Method for Manufacturing a Mold Element for the Production of Micro-arrays and a Mold Element

Abstract

provided is a method for manufacturing a mold element for the production of microarrays, including the following steps: (i) providing a planar base element having a first surface and a second surface opposite the first surface, (ii) providing a planar auxiliary element on the second surface, (iii) penetrating the base element from the first surface in order to form mold openings, and (iv) reversibly or non-reversibly entering the auxiliary element when penetrating the base element. Moreover, a mold element for the production of microarrays, including a planar base element having a first surface a second surface opposite the first surface, a planar auxiliary element arranged on the second surface, and several mold openings extending from the surface of the base element through the second surface of the base element.

Claims

1. A method for manufacturing a mold element for the production of microarrays, comprising the following steps: providing a planar base element having a first surface and a second surface opposite the first surface, providing a planar auxiliary element on the second surface, penetrating the base element from the first surface in order to form mold openings, and reversibly or non-reversibly entering the auxiliary element when penetrating the base element.

2. The method according to claim 1, wherein the auxiliary element is connected to the base element, in particular detachably, wherein it is particularly preferred that the auxiliary element is adhesively connected to the base element.

3. The method according to claim 1, wherein providing the base element and providing the auxiliary element is done by providing a composite element, preferably a film composite, comprising the base element and the auxiliary element.

4. The method according to claim 1, wherein the penetration is effected by embossing, in particular hot embossing, wherein the embossing is effected with an embossing tool having at least one, preferably a plurality of projections complementary to at least a part of the mold openings.

5. The method according to claim 4, wherein the embossing is carried out by means of an embossing roller or an embossing die.

6. The method according to claim 1, characterized by cooling the base element and preferably the auxiliary element after entry.

7. The method according to claim 1, characterized by removing, in particular pulling off the auxiliary element from the base element.

8. A mold element for the production of microarrays, in particular manufactured by the method according to claim 1, comprising a planar base element having a first surface and a second surface opposite the first surface, a planar auxiliary element arranged on the second surface, in particular connected to the second surface, and several, in particular embossed mold openings extending from the first surface of the base element through the second surface of the base element.

9. The mold element according to claim 8, wherein the mold openings extend partially into the auxiliary element.

10. The mold element according to claim 8, wherein the auxiliary element is connected to the base element, in particular detachably, wherein it is preferred that the auxiliary element is adhesively connected to the base element.

11. The mold element according to claim 8 wherein the base element and/or the auxiliary element comprises TPU, PC, APET, PPC and/or PETG, in particular consists thereof.

12. The mold element according to claim 8 wherein the base element and/or the auxiliary element comprises a film, in particular consists thereof, wherein it is preferred that the base element has a thickness of 0.5-1.5 mm and/or the auxiliary element has a thickness of 0.1-2 mm.

13. The mold element according to claim 8 wherein the mold openings are cylindrical or conical, preferably with a round, triangular or quadrangular, particularly preferred square cross-section.

14. The mold element according to claim 8 wherein the auxiliary element comprises: a higher hot forming temperature than the base element, and/or a higher elasticity than the base element.

15. The mold element according to claim 8 wherein mold openings have on the first surface a cross-sectional area of 0.04 mm.sup.2-0.16 mm.sup.2, in particular of 0.04-0.08 mm.sup.2.

16. The mold element according to claim 8 wherein the mold openings have a depth of 600 m to 2200 m, in particular of 600 m to 1000 m.

17. The mold element according to claim 8 wherein the base element has a thickness of 500 to 1.5 mm and/or the auxiliary element has a thickness of 100 m to 2 mm.

18. The mold element according to claim 8 wherein mold openings have on the second surface and/or on a surface of the auxiliary element a cross-sectional area of <1200 m.sup.2, in particular of <100 m.sup.2.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In the following, the invention is described in more detail by means of a preferred embodiment with reference to the accompanying drawings.

[0036] In the Figures:

[0037] FIG. 1 is a schematic side view of a composite element having a base element and an auxiliary element,

[0038] FIG. 2 is a schematic side view of a composite element together with an embossing roller,

[0039] FIG. 3 is a schematic side view of an embossed composite element, and

[0040] FIG. 4 is a schematic detailed view of the section of FIG. 3 with a mold opening formed by the method according to the invention,

[0041] FIG. 5 is a schematic side view of a further composite element together with an embossing roller, and

[0042] FIG. 6 is a schematic side view of a further composite element together with an embossing roller.

DESCRIPTION OF THE INVENTION

[0043] In the Figures, similar or identical components or elements are identified by the same reference numerals or variations thereof (e.g. 10 and 10). In particular in the interest of improved clarity, preferably elements already identified are not provided with reference numerals in all Figures.

[0044] FIG. 1 is an example of a composite element 13 as a starting base for manufacturing a mold element with the aid of the method according to the invention. Composite element 13 comprises a base element 10 and an auxiliary element 11. In particular, base element 10 and auxiliary element 11 are films so that composite element 13 corresponds to a film composite. To form composite element 13, base element 10 and auxiliary element 11 are provided, as shown, wherein they are provided by being introduced from the left. A second surface side 24 of base element 10 is adhesively connected to a first surface 40 in order to form composite element 13. The adhesive connection is made in particular by means of adhesive arranged, for example, on the first surface 40 of auxiliary element 11 and/or on the second surface of base element 10. For example, the adhesive may be an adhesive layer connected to the first surface 40 of the auxiliary element and/or to the second surface 24 of base element 10. On the other hand, it is possible to create the adhesive connection through molecular forces of the film surfaces.

[0045] Shown on the right, auxiliary element 11 and base element 10 are adhesively connected to composite element 13 and are continued, shown by arrow 44.

[0046] Opposite the second surface 24 of base element 10 is the first surface 16 of base element 10. Opposite the first surface 40 of auxiliary element 11 is the second surface 42 of auxiliary element 11. Preferably, the first surface is a top side and/or the second surface is a bottom side.

[0047] For manufacturing a mold element with the aid of the method according to the invention, a composite element 13, in particular in the form of a film composite, is moved from the left (arrow 44) in the direction of arrow 12 in the exemplary embodiment shown in FIG. 2. Preferably, composite element 13 shown in FIG. 2 is composite 13 of FIG. 1.

[0048] To create mold openings 14 in a first surface 16 of base element 10, an embossing roller is preferably provided which rotates in the direction of an arrow 20, in the exemplary embodiment counterclockwise. A plurality of protrusions 22 are provided on an outside of the embossing roller 18. Regularly recurring areas of the outside of the embossing roller are provided with protrusions 22. Alternatively, it is possible that the protrusions 22 are regularly distributed over the entire outside embossing roller 18. As shown, the cross-section of the protrusions 22 corresponds to the cross-section of the mold openings 14. Shown here, the mold openings 14 extend completely through base element 10 and continue into a portion of auxiliary element 11. The portion of mold opening 14 extending through base element 10 corresponds here to a base mold opening 15, which preferably serves as a later die for producing the microarrays. The part of mold opening 14 in auxiliary element 11 represents an auxiliary opening 17. The protrusions 22 are in particular pyramid-shaped and have a preferably square or round cross-section.

[0049] The height of the protrusions 22 and thus the depth of the mold openings 14 is less than the thickness of composite element 13. Thus, during the embossing process, the protrusions 22 do not come into contact with an underground 48. Thus, the protrusions 22 are protected from damage and/or wear, in particular by impact with underground 48. It is also in particular advantageously implemented that the mold openings 14 to the bottom side shown are protected from the environment by auxiliary element 11 and are thus protected from contamination.

[0050] It is preferred that before or after filling the base mold openings 15, auxiliary element 11 is removed, in particular pulled off, from base element 10.

[0051] Composite element 13 extending in the direction of arrow 12 with embossed mold openings 14 corresponds to a mold element 100 to be manufactured. On the one hand, it is possible that to form mold element 100, auxiliary element 11 is connected to base element 10, or auxiliary element 11 is partially removed from base element 10, or auxiliary element 11 is completely removed from base element 10.

[0052] FIG. 3 is an exemplary embodiment of a mold element 100 according to the invention, which was preferably produced using an embodiment of the method according to the invention. It is preferred that mold element 100 of FIG. 3 is mold element 100 of FIG. 2. Mold element 100 is introduced from the left in the direction of arrow 12.

[0053] As shown, mold element 100 has regions 102, 102 with embossed mold openings 14 and region 104 without embossed mold openings 14. Shown on the right side, auxiliary element 11 is removed from base element 10 in the direction of arrow 108, in particular pulled off. Base element 10 continued in the direction of arrow 106 thus has the base mold openings 15, while the removed auxiliary element 11 has the auxiliary recesses 17. As shown, base element 10 with the base mold openings 15 and auxiliary element 11, which is removed therefrom, with the auxiliary recesses 17 thus form mold element 10. The illustrated mold element 100 thus corresponds to a first exemplary embodiment of a mold element according to the invention, such as a mold element with partially removed auxiliary element 11. The mold element 100 also illustrated corresponds to a second exemplary embodiment of a mold element to be manufactured, such as a mold element with a connected auxiliary element 11. The mold element 100 also illustrated corresponds to a third exemplary embodiment of a mold element to be manufactured, such as a mold element with a completely removed auxiliary element 11. In particular, these different embodiments of the mold element are different states and/or regions of a mold element according to the invention to be manufactured.

[0054] FIG. 4 is a detailed section of area IV of FIG. 3. A side length a of the in particular square or round base area of the pyramid-shaped mold opening has a dimension of preferably a=200-400 m. The side length a of mold opening 14 preferably also corresponds to the side length of the base area of base mold opening 15. The side length b of the base area of the auxiliary recess 17 preferably has a dimension of b=3-20 m. The depth of mold opening 14 is preferably t=600 m-2.200 m. The depth of auxiliary recess 17 is preferably t.sub.H=50-500 m. The depth of base mold opening 15 preferably t.sub.B=550-2150 m or 550-1700 m. The thickness of composite element 13 is particularly d=800 m-4 mm. The thickness dB of the base element is preferably 600 m-2 mm. The thickness dB of the auxiliary element is preferably 200 m-2 mm.

[0055] The exemplary embodiment of FIG. 5 substantially corresponds to the one of FIG. 2. In contrast to the embodiment of FIG. 2, in FIG. 6 auxiliary element 11 has a high elasticity and/or a high embossing temperature, so that after entry of the protrusions 22 into auxiliary element 11 no auxiliary recesses 17 (see FIG. 2) remain in auxiliary element 11, but instead auxiliary element 11 preferably forms back into its original shape. Accordingly, the mold openings 14 according to the exemplary embodiment of FIG. 5 are the base mold openings 15.

[0056] The exemplary embodiment of FIG. 6 substantially also corresponds to the exemplary embodiment of FIG. 2. In contrast to the exemplary embodiment of FIG. 1, auxiliary element 11 of FIG. 6 has a porous structure consisting of the recesses 46. The recesses 46 are, for example, pyramidal or cylindrical or part-circular in shape. The recesses 46 are preferably regularly distributed on the first surface of auxiliary element 11. The recesses 46 are oriented in such a way that during the embossing process, the tips of the protrusions 22 enter the recesses 46 and thus do not deform auxiliary element 11. Again, in the exemplary embodiment of FIG. 6, a mold opening 14 thus corresponds to a base mold opening 15.