Circuit board

Abstract

The invention relates to a circuit board for populating with at least one electronic component, at least one heat conducting element being provided, connected to a surface of a sheet-like circuit board body by way of a boundary layer. The boundary layer consists in certain areas of an electrically non-conducting layer and in certain areas of an electrically conducting layer, the non-conducting layer combining with the circuit board body and the heat conducting element to provide at least one receiving space with a pocket-like volume for the conducting layer.

Claims

1. A circuit board for populating with at least one electronic component, comprising: at least one heat conducting element connected to a surface of a sheet-like circuit board body by way of a boundary layer, wherein the boundary layer comprises an electrically non-conducting layer and an electrically conducting layer, the non-conducting layer combining with the circuit board body and the heat conducting element to provide at least one receiving space with a pocket-like volume for the conducting layer, wherein the conducting layer is between the circuit board body and the heat conducting element, wherein a pocket height (T) of the receiving space is configured such that liquid, melted conducting layer is kept in the receiving space by capillary action during the production of the circuit board, wherein the pocket height (T) of the receiving space is determined by the layer thickness of the non-conducting layer, and wherein the heat conducting element has a trough-like formation for receiving the electronic component.

2. The circuit board according to claim 1, wherein the conducting layer consists of a meltable layer, and/or in that the non-conducting layer consists of a thermally activatable adhesive film.

3. The circuit board according to claim 2, wherein the meltable layer, comprises a solder layer.

4. The circuit board according to claim 1, wherein the conducting layer provides an earth connection between the heat conducting element and an earth layer of the circuit board body.

5. The circuit board according to claim 1, wherein in the populated state of the circuit board, at least one electronic component is electrically contacted at the heat conducting element and at least one signal trace of the circuit board body and in that the heat conducting element is electrically contacted by way of the conducting layer at an earth layer of the circuit board body.

6. The circuit board according claim 1, wherein the circuit board body has at least one clearance for receiving an electronic component or for receiving the heat conducting element.

7. The circuit board according to claim 1, wherein in the populated state of the circuit board, an electronic component assigned to the clearance is in heat-conducting and electrical contact with the heat conducting element in the region of the clearance.

8. The circuit board according to claim 7, wherein at least one signal contact on the upper side of the circuit board body has lying opposite it an earth contact on the underside of the circuit board body.

9. The circuit board according to claim 7, wherein the electronic component is in surface-area contact with the heat conducting element.

10. The circuit board according to claim 1, wherein the receiving space for the conducting layer is situated in the region of the clearance.

11. The circuit board according to claim 1, wherein the receiving space for the conducting layer is situated at the edge of the clearance, so that the receiving space is open on one side towards the clearance.

12. A method for the production of a circuit board comprising: a boundary layer for a connection of a heat conducting element to a surface of a sheet-like circuit board body being produced in such a way that the boundary layer consists in certain areas of an electrically non-conducting layer and in certain areas of an electrically conducting layer and the non-conducting layer combines with the surface of the sheet-like circuit board body and the heat conducting element to provide at least one receiving space with a pocket-like volume for the conducting layer; wherein a pocket height (T) of the receiving space is configured such that liquid, melted conducting layer is kept in the receiving space by capillary action during the production of the circuit board, wherein the pocket height (T) of the receiving space is determined by the layer thickness of the non-conducting layer.

13. The method according to claim 12, wherein to produce the boundary layer, at least part of the conducting layer is applied to the heat conducting element and/or to the circuit board body, before or after the non-conducting layer is applied to the heat conducting element and/or the circuit board body and in that the heat conducting element is subsequently connected to the circuit board body by way of the boundary layer.

14. The method according to claim 12, wherein the connection of the heat conducting element to the circuit board body takes place by the effect of activation heat.

15. The method according to claim 14, wherein the non-conducting layer consists of a thermally activatable adhesive.

16. The method according to claim 15, wherein a thermally activatable adhesive film, and in that the activation heat activates the adhesive or the adhesive film.

17. The method according to claim 12, wherein in a subsequent step, the circuit board is populated with at least one electronic component and soldered in a soldering process and in that, during the soldering process, the conducting layer is melted by the effect of heat attributable to the soldering process.

Description

BRIEF DESCRIPTION OF THE FIGURES

(1) The invention is explained in more detail below on the basis of a drawing that merely represents an exemplary embodiment. In the drawing:

(2) FIG. 1 shows a circuit board as proposed in an exploded representation,

(3) FIG. 2 shows the circuit board as shown in FIG. 1 in a vertical section,

(4) FIG. 3 shows the heat conducting element and a non-conducting layer of the circuit board as shown in FIG. 1 in a perspective detail.

DETAILED DESCRIPTION

(5) The circuit board 1 represented in the drawing can be populated for the intended purpose with at least one electronic component 2. The component 2 represented is an integrated circuit 3, which is arranged on a small metal plate 4. The small metal plate 4 serves on the one hand for earthing and on the other hand for dissipating the heat attributable to the loss of power of the component 2. The component 2 is also provided with contact tongues 5, which serve for the electrical contacting of the integrated circuit 3.

(6) FIG. 1 also shows a heat conducting element 6, which consists of metal, in particular of copper. In principle, all materials that have good heat conductivity can be used here.

(7) The representation as shown in FIG. 2 reveals that the heat conducting element 6 is connected to a surface 8 of a sheet-like circuit board body 9 by way of a boundary layer 7. As explained above, the circuit board body 9 is the sheet-like arrangement of one or more individual layers, which may be copper-clad on one or both sides for the formation of traces.

(8) The configuration of the boundary layer 7 between the heat conducting element 6 and the surface 8 of the circuit board body 9 is of particular importance in the present case. An essential factor is that the boundary layer 7 consists in certain areas of an electrically non-conducting layer 10 and in certain areas of an electrically conducting layer 11. In this case, the arrangement is set up in such a way that the non-conducting layer 10 combines with the circuit board body 9 and the heat conducting element 6 to provide at least one receiving space 12 (FIG. 3) with a pocket-like volume for the conducting layer 11. Of interest in this respect is the fact that the non-conducting layer 10 that is provided in any case is additionally used for defining a receiving space 12 for the conducting layer 11. The receiving space 12 may be completely closed or, as shown in FIG. 2, open on one side, in FIG. 2 towards the right.

(9) In principle, it may be provided that the non-conducting layer 10 and the conducting layer 11 go over into one another in a substantially seamless manner. It is also conceivable, however, that a free volume is provided, at least in certain portions, between the two layers 10, 11.

(10) It has also been explained above that the proposed solution opens up entirely new possibilities for the design of the conducting layer 11. In an embodiment, the conducting layer 11 is a meltable layer, in particular a solder layer, which can be melted in a soldering process still to be explained for the earthing of the heat conducting element 6.

(11) The solder layer may for example be provided as a metal paste, as a metal foil or the like, which is melted for earthing in the still to be explained production of the circuit board 1.

(12) However, the use of conductive adhesive, electrically conducting polymers, electrically conductive filled polymers, carbon-based materials, sintered materials or infiltration materials is also conceivable for the realization of the conducting layer 11.

(13) Numerous variants are also conceivable for the realization of the non-conducting layer 10. Here, the non-conducting layer 10 is a thermally activatable adhesive film, which is activated by the effect of activation heat during the still to be explained production of the circuit board 1. Advantageous in the case of such an adhesive film is the fact that forms of almost any desired design are possible, since such an adhesive film can be punched into form in a simple way. At the same time, on account of a certain dimensional stability, such an adhesive film can be handled well in the still non-activated state.

(14) The fact that the receiving space 12 is bounded on the one hand by the surface 8 of the circuit board body 9 and on the other hand by the heat conducting element 6 means that the pocket height T of the receiving space 12 (FIG. 3) can be easily set by the non-conducting layer 10 lying in between. Of interest in this respect is especially a configuration in which the pocket height T of the receiving space 12 is so small that, in its still liquid, in particular melted state, the conducting layer 11 is kept in the receiving space 12 by capillary action during the still to be explained production of the circuit board 1.

(15) The arrangement can be set up in such a way that it is suitable for any orientation of the circuit board 1. It is also conceivable, however, that the arrangement is set up in such a way that, in its still liquid, in particular melted state, the conducting layer 10 is kept in the receiving space 12 by capillary action only when the circuit board 1 is horizontally aligned.

(16) The pocket height T of the receiving space 12 may vary on the basis of the design of the electrically conducting layer 11. If the electrically conducting layer 11 is a meltable solder material, the pocket height T is can be less than 0.5 mm, or can be less than 0.1 mm.

(17) In principle, the conducting layer 11 may serve for the connection of the heat conducting element 6 to any electric circuit-board potential. Here, however, it is the case that the conducting layer 11 provides an earth connection between the heat conducting element 6 and an earth layer 13 of the circuit board body 9. The earth layer 13 may be a copper-clad earth layer, which extends over the entire circuit board body 9, as shown in the drawing. In principle, the earth layer 13 may, however, also be formed in the manner of a trace.

(18) In an embodiment, in the populated state of the circuit board 1, at least one electronic component 2, such as precisely one electronic component 2, is electrically contacted at the heat conducting element 6 and at at least one signal trace 14, in an embodiment a total of six signal traces 14, of the circuit board body 9. Furthermore, the heat conducting element 6 is electrically contacted by way of the conducting layer 11 at an earth layer 13 of the circuit board body 9, so that the earth return of the component 2 is ensured. In particular in the case of high-frequency applications, it is advantageous, as mentioned above, if the earth return takes place in the direct vicinity of the component 2, so that the creation of electromagnetic radiation is suppressed. In order to ensure this, at least one signal contact 15 on the upper side of the circuit board body 9 has lying opposite it an earth contact 16 on the underside of the circuit board body 9.

(19) The terms signal trace and signal contact should be understood broadly in the present case and comprise all traces and contacts that can lead an electric potential to earth potential.

(20) In an embodiment, it is the case that the heat conducting element 6 and the circuit board body 9 are of a planar configuration in the region of the boundary layer 7. It is also conceivable, however, that any desired surface topographies are provided there, in particular in order to influence the design of the receiving space 12.

(21) FIG. 1 shows that the circuit board body 9 has a clearance 17 for receiving an electronic component 2. It is conceivable that multiple clearances 17 are provided and/or that one clearance 17 receives multiple electronic components 2. Alternatively, it may be provided that the clearance serves for receiving the heat conducting element 6. In this case, the heat conducting element 6 represented in FIG. 1 would be provided with a pedestal, which would at least partly protrude through the clearance 17. The connection of the heat conducting element 6 by way of the boundary layer 7 mentioned would not change however as a result.

(22) In an embodiment it is the case that, in the populated state of the circuit board 1, an electronic component 2 assigned to the clearance 17 is in heat-conducting and electrical contact with the heat conducting element 6 in the region of the clearance 17. Here, the electronic component 2 protrudes through the clearance 17, in order to come into corresponding contact with the heat conducting element 6. FIG. 2 shows that the electronic component 2 is in surface-area contact with the heat conducting element 6. Further, in this case a solder layer 18 is provided between the heat conducting element 6 and the component 2.

(23) In an embodiment, the heat conducting element 6 is provided with a trough-like formation 19, which serves for receiving the electronic component 2. The realization of such a trough-like formation 19 is an alternative to the aforementioned pedestal-like formation of the heat conducting element 6.

(24) As mentioned above, especially in the case of high-frequency applications it must be ensured that the earth return is situated in direct proximity to the component 2. It is correspondingly proposed that the receiving space 12 for the conducting layer 11 is situated in the region of the clearance 17. In an embodiment represented in FIG. 2, the receiving space 12 for the conducting layer 11 is even situated right at the edge of the clearance 17, so that the receiving space 12 is open on one side towards the clearance 17. This ensures that the earth return is actually situated as close as possible to the component 2. Here, the aforementioned use of the capillary action in the receiving space 12 is found to be particularly advantageous. Without this capillary action there would be the risk in the case of the configuration represented in FIG. 2 that, in its liquid state, the conductive layer 11 could flow through a gap 20 between the component 2 and the heat conducting element 6 into the trough-like formation 19. In this case, the solder required for the earth contact would be missing in the receiving space 12, so that a malfunction would occur as a result. Furthermore, there would be the risk, promoted in turn by capillary action, that, in its liquid state, part of the electrically conductive layer 11 could flow through a gap 21 between the component 2 and the circuit board body 9 to the contact tongues 5.

(25) As a result, the capillary action that keeps the conducting layer 11 in the receiving space 12 must be designed such that it exceeds the capillary action that pulls the conducting layer 11 upwards out of the receiving space 12 in FIG. 2.

(26) According to further teaching, which is likewise is of importance in its own right, a method for the production of a circuit board 1 as proposed is claimed. In this respect, reference may be made to all of the comments made in relation to the circuit board 1 as proposed.

(27) An essential factor according to this further teaching is that the boundary layer 7 for the connection of the heat conducting element 6 to the surface 8 of the sheet-like circuit board body 9 is produced in such a way that the boundary layer 7 consists in certain areas of an electrically non-conducting layer and in certain areas of an electrically conducting layer 11. An essential factor in this respect is the fact that the boundary layer 7 is built up in such a way that the non-conducting layer 10 combines with the surface 8 of the circuit board body 9 and the heat conducting element 6 to provide at least one receiving space 12 with a pocket-like volume for the conducting layer 11.

(28) To produce the boundary layer 7, part of the conducting layer 11 is applied to the heat conducting element 6. This is represented in FIG. 1. This application can be a bonding application. In the event that the electrically conducting layer 11 is a metal foil that is meltable, it is conceivable that the metal foil is applied to the heat conducting element 6 in a bonding manner by a kind of laser welding process. It is also conceivable, however, that the metal foil is applied in an adhesive manner.

(29) In principle, it is conceivable that the conducting layer 11 is applied to the circuit board body 9, such as in a bonding manner. It is also conceivable in this connection that the conducting layer 11 is applied in a bonding manner as part of the production process for the circuit board body 9.

(30) The application of the conducting layer 11 may take place before or after the non-conducting layer 10 is applied to the heat conducting element 6 and/or the circuit board body 9. In the case represented in FIG. 1, the adhesive film could be placed onto the heat conducting element 6 already bearing the conducting layer 11. Alternatively, it would be conceivable to apply the adhesive film to the circuit board body 9, as long as corresponding centring mechanisms are provided.

(31) Numerous variants, depending on the choice of material, are possible for the application of the non-conducting layer 10 and the conducting layer 11. These include, for example, dispensing, printing, attaching by way of thermal processes (soldering, ultrasonic soldering, welding, microwave welding, etc.), attaching by way of optical processes such as lasering or the like, spraying, mechanical connecting processes (pressing, stamping, crimping), chemical processes, sintering, adhesive bonding or sputtering.

(32) After the application of the non-conductive layer 10 on the one hand and the conducting layer 11 on the other hand, the heat conducting element 6 is connected to the circuit board body 9 by way of the resultant boundary layer 7.

(33) In an embodiment, the connection of the heat conducting element 6 to the circuit board body 9 takes place by the effect of activation heat. This process can also be combined with a pressing operation in the joining direction.

(34) As already indicated, the non-conducting layer 10 can be a thermally activatable adhesive, in particular a thermally activatable adhesive film. It is then the case that the above activation heat activates the adhesive or the adhesive film, so that an adhesive connection is established between the heat conducting element 6 and the circuit board body 9. Of interest in this respect is the fact that the activation heat can be so little that it does not yet melt the conducting layer 11.

(35) The result of the process steps so far is a circuit board 1 to which a heat conducting element 6 is attached. A conducting connection between the heat conducting element 6 and the circuit board body 9 that is envisaged for the use as intended is often not yet provided by the conducting layer 11. Furthermore, at this stage the circuit board 1 is unpopulated.

(36) In a subsequent step, the circuit board 1 is then populated with the at least one electronic component 2 and soldered in a soldering process. The soldering process may be a reflow soldering process, a vapour-phase soldering process, a wave soldering process, a selective soldering process or the like. An essential factor in this respect is the fact that, during the soldering process, the conducting layer 11 is melted by the effect of activation heat attributable to the soldering process and enters into a soldered connection with the earth layer 13 on the one hand and the heat conducting element 6 on the other hand. At this point in time, the conducting layer 11 reaches its liquid state variously mentioned above, in which the likewise already mentioned capillary action within the receiving space 12 ensures that the conducting layer 11 remains in the receiving space 12.

(37) As part of the above soldering process, the small metal plate 4 of the component 2 is also soldered onto the base of the trough-like formation 19 of the heat conducting element 6. The solder required for this may be introduced into the trough-like formation 19 in the form of a solder paste or the like, for example while the component 2 is being fitted.

(38) It should also be pointed out that the non-conducting layer 10 and the conducting layer 11 may respectively comprise multiple sub-layers, that is to say may itself be of a multilayered configuration. Furthermore, it should be pointed out that the boundary layer 7 may comprise not only the above non-conducting layer 10 and conducting layer 11, but also further layers.

(39) Finally, it should be pointed out that the non-conducting layer 10 and the conducting layer 11 may be respectively configured as thermally conducting or thermally non-conducting.