METHOD AND DEVICE FOR CHANGING TEST SUBSTRATES IN A CONTINUOUS-FLOW VACUUM SYSTEM, TREATMENT METHOD, AND CONTINUOUS-FLOW VACUUM SYSTEM

Abstract

A method for changing test substrates in a continuous-flow vacuum system in a multiple-treatment-step process cycle for treating a substrate, a treatment method using the method for changing test substrates, and systems for treating a plurality of substrates (61) and for changing test substrates. For at least two treatment steps, at least two test substrates (66) are transferred to a vacuum treatment system at the beginning of the process cycle and are transferred back out once the process cycle is concluded. Subsequently, the first test substrate (66) concurrently treated in this step is removed from the measurement position (70) it occupied during the treatment and is deposited in an empty position (71) without a test substrate (66). Subsequently, the second test substrate (66) which has not been treated yet is deposited in the resulting free measurement position (70) for the purpose of supplying the second test substrate to the subsequent treatment step.

Claims

1-16. (canceled)

17. A method for changing test substrates, the method comprising a plurality of successive treatment steps in a continuous-flow vacuum system which has a plurality of treatment stations and a transport device comprising at least one carrier for holding both to-be-treated substrates and test substrates, and for transporting the to-be-treated substrates and the test substrates through the plurality of treatment stations, wherein: at least two untreated test substrates are fed into the continuous-flow vacuum treatment system at a beginning of a process run and discharged after completion of the process run; for each of at least two of the successive treatment steps, an untreated test substrate is treated together with the to-be-treated substrates; after a first treatment step of the successive treatment steps, a first test substrate treated in the process run is removed from a measuring position on the at least one carrier occupied by the first test substrate during the first treatment step and is the deposited in an empty position on the at least one carrier having no test substrate; and after removal of the first test substrate treated in the process run, a second, still untreated test substrate is removed from a holding position on the carrier and is deposited in the measuring position, from which the first test substrate was removed, for the purpose of being fed to a subsequent treatment step of the successive treatment steps.

18. The method of claim 17, wherein the previously treated first test substrate is removed from the empty position and deposited in the previously vacated holding position or another holding position on the carrier that does not have a test substrate.

19. The method of claim 18, wherein more than two test substrates are supplied and the changing of the test substrates between measuring positions, empty positions, and holding positions is repeated after each treatment step until all test substrates are treated.

20. The method of claim 17, wherein the changing of the test substrates between measuring positions, empty positions, and holding positions is performed by a loading station of the continuous-flow vacuum system and the test substrates are moved between the positions by the transport device relative to the loading station for access to the test substrates.

21. The method of claim 20, wherein the loading station accesses the test substrates or holders of the test substrates using mechanical, electrical, pneumatic, or magnetic holding.

22. The method of claim 17, wherein the transport device comprises a plurality of carriers and the test substrates are changed between measuring positions and/or empty positions and/or holding positions either on the same carrier or on different carriers.

23. The method of claim 17, wherein a treatment result on the first test substrate treated in the process run is analyzed.

24. The method of claim 23, wherein for each treatment step of the process run to be monitored, a test substrate is introduced together with the to-be-treated substrates and is treated and analyzed in the measuring position, wherein the untreated test substrates are held in holding positions and are protected from treatment.

25. The method of claim 23, wherein the to-be-treated substrates and the test substrates are transported on a circular path through the treatment stations and are repeatedly exposed to treatment during a treatment step in the relevant treatment station, wherein for changing positions of the test substrates, the transport device is stopped in those positions in which a test substrate is required for the treatment, and wherein for changing positions of the test substrates, the transport device is stopped in those positions in which a loading station of the treatment device used for the test substrate change can access the test substrate position currently to be used.

26. A loading station designed for carrying out the method of claim 17, the loading station comprising: an at least partially planar receiving surface configured to be placed against a test substrate and to hold the test substrate; a gripper configured for activatable and deactivatable holding of a test substrate on the receiving surface; and a movement unit configured to execute a movement of the gripper at least in a direction perpendicular to the at least partially planar receiving surface.

27. The loading station of claim 26, wherein the movement unit is configured for rotation about an axis running in the direction perpendicular to the at least partially planar receiving surface and/or for movement in a plane parallel to the at least partially planar receiving surface.

28. The loading station of claim 26, further comprising at least one of: a coolable heat shield configured to thermally protect the gripper from the carrier; distance, proximity, and/or position sensors configured to detect a location and holding of a test substrate; and/or a spring deflectable or compressible in the direction perpendicular to the at least partially planar receiving surface for cushioning the gripper in the direction perpendicular to the at least partially planar receiving surface.

29. A continuous-flow vacuum system configured to perform the method of claim 17, the continuous-flow vacuum system comprising: a vacuum chamber, in which the plurality of treatment stations are arranged; and the transport device, wherein the at least one carrier: has at least one substrate position for receiving a to-be-treated substrate and at least one test substrate position for receiving a test substrate, as an empty position or as a measuring position or as a holding position; or has at least three test substrate positions comprising an empty position, a measuring position, and a holding position, and no substrate position for receiving a to-be-treated substrate.

30. The continuous-flow vacuum system of claim 29, wherein the at least one carrier has n test substrate positions used for a process run, wherein n results from the number N B of treatment steps to be analyzed by means of a test substrate in each case, plus m, and m is an integer and is equal to or greater than 1.

31. The continuous-flow vacuum system of claim 29, wherein each holding position has a fixed or pivotable or detachable shield on the holding position's side facing treatment sources of the treatment stations.

32. The continuous-flow vacuum system of claim 29, further comprising a loading station configured to change the test substrates between measuring positions, empty positions, and holding positions.

Description

[0047] The invention will be explained in greater detail below with reference to exemplary embodiments. The associated drawing shows in

[0048] FIG. 1 a turntable system in perspective view,

[0049] FIG. 2a and FIG. 2b test substrates, respectively.

[0050] a turntable showing the alternative test substrate positions and

[0051] FIG. 3 a loading station mounted on the lid of the turntable system, and

[0052] FIG. 4 a gripper of the loading station positioned over a test substrate.

[0053] The drawings show the device only schematically to the extent necessary to explain the invention. They do not claim to be complete or to be to scale.

[0054] The exemplary embodiment is intended to illustrate the invention only by way of example and not by way of limitation. The person skilled in the art would combine the features previously realized in the various embodiments of the invention and subsequently in the exemplary embodiment in further embodiments to the extent that appears to them to be expedient and useful.

[0055] FIG. 1 shows an open treatment system 60, which uses a holding device in the form of a segmented turntable 1 within its vacuum chamber 2. The treatment unit 60 has a circular structure and has distributed around its circumference a number of stations 60 . . . 60 which serve directly or indirectly for the treatment of substrates 61. In the exemplary embodiment, optical glasses are coated. Glasses are also used as test substrates.

[0056] The turntable 1 is equipped with the segments 20, which act as carriers and, only by way of example, and not by way of limitation, accommodate two substrates to be treated. In a magazine station 62, there are arranged magazines (not shown), in which substrates 61 are held in substrate positions 64 of the segments 20. By rotating the turntable 1 by means of a suitable substrate transport device which carries out the rotation, the substrates 61 pass through the stations 60 . . . 60 including the treatment station(s) at high frequency. Depending on the process step, the relevant station is activated and the process step is executed in this station on the rotating substrates. A process run comprises the activation of all stations required for substrate treatment one after the other. After completion of the process run, the segments 20 with the treated substrates 61 can be removed at the magazine station 62. It is apparent that the treatment station 60 is closed during treatment by means of its lid 63.

[0057] In the illustrated exemplary embodiment, the turntable 1 has a test substrate segment 65 on which, instead of substrates 61, a plurality of, by way of example but not by way of limitation, five test substrates 66 are arranged in the various, six test substrate positions 67 described above. One of the test substrate positions 67 remains free.

[0058] A loading station 80 is arranged on the lid 63 of the turntable system 60 and reaches through it into the turntable system 60. This serves to exchange the treated and untreated test substrates 66 within the test substrate positions 67. The loading station 80 is arranged opposite the magazine station 62 merely by way of example and not by way of limitation.

[0059] FIG. 2a shows a detail of the turntable 1 with the test substrate segment 65 according to FIG. 1. One of the exemplary six test substrate positions 67 shown there is the measuring position 70 and is equipped with a test substrate 66 in the application of the treatment method in order to be subjected to a treatment currently to be carried out for treatment, the turntable is rotated to such an extent that the test substrate segment 65 is located in the relevant station 60 . . . 60.

[0060] A further test substrate position 67 is the empty position 71, which temporarily contains no test substrate and serves to change the four test substrates arranged in the remaining test substrate positions 67 one after the other to the measuring position 70. These four remaining test substrate positions 67 serve as holding positions 72, in which treated or still untreated test substrates 66 are held and protected from being influenced by the treatments during the process run.

[0061] An alternative arrangement of the test substrate positions 67 is shown in FIG. 2b. There, for example, a test substrate position 67 is arranged on each of the segments 20 next to the substrates 61 to be treated. These segments 20 are designated as substrate segments 69 to distinguish them from the test substrate segments 65, which, as described for FIG. 2a, accommodate only test substrates 66 and no substrates 61. As described for FIG. 2a, two of these are the measuring position 70 and the empty position 71. These are located in adjacent substrate segments 69 merely by way of example. The holding positions 72 are distributed over the remaining segments 20.

[0062] In FIG. 2a and FIG. 2b, the measuring position 70 and the empty position 71 are marked with a hatching (measuring position 70) and a cross (empty position 71), respectively, for better differentiation.

[0063] FIG. 3 shows a loading station 80, which protrudes through the lid 63 into the turntable system 60. It is arranged on the lid 63 in such a way that it lies above the segments 20. For clarity and to generalize the description of the loading station 80, substrates 61 of the segment 20 are not shown.

[0064] The loading station 80 comprises a gripper 81 which is arranged in the turntable system 60 and a movement device 82, the latter being mounted, by way of example, but not by way of limitation, on the lid 63 and connected to the gripper 81 via a shaft 83.

[0065] The gripper 81 can be moved axially by means of the movement device 82.

[0066] Optionally, a movement of the gripper 81, relative to the central axis (not shown) of the turntable 1, and/or a radial movement of the gripping means 85, which is part of the gripper 81, relative to the shaft 83, can also be performed.

[0067] The gripper 81 comprises a suitable gripping means 85, which picks up the test substrate 66. It can, for example, be mounted on the gripper 81 like a cantilever.

[0068] The gripper and/or the gripping means 85 may rotate about the axis 84 defined by the shaft 83 and extending parallel to the Z-direction (represented by a coordinate system).

[0069] Due to the feasible movements of the gripping means 85 and in conjunction with an optimized position of the loading station 80, relative to the turntable 1 and the test substrate positions 67 there, the gripping means 85, can reach each of the test substrate positions 67 of the turntable 1.

[0070] The gripper in the embodiment of FIG. 3 further comprises a heat shield 92, which is arranged between the gripper 81 and the segment 20, so that it protects at least the gripper 81 or also the gripping means 85 from a damaging temperature load by the segment 20 during the process run. The design and operation of the heat shield 92 may be different, depending for example on the presence and/or type and extent of a cooling system. In the exemplary embodiment, the heat shield 92 is fixedly mounted to the chamber lid 63 and the gripping means 85 is pivotable behind the heat shield 92. Other embodiments are also possible. For example, the heat shield 92 may also be pivotable about its own axis, which may be parallel to the axis 84. Or, a combination of movements of both components is possible.

[0071] The interaction of the gripping means 85 with the test substrate 66 is shown in FIG. 4.

[0072] The test substrate 66 is or comprises the actual test substrate 86, which is held by a frame 87. Other designs of the test substrate 66 are also possible, for example, depending on the mechanism of action of the gripping means 85 or the substrate material or other conditions.

[0073] The gripping means 85 has a cantilever 88 which extends radially from the shaft 83. The free end portion 89 of the cantilever 88 has one or more magnetic holders 90 with planar receiving surfaces 91 arranged on the underside, which are designed and arranged to receive, hold and deposit the test substrate 66 on its metallic frame 87. To this end, the magnetic holders 90 comprise permanent magnets (not shown) and coils (not shown), which cooperate such that the magnetic field of the permanent magnets can be activated to receive the test substrate 66 and deactivated to deposit the test substrate 66.

[0074] The gripping means 85 and/or the gripper 82 include suitable sensor means (not shown) for detecting the relative positions and the approaching of the gripping means 85 and test substrate 66 relative to each other. For example, sensors may detect the height of the gripper, for example relative to a suitable reference point, or the position of the test substrate.

[0075] The magnetic holders 90 are directly or indirectly connected to the free endpiece 89 via a spring 91, so that the spring is loaded as a result of the contact between the magnetic holder 90 and the frame 87 of the test substrate 66, thus preventing a hard impact on the test substrate 66 when the contact is established, i.e. cushioning the receiving of the test substrate 66. In this way, it is also possible to compensate for different height positions of the individual test substrates.