EMV CHIP SPINNER CARDS AND METHODS FOR THEIR PREPATION
20200005579 ยท 2020-01-02
Inventors
Cpc classification
G07F7/025
PHYSICS
G06K19/07747
PHYSICS
G06Q20/34
PHYSICS
G06K19/072
PHYSICS
G06K19/02
PHYSICS
International classification
Abstract
A credit card or debit card includes at least one rotatable disk arranged onto a top face or a bottom face of the credit card or debit card; and one or more EMV chips arranged onto the at least one rotatable disk.
Claims
1. A credit card or debit card, comprising: at least one rotatable disk arranged onto a top face or a bottom face of the credit card or debit card; and one or more EMV chips arranged onto the at least one rotatable disk.
2. The credit card or debit card of claim 1, wherein the at least one rotatable disk is reversibly attached to the credit card or debit card.
3. The credit card or debit card of claim 1, wherein the at least one rotatable disk is level with the top face or the bottom face of the credit card or debit card.
4. The credit card or debit card of claim 1, further comprising at least one slot for securing an EMV chip in the at least one rotatable disk.
5. The credit card or debit card of claim 4, wherein the at least one rotatable disk includes 1 to 6 slots for holding 1 to 6 EMV chips, respectively.
6. The credit card or debit card of claim 1, wherein the one or more EMV chips are located on a periphery of the at least one rotatable disk.
7. The credit card or debit card of claim 6, wherein 1 to 6 EMV chips are located on the periphery of the at least one rotatable disk.
8. The credit card or debit card of claim 1, further comprising at least one mark in the at least one rotatable disk identifying each of the one or more EMV chips, respectively.
9. The credit card or debit card of claim 1, further comprising at least one display screen, wherein a chosen EMV chip triggers card information onto the display screen.
10. The credit card or debit card of claim 1, wherein the credit card or debit card is a stainless-steel metal credit card or stainless-steel metal debit card.
11. A method of preparing a credit card or debit card, comprising: removing one or more EMV chips from one or more credit cards or debit cards; trimming off any excess glue or plastic from the removed one or more EMV chips; and inserting the trimmed one or more EMV chips onto a rotatable disk arranged onto a top face or a bottom face of a blank credit card or debit card.
12. The method of claim 11, wherein the at least one rotatable disk is reversibly attached to the blank credit card or debit card.
13. The method of claim 11, wherein the at least one rotatable disk is level with the top face or the bottom face of the blank credit card or debit card.
14. The method of claim 11, further comprising at least one slot for securing an EMV chip in the at least one rotatable disk.
15. The method of claim 14, wherein the at least one rotatable disk includes 1 to 6 slots for holding 1 to 6 EMV chips, respectively.
16. The method of claim 1, wherein the one or more EMV chips are located on a periphery of the at least one rotatable disk.
17. The method of claim 16, wherein 1 to 6 EMV chips are located on the periphery of the at least one rotatable disk.
18. The method of claim 11, further comprising at least one mark in the at least one rotatable disk identifying each of the one or more EMV chips, respectively.
19. The method of claim 11, further comprising at least one display screen, wherein a chosen EMV chip triggers card information onto the display screen.
20. The method of claim 11, wherein the blank credit card or debit card is a blank stainless-steel metal credit card or stainless-steel metal debit card.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The present disclosure, in accordance with one or more various embodiments, is described in detail with reference to the following figures. The drawings are provided for purposes of illustration only and merely depict exemplary embodiments of the disclosure. These drawings are provided to facilitate the reader's understanding of the disclosure and should not be considered limiting of the breadth, scope, size, or applicability of the disclosure. It should be noted that for clarity and ease of illustration these drawings are not necessarily made to scale.
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DETAILED DESCRIPTION OF THE EMBODIMENTS
[0016] The following description is presented to enable a person of ordinary skill in the art to make and use embodiments described herein. Descriptions of specific devices, techniques, and applications are provided only as examples. Various modifications to the examples described herein will be readily apparent to those of ordinary skill in the art, and the general principles defined herein may be applied to other examples and applications without departing from the spirit and scope of the disclosure. The word exemplary is used herein to mean serving as an example illustration. Any aspect or design described herein as exemplary is not necessarily to be construed as preferred or advantageous over other aspects or designs. Thus, the present disclosure is not intended to be limited to the examples described herein and shown but is to be accorded the scope consistent with the claims.
[0017] It should be understood that the specific order or hierarchy of steps in the process disclosed herein is an example of exemplary approaches. Based upon design preferences, it is understood that the specific order or hierarchy of steps in the processes may be rearranged while remaining within the scope of the present disclosure. Any accompanying method claims present elements of the various steps in a sample order and are not meant to be limited to the specific order or hierarchy presented.
[0018] In one embodiment, the disclosure provides a credit card or debit card, which includes at least one rotatable disk arranged onto a top face or a bottom face of the credit card or debit card; and one or more EMV chips arranged onto the at least one rotatable disk.
[0019] In another embodiment, the disclosure provides methods for preparing a credit card or debit card, which includes removing one or more EMV chips from one or more credit cards or debit cards; trimming off any excess glue or plastic from the removed one or more EMV chips; and inserting the trimmed one or more EMV chips onto a rotatable disk arranged onto a top face or a bottom face of a blank credit card or debit card.
[0020] In one aspect, the disclosure provides a credit card or debit card, wherein the at least one rotatable disk is reversibly attached to the blank credit card or debit card.
[0021] In another aspect, the disclosure provides a credit card or debit card, wherein the at least one rotatable disk is level with the top face or the bottom face of the blank credit card or debit card.
[0022] In another aspect, the disclosure provides a credit card or debit card, which further includes at least one slot for securing an EMV chip in the at least one rotatable disk.
[0023] In another aspect, the disclosure provides a credit card or debit card, wherein the at least one rotatatable disk includes 1 to 6 slots for holding 1 to 6 EMV chips, respectively.
[0024] In another aspect, the disclosure provides a credit card or debit card, wherein the one or more EMV chips are located on a periphery of the at least one rotatable disk.
[0025] In another aspect, the disclosure provides a credit card or debit card, wherein 1 to 6 EMV chips are located on the periphery of the at least one rotatable disk.
[0026] In another aspect, the disclosure provides a credit card or debit card, which further includes at least one mark in the at least one rotatable disk identifying each of the one or more EMV chips, respectively.
[0027] In another aspect, the disclosure provides a credit card or debit card, which further includes at least one display screen, wherein a chosen EMV chip triggers card information onto the display screen.
[0028] In another aspect, the disclosure provides a credit card or debit card, wherein the blank credit card or debit card is a blank stainless-steel metal credit card or stainless-steel metal debit card.
[0029] Accordingly,
[0030] For example,
[0031]
[0032] Many 1-hole punch systems can be used as a chip cutter and most are commercially available. Alternatively, a sharp edge knife, blade or other suitable device can be used to remove an EMV chip from the plastic credit or debit card.
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[0035] Once the EMV chip is removed from the plastic credit card or plastic debit card, the chip typically contains excess plastic and/or glue attached to the back. The excess plastic and/or glue can be removed using any suitable instrument including but not limited to, use of a sharp blade, razor, or knife. In one embodiment, the excess plastic and/or glue can be removed using a cigar cutter.
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[0040] In embodiments, the credit card or debit card can be made of stainless steel or any other suitable metal or alloy. In addition, the credit card or debit card can be made of suitable plastic, polymeric or reinforced fiber material. Further, the card can be of any desired colored including but not limited to black, gold (rose, white or yellow gold), titanium, and the like or any combinations thereof. In addition, the card can include imprinted information including but not limited to the user's name, account information, and any desired ornamental design.
[0041] The various embodiments described herein for removing an EMV chip from a plastic credit card or debit card and placing the removed EMV chip onto a blank credit card or debit card, can be extended to providing a card with more than one EMV chip. For example, the technology allows for the production of a card having from one to six EMV chips. In other embodiments, the card having from one to six EMV chips further includes one or more magnetic strips as used in the credit card and debit card field of art. In addition, these cards can be physically inserted into a card reader or can be read over short distances using radio-frequency identification (RFID), near field communication, Bluetooth and/or Tap-to-Pay technologies.
[0042] The subject matter described herein can be embodied in systems, apparatus, methods, and/or articles depending on the desired configuration. The implementations set forth in the foregoing description do not represent all implementations consistent with the subject matter described herein. Instead, they are merely some examples consistent with aspects related to the described subject matter. Although a few variations have been described in detail above, other modifications or additions are possible. In particular, further features and/or variations can be provided in addition to those set forth herein. For example, the implementations described above can be directed to various combinations and sub-combinations of the disclosed features and/or combinations and sub-combinations of several further features disclosed above. In addition, the logic flows depicted in the accompanying figures and/or described herein do not necessarily require the particular order shown, or sequential order, to achieve desirable results. Other implementations may be within the scope of the following claims.