044] Stretching speed: 100 mm/min.

[0045] 6. Constant Resistance to Heat and Moisture Aging

[0046] The test method refers to the standard GB/T 29848 ethylene-vinyl acetate copolymer (EVA) film for photovoltaic module encapsulating.

[0047] Test conditions: +85 C., relative humidity 85%.

[0048] The yellowness indexes (YI) of each sample before and after the test were measured according to the national standard GB 2409 yellowness index test method of plastics.

[0049] 7. Maximum Power

[0050] The test method refers to the standard IEC61215 ground crystalline silicon photovoltaic moduledesign authentication and type approval.

[0051] Sample size: 60 double-sided silicon cells, manufactured by Jolywood Sunwatt Co., Ltd.

[0052] Test conditions: AM 1.5, irradiance 1000 W/m.sup.2, +25 C., 50% RH.

Example 1

[0053] The manufacturing process of the encapsulating film is as follows:

[0054] First, 85 wt % of ethylene-vinyl acetate copolymer (DuPont, USA), 10 wt % of 3-(methacryloyl chloride)propyltrimethyloxysilane (Shanghai Chunall International Trade Co., Ltd.) as a modified additive, 2 wt % of 2-(2-hydroxy-3-tert-butyl-5-methylphenyl)-5-chlorobenzotriazole (Jinan Bondor Chemical Technology Co., Ltd.) as an UV stabilizer, 1.5 wt % of 2,6-di-tert-butyl-4-methylphenol (Shenghe Chemical Co., Ltd.) as an anti-thermo-oxidative aging agent, and 1.5 wt % of benzoperoxide (Chengdu Grecia Chemical Technology Co., Ltd.) as initiator were uniformly mixed and extruded at a temperature of 60 C. to 90 C., and then subjected to film casting to obtain an encapsulating layer having a thickness of 450 m.

[0055] Then, a reflecting layer having a thickness of 160 m was sprayed and coated on one side of the encapsulating layer along a coating line which pre-designed the shape of the reflection region. The components of the coating material of the reflecting layer are 75 wt % of hydroxy acrylic resin (Mitsui Chemical Co., Ltd., Japan), 5 wt % of bisphenol A types epoxy resin E51 (Shanghai Huichuang Trade Co., Ltd.), 5 wt % of titanium dioxide CR-60-2 (Ishihara Co., Ltd., Japan), 3 wt % of 3-(methacryloyl chloride)propyltrimethyloxysilane (Shanghai Chunall International Trading Co., Ltd.) as a modified additive, 11.3 wt % of hydroxyethyl acrylate (Jiangyin Zefeng Chemical Co., Ltd.) as a diluent, 0.3 wt % of 2-hydroxy-4-methoxybenzophenone (Jinan Bondor Chemical Technology Co., Ltd.) as an UV stabilizer, 0.3 wt % of tris(2,4-di-tert-butylphenyl) phosphite (Shenghe Chemical Co., Ltd.) as an anti-thermo-oxidative aging agent, and 0.1 wt % of benzoyl peroxide (Chengdu Grecia Chemical Technology Co., Ltd.) as an initiator. The raw materials were uniformly dispersed, coated on the encapsulating layer, and cured by radiation at a temperature of 60 C. to 100 C. for 2 min to obtain a high reflection gain type encapsulating film 51.

Example 2

[0056] First, 60 wt % of ethylene-octene copolymer (Dow Chemical, USA), 10 wt % of 3-(2,3-epoxypropoxy)propylmethyldiethoxysilane (Jinan Langhua Chemical Co., Ltd.) and 20 wt % of vinyl trimethoxysilane (Jinan Langhua Chemical Co., Ltd.) as modified additives, 6 wt % of 2,4-dihydroxybenzophenone (Shanghai Zhixin Chemical Co., Ltd.) as an UV stabilizer, 3 wt % of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (Dongguan Walixi Chemical Co., Ltd.), and 1 wt % of initiator 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane (Guangzhou Qiansheng Trade Co., Ltd.) as an anti-thermo-oxidative aging agent were uniformly mixed, extruded at a temperature of 80 C. to 120 C., and then subjected to film casting to obtain an encapsulating layer having a thickness of 200 m.

[0057] Then, a reflecting layer having a thickness of 5 m was anilox coated on one side of the encapsulating layer along a coating line which pre-designed the shape of the reflection region. The components of the coating material of the reflecting layer are 60 wt % of polycaprolactone diol (Daicel Co., Ltd., Japan), 6 wt % of acrylic vinyl ester resin (Mitsubishi Corporation, Japan), 4 wt % of mica powder (Dongjia Chemical Materials Co., Ltd.), 8 wt % of ceramic microbeads (Suzhou Maiang New Material Co., Ltd.), 18 wt % of titanium dioxide R902 (DuPont, USA), 1 wt % of 3-(2,3-epoxypropoxy)propylmethyldiethoxysilane (Shanghai Chunall International Trade Co., Ltd.) as a modified additive, 2.8 wt % of trihydroxytriacrylate (Jiangyin Zefeng Chemical Co., Ltd.) as a diluent, 0.15 wt % of 2,2-methylenebis-(4-methyl-6-tert-butylphenol) (Shenghe Chemical Co., Ltd.) as an anti-thermo-oxidative aging agent, and 0.05 wt % of 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1-propanone (Chengdu Grecia Chemical Technology Co., Ltd.) as an initiator. The raw materials were uniformly dispersed, coated on the encapsulating layer, and cured with UV at a temperature of 60 C. to 100 C. for 1 min to obtain a high reflection gain type encapsulating film S2.

Example 3

[0058] First, 70 wt % of ethylene-methyl acrylate copolymer (DuPont Chemical Co., Ltd., USA), 18 wt % of vinyl trimethoxysilane (Shanghai Chunall International Trade Co., Ltd.) as a modified additive, 8 wt % of 2-[4-[2-hydroxy-3-dodecyloxypropyl]oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine (Jinan Bondor Chemical Technology Co., Ltd.) as an UV stabilizer, 2.5 wt % of 2-[4-[2-hydroxy-3-dodecyloxypropyl]oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine (Shenghe Chemical Co., Ltd.) as an anti-thermo-oxidative aging agent, and 1.5 wt % of o,o-tert-amyl-o-(2-ethylhexyl)-mono-peroxycarbonate (Chengdu Grecia Chemical Technology Co., Ltd.) as an initiator were uniformly mixed, extruded at a temperature of 80 C. to 120 C., and then subjected to film casting to obtain an encapsulating layer having a thickness of 200 m.

[0059] Then, a reflecting layer having a thickness of 180 m was coated with a mask on one side of the encapsulating layer along a coating line which pre-designed the shape of the reflection region. The components of the coating material of the reflecting layer are 85 wt % of hydroxyl-terminated polyolefin resin (Mitsubishi Corporation, Japan), 5 wt % of bisphenol A epoxy vinyl ester resin (Jinan Yisheng Resin Co., Ltd.), 2 wt % of glass microbeads (Suzhou Maiang New Material Co., Ltd.), 3 wt % of titanium dioxide R706 (DuPont, USA), 2 wt % of polyethylene micropowder (Nanjing Jiazhong Chemical Technology Co., Ltd.), 0.5 wt % of vinyl trimethoxysilane (Nanjing Luoen Silicon Material Co., Ltd.) as a modified additive, 2 wt % of trihydroxy trimethacrylate (Shandong Senjie Chemical Co., Ltd.) as a diluent, 0.38 wt % of 2-hydroxy-4-n-octyloxybenzophenone (Guangzhou Zhenwei Chemical Technology Co., Ltd.) as an UV stabilizer, 0.119 wt % of 4,4-p-isopropyldiphenyl C12-15-alcohol phosphite (Jinan Dongrun Refined Technology Co., Ltd.) as an anti-thermo-oxidative aging agent, and 0.001 wt % of azodiisobutyl nitrile (Jinan Yingxin Chemical Co., Ltd.) as an initiator. The raw materials were uniformly dispersed, coated on the encapsulating layer, and cured by microwaves at a temperature of 100 C. to 150 C. for 1.5 min to obtain a high reflection gain type encapsulating film S3.

Example 4

[0060] First, 65 wt % of ethylene-propylene copolymer (Dow Chemical, USA), 20 wt % of vinyl tri(-methoxyethoxy)silicon (Nanjing Luoen Silicon Materials Co., Ltd.) as a modified additive, 10 wt % of bis(1,2,2,6,6-pentamethyl-4-piperidinyl)-sebacate/mono(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate compound (Jinan Langhua Chemical Co., Ltd.) as an UV stabilizer, 2.5 wt % of octadecyl--(4-hydroxy-3,5-di-tert-butyl-phenyl) propionate (Hangzhou Chuyuan Chemical Co., Ltd.) as an anti-thermo-oxidative aging agent, and 2.5 wt % of 2,5-dimethyl-2,5-bis(benzoyl peroxy)-hexane (BASF, Germany) as an initiator were uniformly mixed, extruded at a temperature of 150 C. to 200 C., and then subjected to film casting to obtain an encapsulating layer having a thickness of 500 m.

[0061] Then, a reflecting layer having a thickness of 200 m was coated by a transfer printing manner on one side of the encapsulating layer along a coating line which pre-designed the shape of the reflection region. The components of the coating material of the reflecting layer are 70 wt % of polytetrahydrofuran diol (Mitsui Chemicals Co., Ltd., Japan), 3 wt % of polyurethane vinyl ester resin (Shanghai Fengbiao Chemical Technology Co., Ltd.), 3 wt % of titanium dioxide CR-60-2 (Ishihara Co., Ltd., Japan), 20 wt % of polystyrene micropowder (Shanghai Guangyun Industrial Co., Ltd.), 1 wt % of vinyl tri(-methoxyethoxy) silane (Nanjing Luoen Silicon Materials Co., Ltd.) as a modified additive, 2.5 wt % of ethoxylated bisphenol A methacrylate (German Evonik Co., Ltd) as a diluent, 0.2 wt % of 2-[4-[2-hydroxy-3-dodecyloxypropyl]oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1, 3,5-triazine (Yongguang Chemical Co., Ltd., Taiwan) as an UV stabilizer, 0.299 wt % of l-dodecyl pentaerythritol thiopropionate (Shenghe Chemical Co., Ltd.) as an anti-thermo-oxidative aging agent, and 0.001 wt % of o,o-tert-butyl-o-isopropyl-mono-peroxycarbonate (Chengdu Grecia Chemical Technology Co., Ltd.) as an initiator. The raw materials were uniformly dispersed, coated on the encapsulating layer, and thermally cured at a temperature of 130 C. to 150 C. for 5 min to obtain a high reflection gain type encapsulating film S4.

Example 5

[0062] First, 90 wt % of ethylene-norbornene copolymer (Dow Chemical, USA), 6 wt % of 3-(2,3-epoxypropoxy)propylmethyldiethoxysilane (Hangzhou Zhijiang Silicone Chemical Co., Ltd.) as a modified additive, 2.5 wt % of poly(polysuccinic acid (4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol) ester) (Yongguang Chemical Co., Ltd., Taiwan), 1 wt % of triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate (BASF, Germany) as an anti-thermo-oxidative aging agent, and 0.5 wt % of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (BASF, Germany) as an initiator were uniformly mixed, extruded at a temperature of 120 C. to 160 C., and then subjected to film casting to obtain an encapsulating layer having a thickness of 450 m.

[0063] Then, a reflecting layer having a thickness of 180 m was coated by spraying on one side of the encapsulating layer along a coating line which pre-designed the shape of the reflection region. The components of the coating material of the reflecting layer are 60 wt % of polycarbonate diol (Ube Co., Ltd., Japan), 3 wt % of polycarbonate diol (Huakai Resin Co., Ltd.), 10 wt % of titanium dioxide R960 (DuPont, USA), 2 wt % of polypropylene micropowder (Hangzhou Wannengda Technology Co., Ltd.), 10 wt % of N-(2-aminoethyl-3-aminopropyl)trimethoxysilane (Nanjing Lidong Chemical Co., Ltd.) as a modified additive, 10 wt % of glycidyl methacrylate (Shanghai Beihe Chemical Co., Ltd.) as a diluent, 1 wt % of 2-(2-hydroxy-5-tert-octylphenyl)benzotriazole (Hangzhou Jessica Chemical Co., Ltd.) as an UV stabilizer, 2.0 wt % of 1,3,5-trimethyl-2,4,6-tri (3,5-di-tert-butyl-4-hydroxybenzyl)benzene (Hangzhou Jessica Chemical Co., Ltd.) as an anti-thermo-oxidative aging agent, and 2.0 wt % of 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1-propanone (BASF, Germany) as an initiator. The raw materials were uniformly dispersed, coated on the encapsulating layer, and sequentially subjected to thermal curing at a temperature of 100 C. to 130 C. for 2 min and UV curing at a temperature of 60 C. to 100 C. for 1 min to obtain a high reflection gain type encapsulating film S5.

Comparative Example 1

[0064] The commercially available photovoltaic encapsulating material F4065 is of transparent type and has a thickness of 450 m.

[0065] The performances of the photovoltaic encapsulating films prepared in Examples 1, 2, 3, 4, and 5 and the material in Comparative Example 1 were tested. The results were shown in Table 1.

TABLE-US-00001 TABLE 1 Performance parameters of the prepared photovoltaic encapsulating films Performance Comparative parameters Unit Example 1 Example 2 Example 3 Example 4 Example 5 Example 1 Reflectivity in / 93.5% 97.9% 94.6% 95.0% 98.7% 0.5% reflection region Light transmittance in / 93.5% 92.5% 92.7% 93.0% 92.5% 92.3% encapsulating region Shrinkage ratio / 1.5%/1.3% 1.5%/1.3% 1.5%/1.3% 1.5%/1.3% 1.5%/1.3% 1.5%/1.3% (MD/TD) Volume resistivity .Math. cm 7.3 * 10.sup.16 1.5 * 10.sup.17 8.6 * 10.sup.17 7.5 * 10.sup.16 3.0 * 10.sup.17 3.5 * 10.sup.16 Degree of crosslinking / 68.9% 60.45% 79.6.% 55.6% 89.6% 80.3% Peeling strength from N/10 mm 158.4 151.6 160.7 157.1 153.9 156.9 glass Peeling strength after N/10 mm 143.2 140.6 144.3 142.0 144.7 135.1 heat and moisture for 2000 h Maximum power W 264.6 267.7 265.1 266.9 268.5 260.3

[0066] It can be seen from the data in the table that the high reflection gain type photovoltaic encapsulating film provided by the present disclosure has a high light transmittance in the encapsulating region and a high reflection performance in the reflection region, and provides a significant gain for the power of the double-sided cell photovoltaic module. In addition, it has very high reliability in terms of encapsulating performance, heat resistance and weather resistance, and thus can fully meet the requirements of double-sided cell encapsulating film materials. The material according to the present disclosure has the advantages of low material cost, simple and convenient preparation process and stable performances, thereby greatly improving the power generation efficiency of the double-sided and single-sided cell crystalline silicon photovoltaic modules, and providing important technical support for the photovoltaic modules with respect to the reduction of the auxiliary material cost and reduction of the levelized cost of energy