ELECTRONIC DEVICE

Abstract

The disclosure relates to an electronic device including a thermally and electrically conductive transmission element configured to dissipate heat from a heat source, wherein the transmission element is at a first electric potential and includes rounded edges. The electronic device further includes a heat sink at a second electric potential and an electrically insulating layer arranged between the heat sink and the transmission element in order to connect the transmission element to the heat sink in a thermally conductive manner.

Claims

1. An electronic device comprising: a thermally and electrically conductive transmission element configured to dissipate heat from a heat source, wherein the transmission element is at a first electrical potential; a heat sink that is at a second electrical potential; and an electrically insulating layer arranged between the heat sink and the transmission element, wherein the electrically insulating layer is configured to thermally conductively connect the transmission element to the heat sink, wherein the transmission element has rounded-off edges, wherein the transmission element is a thermally and electrically conductive connection pad of a printed circuit board (PCB), wherein the thermally and electrically conductive connection pad has edges, and wherein the edges of the thermally and electrically conductive connection pad are rounded off by an electrically conductive coating or by an electrically nonconductive coating.

2. The electronic device of claim 1, wherein the transmission element is arranged at least partially within the insulating layer; and/or wherein edges of the transmission element arranged within the insulating layer are rounded off, wherein the edges of the transmission element face the heat sink and run at least partially in a plane parallel to an area of the heat sink that is opposite the transmission element.

3. The electronic device of claim 2, wherein the transmission element comprises a thermal connection pad of the PCB and a heat spreader, wherein the heat spreader is arranged between the thermal connection pad and the insulating layer, and wherein the heat spreader has the rounded-off edges.

4. The electronic device of claim 3, wherein the edges of the transmission element are rounded in accordance with Borda and/or Rogowski profiles.

5. The electronic device of claim 4, wherein the edges of the thermally and electrically conductive connection pad are rounded off by the electrically conductive coating, and wherein the electrically conductive coating forms a rounded-off edge structure.

6. The electronic device of claim 4, wherein the edges of the thermally and electrically conductive connection pad are rounded off by the electrically nonconductive coating, wherein the electrically nonconductive coating forms a rounded-off edge structure that surrounds the edges of the thermally and electrically conductive connection pad, and wherein the electrically nonconductive coating has a high dielectric constant.

7. The electronic device of claim 1, wherein the transmission element comprises a connection pad and a magnetoresistor, wherein the magnetoresistor is positioned on the connection pad and is arranged between the connection pad and the insulating layer, and wherein ends of the magnetoresistor are bent in a direction of the connection pad in such a way that a rounding is produced in a direction of the heat sink.

8. The electronic device of claim 1, wherein the heat sink has a region with a geometric structure that corresponds to a mirror image of a geometric structure of the transmission element, wherein the region of the heat sink is opposite the geometric structure of the transmission element, wherein the region is formed by a platform facing the heat source, and wherein the platform comprises rounded-off edges.

9. The electronic device of claim 1, wherein the transmission element comprises a thermal connection pad of the PCB and a heat spreader, wherein the heat spreader is arranged between the thermal connection pad and the insulating layer, and wherein the heat spreader has the rounded-off edges.

10. The electronic device of claim 1, wherein the edges of the transmission element are rounded in accordance with Borda and/or Rogowski profiles.

11. The electronic device of claim 1, wherein the edges of the thermally and electrically conductive connection pad are rounded off by the electrically conductive coating, and wherein the electrically conductive coating forms a rounded-off edge structure.

12. The electronic device of claim 1, wherein the edges of the thermally and electrically conductive connection pad are rounded off by the electrically nonconductive coating, wherein the electrically nonconductive coating forms a rounded-off edge structure that surrounds the edges of the thermally and electrically conductive connection pad, and wherein the electrically nonconductive coating has a high dielectric constant.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Exemplary embodiments of the disclosure are described in more detail below with reference to the appended drawings. In the drawings:

[0022] FIG. 1 depicts an electronic device of the generic type from the prior art.

[0023] FIG. 2 depicts a first exemplary embodiment of an electronic device.

[0024] FIG. 3 depicts a further exemplary embodiment of an electronic device.

[0025] FIGS. 4, 5, 6, and 7 depict further exemplary embodiments of an electronic device.

DETAILED DESCRIPTION

[0026] FIG. 1 shows an electronic device 1 of the generic type from the prior art. The electronic device 1 includes a thermally and electrically conductive transmission element 2 connected to a heat source 3, in this case, a printed circuit board (PCB). The transmission element 2 is formed by a connection pad 4 of the PCB 3. The electronic device 1 includes a heat sink 5 at GND potential. The transmission element 2 is at a potential that is elevated in comparison with GND. The heat sink 5 and the transmission element 2 are spaced apart from one another by an electrically insulating layer 6. The material of the electrically insulating layer is thermally conductive, however, in order to enable a heat transfer from the heat source 3 through the transmission element 2 and through the electrically insulating layer 6 to the heat sink 5. The connection pad 2 is arranged within the insulating layer 6. The connection pad has sharp edges 7. The edges 7 face the heat sink 5 and run perpendicular to the plane of the image.

[0027] FIG. 2 shows a first exemplary embodiment of the electronic device 1. The transmission element 2 includes the connection pad 4 and a heat spreader 8. The heat spreader 8 includes an electrically conductive material and is connected to the connection pad 4. Connection pad 4 and heat spreader are at the same electrical potential, which is elevated in comparison with GND. The heat spreader 8 is arranged at least partially within the electrically insulating layer 6 and has rounded-off edges 9. The heat spreader 8 also has a larger base area than the connection pad 4. The heat spreader 8 therefore protrudes beyond the connection pad. The protruding edges 9 of the heat spreader 8 are rounded off. Only those rounded-off edges 9 of the heat spreader 8 that are oriented towards the heat sink 5 are embedded in the electrically insulating layer 6 and surrounded thereby. The roundings of the rounded-off edges 9 of the heat spreader 8 may have the geometry of Borda or Rogowski profiles.

[0028] FIG. 3 shows a second exemplary embodiment of the electronic device 1. In contrast to the first embodiment, the transmission element 2 does not have a dedicated heat spreader 8. Instead, the connection pad 4 of the PCB 3 acts as heat spreader 8. The connection pad 4 is arranged in the insulating layer 6, and the sharp (owing to the production) edges 7 of the connection pad 4 are rounded off, with the result that the connection pad 4 now has rounded-off edges 9. The rounded-off edges 9 point into the plane of the image and are oriented towards the heat spreader 8.

[0029] FIG. 4 shows a further exemplary embodiment of the electronic device 1. The rounded-off edges 9 of the connection pad 4 are produced by an electrically conductive coating 10, with which the connection pad 4 is coated prior to being connected to the electrically conductive layer 6. The rounded-off edges 9 produced in this way may also have the geometry of Borda or Rogowski profiles.

[0030] FIG. 5 shows a further exemplary embodiment of the electronic device 1. The rounded-off edges 9 of the connection pad 4 are produced by an electrically nonconductive coating 11, with which the connection pad 4 is coated prior to being connected to the electrically conductive layer 6. In this case, the sharp edges 7 of the connection pad 4 are encapsulated by casting and additionally insulated. The sharp edges 7 are completely surrounded by the material. The material of the electrically nonconductive coating 11 has a high dielectric constant. In any case, it has a higher dielectric constant and therefore a higher dielectric strength than the material of the insulating layer 6.

[0031] FIG. 6 shows a further exemplary embodiment of the electronic device 1. The transmission element 2 includes the connection pad 4 and an electrical magnetoresistor 12. The magnetoresistor 12 has been soldered to the connection pad 4. The ends of the magnetoresistor 12 are bent in the direction of the heat source 3 (upwards in the drawing), with the result that a rounding is produced in the direction of the heat sink 5. This rounding has the same effect as the rounded edges 9 of the heat spreader 8 or the connection pad 4. The roundings thus produced may likewise be shaped in accordance with Borda or Rogowski profiles.

[0032] FIG. 7 shows a further exemplary embodiment of the electronic device 1. The heat sink 5 has a structured region 13 which is opposite an underside of the transmission element 2 and is formed in mirror-image fashion with respect to a geometry of the underside of the transmission element 2. The structured region 13 is in the form of a raised platform and likewise has rounded edges 14. The rounded edges 14 are embedded in the insulating layer 6. This embodiment is compatible with all of the abovementioned embodiments.

[0033] It is to be understood that the elements and features recited in the appended claims may be combined in different ways to produce new claims that likewise fall within the scope of the present disclosure. Thus, whereas the dependent claims appended below depend on only a single independent or dependent claim, it is to be understood that these dependent claims may, alternatively, be made to depend in the alternative from any preceding or following claim, whether independent or dependent, and that such new combinations are to be understood as forming a part of the present specification.

[0034] While the present disclosure has been described above by reference to various embodiments, it may be understood that many changes and modifications may be made to the described embodiments. It is therefore intended that the foregoing description be regarded as illustrative rather than limiting, and that it be understood that all equivalents and/or combinations of embodiments are intended to be included in this description.

LIST OF REFERENCE SIGNS

[0035] 1 electronic device [0036] 2 transmission element [0037] 3 PCB/heat source [0038] 4 connection pad [0039] 5 heat sink [0040] 6 electrically insulating layer [0041] 7 sharp edges of the connection pad [0042] 8 heat spreader [0043] 9 rounded-off edges of the transmission element [0044] 10 electrically conductive coating [0045] 11 electrically nonconductive coating [0046] 12 magnetoresistor [0047] 13 structured region [0048] 14 rounded edges of the structured region