THERMAL EXTRUSION METHOD TO FABRICATE LARGE-DIMENSION SUPERHYDROPHOBIC CYLINDER PILLAR ARRAYS WITH DROPLET PANCAKE BOUNCING PHENOMENON
20200009763 ยท 2020-01-09
Inventors
- Jinlong SONG (Dalian City, Liaoning Province, CN)
- Liu HUANG (Dalian City, Liaoning Province, CN)
- Changlin ZHAO (Dalian City, Liaoning Province, CN)
- Mingqian GAO (Dalian City, Liaoning Province, CN)
- Xin LIU (Dalian City, Liaoning Province, CN)
Cpc classification
B29C33/38
PERFORMING OPERATIONS; TRANSPORTING
B29C37/0053
PERFORMING OPERATIONS; TRANSPORTING
B29C51/00
PERFORMING OPERATIONS; TRANSPORTING
B29C59/022
PERFORMING OPERATIONS; TRANSPORTING
B29C37/0003
PERFORMING OPERATIONS; TRANSPORTING
B29L2031/756
PERFORMING OPERATIONS; TRANSPORTING
B01J2/30
PERFORMING OPERATIONS; TRANSPORTING
G03F7/0002
PHYSICS
International classification
B29C33/38
PERFORMING OPERATIONS; TRANSPORTING
B29C51/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A thermal extrusion method to fabricate large-dimension superhydrophobic cylinder pillar arrays with droplet pancake bouncing phenomenon. Preparing thermal extrusion mold: the through-hole arrays with 0.81.25 mm diameter, 0.25 mm interval space and 0.61.0 mm height are first obtained on metals, and are then polished, rinsed and dried. Thermal extrusion: polymer materials are first thermally extruded on the obtained mold and cooled to room temperature. Demold: excess polymer materials flowing from the through hole are cut off and then the polymer cylinder pillar arrays are lifted off from the mold. Superhydrophobic treatment: the whole polymer sample is treated using mixed liquid spray consisting of titanium oxide nanoparticles dispersed in fluoroalkylsilane ethanol solution, and the superhydrophobic cylinder pillar arrays are obtained. The method is easy to operate, low-cost, recyclable, effective for different polymer materials, and can obtain cylinder pillar arrays with large dimensions, which can realize efficient large-area and industrial fabrication of the droplet pancake bouncing surfaces.
Claims
1. A thermal extrusion method to fabricate large-dimension superhydrophobic cylinder pillar arrays with droplet pancake bouncing phenomenon, wherein the steps are as follows: preparing thermal extrusion mold: the through-hole arrays with 0.81.25 mm diameter, 0.25 mm interval space and 0.61.0 mm depth are first obtained on metals, and then rinsed and dried; thermal extrusion: based on the obtained mold, the polymer plates are first thermally extruded on the mold and cooled to room temperature; demold: excess polymer materials flowing from the through hole are cut off and then the polymer cylinder pillar arrays are lifted off from the mold; superhydrophobic treatment: the superhydrophobic cylinder pillar arrays are obtained via spraying the mixed 1 wt. % fluoroalkylsilane ethanol solution containing titanium oxide nanoparticles and being dried in the air; The mass ratio of titanium oxide nanoparticles and ethanol solution of fluoroalkylsilane in the aforementioned mixture should not be lower than 1:25.
2. The thermal extrusion method as in claim 1, wherein the aforementioned metals can be aluminum, copper, mold steel or stainless steel.
3. The thermal extrusion method in claim 1, wherein the aforementioned polymer plates can be polypropylene, polycarbonate, polyethylene or polytetrafluoroethylene.
Description
DESCRIPTION OF THE DRAWING
[0015]
[0016]
[0017]
[0018]
[0019]
[0020] In Figs: 1through-hole arrays mold on Al substrate; 2drilling tool; 3thermal extrusion; 4polymer materials; 5upper press plate of the punch; 6heating and pressing; 7bottom press plate of the punch; 8cutting off and demold; 9spraying.
MODE OF CARRYING OUT THE INVENTION
[0021] Combined with drawings and technical solutions, the following statements will further illustrate the mode of carrying out the present invention.
EMBODIMENT
[0022] The method of thermal extrusion replication using porous array mold is adopted to fabricate superhydrophobic cylinder pillar arrays which can generate droplet pancake bouncing phenomenon, as shown in
[0023] (1) Preparing thermal extrusion mold: the Al plates (1 mm thick) were first polished using #800 and #1500 abrasive paper, respectively, and then ultrasonically cleaned with deionized water to remove the surface oxide layer and grease. The through-hole arrays with 1.05 mm diameter, 0.25 mm interval space and 1.0 mm depth were first obtained by drilling, which were then polished with #1500 abrasive paper to remove surface burr followed by rinsing with deionized water and drying.
[0024] (2) Thermal extrusion: the through-hole arrays mold obtained in step 1 was put on the bottom press plate of the punch, and PP plates were just fixed on the upper press plate of the punch. Then the pressure of the punch was adjusted as 2000 Pa after setting the temperature of substrate to 180 C., and the mold materials were cooled to room temperature after baking for 10 min and releasing the pressure.
[0025] (3) Demold: the PP cylinder pillar arrays were prepared by cutting off the excess polymer materials flowing from the through hole in step 2 which could be recycled, and lifting off from the mold. The surface structures are shown in
[0026] (4) Superhydrophobic treatment: the mixed fluoroalkylsilane ethanol solution containing titanium oxide nanoparticles were prepared by adding 6 g titanium oxide nanoparticles (40 nm) into 50 g fluoroalkylsilane ethanol solution. The superhydrophobic PP cylinder pillar arrays were obtained by spraying the mixture onto the PP cylinder pillar arrays fabricated in step 3.