HIGH THROUGHPUT POWDER TREATMENT SYSTEMS
20240093354 ยท 2024-03-21
Inventors
- Maxim S. Shatalov (Mt. Sinai, NY, US)
- Paul J. Decker (Ridge, NY, US)
- Samuel J. Wright (Bellport, NY, US)
- William S. Linss (East Patchogue, NY, US)
Cpc classification
International classification
Abstract
A system for processing powder includes a process tube connected to load lock chamber via a vacuum valve. The load lock chamber includes first and second stations. Each of the first and second stations is configured to receive a barrel containing powder to be treated. A mechanical transfer mechanism is configured to: move a barrel containing powder to be treated from the first station into the process tube; move a barrel containing powder to be treated from the second station into the process tube; move a barrel containing treated powder from the process tube to the first station; and move a barrel containing treated powder from the process tube to the second station.
Claims
1. A system for processing powder comprising: a process tube connected to load lock chamber via a vacuum valve, the load lock chamber including first and second stations, each of the first and second stations configured to receive a barrel containing powder to be treated; and a mechanical transfer mechanism configured to: move a barrel containing powder to be treated from the first station into the process tube; move a barrel containing powder to be treated from the second station into the process tube; move a barrel containing treated powder from the process tube to the first station; and move a barrel containing treated powder from the process tube to the second station.
2. The system according to claim 1, wherein the process tube includes a stationary thermocouple, a stationary gas injector, and an exhaust port.
3. The system according to claim 1, further comprising a rotary shaft configured to advance a barrel containing powder to be treated from the first station into the process tube and to rotate the barrel once positioned within the process tube.
4. The system according to claim 1, further comprising a heater to maintain the process chamber substantially at treatment temperature at all times during barrel movement.
5. The system according to claim 1, wherein the mechanical transfer mechanism is a linear transfer mechanism.
6. The system according to claim 1, wherein the mechanical transfer mechanism includes a transfer arm configured to receive a barrel.
7. The system according to claim 5, wherein the mechanical transfer mechanism includes an elevator configured to receive the barrel from the transfer arm.
8. The system according to claim 1, wherein the process tube is configured to provide a one or more treatment processes selected from chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma deposition, electrochemical deposition, molecular layer deposition, or atomic layer deposition.
9. A method of powder treatment comprising: loading a first barrel containing a powder for treatment into a load lock chamber; preparing the first barrel for treatment while loaded in the load lock chamber; loading the first barrel into a process tube; treating the powder within the first barrel in the process tube; while treating powder within the first barrel, loading a second barrel containing a powder for treatment into the load lock chamber; preparing the second barrel for treatment while loaded in the load lock chamber; after treating of the powder in the first barrel is complete, transferring the first barrel back to the load lock chamber; while the first barrel containing treated powder is positioned in the load lock chamber, loading the second barrel into the process tube; and treating a powder contained in the second barrel.
10. The method of powder treatment according to claim 9, wherein the first barrel containing a powder for treatment is loaded into a first station of the load lock chamber; and the second barrel containing powder for treatment is loaded into a second station of the load lock chamber.
11. The method of powder treatment according to claim 9, wherein preparing the first barrel for treatment while loaded into the first station includes at least one of pre-heating the first barrel or introducing inert gas into the first barrel.
12. The method of powder treatment according to claim 9, wherein treating the powder within the first barrel in the process tube includes at least one treatment process selected from chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma deposition, electrochemical deposition, molecular layer deposition, or atomic layer deposition.
13. The method of powder treatment according to claim 9, wherein treating the powder within the first barrel in the process tube includes: spinning the first barrel at a speed sufficient to provide a centrifuging condition; slowing rotation of the first barrel to create a cataracting condition within the first barrel; and introducing a process gas to treat powder within the first barrel.
14. The method of powder treatment according to claim 13, further comprising: spinning the first barrel at a speed sufficient to provide a centrifuging condition after treating the powder; and continuing to rotate at a centrifuging speed while transferring the first barrel back to the load lock chamber.
15. The method of powder treatment according to claim 9, further comprising cooling the first barrel containing treated powder while positioned in the load lock chamber.
16. The method of powder treatment according to claim 9, further comprising recovering the treated powder from at least one of the first barrel or the second barrel.
17. The method of powder treatment according to claim 9, further comprising, after treating the powder in the second barrel is complete, transferring the second barrel back to the load lock chamber.
18. The method of powder treatment according to claim 17, further comprising maintaining the process chamber at a substantially constant treatment temperature at all times during loading and transferring the first and second barrels.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The present disclosure may be understood by reference to the accompanying drawings, when considered in conjunction with the subsequent, detailed description, in which:
[0031]
[0032]
[0033]
[0034]
[0035]
[0036]
[0037]
[0038]
[0039]
[0040]
[0041]
[0042]
[0043]
[0044]
[0045]
DETAILED DESCRIPTION
[0046] Embodiments of the presently disclosed powder treatment systems are described in detail with reference to the drawings, in which like reference numerals designate identical or corresponding elements in each of the several views. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the present disclosure in unnecessary detail.
[0047] Reference is made in detail to specific embodiments, one or more examples of which are illustrated in the drawings. Each example is provided by way of explanation, not limitation. It will be apparent to those skilled in the art that various modifications and variations may be made in the embodiments without departing from the scope or spirit of the disclosure. For instance, features illustrated or described as part of one embodiment may be used with another embodiment to yield a still further embodiment. Thus, it is intended that the present disclosure covers such modifications and variations as come within the scope of the appended claims and their equivalents.
[0048] While the following description is directed to the exemplary powder treatment systems shown in the figures, it should be understood that the structures and methods described herein may be used in connection with any powder treatment system, especially systems designed for applying materials (e.g., a coating, a nanotube, etc.) to particles, such as, for example a chemical vapor deposition (CVD) system, a physical vapor deposition (PVD) system, a plasma deposition system, an electrochemical deposition system, a molecular layer deposition system, or an atomic layer deposition system. Other types of powder treatment systems with which the present structures and methods may be used or adapted for use will be readily apparent to one skilled in the art reading this disclosure.
[0049] Directional terms such as top, bottom, and the like are used simply for convenience of description and are not intended to limit the disclosure attached hereto. Also, as used herein, the term on includes being in an open or activated position, whereas the term off includes being in a closed or inactivated position. As used herein, the terms first, second, and third may be used interchangeably to distinguish one component from another and are not intended to signify location or importance of the individual components.
[0050] As seen in
[0051] Process tube 200 is a vacuum chamber in which the treatment processes (e.g., CVD, sputtering, electron beam evaporation, thermal evaporation, etc.) take place. Load lock chamber 500 is essentially an auxiliary, secondary vacuum chamber attached to process tube 200 with vacuum valve 300 between the chambers. Load lock chamber 500 has its own high vacuum pumping system and venting (not explicitly shown). It contains two (or more) stations each configured for receiving a barrel containing powder to be treated. A mechanical transfer mechanism is provided to move barrels to and from process tube 200. Load lock chamber 500 reduces the cycle time of processing powder and reduces the potential for contamination in process tube 200. Barrels 100 are loaded into the load lock chamber 500 while at atmospheric pressure and temperature, and may contain air. Barrel 100 within load lock chamber 500 may then be preheated, load lock chamber 500 pumped down to a high vacuum pressure, and filled with an inert gas. Vacuum valve 300 is then opened between load lock chamber 500 and the process tube 200. Barrel 100 is then mechanically transferred from load lock chamber 500 to process tube 200 by means of a linear transfer mechanism. After the powder is processed, barrel 100 is transferred back to load lock chamber 500. During this process, the process tube 200 is always under vacuum and maintained at or near treatment temperature. Thus, load lock chamber 500 allows powder to be transferred into the process tube 200 without venting process tube 200 to atmosphere.
[0052] Treatment of powder within barrel 100 occurs within process tube 200. In embodiments, treatment of powder can be achieved as described in the '851 application. As described therein, the system may vary the speed of rotation of barrel 100 (which is essentially a rotary treatment vessel) containing the powder to be treated depending upon the presence or absence of net gas flow through the barrel 100 or process tube 200 at different stages of the treatment process. During treatment stages where gas flow may be present (e.g. pump down), barrel 100 is spun at a centrifugal speed. During treatment stages where net gas flow may be minimal or introduced into barrel 100 in such a way as to avoid or substantially minimize disturbance of the particles, the rotational speed of barrel 100 is at a cataracting speed, which is less than a centrifugal speed. Cataracting (with or without a comb) is the condition under which the uniform processing (heat treatment, surface modification, thin film deposition, etc.) should take place for best results. This is also the condition that is most susceptible to elutriation since the fine powder particles are distributed evenly and falling throughout barrel 100 by design and therefore are easily entrained in any net gas or vapor flow through the reactor. Entrained particles may be elutriated out with the exhaust resulting in yield loss or equipment issues including contamination of valves, clogging of filters, etc. By ensuring that, during treatment stages, any net gas flow may be minimal or introduced into barrel 100 in such a way as to avoid or substantially minimize disturbance of the particles, elutriation losses or equipment issues are avoided or substantially reduced.
[0053] As seen in
[0054] As seen in
[0055] As seen in
[0056] As seen in
[0057] In aspects, the present disclosure relates to methods of powder treatment.
[0058]
[0059] Referring to
[0060] In
[0061] As seen in
[0062] In
[0063]
[0064] As seen in
[0065] When processing of the powder is complete, end cap 275 moves back through and to the far side of load lock chamber 500 (left in the Figures), elevators 610 and load arms 550a, 550b shuffle around, removing processed barrel 100a away from the center line of process tube 200 and loading the next barrel 100b onto receiving fixtures 560. Loading and processing sequences are then repeated.
[0066] While this second barrel 100b is in process, the first barrel 100a is cooling. The load lock chamber 500 (which has been under vacuum since after the hinged barrel doors closed) can be brought back to atmospheric pressure, hinged door (not shown) opened, first barrel 100a removed, and a third barrel (not shown) introduced into load lock chamber 500 in the location from which barrel 100a was removed.
[0067] Any variety of treatment processes may be employed to treat powder within the barrel once it is loaded into the process chamber. These various processes may involve treatment sequences during which treatment temperature, pressure, and the flow of process gas (or gases) can be varied over time. Many such process variations are within the purview of those skilled in the art.
[0068]
[0069] At step 940, the vacuum valve is closed, and the rotation of the barrel is slowed down to create a cataracting condition within the barrel. Once a cataracting condition is achieved, process gas is turned on and the process tube and barrel are backfilled to a target pressure for treatment (945). At step 950, with the flow of process gas turned off, treatment continues until the depletion of precursor is achieved. Once the precursor is depleted, at step 955, the rotation speed of the barrel is increased to achieve a centrifuging condition. The vacuum valve is opened, and the process tube and barrel are pumped down at step 960. It should be understood that steps 940 through 960 may be repeated as many times as necessary to complete the powder processing.
[0070] At step 965, the vacuum valve is closed, and the process tube and barrel are backfilled with inert gas. The flow of gas is turned off, the vacuum valve is opened, and the process tube and barrel are pumped down at step 970. It should be understood that steps 965 and 970 may be repeated as many times as necessary to pump-purge the process tube and barrel.
[0071] At step 975, the vacuum valve is closed, and inert gas is backfilled to offload pressure within the process tube and barrel. The rate of rotation of the barrel is then reduced from a centrifuging speed to zero at step 980. The barrel is unloaded from the process chamber and moved to the load lock chamber at step 990, at which time the hinged door to the load lock chamber can be opened. Care should be taken to minimize pressure differential between the load lock chamber and process chamber when the hinged door opens. Alternatively, the barrel may continue to rotate at a centrifuging speed during unload from the process chamber to the load lock chamber.
[0072] This written description uses examples to describe the present powder treatment system and processes to enable any person skilled in the art to make and use any devices or systems and perform any incorporated methods. The scope of the disclosure may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of this disclosure if they include structural elements that do not differ from the explicitly disclosed embodiments, or if they include equivalent structural elements with insubstantial differences from the explicitly disclosed embodiments.
[0073] It should be understood that various aspects disclosed herein may be combined in different combinations than the combinations specifically presented in the description and accompanying drawings. It should also be understood that, depending on the example, certain acts or events of any of the processes or methods described herein may be performed in a different sequence, may be added, merged, or left out altogether (e.g., all described acts or events may not be necessary to carry out the techniques). In addition, while certain aspects of this disclosure are described as being performed by a single module or unit for purposes of clarity, it should be understood that the techniques of this disclosure may be performed by a combination of units or modules associated with a particle treatment system.