Laser shock peening method for obtaining large-area uniform surface morphology

Abstract

Provided is a laser shock peening method for obtaining a large-area uniform surface morphology. Using the relationship between the thickness of an absorption layer and a plastic deformation due to the laser shock peening and using a grid-shaped absorption layer (5) having a staggered distribution in thickness in cooperation with a two-layer interlaced laser shock processing method significantly reduce the height difference between micro-protrusions (10) and micro-pits (12) produced by an impact of a square light spot, and effectively reduce the roughness of the workpiece surface such that a large-area uniform surface morphology is formed on the workpiece surface.

Claims

1. A laser shock peening (LSP) method for improving surface morphology of a work piece, the method comprising: mounting the work piece on a workbench; disposing a latticed absorbing layer onto a surface of the work piece; providing a laser and a laser control device; using the laser control device to set laser output power and laser parameters of the laser, modulate a laser output spot into a square spot, and set an overlapping distance between adjacent square spots to a value off f; using a numerical control system to adjust the workbench, so as to make a position of a laser beam of the laser overlap a first corner of a first lattice of the latticed absorbing layer at a first initial corner of a first shocking area, wherein the first corner of the first lattice of the latticed absorbing layer is then considered as a first initial position of a first layer of LSP; providing running water as a constraint layer over the latticed absorbing layer; applying the laser and operating the numerical control system to control both translation and rotation of the workbench, so as to impact the surface of the work piece by LSP in a row-by-row manner on the first layer of LSP, wherein an X-direction and a Y-direction of the constraint layer match those of the workbench; using the numerical control system to adjust the workbench to move a distance of a/2 in both the X-direction and Y-direction, so as to make the position of the laser beam of the laser overlap a second corner of a second lattice of the latticed absorbing layer at a second initial corner of a second shocking area, wherein the second corner of the second lattice of the latticed absorbing layer is then considered as a second initial position of a second layer of LSP, wherein a is a length of a side of the square spot; and providing running water again as the constraint layer, and applying the laser and operating the numerical system to control both translation and rotation of the workbench, so as to impact the surface of the work piece in a row-by-row manner on the second layer of LSP, wherein technological parameters of the laser application on the first layer of LSP are the same as those on the second layer of LSP, wherein the method reduces surface roughness of the surface of the work piece and has a strengthening effect on the surface of the work piece, wherein the latticed absorbing layer has a first thickness (d1) in an overlapped area where adjacent square spots overlap and a second thickness (d2) in other areas, where d2 is greater than d1 and is calculated as d2=(d1)(1+).sup.1/2, where is a Poisson ratio of a material of the latticed absorbing layer, wherein d1 is calculated as d1=V, where V is a gasification rate of the latticed absorbing layer and is a duration time of a pressure pulse on the latticed absorbing layer, where is three to four times larger than a pulse width of the laser during laser application, wherein the latticed absorbing layer in the overlapped area comprises a concavity on an upper surface thereof, a fillet radius of the concavity being 0.1 millimeters (mm) to 0.2 mm, and wherein a lower surface of the latticed absorbing layer is configured to adhere to the surface of the work piece.

2. The method according to claim 1, wherein the workbench is a five-axis workbench.

3. The method according to claim 2, wherein the length a of the side of the square spot is 2 mm to 8 mm, and wherein the technological parameters of the laser application on the first layer of LSP, which are the same as those on the second layer of LSP, are as follows: a laser frequency of 1 Hertz (Hz) to 5 Hz; the pulse width of 8 nanoseconds (ns) to 30 ns; and a pulse energy of 3 Joules (J) to 15 J.

4. The method according to claim 2, wherein the bottom surface of the latticed absorbing layer is a planar surface that is sticky.

5. The method according to claim 2, wherein when the laser beam of the laser overlaps the firsts corner of the first lattice of the latticed absorbing layer and when the laser beam of the laser overlaps the second corner of the second lattice of the latticed absorbing layer, a ratio (f/a) of the overlapping distance (f) to the length of the side of the square spot (a) 0.08 to 0.12.

6. A laser shock peening (LSP) method for improving surface morphology of a work piece, the method comprising: mounting the work piece on a workbench; disposing a latticed absorbing layer onto a surface of the work piece; providing a laser and a laser control device; using the laser control device to set laser output power and laser parameters of the laser, modulate a laser output spot into a square spot, and set an overlapping distance between adjacent square spots to a value of f; using a numerical control system to adjust the workbench, so as to make a position of a laser beam of the laser overlap a first corner of a first lattice of the latticed absorbing layer at a first initial corner of a first shocking area, wherein the first corner of the first lattice of the latticed absorbing layer is then considered as a first initial position of a first layer of LSP; providing running water as a constraint layer over the latticed absorbing layer; applying the laser and operating the numerical control system to control both translation and rotation of the workbench, so as to impact the surface of the work piece by LSP in a row-by-row manner on the first layer of LSP, wherein an X-direction and a Y-direction of the constraint layer match those of the workbench; using the numerical control system to adjust the workbench to move a distance of a/2 in both the X-direction and Y-direction, so as to make the position of the laser beam of the laser overlap a second corner of a second lattice of the latticed absorbing layer at a second initial corner of a second shocking area. wherein the second corner of the second lattice of the latticed absorbing layer is then considered as a second initial position of a second layer of LSP, wherein a is a length of a side of the square spot; and providing running water again as the constraint layer, and applying the laser and operating the numerical system to control both translation and rotation of the workbench, so as to impact the surface of the work piece in a row-by-row manner on the second layer of LSP, wherein technological parameters of the laser application on the first layer of LSP are the same as those on the second layer of LSP, wherein the method reduces surface roughness of the surface of the work piece and has a strengthening effect on the surface of the work piece, and wherein the method further comprises preparing the latticed absorbing layer by: mixing organic silica gel GN-521, cyanoacrylate, and methyl tert-butyl ether at a mass ratio of 5:3:2 (silica gel:cyanoacrylate:methyl tert-butyl ether) and allowing them to react at a temperature of 70 C. to 90 C. for a period of time of 10 minutes to 30 minutes to form a mixture die; modifying the mixture die according to the length of the side of the square spot (a) and a ratio (f/a) of the overlapping distance (f) to the length of the side of the square spot (a) while maintaining a bottom surface as a plane; and cooling the modified mixture die to form the latticed absorbing layer having a thickness of 0.8 mm to 1 mm.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:

(2) FIG. 1 is an illustration of a LSP system that can be used to induce a uniform surface morphology with a large area.

(3) FIG. 2 is an illustration of the front-view of a latticed absorbing layer, wherein D-D is an cross-sectional illustration of a latticed absorbing layer. While a is the length of the square-spot, f is the overlapped distance of adjacent square-spots, f/a is the overlapping rate, d1 is the thickness of overlapped area of adjacent square-spots, d2 is the thickness of other areas.

(4) FIG. 3 is an illustration of square-spot arrangement in the laser shocked region on the work-piece surface. (a) the first layer, (b) the second layer. Where a is the length of the square-spot, f is the overlapped distance between adjacent square-spots, point A is the starting position in the first layer subjected to LSP, and point B is the starting position in the second layer subjected to LSP.

(5) FIG. 4 is a cross-sectional illustration of the work-piece subjected to LSP.

(6) 1 laser generation device, 2 laser control device, 3 square-spot, 4 running water constraint layer, 5 latticed absorbing layer, 6 work-piece, 7 five-axis workbench, 8 numerical control system, 9 rectangular region to be treated by LSP, 10 micro-convex, 11 starting position, 12 micro-concave, 22 center region, 23 transitional region, 24 edge region.

DETAILED DESCRIPTION OF THE INVENTION

(7) Reference will now be made in detail to present embodiments of the invention, one or more examples of which are illustrated in the accompanying drawings. The detailed description uses numerical and letter designations to refer to features in the drawings. Like or similar designations in the drawings and description have been used to refer to like or similar parts of the invention.

(8) Each example is provided by way of explanation of the invention, not limitation of the invention. In fact, it will be apparent to those skilled in the art that modifications and variations can be made in the present invention without departing from the scope or spirit thereof. For instance, features illustrated or described as part of one embodiment may be used on another embodiment to yield a still further embodiment. Thus, it is intended that the present invention covers such modifications and variations as come within the scope of the appended claims and their equivalents.

(9) Mount the work-piece 6 on a five-axis workbench 7 and paste the latticed absorbing layer 5 onto the surface of work-piece 6 to be processed.

(10) Use a laser control device 2 to set the laser output power and the laser spot parameters, modulate the round laser spot into square-spot 3, and the overlapping distance between adjacent square-spots 3 is f.

(11) Use a numerical control system 8 to adjust the five-axis workbench 7, so as to make the center of the square-spot 3 and the center of a single lattice of the absorbing layer 5 overlapped at the point A. Fix position accurately along the X- and Y-direction of the latticed constraint layer 4.

(12) Take running water as the constraint layer 4, turn on the laser generation device 1 and operate the numerical system 8 to control both translation and rotation of the five-axis workbench 7, so as to treat the surface of the work-piece 6 in a row-by-row way on the first layer.

(13) Use the numerical control system 8 to adjust the five-axis workbench 7, so as to make the overlap between the position of the square-spot 3 and the corner of a single lattice of the absorbing layer 5, to move a/2 outward the initial corner of the laser shocked region in the first layer, both along the X- and Y-directions. This new overlapped corner is then taken as the starting position 11 in the second layer subjected to LSP, namely the point B in FIG. 3(b). The X- and Y-directions of the latticed constraint layer 4 should again agree well with those of the workbench.

(14) Take running water as the constraint layer 4, turn on the laser generation device 1 and operating the numerical system 8 to control both translation and rotation of the five-axis workbench 7, so as to treat the surface of the work-piece 6 in a row-by-row way on the second layer.

(15) The pulse laser beam used during LSP in the present invention is square-spot 3, the length of the square-spot 3 is 2-8 mm, laser frequency is 1-5 Hz, pulse width is 8-30 ns, and pulse energy is 3-15 J.

(16) The design of the said latticed absorbing layer 5: the absorbing layer 5 corresponding to the overlapped area between both adjacent square-spots 3 has a smaller thickness (d1), while the absorbing layer 5 corresponding to other areas has a larger thickness (d2), the front-view of the absorbing layer 5 that has a smaller thickness is a concavity, while the back is a plane, the smaller thickness d1 is calculated by d1=V, where, V is the gasification rate of the coating and is the lasting time of the pressure pulse which is 3-4 times of the width of the pulse laser, the larger thickness d2 is calculated by d2=d1{square root over (1+)}, where, is the Poisson's ratio of the shocked material, the fillet radius of the concavity is 0.1-0.2 mm, and the back of the latticed absorbing layer 5 is sticky, which can be stick to a smooth surface of the work-piece 6.

(17) Taking two-layer interleaved LSP, technological parameters of the two-layer LSP keep unchanged, and the distance between the starting position 11 of the second layer and that of the first layer is a/2 in both along the X- and Y-directions. During the process of each layer with square-spots 3, the overlapping rates f/a between adjacent square-spots are set to 8-12%.

(18) The preparation method of the latticed absorbing layer 5 in the present invention is: mix organic silica gel GN-521, cyanoacrylate and methyl tert-butyl ether at the mass ratio of 5:3:2 and allow them to react at 70-90 C. for 10 min30 min, suppress a terrace die according to the length of the square-spot 3 and the overlapping rate on the front-view of the absorbing layer, the back is a plane, and the absorbing layer with a thickness of 0.8-1 mm can finally be formed after being cooled.

(19) The beneficial effect of the present invention: obviously reduce the height difference between micro-convex 10 and micro-concave 12, control plastic deformation of the work-piece 6 surface, and decrease the surface roughness.