Replication and related methods and devices, in particular for minimizing asymmetric form errors
11554563 · 2023-01-17
Assignee
Inventors
- QiChuan Yu (Singapore, SG)
- Han Nee Ng (Singapore, SG)
- Tobias Senn (Rüschlikon, CH)
- John A. Vidallon (Singapore, SG)
- Ramon Opeda (Singapore, SG)
- Attilio Ferrari (Rüschlikon, CH)
- Harmut Rudmann (Rüschlikon, CH)
- Martin Schubert (Rüschlikon, CH)
Cpc classification
B29C33/3878
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29D11/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
The method regards manufacturing devices by replication, wherein each of the devices comprises a device surface. The method comprises producing the devices from a replication material by replication using a replication tool (1), wherein the replication tool (1) comprises a tool material comprising replication sites (4) comprising a replication surface (5) each. Each of the replication surfaces (5) corresponds to a negative of the device surface of a respective one of the devices. The tool material comprises, in addition to the replication sites, one or more mitigating features (7) for reducing asymmetric form errors of the device surfaces. Replication tools (1) and methods for manufacturing these are also described.
Claims
1. A method for manufacturing devices by replication, each of the devices comprising a device surface, the method comprising: producing the devices from a replication material by replication using a replication tool; wherein the replication tool comprises a tool material comprising replication sites comprising a replication surface each, wherein each of the replication surfaces corresponds to a negative of the device surface of a respective one of the devices, and wherein the tool material comprises, in addition to the replication sites, one or more mitigating features, wherein the mitigating features comprise recesses, grooves, cuts or protrusions, and wherein the replication sites and the mitigating features are separated by the tool material so that the replication material does not flow between the replication sites and the mitigating features during manufacturing and the devices are solely shaped by the replication sites, wherein the mitigating features are features for at least one of: reducing a directionality of shape deviations of the replication surfaces; reducing a directionality of shape deviations of the replication surfaces from a negative of respective desired device surface shapes; avoiding or at least reducing asymmetric form errors of the device surfaces; reducing a directionality of a distribution of tool material in a respective region around each of the replication sites; increasing a uniformity of a distribution of the tool material in respective regions around each of the replication sites; and relieving stress in the tool material.
2. The method according to claim 1, further comprising producing the mitigating features after producing the replication surfaces, and wherein the mitigating features are features for at least one of: for provoking at least partial reversal of an undesired deformation of the replication surfaces; for provoking a desired deformation of the replication surfaces, wherein said desired deformation at least partially reverses a pre-existing undesired deformation of the replication surfaces.
3. The method according to claim 1, further comprising producing the mitigating features at the time of producing the replication surfaces, and wherein the mitigating features are features for avoiding or at least reducing a deformation of the replication surfaces, wherein the method comprises producing the replication surfaces by means of shaping surfaces of a master during manufacture of the replication tool, and wherein said deformation is a deformation relative to a negative of respective shaping surfaces of the master.
4. The method according to claim 1, wherein the replication surfaces comprise recesses in the tool material.
5. The method according to claim 1, wherein the devices are rotationally symmetric optical devices.
6. The method according to claim 1, wherein a lateral distribution of the replication sites has a symmetry lower than a rotational symmetry of order two, wherein the rotational symmetry is a two-fold mirror symmetry.
7. The method according to claim 1, wherein the producing the devices by replication comprises a carrying out an embossing process.
8. The method according to claim 1, wherein the replication tool comprises a rigid carrier to which the tool material is attached, and wherein the tool material is resilient and/or has an open-porous structure, and wherein the tool material is a silicone.
9. The method according to claim 1, wherein the mitigating features are interspersed with the replication sites.
10. A replication tool for manufacturing devices by means of replication, the replication tool comprising a multitude of replication sites established in a tool material of the replication tool, each of the replication sites having a replication surface having a shape corresponding to a negative of a device surface of one of the devices; and, in addition, one or more mitigating features, wherein the mitigating features are features for avoiding or at least reducing asymmetric form errors of the devices wherein the mitigating features comprise recesses, grooves, cuts or protrusions, and wherein the replication sites and the mitigating features are separated by the tool material so that the replication material does not flow between the replication sites and the mitigating features during manufacturing and the devices are solely shaped by the replication sites.
11. The replication tool according to claim 10, wherein the replication sites are arranged on a non-square rectangular grid, and the mitigating features are interlacing the grid.
12. The replication tool according to claim 10, wherein the replication sites are arranged in mutually parallel rows, and at least a portion of the mitigating features are arranged between neighboring ones of the rows, wherein at least a portion of the mitigating features are arranged between each pair of neighboring ones of the rows.
13. The replication tool according to claim 10, wherein the mitigating features are located in the vicinity of each of the replication sites and are distinct from the replication surfaces and the replication sites.
14. The replication tool according to claim 10, wherein the replication surfaces comprise recesses in the tool material, wherein the replication surfaces are concave.
15. The replication tool according to claim 10, comprising a carrier to which the tool material is attached, wherein the carrier is stiffer than the tool material, wherein the tool material is a resilient material, wherein the tool material is a silicone.
16. The replication tool according to claim 10, wherein the mitigating features are features for reducing asymmetric form errors of the replication surfaces.
17. The replication tool according to claim 10, wherein the tool material has an open porous structure, wherein the tool material is a silicone.
18. The replication tool according to claim 17, wherein the tool material is a polydimethylsiloxane.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Below, the invention is described in more detail by means of examples and the included drawings. In the drawings, same reference numerals refer to same or analogous elements. The figures show schematically:
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(11) The described embodiments are meant as examples or for clarifying the invention and shall not limit the invention.
DETAILED DESCRIPTION OF THE INVENTION
(12)
(13) Replication tool 1 includes mutually distanced replication sites 4, for the manufacture of separate devices by replication, such as a multitude of microlenses.
(14) The tool material 2 can be a resilient material, and it can be a material which is interspersed pores and/or channels.
(15) The tool material can be a spongy material.
(16) The tool material can be, e.g., a polydimethylsiloxane (PDMS).
(17) In
(18) The replication material 9 can be, e.g., a curable material, e.g., a curable epoxy resin.
(19) With replication material 9 between substrate 11 and replication tool 1, these two are moved towards each other, e.g., until they abut each other, cf.
(20) While maintaining the relative position of substrate 11 and replication tool 1, replication material 9 is hardened, e.g., cured, e.g., by UV irradiation and/or by application of heat.
(21) After the hardening process, a plurality of separate devices 10 is produced on substrate 11 each of which has a device surface 15 having a shape corresponding to the negative of the shape of one of the replication surfaces 5, and replication tool 1 is removed, cf.
(22) As an option, it is possible to subject the replication tool 1, in particular the tool material 2, to a conditioning step before carrying out the replication process, e.g., by exposing the tool material 2 to a conditioning material. Such a conditioning material can be, e.g., the same material as the replication material used in the replication processes, e.g., they both can be the same epoxy resin. The conditioning material can be applied locally (such as illustrated in
(23) In reaction to the exposure to the conditioning material, tool material 2 can slightly change dimensionally, e.g., it undergoes a slight swelling process. For example, a portion of conditioning material can afterwards be present in pores and channels of an open porous structure of tool material 2, wherein it can have replaced a portion of material, e.g., of PDMS precursors and uncured PDMS, respectively, present in the pores and channels prior to the exposure to conditioning material.
(24) Subsequently, the conditioning material is removed from tool material 2. A possible way of removing the conditioning material from replication tool 1 is to harden the initially liquid conditioning material, e.g., by exposing it to energy, such as by irradiating it with UV radiation and/or by heating it, and then to remove the hardened conditioning material.
(25) The conditioning can effect that a size of produced devices 10 can be more precisely predicted and that the size of produced devices 10 can be kept very constant during several replication processes which are successively carried out using one and the same replication tool 1. Further details regarding the conditioning are described in the U.S. provisional application Ser. No. 62/503,464 mentioned above.
(26) However, an effect observed by the inventors relates not so much to the (overall) size of the produced devices 10, but rather to their shape, and more particularly to asymmetric form errors the devices 10 can exhibit.
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(28) In the illustrated simple case, the size of device 10 along the x-axis corresponds to the desired size, but the size along the y-axis is smaller than desired.
(29) Of course, shape deviations can be much more complicated, exhibiting a more complicated directional dependencies. And generally, also the third dimension (along the z-axis) could be considered. However, how to handle these more complicated approaches and cases will become clear from the explanations regarding the instant relatively simple case.
(30) Concentrating on merely a dimension along the x-axis and a dimension along the y-axis, one can simply quantify the shape deviations by two scaling factors, Fx and Fy, for the respective two directions. E.g., Fx=(device size along x)/(desired size along x) and Fy=(device size along y)/(desired size along y). In the illustrated case, Fx equals 1, and Fy is lower than one, e.g., is approximately 0.8.
(31) A numerical value for the directionality can be defined, e.g., by forming the quotient of the (absolute values of the) scaling factors (Fx, Fy) for the considered directions and subtracting 1 therefrom, i.e. in the instant case a value for the directionality would be 1.0/0.8−1=1.25−1=0.25. Other ways of defining a numerical value for the directionality are readily at hand, such as involving integration over directions and/or other ways of normalizing.
(32) Reducing this value, optimally to zero, is a goal to be achieved for improved shape fidelity in replication. This can be achieved by the provision of mitigating features, e.g., in the way as herein described.
(33) Whereas
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(35) With the mitigating features 7 provided in the replication tool 1 and more particularly in the tool material 2, the asymmetry of the form errors (and the directionality of the shape deviations) is much reduced, such that the replication surfaces 5 assume at least approximately the shape illustrated by the dashed circles labelled 5a.
(36) The cuts can be applied to the tool material after producing the replication sites 5, such as after hardening the tool material 2 (provided that the tool material is shaped in a replication process).
(37) Assumed reasons why the provision of the mitigating features 7 makes possible to overcome asymmetric form errors (at least in part) have been explained above.
(38) Mitigating features 7 can also be different from cuts. E.g., they can be recesses in the tool material.
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(40) The mitigating features 7 in
(41) Mitigating features 7 of such a kind can be produced, e.g., by shaping the tool material 2 accordingly, in particular already at the time of shaping the replication sites 5. This can be accomplished, e.g., using a suitably structured master in a replication process for shaping the tool material 2.
(42) Here and in the other illustrated embodiments, the mitigating features 7 are not features which are merely peripherically located at the replication tool 1. But the arrangement of the mitigating features 7 overlaps the arrangement of the replication sites 5. And more particularly, the mitigating features 7 can interlace a grid defined by the replication sites 5.
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(44) The mitigating features 7 in
(45) As described for
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(48) Master 20 has shaping sites 24 for shaping the replication sites 4 of replication tool 1. Each shaping site 24 includes a shaping surface 25 for shaping a respective replication surface 5. Accordingly, the shaping sites 24 correspond (with respect to their shapes) to device surfaces of devices 10 to be produced and to negatives of the replication surfaces 5.
(49) Furthermore, master 20 is shaped to exhibit further structures adjoining the shaping surfaces 25 for shaping additional surfaces portions 8 of the replication tool 1. These are useful in case the devices shall be produced by embossing with flow control, as will be explained below (cf.
(50) Still furthermore, master 20 includes in addition to the shaping sites 24 additional shaping sites 27 which are provided for shaping the mitigating feature(s) 7. Since the mitigating features 7 establish a recess, e.g., a groove, in the illustrated case, the additional shaping sites 27 establish a protrusion of master 20.
(51) For example, tool material 2 in its initial, e.g., uncured, state can be applied to carrier 3 and shaped by master 20 in a vacuum injection molding process. During the shaping, it is hardened, e.g., cured. Then, the master is removed.
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(53) The devices 10 can be, e.g., optical devices, such as lenses, more particularly microlenses. Asymmetric form errors of the described kind can lead, e.g., to an undesired optical aberrations such as an astigmatism of the (ideally rotationally symmetric) lenses. I.e. the lenses would exhibit different focal lengths for light impinging on the lens along different directions. The mitigating features 7 can reduce or remove such undesired astigmatism or other undesired (optical) effects arising from asymmetric form errors.
(54) Depending on the circumstances, there are various reasons for which the mitigating features 7 can be applied and various effects the mitigating features 7 can have. For example:
(55) The mitigating features can be provided for avoiding or at least reducing asymmetric form errors of the device surfaces produced.
(56) The mitigating features can be provided for reducing a directionality of shape deviations (or: for reducing direction-dependent shape deviations) of the replication surface; more particularly for reducing a directionality of shape deviations of the replication surfaces from respective initial shapes of the replication surfaces. The initial shapes can correspond to a negative of the shape of a shaping surface of a master and/or to a negative of a shaping surface of a master and/or to a negative of a desired device surface. And/or the initial shapes correspond to shapes exhibited by the replication surface at the time of shaping the replication surfaces.
(57) The mitigating features can be provided for reducing a directionality of shape deviations of the devices, more particularly of shape deviations of the device surfaces. The deviations can be deviations from a desired shape.
(58) The mitigating features can be provided for reducing a directionality of shape deviations of the replication surfaces from respective shaping surfaces of a master used for shaping the tool material (and in particular the replication sites) in a replication process
(59) The mitigating features can be provided for reducing a directionality of shape deviations of the replication surfaces from a negative of respective desired device surfaces.
(60) The mitigating features can be provided for increasing a homogeneity (or, vice versa, decreasing a directionality) of a distribution of tool material in a respective region around each the replication sites.
(61) The mitigating features can be provided for provoking a (desired) deformation of the replication surfaces, in particular wherein said (desired) deformation at least partially reverses a pre-existing (undesired) deformation of the replication surfaces. This can in particular be the case if the mitigating features are produced after the replication sites have been produced. Reasons for the occurrence of such undesired deformations have been herein described.
(62) The mitigating features can be provided for provoking an at least partial reversal of an (undesired) deformation of the replication surfaces; wherein said (undesired) deformations can have taken place after shaping the replication surfaces (e.g., using a suitable master). And said deformations can have occurred before shaping replication material by means of the replication surface to produce the devices. This can in particular apply if the mitigating features are produced after the replication sites have been produced.
(63) The mitigating features can be provided for avoiding or reducing a deformation of the replication surfaces, in particular a deformation relative to a negative of a shaping surface of a master by means of which the replication surfaces are shaped during manufacturing the replication tool. This can in particular be the case if the mitigating features are produced simultaneously with the replication sites.
(64) The mitigating features can establish one or more stress-relieving structures at which the tool material can relieve stress, in particular thermo-mechanical stress.
(65) The mitigating features can contribute to making a distribution of the tool material in respective a region around each of the replication sites more uniform.
(66) The mitigating features can effect that asymmetric form errors (and/or a directionality of shape deviations; from a respective master and/or from a (desired) device, as herein described) of the produced devices (and/or of the replication surfaces at the time of producing the devices by replication using the replication tool) which would occur with another replication tool, which is identical with the replication tool but merely does not include the mitigating features, are reduced (or even completely avoided). The identity of the replication tool and the other replication tool (without the mitigating features) can also include that both are manufactured identically—of course except for the provision of the mitigating features.
(67) The mitigating features can be provided for reducing asymmetric form errors (as described) with respect to asymmetric form errors occurring when using another replication tool which is an identical replication tool, but which differs from the replication tool merely in that it is void of the mitigating features.
(68) As will have become clear, the provision of the mitigating features can improve shaping fidelity and can result in the production of better quality devices.