SUBSTRATE HOUSING STRUCTURE
20200017274 ยท 2020-01-16
Inventors
Cpc classification
B65D81/052
PERFORMING OPERATIONS; TRANSPORTING
B65D77/26
PERFORMING OPERATIONS; TRANSPORTING
International classification
B65D81/05
PERFORMING OPERATIONS; TRANSPORTING
B65D77/26
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A substrate housing structure includes a container, a cover, a bag, and a band. The container holds substrates therein. The over covers an opening of the container. The bag is disposed in a space between. the cover and a storing object including at least the substrates that are stacked. The bag is filled with flowable matter. The band is wrapped around the container and the cover.
Claims
1. A substrate housing structure comprising: a container holding a plurality of substrates therein; a cover covering an opening of the container; a bag disposed in a space between the cover and a storing object including at least the plurality of the substrates that are stacked, the bag being filled with flowable matter; and a band wrapped around the container and the cover.
2. The substrate housing structure according to claim 1, wherein the storing object includes cushion sheets disposed between the substrates such that the substrates and the cushion sheets are alternately on top of each other, the cushion sheets being disposed to reduce contact between the substrate, and the cushion sheets have a size larger than a plane size of the plurality of the substrates.
3. The substrate housing structure according to claim 2 wherein the size of the cushion sheets is about equal to a size of an inner bottom surface.
4. The substrate housing structure according to claim 1, wherein the cover is smaller than the opening.
5. The substrate housing structure according to claim 1, wherein the container includes a recess in an inner wall thereof in which the bag is inserted.
6. The substrate housing structure according to claim 1, wherein the bag includes partitions that divides an internal space into a plurality of sections.
7. The substrate housing structure according to claim 6, wherein the partitions are substantially perpendicular to an in-plane direction of the substrates.
8. The substrate housing structure according to claim 6, wherein the partitions include communication holes so that the sections of the internal space adjacent to the bag communicate with each other.
9. The substrate housing structure according to claim 8, wherein the communication holes are formed so that all the sections of the internal space of the bag divided by the partitions communicate with each other.
10. The substrate housing structure according to claim 1, wherein the cover and the bag are bonded together.
11. The substrate housing structure according to claim 1, wherein the container includes a groove in an outer wall thereof in which the band is fitted.
12. The substrate housing structure according to claim 1, wherein the substrates include glass substrates.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0010]
[0011]
[0012]
[0013]
[0014]
[0015]
[0016]
[0017]
[0018]
DETAILED DESCRIPTION
First Embodiment
[0019] A first embodiment will be described with reference to
[0020] As illustrated in the exploded view in
[0021] The storing object 20 according to this embodiment includes cushion sheets 24. The substrates 22 and the cushion sheets 24 are alternately disposed to reduce contact between the substrates 22 and to absorb impact. Each cushion sheet 24 is made of a material having insulating properties, resistance to impact, and flexibility (e.g., a formed polyolefin-based material such as formed polyethylene and formed polypropylene). Each cushion sheet 24 is formed in a sheet shape having a plane size that is about equal to a size of an inner bottom surface 12 of the container 10. Each substrate 22 is a glass substrate for a liquid crystal panel. Each substrate 22 has a thickness of about 0.25 mm to 1.5 mm. The container 10 is designed so that a plane size of the substrate 22 is about 1/3 to 2/3 of the size of the inner bottom surface 12. As illustrated in the top views in
[0022] The container 10 will be described. The container 10 is made of a material having strength that is sufficient for holding the storing object 20 (e.g., formed polystyrene). The container 10 is designed to have a horizontally elongated shape in a plan view so that the plane size of the substrate 22 is about to of the inner bottom surface 12. The container 10 is designed slightly larger so that the container 10 can be used even if the thickness and the plane size of the substrates 22 are altered.
[0023] The container 10 includes outer grooves 13A in outer walls 13. The bands 50 having the strip shape are fitted in the outer grooves 13A, respectively. In this embodiment, four outer grooves 13A are arranged at equal intervals in each of two sidewalls on a short edge side (in the plan view) and three outer grooves 13A are arranged at equal intervals in each of two sidewalls on a long edge side (in the plan view) Each outer groove 13A has a rectangular shape along an outline of the band 50 and linearly extends from the top surface 14 to the outer bottom surface 16 of the container 10.
[0024] The container 10 may include inner walls 17 with an inner groove 17A. The inner groove 17A may be a rectangular groove that extends for an entire perimeter of the container 10. The inner groove 17A may be located higher than the top of the storing object 20 so that a portion of the bag 40 that is disposed between the storing object 20 and the cover 30 is inserted in the inner groove 17A when the bag 40 is deformed.
[0025] The cover 30 is made of a material having strength. that is sufficient for holding the storing object 20 (e.g., formed polystyrene). The cover 30 has a plate shape with an outline along an outline of the opening 11 of the container 10. A plane size of the cover 30 is slightly smaller than the opening 11 of the container 10 as illustrated in
[0026] The bag 40 includes flexible film (e.g., a. polyethylene film, a nylon film) formed in a bag shape and an inner space filled with gas (e.g., air, an example of flowable matter). The bag 40 has a rectangular shape along the shape of the opening 11 of the container when the inner space is not filled with gas. The plane size of the bag 40 is greater than the opening 11 so that portions of the bag 40 enter spaces between the storing object 20 and the inner walls 17 of the container 10. The bag 40 may be bonded to the lower surface of the cover 30 and disposed between the storing object 20 and the cover 30. With the bag 40 bonded to the cover 30, the bag 40 can be handled with the cover 30 resulting in improvement in work efficiency during packing and unpacking. A known adhesive or a known adhesive tape may be used for bonding the bag 40 to the cover 30.
[0027] As illustrated in
[0028] Next, functions and effects of the substrate housing structure 100 will be described When the bag 40 is placed between the cover 30 and the storing object 20, the bag 40 is deformed to fit the spaces to cover the top and sides of the storing object 20 as illustrated in
[0029] The substrates 22 that are glass substrates for liquid crystal panels may be fragile. With the cushion sheets 24 between the substrates 22 in the storing object 20, the substrates 22 are less likely to contact with each other and thus impact on the substrates 22 can be reduced. The size of each substrate 22 is about to of each cushion sheet 24, that is, the cushion sheets 24 are larger than the substrates 22. As illustrated in
[0030] In this embodiment, the cover 30 is smaller than the opening 11 of the container 10. According to the configuration, the cover 30 is held inside the storing space 103. Therefore, the pressing force applied to the cover 30 can be easily transferred to the storing object 20 via the bag 40. By altering the tightness of the bands 50, the pressing forces applied to the storing object 20 can be easily adjusted.
[0031] However, the cover 30 that is smaller than the opening 11 creates gaps between the cover 30 and the top surface 14 of the container 10. This may result in reduction in thermal insulation performance of the container 10. If the substrates 22 are transported by air using the substrate housing structure 100, condensation may occur on the substrates 22 when the substrates 22 arrive at a destination due to a difference in temperature between on the ground and high up in the air. To reduce the condensation, an inner groove 17A may be formed in upper portions of the inner walls 17 of the container 10. With the portions of the bag 40 fitted in the inner groove 17A, the bag 40 is close contact with the inner walls 17. According to the configuration, the spaces between the cover 30 and the inner walls 17 are filled with the portions of the bag 40 to improve the thermal insulation performance.
[0032] With the outer grooves 13A in the outer walls 13 of the container in which the bands 50 are fitted, the bands 50 are less likely to be displaced, that is, the bands 50 are properly fixed. Therefore, the pressing forces applied to the storing object 20 can be increased. Furthermore, the positioning of the bands 50 can be easily performed and thus fitting of the bands 50 can be efficiently performed.
Second Embodiment
[0033] A bag 140 according to a second embodiment will be described. with reference to
[0034]
[0035] As illustrated in
[0036] As illustrated in
[0037] As illustrated in
[0038] Next, functions and effects of the partitions 142 will be described. With the partitions 142, airflows in the internal space of the bag 140 are restricted. This increases the pressing force of the bag 140. Specifically, with the partitions 142 substantially perpendicular to the in-plane direction of the substrates 22, the airflows in the thein-la .c are further restricted. Therefore, displacement of the substrates in the horizontal direction is less likely to occur.
[0039] As illustrated in
Other Embodiments
[0040] The technology described herein is not limited to the embodiments described in the above descriptions and drawings. The following embodiments may be included in the technical scope of the technology described herein.
[0041] (1) In the above embodiments, the container, the cover, and the cushion sheets have the rectangular shapes. However, they may have other shapes.
[0042] (2) In the above embodiments, the bag is filled with gas such as air. However, the bag may be filled with any flowable member such as liquid and gel.
[0043] (3) In the above embodiments, the cushion sheets are disposed between the substrates so that they are stacked. However, sheets made of a material having insulating properties, resistance to impact, and flexibility may be used. For example, paper sheets may be used.
[0044] (4) In the above embodiments, each substrate is about to of the cushion sheets. However, the substrates and the cushion sheets can be formed in any sizes as long as they can stored in the container.
[0045] (5) The shapes, the positions, the number, the sizes, and the intervals of the grooves in the outer walls are merely examples and can be altered where appropriate.
[0046] (6) The shapes, the positions, the number, the sizes, and the intervals of the recesses in the inner walls are merely examples and can be altered where appropriate. The recesses may not be formed in the inner walls to extend for the entire inner perimeter but in section of the inner walls.
[0047] (7) The shapes, the numbers, and the sizes of the bands in the embodiments are merely examples and can be altered where appropriate.
[0048] (8) In the second embodiment, the partitions are arranged in the grid pattern with equal intervals. However, the partitions may be arranged at unequal intervals or in a pattern other than the grid pattern.
[0049] (9) In the second embodiment, the communication holes arranged in the comb-like pattern or the single line pattern allow the airflows mainly in the longitudinal direction. However, the communication hole may be formed to allow the airflows in the transverse direction.
[0050] (10) In the above embodiment section, twenty to fifty glass substrates having the thickness of 0.25 mm to 1.5 mm for the liquid crystal panel are stacked for transport. However, the technology described herein can be applied to other types of substrates hazing different thicknesses, sizes, and the numbers.