METHOD FOR MODIFIYING A SURFACE OF A METALLIC SUBSTRATE MATERIAL
20200002833 ยท 2020-01-02
Inventors
Cpc classification
C25D5/18
CHEMISTRY; METALLURGY
C25D7/00
CHEMISTRY; METALLURGY
C25D5/34
CHEMISTRY; METALLURGY
International classification
C25D5/34
CHEMISTRY; METALLURGY
Abstract
A method for chemically modifying a surface of a metallic substrate material being made of a first metallic material includes the steps of a) bonding an alloy material made of the first metallic material and a second metallic material onto the substrate material; and b) etching away at least some of the first metallic material from the bonded substrate material to obtain a modified substrate material, wherein the modified substrate material has an increased specific surface area. A substrate for Surface Enhanced Raman Spectroscopy (SERS) includes a modified substrate material.
Claims
1. A method for chemically modifying a surface of a metallic substrate material being made of a first metallic material comprising the steps of: a) bonding an alloy material made of the first metallic material and a second metallic material onto the substrate material; and b) etching away at least some of the first metallic material from the bonded substrate material to obtain a modified substrate material, wherein the modified substrate material has an increased specific surface area.
2. The method of claim 1, wherein the modified substrate material has a higher specific surface area than the substrate material.
3. The method of claim 1, wherein the first metallic material is less chemically reactive than the second metallic material.
4. The method of claim 3, wherein the first metallic material comprises at least one of gold, silver or copper.
5. The method of claim 3, wherein the second metallic material comprises at least one of silver-or copper.
6. The method of claim 1, wherein steps a) and b) are carried out in an electrochemical cell containing a solution of electrolyte.
7. The method of claim 6, wherein step a) comprises the step of electrodepositing of the alloy material onto the metallic substrate material by manipulating at least one of a voltage or a current density applied to the electrochemical cell.
8. The method of claim 6, wherein step b) comprises the step of electrochemically de-alloying of at least some of the first metallic material by manipulating at least a voltage or a current density applied to the electrochemical cell.
9. The method of claim 6, wherein the solution of electrolyte comprising an ion of the second metallic material.
10. The method of claim 9, wherein the solution of electrolyte further includes a reagent for passivating the second metallic material.
11. The method of claim 10, wherein the reagent comprises a sulfur-containing compound.
12. The method of claim 13, wherein the sulfur-containing compound is thiourea.
13. The method of claim 6, wherein the solution of electrolyte further includes an acid.
14. The method of claim 13, wherein the acid comprises HNO.sub.3, H.sub.2SO.sub.4 or chloroauric acid.
15. The method of claim 1, wherein the alloy material is in a form of micro-isles.
16. The method of claim 1, wherein step b) further including the step of detaching at least some of the second metallic material from the bonded substrate material as the first metallic material is etched away.
17. The method of claim 16, wherein the second metallic material detached from the bonded substrate is in a form of particles.
18. The method of claim 17, wherein the detached second metallic material includes nano-pores.
19. The method of claim 1, wherein the modified substrate material includes a nanostructured surface with nano-pores.
20. The method of claim 1, wherein steps a) and b) are carried out for 1 to 60 seconds.
21. The method of claim 7, wherein the electrodeposition is carried out by applying at least one of a voltage ranged from about 0.45V to 0.72V or a current density ranged from 0.1 to 10 mA/cm.sup.2.
22. The method of claim 8, wherein the electrochemical de-alloying is carried out by applying at least one of a voltage ranged from about 0.5V to 0.8V or a current density ranged from 0.1 to 10 mA/cm.sup.2.
23. The method of claim 1, further including the step of: repeating steps a) and b).
24. The method of claim 23, wherein steps a) and b) are repeated for 20 to 200 times.
25. The method of claim 1, wherein the metallic substrate material is in a form of a wire, a foil, a foam or a mesh.
26. The method of claim 1, wherein the modified substrate material is a substrate for Surface Enhanced Raman Spectroscopy (SERS).
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE INVENTION
[0034] Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by one skilled in the art to which the invention belongs.
[0035] As used herein, comprising means including the following elements but not excluding others. Essentially consisting of means that the material consists of the respective element along with usually and unavoidable impurities such as side products and components usually resulting from the respective preparation or method for obtaining the material such as traces of further components or solvents. The expression that a material is certain element is to be understood for meaning essentially consists of said element. As used herein, the forms a, an, and the, are intended to include the singular and plural forms unless the context clearly indicates otherwise.
[0036] In the first aspect of the invention, there is provided a method for chemically modifying a surface of a substrate material in particular a metallic substrate material. The method can be applied to increase a surface area of the substrate material after modification.
[0037] The term chemically modifying refers to the modification, addition or removal of any of a variety of molecules of a subject through chemical reaction such that the subject's physical, chemical, electrochemical, optical, electrical properties or the like may change afterwards. In one embodiment, the chemical modification is an electrochemical modification in particular an electrodeposition and an electrochemical de-alloying.
[0038] The term substrate material refers to physical layers providing a surface that allows other substances to attach, bond or adhere thereto. The substrate material may be in a form of a wire, a foil, a foam or a mesh. The substrate material may be further a metallic substrate being made of a first metallic material.
[0039] Turning to the method, the method comprises the steps of: [0040] a) bonding an alloy material made of the first metallic material and a second metallic material onto the substrate material; and [0041] b) etching away at least some of first metallic material from the bonded substrate material to obtain a modified substrate material, wherein the modified substrate material has an increased specific surface area.
[0042] The term alloy material refers to a material containing a mixture of chemical elements in particular two or more elements, where at least one of which is a metal. In one embodiment, the alloy material is made of a first metallic material and a second metallic material. Preferably, the first metallic material is less chemically reactive than the second metallic material. More preferably, the first metallic material is selected from gold, silver or copper whereas the second metallic material is selected from silver, platinum or copper. Further preferably, the first metallic material is selected from gold or silver whereas the second metallic material is selected from silver or copper. Most preferably, the first metallic material is selected from gold whereas the second metallic material is selected from silver.
[0043] In an embodiment, the alloy material particularly in a form of micro-isles is bonded onto the substrate material being made of the first metallic material via electrodeposition. Following to the electrodeposition, at least some of the first metallic material from the bonded substrate material is etched away via electrochemical de-alloying. The second metallic material in the micro-isles initially serve as micro-masks to shield the underneath first metallic material from etching, and are then detached from the bonded substrate material as the first metallic material is etch away. Preferably, the second metallic material is detached as a result of the under-cutting effect. In a particular embodiment, the detached second metallic material is in a form of particles that may have nano-pores. These materials may be recycled or processed for further use including but not limited to catalysis, electrode applications or the like.
[0044] The electrodeposition and electrochemical de-alloying processes are carried out in an electrochemical cell in particular the electrochemical cell with a three-electrode system. In one embodiment, the electrochemical cell may comprise a working electrode consisting of the metallic substrate material to be modified, a counter electrode preferably made of platinum, and a reference electrode in particular a saturated calomel electrode. A person having the ordinary skills in the art would appreciate that other suitable electrodes may also be applied in accordance with the present disclosure.
[0045] The electrodes as described above are connected in a solution of electrolyte. In one embodiment, the solution of electrolyte comprises an ion of the first metallic material and an ion of the second metallic material. In a particular embodiment, the first metallic material is less chemically reactive than the second metallic material. The solution of electrolyte may further include a reagent for passivating the second metallic material.
[0046] The term passivating refers to a process where a material becoming less affected or corroded by the environment after subjecting to that process. In a particular embodiment, the second metallic material is passivated by the reagent such that the first metallic material undergoes electrochemical de-alloying instead of the second metallic material. Preferably, the reagent comprises a sulphur-containing compound.
[0047] The term sulfur-containing compound used herein refers to organosulfur compounds, which are organic compounds that contain sulfur. The sulfur-containing compound may be selected from the group consisting of sulfides, disulfides, polysulfides, thioesters, sulfoxides, sulfones, thiosulfinates, thioketones, thioaldehydes or thioamides. Preferably, the sulfur-containing compound may be selected from the group consisting of disulfides, sulfoxides, thioketones, thioaldehydes or thioamides. Further preferably, the sulfur-containing compound is selected from the group consisting of thioamides. Most preferably, the sulfur-containing compound is thiourea.
[0048] In one embodiment, the solution of electrolyte may further include an acid in particular an inorganic acid. Preferably, the acid comprises HNO.sub.3, H.sub.2SO.sub.4 or chloroauric acid.
[0049] The electrodeposition as described above is carried out by applying a predetermined voltage/current for a predetermined duration; and the electrochemical de-alloying as described above is carried out by applying another predetermined voltage/current for another predetermined duration. The voltage/current may be in the form of a pulse voltage/current waveform in particular a square wave. In a particular embodiment, the electrodeposition is carried out by applying a voltage of about 0.45V to 0.72V or a current density of about 0.1 to 10 mA/cm.sup.2; and the electrochemical de-alloying is carried out by applying a voltage of about 0.5V to 0.8V or a current density of about 0.1 to 10 mA/cm.sup.2. Each of the process is carried out between 1 to 120 seconds, preferably between 1 to 60 seconds.
[0050] After the electrodeposition and the electrochemical de-alloying processes as described above, the modified substrate material has nanostructured surface with nano-pores and therefore having a higher specific surface area and surface roughness as compared with the initial metallic substrate material.
[0051] The method further includes the step of repeating the electrodeposition and electrochemical de-alloying processes when the modified substrate material does not possess a desired surface nanostructure in particular the size and/or number of pores are not ideal for a particular application. In one embodiment, the electrodeposition and electrochemical de-alloying processes are repeated for 1 to 300 times, preferably for 20 to 200 times.
[0052] In the second aspect of the invention, there is provided a substrate for Surface Enhanced Raman Spectroscopy (SERS) comprising a modified substrate material formed in accordance with the method mentioned in the first aspect of the invention.
[0053] The inventors have, through their own research, trials and experiments, devised that the modified substrate material has a great potential in SERS application. In one embodiment, the modified substrate material shows an enhanced sensitivity as compared with the unmodified substrate material. In another embodiment, the modified substrate material may be applied to detect the content of peanut oil in sesame oil.
[0054] Other than the SRES applications, the modified substrate material may be further applied as photocatalysts for degrading organic compounds. In one embodiment, the modified substrate material is a foam and is applied to photodegrade methyl blue. The modified substrate material shows a much higher degradation performance than the unmodified substrate.
[0055] The modified substrate material of the present invention may be further processed by generating, bonding or coating a metallic, metallic oxide, electro-active or photocatalytic oxide material on the surface of the modified substrate material. For example, the modified substrate material may be coated with a MnO.sub.2, TiO.sub.2, RuO.sub.2, IrO.sub.2 or PtO.sub.2 to form electrodes for electrochemical supercapacitors, offering an enhanced conductivity.
[0056] The scanning electron microscope (SEM) images were taken on a Philips XL30 FEG SEM. Energy dispersive X-ray (EDX) spectra were obtain on a JEOL JSM-6334F field emission SEM system. SERS measurements were performed on a Renishaw 2000 microscope equipped with a HeNe laser (632.8 nm) of 17 mW power and the light spot 2 m wide. For the UV illumination source, a mercury lamp with the maximum output wavelength of 365 nm was used. For the visible light source, a 300 W tungsten lamp was used. The lamps were kept at a distance of 15 cm from the reaction vessel with the light intensity there measured to be 206 mW/cm.sup.2. The diameters of reaction vessels were 4.0 cm.
[0057] With reference to
[0058] In one example embodiment, there is provided electrodeposition of Ag and electrochemical de-alloying Au. For instance, the electrochemical processes were conducted at room temperature using a computer controlled potentiostat (HEKA, PG310) in a 50 ml solution contain silver nitrate (AgNO.sub.3(s), 0.02 M) and thiourea (0.05 M). Au wire with two ends fixed to the ITO glass was used as the working electrode, a platinum ring was used as the counter electrode, and saturated calomel electrode was used as the reference electrode. The reference electrode was put 1 cm away from the working electrode. A voltage/current square-wave was applied which periodically modulated between two extreme values for n cycles: a cathodic voltage/current of V.sub.1 or.sub.1, for a time duration of t.sub.1 for electrodepositing the AuAg alloy isles, and an anodic voltage/current of V.sub.2 or i.sub.2 for a time duration of t.sub.2 for selectively etching Au (typically, V.sub.1=0.72 V or =5 mA/cm.sup.2, V.sub.2=0.7 V or i.sub.2=5 mA/cm.sup.2, t.sub.1=t.sub.2=10 sec, and n=100). The roughened Au wire was rinsed with deionized (DI) water and dried under N.sub.2 prior to any measurements.
[0059] In this case, Ag micro-isles were electrodeposited onto the Au wire for 5 seconds to serve as masks to shield the Au wire and then the Au wire underwent de-alloying for 5 seconds. This electrodeposition/de-alloying cycle was repeated for 100 times to obtain an Au wire with a desired nanostructured surface. It is appreciated that Ag is more susceptible to de-alloying when Ag and Au are present together. Hence, the inventor intentionally added a passivating reagent, thiourea, to the electrolyte solution. By this way, the presence of S may lead to the formation of Ag.sub.2S thin film on the Ag surface, protecting the inner Ag from anodic dissolution. Therefore, it can ensure the selective dissolution of Au component.
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[0061] The roughened Au wire is particularly suitable as a substrate in Surface Enhanced Raman Spectroscopy (SERS) applications. To verify this, the Au wire was immersed in a solution of Rhodamine B (10.sup.12 M) for 3 hours prior to SERS measurements. In order to maximize the homogeneity of the signal collected, the Au wire was rolled to provide a relatively flat surface during the measurement.
[0062] The two-dimensional point-by-point SERS mapping images (
[0063] Together, the high sensitivity and stability of the roughened Au wire as well as the convenient and low cost method preparing the same, rendering the wire highly desirable as SERS substrates.
[0064] Other than Au wire, Au foil has also been modified using the method as described above. SEMs images indicated that the surface of the Au foil apparently possesses nanostructures after modification as compared with the one without modification (
[0065] The inventors have also devised that vegetable oils are essential in our daily diet, and owing to the potential allergic issue, it is of paramount importance to know the composition of the vegetable oil particularly the content of peanut in the oil. In this example, sesame oil with different contents of peanut oil was measured on the commercial Au wire and the roughened Au wire. Both the Raman spectra of pure peanut oil on the roughened Au wire (
[0066] In one example embodiment, there is provided electrodeposition of Cu and electrochemical de-alloying Ag. Preferably, the electrochemical processes were conducted at room temperature using a three-electrode cell system containing a solution of copper(II) sulfate (0.2 M) and HNO.sub.3 (0.1 M). Ag wire with two ends fixed to the ITO glass (GULUO glass) was used as the working electrode, a platinum ring was used as the counter electrode, and saturated calomel electrode was used as the reference electrode. A pulse voltage/current waveform was applied which periodically modulated between two extreme values for n cycles: a cathodic voltage/current of V.sub.1 or i, for a time duration of t.sub.1 for electrodepositing the AgCu alloy isles, and an anodic voltage/current of V.sub.2 or i.sub.2 for a time duration of t.sub.2 for selectively etching Ag (typically, V.sub.1=0.45 V or i.sub.1=7 mA/cm.sup.2, V.sub.2=0.8 V or i.sub.2=7 mA/cm.sup.2, t.sub.1=t.sub.2=5 sec, and n=200). The roughened Ag wire was rinsed with deionized (DI) water and dried under N.sub.2 prior to any measurements.
[0067] In this case, Cu micro-isles were electrodeposited onto the Ag wire for 5 seconds to serve as masks to shield the Ag wire and then the Ag wire underwent de-alloying for 5 seconds. This electrodeposition/de-alloying cycle was repeated for 200 times to obtain an Ag wire with a desired nanostructured surface. The surface of the Ag wire was greatly roughened after modification (
[0068] The greatly roughened surface is found to be beneficial for various applications particularly in SERS applications. SERS measurements revealed that the roughened Ag wire displayed dramatically stronger signal than the unmodified one in the detection of Rhodamine 6G (
[0069] In one example embodiment, there is provided electrodeposition of Pt and electrochemical de-alloying Cu. Preferably, the electrochemical deposition and dealloying were carried out at room temperature using a computer-controlled potentiostat (HEKA, PG310) in a three-electrode electrochemical cell which contained a saturated calomel reference electrode, a platinum ring as the counter electrode, and the copper foam as the working electrode. An aqueous solution of copper sulfate pentahydrate (0.02 M) (Riedal-Dehan), 0.005 M of K.sub.2PtCl.sub.4, and 0.5 M of H.sub.2SO.sub.4 was used as the electrolyte. A voltage/current square-wave was applied which periodically modulated between two extreme values for n cycles: a cathodic voltage/current of V.sub.1 or i, for a time duration of t.sub.1 for electrodepositing the CuPt alloy isles, and an anodic voltage of V.sub.2 or i.sub.2 for a time duration of t.sub.2 for selectively etching Au (typically, V.sub.1=0.5 V or i.sub.1=4 mA/cm.sup.2, V.sub.2=0.5 V or i.sub.2=4 mA/cm.sup.2, t.sub.1=t.sub.2=10 sec, and n=100). The roughened Cu foam was rinsed with deionized (DI) water and dried under N.sub.2 prior to any measurements.
[0070] In this example, Pt micro-isles were electrodeposited onto the Cu foam for 10 seconds to serve as masks to shield the Cu foam and then the Cu foam underwent de-alloying for 10 seconds. This electrodeposition/de-alloying cycle was repeated for 100 times to obtain a Cu foam with a desired nanostructured surface (
[0071] The ability of the roughened Cu foam as a substrate in SERS application has been demonstrated. The Cu foam was immersed in a solution of Rhodamine B (10.sup.6 M) for 3 hours prior to SERS measurements. As shown in
[0072] The inventors have also devised that the applications of the roughened metallic substrate material is not limited to SERS and it may be further applied in the photodegradation of organic compounds such as methyl blue. For instance, Cu foam (1 cm1 cm) was dispersed with 10 ml of methyl blue (MB) solution (1.510.sup.5 M) in a dark room for 3 hours to allow an adsorption-desorption equilibrium established between the MB and Cu foam. Upon irradiation for 150 minutes, it can be clearly seen that the signal ratio of the roughened Cu foam decreased significantly from 1.0 to 0.2 whereas that of the commercial Cu foam remained almost unchanged. These results suggest that the photodegradation performance of the roughened Cu foam is much higher than the commercial Cu foam.