Method for producing a multiplicity of surge arresters in an assembly, surge arrester and surge arrester assembly

Abstract

A method is provided for manufacturing a plurality of arresters as a composite structure. A ceramic carrier having a plurality of holes and two electrode bodies are provided. The ceramic carrier and the two electrode bodies are assembled into a base under gas atmosphere. The ceramic carrier is located between the electrode bodies. The electrode bodies are soldered to the ceramic carrier. The base body is separated into a plurality of gas-filled arresters is carried out. In addition, a gas-filled arrester is provided which has a height of maximal 2 mm and electrode surfaces of maximal 1.21.2 mm.sup.2.

Claims

1. A method for manufacturing a plurality of arresters, the method comprising: providing a ceramic carrier having a plurality of holes; providing first and second electrode bodies, wherein each of the first and second electrode bodies comprise a plurality of protuberances; assembling the ceramic carrier and the first and second electrode bodies under a gas atmosphere into a base body, wherein the ceramic carrier is located between the first and second electrode bodies such that the protuberances engage with and extend into the holes of the ceramic carrier; soldering the first and second electrode body to the ceramic carrier; and separating the base body into a plurality of gas-filled arresters.

2. The method according to claim 1, wherein gas-filled hollow spaces are formed in the holes of the ceramic carrier when assembling the ceramic carrier and the first and second electrode bodies into the base body.

3. The method according to claim 1, wherein, before soldering the base body, a solder layer is arranged between the ceramic carrier and each of the first and second electrode bodies.

4. The method according to claim 3, wherein the solder layer is a solder foil.

5. The method according to claim 3, wherein gas-filled hollow spaces are formed in the holes of the ceramic carrier when assembling the ceramic carrier and the first and second electrode bodies into the base body and wherein the gas-filled hollow spaces are sealed via solder when soldering the base body.

6. The method according to claim 1, wherein separating the base body comprises sawing, water jet cutting, or laser cutting.

7. The method according to claim 1, wherein the gas atmosphere contains noble gases or hydrogen.

8. The method according to claim 1, wherein the ceramic carrier includes a matrix made up of 1515 holes.

9. The method according to claim 1, wherein each of the gas-filled arresters has a height of at most 2 mm and electrode surfaces of at most 1.21.2 mm.sup.2.

10. The method according to claim 1, wherein each protuberance is conical, cylinder-shaped or dome-shaped.

11. A method of making an arrester composite structure comprising a plurality of gas-filled arresters manufactured according to the method of claim 1.

12. The method according to claim 1, wherein the thickness of each electrode body at the protuberances is greater than the thickness of that electrode body adjacent to the protuberances.

13. The method according to claim 1, wherein the thickness of each electrode body at the protuberances is greater than the thickness of that electrode body adjacent to the protuberances.

14. A method for manufacturing a plurality of arresters, the method comprising: providing a ceramic carrier having a plurality of holes; providing first and second electrode bodies, wherein each of the electrode bodies comprises a plurality of protuberances; providing two solder foils, each solder foil having a plurality of holes, the two solder foils being provided separately from the ceramic carrier and from the second electrode bodies; assembling the ceramic carrier, the solder foils and the first and second electrode bodies under a gas atmosphere into a base body such that the ceramic carrier is located between the solder foils such that the holes of the solder foils match with the holes of the ceramic carrier and wherein the ceramic carrier and the solder foils are located between the first and second electrode bodies such that the protuberances engage with and extend into the holes of the ceramic carrier and the holes of one of the solder foils; soldering the first and second electrode body to the ceramic carrier; and separating the base body into a plurality of gas-filled arresters.

15. The method of claim 14, wherein each of the plurality of gas-filled arresters has a height of at most 2 mm and electrode surfaces of at most 1.21.2 mm.sup.2.

16. The method of claim 14, wherein separating the base body comprises sawing, water jet cutting, or laser cutting.

17. The method of claim 14, wherein the gas atmosphere contains noble gases or hydrogen.

18. The method of claim 14, wherein the ceramic carrier includes a matrix made up of 1515 holes.

19. The method of claim 14, wherein the protuberances are conical, cylinder-shaped or dome-shaped.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The present invention is explained below based on schematic figures.

(2) FIG. 1 shows a ceramic carrier and two electrode bodies in an exploded view;

(3) FIG. 2 shows a base body in a cross-sectional view;

(4) FIG. 3a shows an arrester in a cross-sectional view;

(5) FIG. 3b shows an arrester;

(6) FIG. 4 shows a solder foil;

(7) FIG. 5 shows a ceramic carrier including a solder layer;

(8) FIG. 6 shows a ceramic carrier in a cross-sectional view;

(9) FIG. 7 shows an electrode body; and

(10) FIG. 8 shows an electrode body in a cross-sectional view.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

(11) FIG. 1 shows a ceramic carrier 1 and two electrode bodies 2. The ceramic carrier 1 has a plurality of holes 4. The electrode bodies 2 have a plurality of protuberances. The ceramic carrier 1 and the electrode bodies 2 together form a base body 3. FIG. 1 depicts the base body 3 in an exploded view. A solder layer (not shown here) is present between the ceramic carrier 1 and each of the electrode bodies 2.

(12) FIG. 2 shows a section of a base body 3 in a cross-sectional view. The electrode bodies 2 and the ceramic carrier 1 are soldered by means of a solder layer 5. The holes 4 of the ceramic carrier 1 form hollow spaces 6 which are delimited by the electrode bodies 2. The solder layer 5 is also used to seal the hollow spaces 6. The assembly of the base body 3 is carried out in a gas atmosphere, so that the hollow spaces 6 are also filled with a gas.

(13) FIG. 3a shows a separated arrester 7. The arrester 7 includes a ceramic body 8 and two electrodes 9a, 9b. A gas-filled hollow space 6 is situated between the electrodes 9a, 9b, which is shown in FIG. 3b.

(14) FIG. 3b depicts the arrester 7 from FIG. 3a in a cross-sectional view. The arrester 7 has particularly small dimensions. For example, the arrester 7 has a height h of 2 mm. The dimensions of an electrode surface 11 of the arrester 7 are, for example, 1.21.2 mm.sup.2. The electrode surface 11 corresponds to a surface area of the arrester 7. The arrester 7 may also have smaller dimensions. For example, the arrester 7 may have a height h of 1 mm and an electrode surface 11 of 0.50.5 mm.sup.2.

(15) FIG. 4 shows a ceramic carrier 1. FIG. 5 shows the ceramic carrier 1 from FIG. 4 in a cross-sectional view. The ceramic carrier 1 contains, for example, aluminum oxide, Al.sub.2O.sub.3, as a ceramic material. The ceramic carrier 1 has a plurality of holes 4. The height of the ceramic carrier 1 is 1.3 mm. The ceramic carrier 1 has a square shape with an edge length of 41 mm. The holes 4 have a diameter of 0.65 mm.

(16) The holes 4 are spaced at uniform distances from each other. The centers of the holes 4 have a spacing of 1.50.02 mm from each other. In total, 225 holes 4 are arranged in 15 rows and 15 columns. The holes 4 form a square pattern. The region in which the holes are arranged has a square area with an edge length of 210.05 mm.

(17) The ceramic carrier 1 shown in FIG. 4 is imprinted with a solder layer 5. The solder layer 5 covers a region having an area of 3030 mm.sup.2. The solder layer 5 covers the region in which the holes 4 are arranged.

(18) FIG. 6 shows a solder foil 12. The solder foil 12 may be arranged between the electrode bodies 2 and the ceramic carrier 1 before the soldering of the base body 3. The solder foil 12 may replace a solder layer imprinted on the ceramic carrier 1 as shown in FIG. 4. The solder foil 12 is square and has an edge length of 25 mm.

(19) In total, two solder foils 12 are required for soldering a base body 3. The solder foil 12 has holes 13. The arrangement of the holes 13 of the solder foil 12 matches the arrangement of the holes 4 of the ceramic carrier 1. As a result, the holes 4 of the ceramic carrier 1 are not covered by the solder foil 12. The holes 13 of the solder foil also have a diameter of 0.65 mm. The height of the solder foil is 0.05 mm. The solder foil may contain silver. The solder foil is made up of, for example, a silver-copper eutectic or another solder material. For example, the solder foil 12 contains or is made up of the material Ag/Cu 72/28.

(20) FIG. 7 shows an electrode body 2. FIG. 8 shows the electrode body from FIG. 7 in a cross-sectional view. The surface of the electrode body 2 matches the surface of the ceramic carrier 1. The electrode body 2 has a plurality of protuberances 14. The number and arrangement of the protuberances 14 matches the number and arrangement of the holes 4 of the ceramic carrier 1. The electrode body 1 has an overall height of 0.6 mm. A basic height of the electrode body 2 without consideration of the protuberances 14 is 0.3 mm. Therefore, the protuberances 14 have a height of 0.3 mm.

(21) As shown in FIG. 8, each of the protuberances 14 has the shape of a cone. At its widest point, the cone has a diameter of 0.52 mm. The cone narrows at an angle of 10.

(22) The electrode body 2 contains or is made up of an electrically conductive material. For example, the electrode body 2 contains an iron-nickel alloy or copper or is made up of such a material.