PERFORMANCE OF TECHNICAL CERAMICS

Abstract

Disclosed herein are a ceramic particle comprising a ceramic core substrate and a conformal coating of a sintering aid film on a surface of the core substrate, wherein the conformal coating includes a plurality of distributed islands of the sintering aid film across the surface of the core substrate; methods for producing the ceramic particle by ALD or MLD; and methods of using the coated ceramic particles in additive manufacturing or in solid oxide fuel cells. In one example, the film may have a thickness of less than three nanometers. The disclosed ceramic particle may be non-reactive with water.

Claims

1. A ceramic particle comprising: a core substrate chosen from yttria-stabilized zirconia, partially stabilized zirconia, zirconium oxide, aluminum nitride, silicon nitride, silicon carbide, boron carbide, boron nitride, aluminum oxide, barium titanate, and cerium oxide, and a conformal coating of a sintering aid film on a surface of the core substrate, wherein the conformal coating of the sintering aid film comprises a plurality of distributed islands of the sintering aid film across the surface of the core substrate.

2. The ceramic particle of claim 1, wherein less than 40 percent of the surface of the core substrate is covered by the plurality of distributed islands of the sintering aid film, and wherein the plurality of distributed islands of the sintering aid film are substantially evenly distributed.

3. The ceramic particle of claim 2, wherein about 5 percent of the surface of the core substrate is covered by the plurality of distributed islands of the sintering aid film.

4. The ceramic particle of claim 1, wherein the ceramic particle is non-reactive with water.

5. The ceramic particle of claim 1, wherein the core substrate comprises barium titanate and the sintering aid film comprises at least one compound chosen from alumina, an alkaline earth oxide, zinc oxide, titanium oxide, boron nitride, a silicon oxide, silicon carbide, magnesium oxide, and an oxide of a lanthanide.

6. The ceramic particle of claim 5, wherein the sintering aid film comprises at least one of alumina and an oxide of lanthanum.

7. The ceramic particle of claim 1, wherein the core substrate comprises aluminum nitride, and wherein the sintering aid film comprises at least one compound chosen from, yttrium fluoride, yttrium nitride, gadolinium oxide, gadolinium nitride, samarium oxide, lithium oxide, niobium oxide, calcium fluoride, cerium oxide, boron nitride, silicon oxide, and an alkaline earth oxide.

8. A colloidal gel or slurry suitable for additive manufacturing, the colloidal gel or slurry comprising the ceramic particle of claim 1.

9. A solid oxide fuel cell comprising the ceramic particle of claim 1.

10. A ceramic particle comprising: a core substrate chosen from yttria-stabilized zirconia, partially stabilized zirconia, zirconium oxide, aluminum nitride, silicon nitride, silicon carbide, boron carbide, boron nitride, aluminum oxide, barium titanate, and cerium oxide, and a conformal coating of a sintering aid film having a thickness of less than three nanometers and covering the core substrate.

11. The ceramic particle of claim 10, wherein the ceramic particle is non-reactive with water.

12. The ceramic particle of claim 10, wherein the core substrate comprises aluminum nitride, and wherein the sintering aid film comprises at least one compound chosen from, yttrium fluoride, yttrium nitride, gadolinium oxide, gadolinium nitride, samarium oxide, lithium oxide, niobium oxide, calcium fluoride, cerium oxide, boron nitride, silicon oxide, and an alkaline earth oxide.

13. A colloidal gel or slurry suitable for additive manufacturing, the colloidal gel or slurry comprising the ceramic particle of claim 10.

14. A solid oxide fuel cell comprising the ceramic particle of claim 10.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Embodiments of the invention are further described hereinafter with reference to the accompanying drawings, in which:

[0017] FIG. 1 is a graphical representation of Relative Density measured volumetrically for different sample types having been sintered in air at 1350 C. for 2 hours as a function of the number of ALD cycles, and wherein BM represents a Prior Art ball-milled sample.

[0018] FIG. 2 is a graphical representation of oxygen ion conductivity at different temperatures in C., measured using electrochemical impedance spectroscopy for different sample types having been sintered in air at 1350 C. for 2 hours, and wherein BM represents a Prior Art ball-milled sample.

[0019] FIG. 3 A is a graphical representation of the relative density (% theoretical) as a function of temperature during constant rate of heating at 10 C./min heating rate, in dilatometer experiments for all samples analyzed (coated and uncoated).

[0020] FIG. 3 B is a graphical representation of the relative density (% theoretical) as a function of temperature during constant rate of heating at 15 C./min heating rate, in dilatometer experiments for all samples analyzed (coated and uncoated).

[0021] FIG. 3 C is a graphical representation of the densification rate (1/K) as a function of temperature during constant rate of heating at 10 C./min heating rate, in dilatometer experiments for all samples analyzed (coated and uncoated).

[0022] FIG. 3D is a graphical representation of the densification rate (1/K) as a function of temperature during constant rate of heating at 15 C./min heating rate, in dilatometer experiments for all samples analyzed (coated and uncoated).

[0023] FIG. 4 is a graphical representation of the apparent activation energy of densification as a function of number of ALD cycles, wherein the activation energy was determined from a series of constant rate of heating dilatometer experiments.

[0024] FIG. 5 is a graphical representation of the decrease in ionic conductivity (S/cm) when decreasing the sintering temperature from 1450 C. to 1350 C. as a function of measurement temperature and number of ALD cycles, wherein conductivity was measured using electrochemical impedance spectroscopy.

[0025] FIG. 6 is a bar graph showing, for zero to 5 ALD cycles, the increase in R GB/R bulk at 300 C. defined as (the ratio of grain boundary resistivity to bulk resistivity after sintering at 1450 C. for 2 h) minus (the ratio of grain boundary resistivity to bulk resistivity after sintering at 1350 C. for 2 h) as measured using electrochemical impedance spectroscopy at 300 C. in air.

[0026] FIG. 7 is a table listing four ceramic cores at the top of each column, and under each core, providing some disclosed sintering aids for use with the respective core.

DETAILED DESCRIPTION

[0027] The invention inter alia also includes the following exemplary embodiments, alone or in combination. It will be understood that the particular embodiments of the invention are shown by way of illustration and not as limitations of the invention. At the outset, the invention is described in its broadest overall aspects, with a more detailed description following.

[0028] Disclosed herein are a process comprising adding a conformal thin film of ceramic sintering aid of desired thickness (wt %) to a primary ceramic powder by atomic layer deposition using, for example, an agitated powder reactor, and a product formed by the process. As the term is used herein, the adjective conformal means that the noun or object that conformal modifies takes the shape or conforms to an underlying shape. As used herein, a conformal coating on the surface of a core substrate and a conformal film on the surface of a core substrate have the same meaning, which meaning is that the coating or the film conforms to the contours of the surface of the core substrate. It should be noted that a conformal film does not mean a film of uniform thickness.

[0029] For use in preparing a 3D ink. e.g., incorporation of a conformal coating of the sintering aid around each primary ceramic substrate particle, was found to improve the fabricated part properties associated with grain boundary phenomena. The grain boundary phenomena included impurity scavenging, grain boundary diffusion, grain growth, liquid-phase sintering, ionic conductivity, thermal conductivity, etc. When used in Additive Manufacturing (AM) or 3D printing, the disclosed ceramic particles with the sintering aid coating showed increased homogeneity of formed dense parts as compared with that of dense parts formed by conventional techniques such as ball milling, spray drying, or sol-gel processing.

[0030] Sintering is the process of causing a material to become a coherent or compact, dense mass by applying heat and/or pressure without melting or liquefying the material. On a molecular level, sintering is a process of fusing small grains, e.g., powders, to form physical objects. Sintering usually involves heating a powder. When a powdered material is heated to a sufficient temperature in a sintering process, the smaller particles or atoms within the powder particles diffuse across the boundaries of adjacent particles, fusing the particles together to form a solid piece. In contrast to melting, the powder used in sintering need not reach a liquid phase. As the terms are used herein, densification and sintering, and grammatical variations thereof, have the same meaning. A sintering aid helps impart integrity and compressive strength to the material being sintered.

[0031] Additionally, in the preparation of a ceramic slurry or colloid in, for example, tape casting or additive manufacturing via direct ink writing, the thin film of sintering aid enables facile rheology control by exposing only one surface (the sintering aid), as compared to conventional sintering aid incorporation methods wherein multiple surfaces, and thus multiple surface charges will be present (i.e., the sintering aid and the primary ceramic). For fine ceramic precursor powders that are prone to degradation in aqueous environments, e.g., aluminum nitride (AlN) powders, the thin and pinhole-free conformal coating of an oxide ceramic sintering aid, renders the particles resistant to degradation by water, thereby enabling aqueous processing which is critical in, for example, direct ink writing (additive manufacturing). 3 wt % yttrium oxide is a good sintering agent for aluminum nitride. A more detailed description follows.

[0032] Atomic Layer Deposition (ALD), a thin film deposition technique, is a self-limiting surface reaction that deposits uniform layers of the desired precursor onto the particle surface. This can be done by fluidizing the particles and adding two different precursors in sequence such that there are two reactions occurring sequentially. For the addition of Al.sub.2O.sub.3 to 8YSZ, the reaction utilizes trimethylaluminum (TMA) and water as precursors, adding first TMA, then water, then TMA, and so on. One addition of TMA plus one addition of water comprises one cycle. The reaction proceeds in a fluidized bed reactor to help ensure coating of all surfaces.

[0033] Previous studies have investigated the effects of Al.sub.2O.sub.3 on the kinetics of 8YSZ densification. In these studies, undoped 8YSZ was compared with samples mixed with Al.sub.2O.sub.3 concentrations ranging from 0.1-10 wt % Al.sub.2O.sub.3 where Al.sub.2O.sub.3 was incorporated using a conventional process such as milling, spray drying, or sol-gel-type processing with the optimal amount for minimizing the sintering temperature and apparent activation energy typically found to be less than (<) 1 wt %.

[0034] In accordance with the present invention there is provided a method wherein atomic layer deposition (ALD) was used to add Al.sub.2O.sub.3 to 8YSZ as a sintering aid. The effects of the ALD-produced mixture on sintering behavior, kinetics, and ionic conductivity, and for comparison to 8YSZ as purchased, were tested. Al.sub.2O.sub.3 was deposited as a conformal coating on 8YSZ particles at concentrations ranging from approximately () 1 to approximately 4 wt %, corresponding with 1 to 9 ALD cycles, respectively. According to another embodiment of the invention, the mass or weight of the alumina in the sintering aid film is from about 0.2 weight percent to about 2 weight percent of the ceramic particle. For all samples, the addition of Al.sub.2O.sub.3 reduced the temperature required for sintering by 100 C. and decreases the apparent activation energy of densification. The optimal concentration of Al.sub.2O.sub.3 was found to be about 2.2 wt % corresponding with about 5 ALD cycles which reduced the apparent activation energy from 700 kJ/mol to 400 kJ/mol. A ceramic particle prepared according to an embodiment of the invention is non-reactive with water.

Three Dimensional (3D) Printing Ink

[0035] There has been an ongoing need in the 3D ink industry for a method of achieving a more uniform distribution of ceramic and sintering aid, increased reliability and consistency of parts produced, and increased densification with closer packing of particles, which aspects are critical for the production of small parts.

[0036] We investigated the effects of the addition of Al.sub.2O.sub.3 by ALD on densification and ionic conductivity, developed a strong 3D ink formulation, and successfully printed 3D lattice structures to be further analyzed. With the addition of different amounts of Al.sub.2O.sub.3 to 8YSZ, the effects on densification behavior were examined through constant rate of heating experiments using a horizontal push-rod dilatometer. The effects examined included the sintering temperature, the temperature at which the maximum densification rate occurs, the kinetics by which the densification proceeds, the overall ionic conductivity as a function of temperature, and the relative contributions of grain boundary and bulk resistivity. The ink formulation was determined by preparing numerous batches of ink and varying the solids loading and relative polymer amounts in order to obtain the desired rheology for printing with maximum solids vol %. The optimized ink was then used to print 3D structures that were sintered and examined under the SEM.

[0037] One embodiment of the invention is a material composition for 3D printing, the composition comprising dispersed solids in a colloid, the solids coated conformally with a solid sintering additive. In another embodiment, the dispersed solids are coated conformally with the solid sintering additive by atomic layer deposition (ALD). In yet another embodiment, the conformal coating is also uniform throughout. The invention inter alia includes the following, alone or in combination.

[0038] Prior art ball milling together of Al.sub.2O.sub.3 and 8YSZ yields only a reasonably uniform distribution of ceramic and sintering aid. However, in contrast to ball milling, using ALD coating of particles yields precise, uniform, conformal coating of 8YSZ ceramic particles with Al.sub.2O.sub.3. In coating every substrate particle uniformly by ALD, one can ensure that the sintering aid is utilized throughout the densifying matrix. Uniform, conformal coating also allows use of a lower temperature for densification, which will also reduce the tendency for grain sizes/flaw sizes to grow. The lower temperature also appears to reduce the amount of sintering aid needed to be deposited on the substrate particles in order to achieve high density upon part fabrication.

[0039] With prior art methods, it is expected that the incorporation of the sintering aid as a particle additive will result in particulate inclusions at triple grain junctions in the densified matrix. In contrast, when the sintering aid additive is deposited according to an embodiment of our invention as a conformal coating or a uniform, conformal coating by ALL), the additive will exist as an intergranular amorphous thin film, instead of as particulates. The presence of an intergranular, amorphous, uniform, conformal film coating of the ceramic particles enables lower temperature densification and improved homogeneity of dense parts.

[0040] Stability is critical for use in 3D printing, or Additive Manufacturing (AM), and a colloidal gel needs to be prepared from the core/shell substrate/sintering aid particles. Because colloidal properties are the result of fine tuning the dispersion in order to suspend particles in the ink/gel, it is critical to optimize the chemical characteristics of the suspended ceramic particles. For conventional ball-milled precursors, there will be two surfaces (the substrate ceramic and the sintering aid) that require stabilization, and the gel formulation will be a compromise of properties for the substrate and sintering aid. For Particle ALL) coatings, there is only one surface to be optimized, that of the sintering aid which surrounds each particle. Hence, it is not only easier to prepare colloidal gels, but also easier to prepare gels that are truly optimized for the system. This improves the preparation of 3D inks/gels having improved flowability for additive manufacturing and ultimately part-to-part reliability.

[0041] Importantly, using ALD) rather than ball milling, one can use substrate ceramic particles of smaller size, and therefore achieve closer packing and overall improved uniformity of densification. This unexpected result demonstrates the criticality of using ALD to conformally coat substrate ceramic particles in producing 3D ink, and is important for production of very small 3D parts, for which full densification is required.

Solid Oxide Fuel Cells

[0042] At least because the ionic resistance of 8YSZ increases with decreasing temperature, the costs of running SOFCs currently remain high because they must be run at high temperatures. Therefore, there is an unmet need of being able to lower the operating temperature of the fuel cell, which can be done by improving the properties of 8YSZ. 8YSZ has a high sintering temperature of 1450 C. However, the addition of Al.sub.2O.sub.3 has been demonstrated to lower this temperature, similarly reducing the costs of manufacturing SOFCs. It has also shown positive effects on improving ionic conductivity at lower temperatures which would in turn lower the operating temperature of the SOFC. It may be important that ionic conductivity of 8YSZ remain fairly stable when used in SOFCs.

EXEMPLIFICATION

[0043] The primary equipment used for the dilatometer studies included the dilatometer, planetary centrifugal mixer, hydraulic press, and cylindrical steel die. The dilatometer requires ceramic powder compacts that are cylindrical in shape. To achieve this, 8YSZ powder, both with and without Al.sub.2O.sub.3, were mixed with a polymeric binder, which was a solution of 2 wt % poly(vinyl alcohol) (Acros Organics, 98.0-98.8% hydrolyzed, average molecular weight 31,000-50,000 grams/mole) and 98 wt % deionized water. The binder was incorporated by mixing 4 grams of binder, 20 grams of 8YSZ powder, and 25 grams of grinding media (Tosoh Corp., 5 mm diameter, YTZ Grinding Media) in a planetary centrifugal mixer for 30 seconds at 1100 rpm. The planetary centrifugal mixer provides sufficient dispersion of the binder throughout the ceramic powder by simultaneously undergoing high speed revolution and rotation, while the grinding media aids in dispersion.

[0044] After sufficient mixing, the 8YSZ powder/binder mixture was separated from the milling media. Cylindrical compacts were made by placing 0.45 grams of 8YSZ powder/binder mixture into a 6 mm inner diameter cylindrical die, which was exposed to 1 ton of pressure for 90 seconds using a hydraulic press. The compact was then ejected from the die and assigned a compact number. Samples were pressed for 8YSZ powder with 0-9 Al.sub.2O.sub.3 ALD cycles.

[0045] The dilatometer comprises a sample holder, furnace, and push rod to measure displacement. A constant force of 35 centinewton (35 cN) was exerted on the push rod to maintain constant contact with the sample being tested as it shrinks during heating.

[0046] Each sample was sintered in air. Before the compact was inserted into the dilatometer, the length was measured and recorded using calipers. The compact number was recorded along with the heating test that was to be run. Constant rate of heating experiments were then carried out as follows: heating rate of 1 C./min from room temperature to 600 C. (binder burnout), desired heating rate (5, 10, 15, or 20 C./min) from 600 C. to 1550 C., cooling back to room temperature at 20 C./min. The linear shrinkage was recorded during these experiments by the dilatometer which was calibrated using a sapphire standard. The shrinkage was then related to density by correcting for the thermal expansion of the samples using the cooling portion of the curves and assuming isotropic shrinkage. As such, these experiments enable the density to be produced as a function of temperature, heating rate, and sample type. The densification rate is then taken as the first derivative of the density with respect to temperature, approximated using finite difference. The density and densification rate can then be used to approximate the apparent activation energy for densification by utilizing an Arrhenius-type dependence of the rate of densification on temperature.

[0047] The principal equipment for ink formulation is a high precision scale accurate to 0.1 milligrams and a planetary centrifugal mixer. The centrifugal planetary mixer allows thorough mixing of high viscosity inks. It works by orienting the container at 45 relative to the vertical axis and spinning the container counterclockwise. As the container spins counterclockwise on its own axis, the container is spun along the vertical axis in a clockwise direction which causes vertical spiral convection and exerts a force of 400 G on the ink, effectively evacuating all air as well. The ink formulation begins with a small container fitted for the planetary mixer, which is where the ink will be produced and stored. First, YTZ grinding media is added to aid in mixing. 11.56 grams of water was added, then 3.86 grams of ammonium polyacrylate (Darvan 821A) as dispersant. The mass of powder was added in two parts to help ensure uniform mixing. First, 37 grams of 8YSZ powder (coated or uncoated) was added to the aqueous solution which was then placed in the planetary mixer and set to mix for 30 seconds at 1100 rpm. Another 37 grams of 8YSZ powder was added to total 74 grams of powder. It was mixed again for the same time and speed. Next, 1.08 grams of hydroxypropyl methylcellulose (HPMC) were added as a viscosifier to prevent separation of the ink into component parts. The colloidal ink was mixed once more; then the sides were scraped down and it was mixed again. The final ingredient addition is polyethylene imine (PEI) which is in a 40 wt % solution with water to lower viscosity and allow handling. One drop was added, or about 0.02 grams, as a flocculant. The ink was mixed one last time with a final solids volume of 43.5%. The ink was then sealed from air until use.

[0048] The principal equipment for direct ink writing and sintering of parts includes a 3D printer, oil bath, and high temperature furnace. So that it may operate with very high precision, the 3D printer utilizes magnets to move. The printer was connected to a computer and operated from there using a specifically designed program. First, a syringe was filled with the prepared 3D ink, and fitted with a tip having a diameter of 330 microns. The oil bath was placed underneath the 3D printer, and the printing substrate was placed in the oil bath. The substrate was a ceramic, and dark in color to allow for visualization of the white ink. To begin printing, the syringe was placed in the printer, and the printer was lowered until just touching the surface of the substrate; then it was raised 200 microns. Rasters, or series of parallel scanning lines, were initiated in order to get the ink flowing smoothly before beginning the print job. Using the computer program, the desired shape was selected and once ready, the printer automatically carried out the print job. Once it completed printing, the piece was removed from the oil bath and left to dry for 48 hours in air. The pieces were sintered in a high temperature tube furnace. The sintering process began with binder burnout, then heated to 1450 C. at a rate of 1.5 C./min; then held at the maximum temperature for 1 hour. It was then cooled at a rate of 20 C./min to room temperature.

[0049] The principal equipment for ionic conductivity measurements are a mechanical press, a sintering furnace, and an electrochemical impedance spectrometer. 8YSZ powder (coated or uncoated) were mixed with 2-3 drops poly(vinyl alcohol) and pressed to a thickness of 0.5 by a mechanical press. Pressed pellets were then densified in air at either 1350 C. or 1450 C. for 2 h. The sintered pellets were then painted with a conductive Pt paste and inserted into a furnace for the electrochemical impedance spectrometry measurements. Ionic conductivity was measured in air at temperatures ranging from 300-800 C.

Results and Discussion

[0050] Al.sub.2O.sub.3 was deposited on commercial 8YSZ powder by means of ALD. The ALD process exhibited a nearly linear growth rate with number of cycles enabling the deposition of Al.sub.2O.sub.3 at a controllable concentration. The Al.sub.2O.sub.3 was precisely deposited as a uniform and conformal coating covering each primary 8YSZ particle as a thin amorphous film. The presence of Al.sub.2O.sub.3 by ALD enables pellets to reach near theoretical density (>94%) after sintering in air for 2 h at 1350 C. This same density is not reached for either the YSZ with no Al.sub.2O.sub.3 or the YSZ with Al.sub.2O.sub.3 incorporated by ball milling as seen in FIG. 1.

[0051] The precise incorporation of Al.sub.2O.sub.3 by ALD) decreased the temperature required to sinter/densify by 100 C. for all Al.sub.2O.sub.3 concentrations investigated. FIG. 3A depicts the relative density (% theoretical) as a function of temperature during constant rate of heating at 10 C./min heating rate. FIG. 3B depicts the relative density (% theoretical) as a function of temperature during constant rate of heating at 15 C./min heating rate. For both heating rates, the uncoated samples had less relative density than did the coated samples. Similarly, the densification rate in the initial stage of sintering (relative density <80% theoretical) was found to be greater for all coated samples than the uncoated samples at all temperatures within this regime (FIG. 3C and FIG. 3D.). The temperature at which the maximum densification rate is obtained is similarly decreased by 100 C. for all coated samples when compared to the uncoated 8YSZ except the 9ALD sample for which the temperature is decreased by <100 C.

[0052] An Arrhenius-type analysis of the densification rate as a function of temperature over densities within the initial stage (60-80% density) reveals the apparent activation energy of densification for each sample type. The activation energy is the highest for the uncoated sample, decreases slightly at low Al.sub.2O.sub.3 concentrations (1, 3 cycles) and high Al.sub.2O.sub.3 concentrations (7, 9 cycles), and decreases significantly at the optimal concentration (of those evaluated) of 5ALD cycles or 2.2 wt % Al.sub.2O.sub.3(FIG. 4). This dramatic change in activation energy at the 5ALD incorporation level suggests that a conformal ALD film of this thickness (0.5-0.7 nm) enables a low activation energy diffusion process to occur. It is expected that from about 1 to about 3 ALD cycles, a monolayer does not exist around each 8YSZ particle, instead preferring the formation of small Al.sub.2O.sub.3 islands forming a submonolayer of coverage. At 5ALD cycles, we did have a conformal monolayer of Al.sub.2O.sub.3 around each substrate particle, 0.5 nm in thickness. As the number of ALD cycles is increased, this monolayer grows in thickness to 1-1.4 nm at 9ALD cycles. The minimum activation energy is found for the 5ALD film of 0.5 nm thickness, suggesting that this is the optimal thickness for an intergranular amorphous film to be thick enough to dissolve sufficient cations (Zr.sup.4+) but thin enough to enable facile diffusion from grain to grain. At lower thicknesses, the intergranular diffusion path will be insufficiently formed. At higher thicknesses, the film will be sufficiently thick to act in part as a barrier to intergranular diffusion.

[0053] A reduction in sintering temperature is expected to have deleterious effects on the ionic conductivity of 8YSZ electrolytes due in part to the retention of pores or defects in the microstructure. Ionic conductivity measurements were obtained for 8YSZ (coated and uncoated) using electrochemical impedance spectrometry following two sintering procedures 1450 C. for 2 h and 1350 C. for 2 h. The decrease in conductivity accompanying the decrease in sintering temperature was found to be diminished for all coated samples evaluated (1-7 ALD cycles). The conductivity decrease is similarly expected to be measurement temperature-dependent. However, we found the ionic conductivity decrease to be approximately constant as a function of impedance temperature, with the exception of the 3ALD sample. As such, the Al.sub.2O.sub.3 ALD coatings demonstrate that a reduction in sintering temperature is not accompanied by a reduction in ionic conductivity (electrolyte performance) as is the case in the uncoated sample. The ionic conductivity of samples sintered at 1350 C for 2 h was found to be optimized or maximized with 1 ALD cycle of Al.sub.2O.sub.3 (0.7 wt %) as seen in FIG. 5. The performance of this sample was found to be superior to YSZ with no Al.sub.2O.sub.3 and YSZ with Al.sub.2O.sub.3 incorporated by ball milling. Ionic conductivity decrease is defined as (conductivity after sintering at 1450 C minus conductivity after sintering at 1350 C). Coated samples outperformed the uncoated sample at all temperatures. The benefit of the ALD coatings increases with temperature.

[0054] Low temperature (300 C.) electrochemical impedance spectrometry can be used to decouple the relative contributions of the grain boundaries and the grain interior to the total resistivity of the electrolyte. Following sintering at two temperatures as described previously, we note the increase in grain boundary resistivity is significant for the uncoated sample but less so for the coated samples, particularly for the 5ALD sample (FIG. 6). This suggests that the ALL) coatings sufficiently alter the microstructure, and particularly the grain boundary microstructure, such that resistivity at the grain boundary is reduced following reduced temperature sintering compared with the uncoated sample.

[0055] Colloidal gel ink formulations were developed for 8YSZ with 0, 1, and 3 Al.sub.2O.sub.3 ALD cycles. For 8YSZ with 0 Al.sub.2O.sub.3 ALD cycles, the optimum solids volume percentage was found to be between 43.5 vol % to just under 44 vol %. A printable 8YSZ ink can be made with 44 vol % solids, but it is prone to thickening with time, causing the printer to clog and stall, rendering the printed part unusable. However, inks consisting of 43.5 vol % solids could be printed reliably, and had a high viscosity to resist deformation and retain their shape after extrusion. Additionally, it was shown that the ink formation with 43.5 vol % solids content experiences minimal warping and uniform shrinkage after densification. At a solids loading greater than 44 vol %, the colloidal ink collapses and becomes unprintable and firm. The polyelectrolyte, Darvan, no longer effectively disperses the mixture and phases of liquid and powder begin to separate. Solids loading less than 43 vol % leads to deformation after extrusion, and an increased likelihood of warping and cracking during drying and densification. The final optimized ink formulation for 8YSZ with 0 Al.sub.2O.sub.3 cycles was 43.5 vol % 8YSZ powder, 41.5 vol % water, 11.1 vol % Darvan, 3.8 vol % hydroxypropyl methylcellulose, and 0.2 vol % PEI.

[0056] The optimized ink formulation for 8YSZ was then extended to 8YSZ with 1 and 3 Al.sub.2O.sub.3 ALD cycles. The ink formulation for 8YSZ with 1 Al.sub.2O.sub.3 ALD cycle was 42.4 vol % 8YSZ/Al.sub.2O.sub.3 powder, 42.0 vol % water, 11.4 vol % Darvan, 4.1 vol % hydroxypropyl methylcellulose, and 0.2 vol % PEI. Additionally, the ink formulation for 8YSZ with 3 Al.sub.2O.sub.4 ALD cycles was 39.4 vol % 8YSZ/Al.sub.2O.sub.3 powder, 44.8 vol % water, 12.2 vol % Darvan, 3.4 vol % hydroxypropyl methylcellulose, and 0.2 vol % PEI. Both these formulas led to the successful fabrication of 3D square lattice structures using direct ink writing, where clogging did not occur during printing and final parts did not warp or deform.

[0057] The rheology of the ink chosen is highly dependent on the surface chemistry of the ceramic particles. A solution of 8YSZ and water has a pH of approximately 7 and, with a basic isoelectric point, the 8YSZ surface becomes positively charged. Van der Waals forces cause the 8YSZ particles to agglomerate, so the a negatively changed polyelectrolyte. Darvan, was added to homogeneously disperse the 8YSZ powder through electrosteric repulsion. The dispersant allows for ink homogeneity, but a flocculant must be added to ensure the ink is stronger and has desirable mechanical properties to resist deformation. The flocculant added was PEI, which is a positively charged polyelectrolyte. A small amount was added so that some, but not all, of the dispersant effects were countered. Viscosity was adjusted by adding hydroxypropyl methylcellulose, and ensured that the ink would not separate out into individual components. The final result was a homogenous, viscous ink that prints without separating and holds it shape during extrusion, drying, and densification.

[0058] It was found that the ink formulations for 8YSZ with 0, 1, and 3 Al.sub.2O.sub.3ALD cycles required similar amount of dispersant and flocculant, only varying slightly in water and Darvan content, to control the particle surface chemistry and produce an ink with required rheology. The ink formulation is dependent on the particle surface chemistry, and at 1 and 3 Al.sub.2O.sub.3ALD cycles, only a sub-monolayer of Al.sub.2O.sub.3 is present. The particle surface consists of both 8YSZ and Al.sub.2O.sub.3. Therefore, it can be seen that the particle surface chemistry of both 8YSZ and 8YSZ with 1 and 3 Al.sub.2O.sub.3 cycles respond similarly to the polyelectrolytes utilized in the production of the colloidal gel ink.

[0059] It was also found that a significant amount of shrinkage occurs during densification for 3D printed colloidal gel inks. For 8YSZ with 0 Al.sub.2O.sub.3 ALD cycles, the initial dimensions of all printed parts are approximately 35.3 mm by 35.5 mm. After drying the dimensions are 34.7 mm by 34.8 mm, which is a shrinkage of about 4%. The dimensions of the sintered pieces on average are 27.3 mm by 26.9 mm, which is a shrinkage of about 40%. This is due to the elimination of water, hydroxypropyl methylcellulose, Darvan, and PET from the part and the reduction of pores from between ceramic grains.

[0060] According to an embodiment of the invention, a ceramic particle has a conformal coating of the sintering aid film covering the core substrate, and is formed by atomic layer deposition using a system chosen from at least one of a fluid bed reactor, a vibrating reactor, a rotating reactor, a spatial system wherein precursor gases are separated in space, and a batch reactor.

[0061] A ceramic particle according to an embodiment of the invention has a core comprising cerium oxide and a sintering aid film chosen from alumina, titanium oxide, yttrium oxide, calcium oxide, iron oxide, copper oxide, chromium oxide, boron oxide, silicon dioxide, nickel oxide, and any desired combinations thereof. In another embodiment, the core of the ceramic particle comprises aluminum nitride, and the sintering aid film is chosen from yttrium oxide, magnesium oxide, calcium oxide, silicon dioxide, lanthanum oxide, and any desired combinations thereof.

[0062] A ceramic particle according to an embodiment of the invention has a core chosen from silicon nitride and silicon carbide, and the sintering aid film is chosen from yttrium oxide, alumina, magnesium oxide, lutetium oxide, ytterbium oxide, and any desired combinations thereof.

[0063] Analysis and Recommendations

[0064] The precise coating of 8YSZ with Al.sub.2O.sub.3 by ALD is effective in reducing the sintering temperature and temperature at which the maximum rate of densification is obtained by 100 C. The apparent activation energy for densification was found to similarly decrease for all coated samples when compared with the uncoated 8YSZ. The optimal level of ALD incorporation for maximally reducing the apparent activation energy was found to be 5 ALD cycles or 2.2 wt % Al.sub.2O.sub.3.

[0065] The precise conformal coating of 8YSZ with Al.sub.2O.sub.3 by ALD is similarly effective in enabling sufficiently conductive electrolytes when utilizing a reduced sintering temperature. For this application, 1 ALD cycle or 0.7 wt % Al.sub.2O.sub.3 was found to be the optimal, although 5 and 7 ALD cycles (2.2 and 3.3 wt %) perform similarly. At low temperature (300 C.), the resistivity of the grain boundaries is decreased substantially after sintering at low temperature for the coated samples, particularly the sample with 5 ALD cycles.

[0066] For uncoated 8YSZ powder, a colloidal gel ink formulation with maximum solids loading was determined to reliably produce 8 YSZ ceramic parts that did not warp or deform during sintering. The colloidal gel ink formulation for 8YSZ powder was then modified for 8YSZ powder with an Al.sub.2O.sub.3 coating by 1 and 3 Al.sub.2O.sub.3 ALD cycles, and the formulation was determined to reliably print ceramic parts from core/shell 8YSZ/Al.sub.2O.sub.3 powder that did not warp or deform during sintering. The addition of an Al.sub.2O.sub.3 coating to 8YSZ powder reduces the sintering temperature in comparison to uncoated 8YSZ powder. That is, one can print and sinter/densify uncoated 8YSZ powder, but it would require higher densification temperatures to do so than is required for parts produced from 8YSZ powder with a coating from 1 and 3 Al.sub.2O.sub.3 ALD cycles.

[0067] 3YSZ represents zirconia doped with three mole percent (3 mol %) yttria. 3YSZ is also referred to as Y-TZP. The colloidal gel ink formulation for 3YSZ (partially stabilized zirconia or Y-TZP), conformally coated with alumina by atomic layer deposition, was adjusted and optimized. ALD coating of zirconium ceramic particles with alumina should be beneficial as a sintering aid for any level of yttrium doping of zirconium oxide. In practice, we found that the amount of doping can be varied slightly from about 3 percent to about 8 percent in order to obtain different properties.

[0068] The dopant concentration in zirconia dictates the crystal structure of the material. Zirconia doped with three mole percent, 3YSZ, is the mechanically strong tetragonal phase, and has been used in dental ceramics. We herein disclose that when 20 wt % Al.sub.2O.sub.3 is added by ALD as a conformal coating to 3YSZ (ATZ) the mechanical properties are further enhanced. Alumina toughened zirconia (ATZ) ceramics, wherein the alumina has been added as a conformal coating by ALD, is potentially important for use in biomedical implants and other applications requiring high strength and abrasion resistance at ambient temperature.

[0069] As the terms are used herein, the number preceding the YSZ indicates the molar percentage doping by yttria. 8 mol % doping optimally stabilizes the cubic crystal structure of ZrO2 which is preferred for oxygen ion conduction (e.g., in a solid electrochemical device). 8YSZ is commonly referred to as yttria-stabilized zirconia, yttria-stabilized cubic zirconia, cubic stabilized zirconia, or fully stabilized zirconia, 3YSZ can also be referred to as yttria-stabilized zirconia, but is more commonly referred to tetragonal zirconia polycrystal, TZP, Y-TZP, tetragonal polycrystalline zirconia, yttria-stabilized tetragonal zirconia, or partially stabilized zirconia.

[0070] Other stabilizers such as Sc.sub.2O.sub.3 can also be used to control the crystal structure of ZrO.sub.2 in the same manner as Y.sub.2O.sub.3. In yet other embodiments of the invention, the Al.sub.2O.sub.3 sintering aid deposited by atomic layer deposition should be beneficial also in these cases.

New Ceramic Cores and Sintering Agents for AM

[0071] As shown in the table provided in FIG. 7. A ceramic core comprising aluminum oxide can be sintered by the addition of one or more compounds chosen from calcium oxide, sodium oxide, silicon oxide, iron oxide, and magnesium oxide. The listed sintering aids are provided by Panadyne Inc, Montgomeryville, Pa., and Coorstek, Milford N.H. Formula of sodium oxide should be Na.sub.2O.

[0072] As shown in the second column of the table provided in FIG. 7, silicon carbide ceramic core could be sintered by the addition of one or more elements or compounds chosen from aluminum oxide-yttrium oxide, holmium oxide-aluminum oxide, boron-carbon, aluminum, holmium oxide, iron, aluminum, magnesium oxide, and calcium oxide. The above-mentioned sintering aids are available from Agsco, Pine Brook, N.J. Further sintering aids suitable for SiC ceramic cores include boron oxide and yttrium.

[0073] Boron nitride ceramic core (third column, FIG. 7) can be sintered by the addition of compounds chosen from sodium oxide, iron oxide, calcium oxide, magnesium oxide, aluminum oxide, titanium oxide, and yttrium oxide.

[0074] The ceramic core boron carbide, or carbon tetraboride, may have different allotropic forms. The molecular formula, B.sub.4C, may have the structural formula:

##STR00001##

Any of these allotropic forms of ceramic carbon tetrahboride can be sintered by the addition of one or more compounds selected from aluminum oxide, boron oxide, aluminum, and iron, including magnetic iron, as shown in the last column of the table in FIG. 7.

[0075] Disclosed in the below Table, left column, are other examples of new core ceramic particles; and in the right column, examples of sintering aids (the addition of one or more elements or compounds that could be chosen as a sintering aid for the ceramic particle listed at left.)

TABLE-US-00001 TABLE CERAMIC PARTICLE SINTERING AIDS Ytttria stabilized Al.sub.2O.sub.3, alkaline earthoxides (e.g., MgO, CaO), yttrium oxide, zirconia lanthanum oxide, and lutetium Partially Yttria Al.sub.2O.sub.3, alkaline earthoxides (e.g., MgO, CaO), yttrium oxide, stabilized zirconia lanthanum oxide. Zirconium oxide alkaline earth oxides, yttrium oxide, lanthanum oxide, MgO, and CaO Aluminum yttrium oxide, yttrium fluoride, yttrium nitride, gadolinium nitride, nitride lithium oxide, niobium oxide, MgO, CaO, CaF.sub.2, boron nitride, silicon oxide, an oxide of any lanthanide (such as, e.g., lanthanum oxide, cerium oxide, gadolinium oxide, samarium oxide), any lanthanide, aluminum boride, aluminum, diboride, calcium boride, yttrium boride, strontium boride, barium boride, cerium boride, praseodymium boride, samarium boride, and neodymium boride Silicon nitride Al.sub.2O.sub.3, yttrium oxide,titanium carbide, MgO, CaO, CaF.sub.2, boron nitride, ytterbium oxide, an oxide of any lanthanide (such as, e.g., lanthanum oxide, cerium oxide, gadolinium oxide, samarium oxide, lutetium oxide), and any lanthanide Silicon carbide 1. aluminum nitride, rhenium oxide, an oxide of any lanthanide (such as, e.g., lanthanum oxide), magnesium, MgF.sub.2, hafnium oxide, hafnium, lutetium oxide, lutetium, ytterbium oxide, scandium oxide, scandium, any lanthanide, boron, carbon. CaO, MgO, Ag, Au, Ge, Sn, Pd, Fe, Al, Y.sub.2O.sub.3Al.sub.2O.sub.3, and Ho.sub.2O.sub.3/Al.sub.2O.sub.3. Tungsten carbide nickel, copper, palladium, cobalt, nickel oxide, copper oxide, and cobalt oxide Silicates (Silicates such as porcelain, steatite, cordierite, mullite and forsterite) Al.sub.2O.sub.3, yttrium oxide, titanium oxide, lanthanum oxide,and boron oxide Cerium oxide Al.sub.2O.sub.3, alkaline earthoxides (such as MgO, CaO), yttrium oxide, titanium oxide, lanthanum oxide, iron oxide, copper oxide, chromium oxide, boron oxide, silicon oxide, and nickel oxide. Yttrium oxide Al.sub.2O.sub.3, zirconium oxide,and lithium fluoride Magnesium Al.sub.2O.sub.3, BaO, iron oxide,silicon oxide, titanium oxide, yttrium oxide, oxide zirconium oxide, and phosphorous oxide Boron carbide Al.sub.2O.sub.3, aluminum, analkaline earth oxide (e.g., MgO), boron oxide, aluminum, aluminum nitride, yttrium oxide, yttrium metal, yttrium fluoride, yttrium nitride, , magnesium fluoride, iron, iron oxide, cerium oxide, boron nitride, silicon oxide, silicon, silicon carbide, titanium boride, carbon, scandium oxide, scandium, silver, gold, germanium, tin, palladium, an oxide of any lanthanide, and any lanthanide. Boron nitride Al.sub.2O.sub.3, yttrium oxide,yttrium metal, yttrium fluoride, yttrium nitride, lanthanum oxide, CaO, CaF.sub.2, boron oxide, boron, silicon carbide, silicon nitride, lutetium oxide, lutetium, ytterbium oxide, ytterbium, titanium boride, an oxide of any lanthanide, any lanthanide, sodium superoxide, and sodium peroxide. Aluminum oxide an alkaline earth oxide, an oxide of Zn, Na, Si, Fe, titanium oxide, SiC, crystalline silica, amorphous silica, any silicate, lanthanum oxide, an oxide of any lanthanide, and any lanthanide. Barium titanium Al.sub.2O.sub.3, alkaline earthoxides, ZnO, titanium oxide, boron nitride, silicon oxide (barium oxide, silicon carbide, an oxide of any lanthanide, and any lanthanide. titanate) Titanium zirconia, titanium disilicide, chromium, chromium boride, nickel, diborides nickel boride, aluminum nitride, yttrium oxide, niobium oxide, iron, silicon nitride, and carbon. CaB.sub.6 silicon, MgO, copper oxide, nickel boride, and yttrium oxide. Zirconium boron carbide, carbon, zirconia, silicon aluminum oxynitride, silicon diboride nitride, molybdenum disulfide, molybdenum, and boron and carbon.

[0076] The disclosed ceramic core particles can be conformally coated with any of the disclosed sintering aids by using the process of Atomic Layer Deposition (ALD) or Molecular Layer Deposition (MLD), using a protocol similar to the ones described in the above exemplification section.

[0077] We herein disclose examples of a variety of processes that can be used in AM, utilizing any one of the foregoing disclosed ceramic cores having a coating of the sintering aid film according to an embodiment of the invention. An embodiment of invention can be employed for 3D printing of ceramics and cermets, among others. A variety of processes can be used in additive manufacturing, including: vat photopolymerization, materials extrusion, material jetting, binder jetting, powder bed fusion, direct energy deposition, and sheet lamination. These processes differ in the way layers are deposited to create a three-dimensional object, whether the created object requires subsequent densification or other refinement, and in the materials that are compatible for use in each process.

[0078] Within the scope of the afore-mentioned processes, some methods melt or soften material to produce layers, e.g., selective laser melting (SLM), direct metal laser sintering (DMLS), selective laser sintering (SLS), and fused deposition modeling (FDM), while others cure liquid materials using different technologies. e.g., stereolithography (SLA).

[0079] Other approaches for AM include binder jetting (or powder bed and inkjet 3D printing) and cold spray. Binder jetting first uses a liquid sprayed in a pattern over the particles to create a green body, and then in a second step, additional material (either a stronger resin or liquid metal) is added. With metal or ceramic materials this green body can then be sintered or fired to form the final finished part. Cold spray uses the conversion of kinetic energy to thermal energy to cold-weld the (often metal) particles by spraying high speed particles at/onto a build plate.

[0080] Because the sintering temperature does not have to reach the melting point of the material, sintering can be used for materials with high melting points, such as tungsten metal and ceramics. Both sintering and melting can be used in additive manufacturing. SLM is used for additive manufacturing of metals or metal alloys (e.g. titanium, gold, steel, INCONEL, INCOLOY, cobalt chrome, etc.), which have discrete melting temperatures and typically undergo melting during the SLM process. Inconel is an alloy predominantly of nickel-chrome, generally containing over 50% nickel, whereas Incoloyl is a nickel-iron-chromium alloy, having less than 50% nickel content.

[0081] Additionally, the function of the films can be expanded beyond simply improving the sintering properties. The films could also change the thermal, electrical or optical properties of the powders or the finished part.

Application Areas for Ceramics and Sintered/Printed Ceramic Parts:

[0082] Ceramic powders and sintered components are used in a large number of applications, especially for high temperature refractory parts. Such materials according to an embodiment of the invention are lightweight, highly resistant to wear, erosion, chemical corrosion, thermal stresses among other benefits. Some of the specific application areas for these materials are components for light weight armor, shields, transportation, oil and gas, fuel cells, electronics, aerospace, energy generation, among many others.

[0083] It should be noted that ceramic core materials having an ALD or MLD coating of sintering aid material according to an embodiment of the invention have improved properties, in comparison to ceramics wherein the sintering aid has been added to the ceramic using a ball-milling process. Another embodiment of the invention is the use, in technical and/or advanced ceramics, of at least one of the disclosed sintering aids, in the forming or firing of a ceramic component, wherein the sintering aid is applied as a conformal thin film on the ceramic component using ALD or MLD.

[0084] Features, integers, characteristics, compounds, chemical moieties or groups described in conjunction with a particular aspect, embodiment or example of the invention are to be understood to be applicable to any other aspect, embodiment or example described herein unless incompatible therewith. All of the features disclosed in this specification (including the accompanying drawings), and/or all of the steps of any method or process so disclosed, may be combined in any combination except combinations where at least some of such features and/or steps are mutually exclusive. The drawings in the Figures are not necessarily to scale. The invention is not restricted to the details of any foregoing embodiments. The invention extends to any novel one, or any novel combination, of the features disclosed in this specification (including any accompanying drawings), or to any novel one, or any novel combination, of the steps of any method or process so disclosed.

EQUIVALENTS

[0085] While this invention has been particularly shown and described with references to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention.