Glass device housings
10512176 ยท 2019-12-17
Assignee
Inventors
- Peter N. Russell-Clarke (San Francisco, CA, US)
- Jonathan P. Ive (San Francisco, CA)
- Michael K. Pilliod (Venice, CA, US)
Cpc classification
H04M1/0269
ELECTRICITY
H05K5/0234
ELECTRICITY
G06F3/045
PHYSICS
International classification
H05K7/00
ELECTRICITY
G06F3/041
PHYSICS
B24B7/24
PERFORMING OPERATIONS; TRANSPORTING
G06F3/045
PHYSICS
Abstract
An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.
Claims
1. A portable electronic device comprising: a glass housing structure comprising: a first housing structure defining: a front portion formed from a glass material; and a first portion of a sidewall having a first height and formed from the glass material; and a second housing structure defining: a rear portion formed from the glass material; and a second portion of the sidewall having a second height that is different than the first height, the second portion of the sidewall attached to the first portion of the sidewall to define an all glass sidewall extending from the front portion to the rear portion; and a display positioned within an interior volume defined by the first and second housing structures and viewable through the front portion of the first housing structure.
2. The portable electronic device of claim 1, wherein: the first housing structure includes a speaker port that includes an opening defined within the front portion of the first housing structure; the speaker port includes a raised rib that at least partially surrounds the opening; and the portable electronic device further comprises a speaker positioned below the speaker port.
3. The portable electronic device of claim 1, wherein: the second housing structure includes a raised rib that extends into the interior volume; and the raised rib is formed from the glass material.
4. The portable electronic device of claim 1, wherein: the first housing structure includes a peripheral region that at least partially surrounds the display; the front portion has a thickness; and the peripheral region has a width that is greater than the thickness of the front portion.
5. The portable electronic device of claim 4, wherein: the first housing structure includes a glass sheet member that defines the front portion; and the peripheral region is defined at least in part by a glass housing member that is fused to the glass sheet member.
6. The portable electronic device of claim 5, wherein: the glass sheet member and the glass housing member define a curved contour; and the glass sheet member and the glass housing member are chemically strengthened along the curved contour.
7. An electronic device comprising: a unitary glass housing structure defining at least four exterior sides of the electronic device, the unitary glass housing structure having a width dimension and a length dimension greater than the width dimension and defining an opening extending along the length dimension; a glass sidewall structure bonded to the unitary glass housing structure along the length dimension of the unitary glass housing structure to cover the opening; and a display positioned within the electronic device and visible through at least one of the at least four exterior sides.
8. The electronic device of claim 7, wherein: the unitary glass housing structure defines a curved interior surface; and the display is a flexible display and conforms to the curved interior surface.
9. The electronic device of claim 8, wherein the flexible display is viewable through two or more of the at least four exterior sides of the unitary glass housing structure.
10. The electronic device of claim 7, wherein: the unitary glass housing structure is formed from a glass material; the glass sidewall structure is formed from the glass material; and the glass sidewall structure defines at least one port for receiving an electrical connection.
11. The electronic device of claim 7, wherein: the glass sidewall structure is a first glass sidewall structure; and the electronic device further comprises a second glass sidewall structure attached to the unitary glass housing structure along a side that is opposite to the first glass sidewall structure.
12. The electronic device of claim 7, wherein the glass sidewall structure is fused to the unitary glass housing structure.
13. The electronic device of claim 7, wherein the unitary glass housing structure comprises: a first glass sheet defining a front exterior side of the electronic device; a second glass sheet defining a rear exterior side of the electronic device; and a glass member positioned between the first and second glass sheets and defining at least one additional exterior side surface.
14. The electronic device of claim 7, wherein: the unitary glass housing structure and the glass sidewall structure cooperate to define a curved surface; and the unitary glass housing structure and the glass sidewall structure are chemically strengthened along the curved surface.
15. The electronic device of claim 7, wherein: the unitary glass housing structure defines an audio port along a front exterior side of the at least four exterior sides; and the electronic device further comprises an audio component positioned within the electronic device and aligned with the audio port.
16. A portable electronic device comprising: a glass housing structure comprising: a front glass sheet defining a front exterior surface of the portable electronic device; a rear glass sheet defining a rear exterior surface of the portable electronic device; and a glass sidewall structure positioned between the front and rear glass sheets and defining at least a portion of a side exterior surface of the portable electronic device, the front glass sheet, the rear glass sheet and the glass sidewall structure defining an all glass side exterior surface having a curved profile; and a display positioned within the glass housing structure.
17. The portable electronic device of claim 16, wherein: the glass housing structure defines a curved interior surface; and the display conforms to the curved interior surface of the glass housing structure.
18. The portable electronic device of claim 16, wherein the front glass sheet, the rear glass sheet, and the glass sidewall structure are chemically strengthened along the curved profile.
19. The portable electronic device of claim 16, wherein: the front glass sheet has a first thickness; and the glass sidewall structure has a second thickness that is greater than the first thickness.
20. The portable electronic device of claim 16, wherein the glass sidewall structure defines one or more electrical ports for receiving an electrical connector.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
(28) Electronic devices such as computers, handheld devices, computer monitors, televisions, cellular telephones, media players, and other equipment may have displays and other components that are covered with glass structures. The glass structures, which may sometimes be referred to as glass housing structures, may be used to provide a protective transparent covering for a display or other optical component, may be used to form a housing sidewall, may be used to form other housing structures such as a rear housing wall or other housing structures, may be used to form raised features such as raised ribs that serve as support structures for a sheet of glass or other glass structures, or may otherwise be used in forming structures in an electronic device.
(29) An example of an electronic device that may have glass housing structures is shown in
(30) Housing 18 may be formed from metal, plastic, glass, ceramic, carbon-fiber composite material or other fiber-based composite materials, other materials, or combinations of these materials. Display 16 may be covered with glass structures 20. Glass structures 20 may serve as a glass front housing structure for device 10. Glass structures 20 may be transparent so that display 16 may be viewed by a user of device 10 through glass structures 20. Display 16 may include display structures with image pixels formed from light-emitting diodes (LEDs), organic LEDs (OLEDs), plasma cells, electrowetting pixels, electrophoretic pixels, liquid crystal display (LCD) components, or other suitable image pixel structures. Touch sensor electrodes may be included in display 16 to provide display 16 with touch sensing capabilities (e.g., display 16 may be a touch screen) or display 16 may be touch insensitive.
(31) In the illustrative example of
(32)
(33) In the illustrative example of
(34) The illustrative device configurations of
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(36) Display structures 40 may include a number of layers of material. These layers may include, for example, layers of glass, layers of plastic, and layers of adhesive. A liquid crystal display may have layers of polarizer, light diffusing elements, light guides for backlight structures, and a liquid crystal layer. An organic light-emitting diode (OLED) display may have organic materials that are used in producing light. An array of circuit components such as a thin-film transistor (TFT) array may be used to drive the image pixels in a display. This array of circuitry may be formed on a substrate material such as glass or polymer. The substrate layer on which the thin-film transistors and/or other circuitry for the display are formed may sometimes referred to as a TFT substrate or transistor substrate.
(37) Glass housing structures 20 may be mounted to housing structures 18 (e.g., housing structures formed from metal, glass, plastic, fiber-based composites, etc.). Internal components may be mounted within the housing of electronic device 10. For example, device 10 may include a printed circuit such as printed circuit 42. Printed circuit 42 may be a rigid printed circuit board (e.g., a fiberglass-filled epoxy board), a flexible printed circuit (flex circuit) formed from a flexible sheet of polyimide or other polymer layer, or may formed using other dielectric substrate materials. Components 44 such as switches, connectors, discrete circuit elements such as capacitors, resistors, and inductors, integrated circuits, and other electronic devices may be mounted to substrate 42. Display structures 40 may be coupled to circuitry on substrates such as substrate 42 using communications path 46 (e.g., a flex circuit cable or other suitable path).
(38) To help maximize the interior volume in device 10 and reduce the size and weight of glass structures 20, center portion 48 of glass structures 20 may have a thickness T1 that is smaller than edge thickness T2. The smaller size of thickness T1 may create a recessed portion 50. Recess 50 in center portion 48 may have a rectangular shape or other suitable shape and may be configured to receive internal components in device 10 such as display structures 40. The larger size of edge thickness T2 relative to center thickness T1 may help strengthen glass structure 20 along its periphery to prevent damage in the event of an impact event. The larger size of the edges of glass structures 20 may also improve device aesthetics.
(39) Glass structures 20 may have a rectangular periphery (e.g., glass structures 20 may be formed from structures such as a planar sheet having a rectangular outline when viewed from above) and center portion 48 may form a rectangular recess within center of glass structures 20. In this type of configuration, thickened edge portions 49 may form a rectangular ring that runs around the periphery of glass structure 20. If desired, glass structure 20 may have other shapes (e.g., oval, circular, square, shapes with curved edges and/or straight edges, etc.). The thickened edge portions of glass structures 20 may also be provided along only part of the edges of glass structures 20, rather than the entire periphery of glass structures 20.
(40) Housing structures such as structures 20 and 18 may be joined using interposed layers of adhesive, using fasteners, using interlocking engagement features such as snaps, or using other suitable attachment mechanisms.
(41) In the illustrative example of
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(43) As shown in
(44) Device structures such as glass structures 20 may be formed from multiple pieces of glass that are fused together. Glass structures may, for example, be heated to an elevated temperature (e.g., about 800 C.) that is above the glass fusion temperature and that is below the glass working temperature. Using a metal die or other glass fusing tool, the heated glass pieces may be pressed together. Glass structures that are fused together using this type of approach may have invisible or barely visible joint lines (i.e., the fused glass joints that are formed when fusing a first glass member to a second glass member may be invisible or barely visible to the naked eye).
(45) Illustrative operations and equipment involved in forming glass structures 20 with recessed portion are shown in
(46) Initially, a portion of glass structures 20 such as planar glass member 20A may be formed and polished using polishing tool 56. For example, both upper surface 58 and lower surface 60 of glass structures 20A may be polished using tool 56. Polishing tool 56 may be used to perform mechanical and/or chemical polishing processes. Glass structures 20A may be formed from a glass sheet with a rectangular shape, a shape with curved edges, a shape with straight edges, or a shape with a combination of curved and straight edges.
(47) Following polishing operations with tool 56, additional glass structures may be fused to glass structures 20A using heated press (fusing tool) 62. In particular, upper press member 64 may be moved downwards in direction 66 while lower press member 68 is moved upwards in direction 70 to press glass structures 20A and glass structures 20B together. During pressing, the temperature of glass structures 20A and 20B may be maintained at an elevated temperature of about 800 C. (e.g., a temperature above the fusion temperature of the glass and below the working temperature of the glass). This forms glass fusion bond 72 between structures 20A and 20B and fuses structures 20A and 20B together to form glass structures 20.
(48) Glass structures 20B may, for example, be a peripheral glass member having the shape of a rectangular ring that runs around the periphery of a rectangular version of glass structure 20A or may be a glass member that runs around part of the periphery of glass structure 20A (as examples). The glass structures that are formed by fusing structures 20B to structures 20A may have an edge thickness T2 and a thinner central region of thickness T1, as described in connection with
(49) Because lower surface 60 of glass structures 20A was polished by tool 56, this surface may remain polished following fusion of glass structures 20B to glass structures 20A.
(50) Following formation of glass structures 20 using glass fusing tool 62, glass structures 20 may be strengthened. For example, glass structures 20 may be strengthened using chemical strengthening tool 74. Chemical strengthening tool 74 may be used to immerse glass structures 20 in a bath containing potassium nitrate (as an example). Glass structures 20 may be free of glass frit at fusion joints 72, which may promote compatibility with chemical strengthening treatments. Heat-based tempering operations may also be performed to strengthen glass structures 20, if desired.
(51) Following strengthening of glass structures 20 with chemical strengthening tool 74, glass structures 20 may have polished upper surface 58, polished lower surface 60, recessed central region 48 of thickness T1, and thickened edge regions 49 of thickness T2 (T2>T1). Glass structures 20 may then be assembled into device 10. For example, glass structures 20 may be attached to additional glass structures (using glass fusing, using adhesive, using fasteners, using mating engagement structures, etc.) and/or non-glass housing structures.
(52) As shown in
(53) If desired, glass structures 20B may be fused to glass structures 20A in other patterns. For example, glass structures 20B that have the shape of strengthening support ribs may be fused across the center of the surface of glass structures 20A, as shown in
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(56) Glass structures 20 may be formed from clear glass, glass with a colored tint (e.g., a blue tint, red tint, green tint, etc.), black glass, gray glass, or glass of other colors. As shown in
(57) As shown in
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(60) In the
(61) Illustrative operations involved in forming glass structures 20 with a recessed portion and curved features such as rounded edges are shown in
(62) As shown in
(63) After fusing structures 20A and 20B together using tool 62, tool 92 (e.g., a machining tool, grinding tool, polishing tool and/or other equipment for machining and polishing structures 20) may be used in removing excess glass along curved surfaces 86 and 88, thereby rounding the edges of glass structures 20.
(64) Glass strengthening equipment such as chemical strengthening tool 74 may be used to strengthen glass structures 20 following formation of curved surfaces 86 and 88.
(65) If desired, display structures 40 (
(66) As shown in
(67) In the
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(70) Components 102 may be inserted into the interior of structures 20E (e.g., in the gap formed between the opposing front and rear sheets and between the opposing right and left sheets of glass). Components 102 may include, for example, display structures 40 for forming display 16 and other components (see, e.g., components 44 of
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(72) As shown in
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(74) At step 118, glass structures such as glass structures 20A and 20B may be polished using polishing equipment 56.
(75) At step 120, fusing equipment 62 may be used to fuse two or more glass structures together. For example, glass structures 20A and 20B may be fused together to form glass structures 20 or the five sides of the five-sided-box glass structures of
(76) If desired, additional machining and polishing operations may be formed at step 122. For example, a thickened edge portion (of thickness T2) of glass structures 20 may be machined and polished to form a rounded edge for glass structures 20, as shown in
(77) At step 124, glass structures 20 may be strengthened using heat and/or chemical treatment. For example, glass structures 20 may be strengthened by applying a chemical bath to glass structures 20 using chemical strengthening tool 74.
(78) At step 126, glass structures 20 may be assembled with other housing structures to form electronic device 10. Glass structures 20 may, for example, be attached to glass or non-glass housing structures 18 or other structures to form device 10. Internal components such as a display, integrated circuits, and other components may be mounted within the glass structures and other structures for the housing of device 10.
(79) The foregoing is merely illustrative of the principles of this invention and various modifications can be made by those skilled in the art without departing from the scope and spirit of the invention.